CN213905315U

CN213905315U - Thinning wafer discharging jig

Info

Publication number: CN213905315U
Application number: CN202023341867.3U
Authority: CN
Inventors: 石正强
Original assignee: Fujian Huixin Laser Technology Co ltd
Current assignee: Fujian Huixin Laser Technology Co ltd
Priority date: 2020-12-31
Filing date: 2020-12-31
Publication date: 2021-08-06
Anticipated expiration: 2030-12-31

Abstract

The utility model relates to an attenuate wafer piece tool down, including the saddle and the cushion cap of mutually supporting, cushion cap establishes on the saddle, and cushion cap's lower extreme is equipped with the installation department that is used for installing the wafer fixed station, is equipped with the confession on the saddle the holding cavity that the wafer fixed station stretched into is equipped with many support columns that are used for accepting the wafer that drops from the wafer fixed station in the holding cavity, forms between many support columns to supply the layer board to stretch into to get the piece space, and cushion cap establishes behind the saddle, forms the clearance that is used for safely accepting the wafer between the upper end of support column and the wafer fixed station, be equipped with on the saddle with the material mouth of getting of holding cavity intercommunication. The utility model discloses in, need not to promote the wafer when the separation, the difficult scraping that appears wafer and wafer fixed station can reduce the phenomenon of fragment and fish tail, can promote the quality of wafer.

Description

Thinning wafer discharging jig

Technical Field

The utility model relates to a piece tool under attenuate wafer.

Background

The wafer needs to be thinned during the chip manufacturing process, and in the prior art, the wafer 30 is stuck on the wafer fixing table 20 through wax, and after the wafer 30 is processed, the wafer 30 is taken out from the wafer fixing table 20. The operation of removing the wafer 30 from the wafer mounting table 20 is generally as follows: referring to fig. 1 and 2, the wafer fixing table 20 with the wafer 30 is placed in the heating platform 10, heated to 100 ℃, and the wax is naturally melted, so that the thinned wafer 30 is separated from the wafer fixing table 20; the wafer 30 is pushed out 2/3 distance from the wafer fixing platform 20 by using a tool, and then the wafer 30 is clamped by using tweezers, for some thinner wafers 30, for example, the thickness of the wafer 30 is about 100um, when the wafer 30 is pushed out from the wafer fixing platform 20 and the wafer 30 is clamped by the tweezers, scratches and fragments are easy to occur, the traditional method can only be applied to the wafers with the diameters of 2 inches and 3 inches, and beyond this range, the risk of scratching and damage of the wafer in the pushing process is higher, process equipment needs to be added, and the price is high.

Accordingly, the present inventors have made extensive studies to solve the above problems and have made the present invention.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a piece tool under attenuate wafer that can promote piece quality under wafer.

In order to achieve the above purpose, the utility model adopts the following technical scheme:

the utility model provides a thinning wafer unloading tool, includes saddle and the cushion cap of mutually supporting, and cushion cap lid is established on the saddle, and cushion cap's lower extreme is equipped with the installation department that is used for installing the wafer fixed station, is equipped with the confession on the saddle the holding cavity that the wafer fixed station stretched into is equipped with many support columns that are used for accepting the wafer that drops from the wafer fixed station in the holding cavity, forms the piece space of getting that supplies the layer board to stretch into between many support columns, and cushion cap lid establishes behind the saddle, forms the clearance that is used for safely accepting the wafer between the upper end of support column and the wafer fixed station, be equipped with on the saddle with the material mouth of getting of holding cavity intercommunication.

As an optimal mode of the utility model, the saddle includes the bottom plate and sets up the support section of thick bamboo on the bottom plate, the support column sets up on the bottom plate, get the material mouth setting and be in on the support section of thick bamboo, get the material mouth and run through to the inner wall from the outer wall that supports a section of thick bamboo.

As an optimized mode of the present invention, the wafer fixing platform is detachably disposed on the mounting portion.

As an optimal mode of the utility model, the installation department is the mounting hole, the mode setting that the wafer fixed station passes through joint or spiro union connection is in the mounting hole.

As an optimized mode of the utility model, the inner wall of the supporting cylinder is provided with a limiting platform for supporting the wafer bearing platform, the outer diameter of the wafer bearing platform is smaller than the inner diameter of the supporting cylinder.

As an optimized mode of the utility model, the wafer bearing platform is provided with a first handle for extracting the wafer bearing platform.

As an optimized mode of the utility model, be equipped with on the saddle and be used for drawing the second handle of saddle.

As a preferred mode of the present invention, the number of the supporting columns is at least three.

As a preferred mode of the present invention, the wafer fixing table further comprises a separation mechanism for melting or eliminating the bonding medium between the wafer and the wafer fixing table and automatically dropping the wafer from the wafer fixing table to the supporting column.

As an optimized mode of the utility model, the separation mechanism is used for placing the wafer bearing platform and the beaker of the supporting platform, a solvent is arranged in the beaker.

After the technical proposal of the utility model is adopted, the wafer is arranged on the wafer fixing platform, the wafer fixing platform is arranged on the wafer bearing platform, the wafer bearing platform is covered on the supporting platform, the wafer bearing platform and the supporting platform are arranged in a certain environment (under the environment, the bonding medium between the wafer fixing platform and the wafer can be melted or eliminated, the environment can be the environment that the bonding medium can be melted or the solution that the bonding medium can be eliminated, etc.), the bonding medium between the wafer fixing platform and the wafer can be melted or eliminated, the wafer automatically drops on the supporting column, tools such as the supporting plate, etc. extend into the material taking space from the material taking port and are positioned on the lower surface of the wafer, and the wafer is supported, and then the wafer is taken out, need not to promote the wafer when the separation, the difficult scraping that appears wafer and wafer fixed station can reduce the phenomenon of piece and fish tail, can promote the quality of wafer.

Drawings

FIG. 1 is a schematic view of a wafer, a wafer fixing stage and a heating platform in a heating process in the prior art.

Fig. 2 is a schematic view of a wafer, a wafer fixing stage and a heating platform in a material fetching process in the prior art.

Fig. 3 is a schematic view of the local exploded structure of the present invention.

Fig. 4 is a front view of the saddle of the present invention.

Fig. 5 is a schematic top view of the pallet of the present invention.

Fig. 6 is a schematic view of the usage of the present invention.

In the figure:

heated platen 10 wafer mounting table 20

Wafer 303 wafer table 40

First handle 41 mounting portion 42

Supporting barrel 51 of supporting table 50

Bottom plate 52 support column 53

Spacing stage 55 of accommodation chamber 54

Second handle 56 material taking port 57

Beaker 60 solvent 70

Detailed Description

In order to further explain the technical solution of the present invention, the following embodiments are described in detail.

Referring to fig. 1 to 6, a thinned wafer unloading jig comprises a supporting table 50 and a supporting table 40 which are matched with each other, the supporting table 40 is covered on the supporting table 50, a mounting portion 42 for mounting a wafer fixing table 20 is arranged at the lower end of the supporting table 40, in the previous process, a wafer 30 is pasted on the wafer fixing table 20 for thinning, and after the thinning, the wafer 30 is mounted on the mounting portion 42 together with the wafer fixing table 20. The utility model discloses in, be equipped with the confession on the saddle 50 the holding chamber 54 that wafer fixed station 20 stretched into, be equipped with many support columns 53 that are used for accepting the wafer 30 that drops from wafer fixed station 20 in the holding chamber 54, many support columns 53 evenly lay around the center of holding chamber 54, the upper surface of each support column 53 is located the coplanar and forms the holding surface, form the space of getting that supplies layer board (not shown in the figure) to stretch into between many support columns 53, when getting the piece, the layer board extends and gets the piece space, and the lower surface of rebound to wafer 30 holds up wafer 30, later shift out layer board and wafer 30 level, in the embodiment, the layer board is the special fluorine dragon shovel. The utility model discloses wafer bearing table 40 lid is established behind saddle 50, forms the clearance that is used for safely accepting wafer 30 between the upper end of support column 53 and wafer fixed station 20, be equipped with on saddle 50 with the material mouth 57 of getting that holding chamber 54 communicates. The utility model discloses a clearance size can be set for according to the nature of wafer 30 for wafer 30 drops can not be damaged or bruise behind support column 53, and theoretically this clearance can infinitely approach 0 the utility model discloses a best implementation mode adopts solvent 70 to make the wax between wafer 30 and the wafer fixed station 20 dissolve, and wafer 30 slowly sinks in solvent 70 and falls to support column 53 on, and solvent 70 plays the guard action to wafer 30.

As a preferred mode of the present invention, the supporting platform 50 includes a bottom plate 52 and a supporting cylinder 51 disposed on the bottom plate 52, the upper end opening of the supporting cylinder 51 is provided, the supporting platform 40 is placed into the supporting cylinder 51 from the opening, the supporting column 53 is disposed on the bottom plate 52, the material taking port 57 is disposed on the supporting cylinder 51, and the material taking port 57 runs through to the inner wall from the outer wall of the supporting cylinder 51.

As a preferred embodiment of the present invention, the wafer fixing stage 20 is detachably disposed on the mounting portion 42. The detachable mode can be for a plurality of, for example carries out the joint through the buckle, inhales the part through magnetism and carries out actuation etc. as the utility model discloses a preferred mode, installation department 42 is the mounting hole, wafer fixed station 20 sets up in the mounting hole through joint or spiro union's mode.

The utility model discloses in, the cushion cap 40 can directly be taken up and lean on the saddle 50, and the external diameter of cushion cap 40 and saddle 50's external diameter can be the same this moment, for make cushion cap 40 can cooperate together more steadily, as the utility model discloses an optimal mode, the inner wall that supports a 51 is equipped with and is used for the bearing spacing 55 of cushion cap 40, spacing 55 along the circumference setting that supports a 51, the external diameter of cushion cap 40 is less than support a 51's internal diameter, cushion cap 40 are placed in supporting a 51, and spacing 51 can restrict cushion cap 40 and continue to move down, and support a 51 can restrict cushion cap 40 at radial displacement.

As a preferred mode of the present invention, a first handle 41 for picking up the wafer stage 40 is disposed on the wafer stage 40 to facilitate the moving operation of the wafer stage 40. As a preferred mode of the present invention, the tray 50 is provided with a second handle 56 for picking up the tray 50, so as to facilitate the moving and operating of the tray 50.

As a preferable mode of the present invention, the number of the supporting columns 53 is at least three, in an embodiment, the number of the supporting columns 53 is 3, and the 3 supporting columns 53 are arranged in an equilateral triangle.

As a preferred embodiment of the present invention, the present invention further comprises a separation mechanism for melting or eliminating the bonding medium between the wafer 30 and the wafer fixing stage 20 and automatically dropping the wafer 30 from the wafer fixing stage 20 onto the supporting column 53.

As a preferred mode of the present invention, the detaching mechanism is a beaker 60 for placing the wafer supporting platform 40 and the supporting platform 50, a solvent 70 is disposed in the beaker 60, and in the embodiment, the solvent 70 is acetone.

It should be noted that the utility model provides a wafer 30 after the wafer bearing table 40 and saddle 50 structure has been realized accepting and breaks away from, and the lower piece of the wafer 30 after the supplementary attenuate, how to realize the separation of wafer 30 and wafer fixed station 20 can adopt with wafer 30 with bonding medium between the wafer fixed station 20 melts or eliminates, and the best mode makes and adopts solvent 70 to carry out the dissolution of wax, makes wafer 30 slowly descend to support column 53 with the help of solvent 70.

The product form of the present invention is not limited to the embodiment of the present invention, and any person can properly change or modify the product form of the present invention without departing from the scope of the present invention.

Claims

1. The utility model provides a lower piece tool of attenuate wafer which characterized in that: including saddle and the cushion cap of mutually supporting, cushion cap establishes on the saddle, and cushion cap's lower extreme is equipped with the installation department that is used for installing the wafer fixed station, is equipped with the confession on the saddle the holding cavity that the wafer fixed station stretched into is equipped with many support columns that are used for accepting the wafer that drops from the wafer fixed station in the holding cavity, forms the piece space of getting that supplies the layer board to stretch into between many support columns, and cushion cap establishes behind the saddle, forms the clearance that is used for safely accepting the wafer between the upper end of support column and the wafer fixed station, be equipped with on the saddle with the material mouth of getting of holding cavity intercommunication.

2. The wafer thinning jig according to claim 1, wherein: the saddle includes the bottom plate and sets up the support section of thick bamboo on the bottom plate, the support column sets up on the bottom plate, the material taking mouth sets up on the support section of thick bamboo, the material taking mouth runs through to the inner wall from the outer wall of a support section of thick bamboo.

3. The wafer thinning jig according to claim 2, wherein: the wafer fixing table is detachably arranged on the mounting portion.

4. The wafer thinning jig according to claim 3, wherein: the installation department is the mounting hole, the mode setting that the wafer fixed station passes through joint or spiro union connection is in the mounting hole.

5. The wafer thinning jig according to claim 2, wherein: the inner wall of the supporting cylinder is provided with a limiting table for supporting the wafer bearing table, and the outer diameter of the wafer bearing table is smaller than the inner diameter of the supporting cylinder.

6. The wafer thinning jig according to claim 1, wherein: the wafer bearing platform is provided with a first handle for extracting the wafer bearing platform.

7. The wafer thinning jig according to claim 5, wherein: and a second handle for extracting the supporting platform is arranged on the supporting platform.

8. The wafer thinning jig according to claim 1, wherein: the number of the supporting columns is at least three.

9. The wafer thinning jig according to any one of claims 1 to 8, wherein: and the separation mechanism is used for melting or eliminating the bonding medium between the wafer and the wafer fixing table and automatically dropping the wafer from the wafer fixing table onto the supporting columns.

10. The wafer thinning jig as claimed in claim 9, wherein: the separation mechanism is a beaker used for placing the wafer bearing table and the supporting table, and a solvent is arranged in the beaker.