CN213904000U - Liquid crystal module - Google Patents
Liquid crystal module Download PDFInfo
- Publication number
- CN213904000U CN213904000U CN202023202488.6U CN202023202488U CN213904000U CN 213904000 U CN213904000 U CN 213904000U CN 202023202488 U CN202023202488 U CN 202023202488U CN 213904000 U CN213904000 U CN 213904000U
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- China
- Prior art keywords
- heat dissipation
- boundary strip
- liquid crystal
- filtering processing
- processing circuit
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- 239000004973 liquid crystal related substance Substances 0.000 title claims abstract description 46
- 230000017525 heat dissipation Effects 0.000 claims abstract description 161
- 238000001914 filtration Methods 0.000 claims abstract description 56
- 239000000203 mixture Substances 0.000 claims abstract description 27
- 230000000149 penetrating effect Effects 0.000 claims abstract description 11
- 229910000838 Al alloy Inorganic materials 0.000 claims description 3
- 239000005341 toughened glass Substances 0.000 claims description 3
- 239000006185 dispersion Substances 0.000 abstract description 3
- 230000005855 radiation Effects 0.000 abstract 12
- 239000000956 alloy Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- Liquid Crystal (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The utility model relates to a liquid crystal module, which comprises a heat radiation total frame arranged in a wrapping manner, wherein the upper part of the heat radiation total frame is fixedly provided with a light filtering processing component, the lower part of the light filtering processing component is horizontally provided with a first heat radiation boundary strip in a penetrating manner, the two ends of the first heat radiation boundary strip are connected with the heat radiation total frame, the two ends of the first heat radiation boundary strip are provided with light filtering processing circuit integrated boards, the lower part of the light filtering processing circuit integrated board is provided with a bearing plate, the first heat radiation boundary strip is particularly provided with the light filtering processing circuit integrated boards in a penetrating manner, the lower part of the bearing plate is provided with a liquid crystal composition layer, a horizontal second heat radiation boundary strip is also arranged between the bearing plate and the liquid crystal composition layer, a horizontal third heat radiation boundary strip is also arranged between the first heat radiation boundary strip and the second heat radiation boundary strip and penetrates through the light filtering processing circuit integrated boards, and a horizontal third heat radiation boundary strip, and both ends of the third heat dissipation boundary strip are also connected with the heat dissipation main frame. The utility model discloses can dispose the liquid crystal module and have good heat dispersion.
Description
Technical Field
The utility model belongs to the display field, concretely relates to liquid crystal module.
Background
Generally, the liquid crystal module is a screen + backlight assembly. For example, a display unit of a liquid crystal television is a liquid crystal module, which is equivalent to a picture tube in a CRT. Other parts comprise a power supply circuit, a signal processing circuit and the like, however, the existing liquid crystal module composition structure is relatively solidified, most of the liquid crystal module composition structure has no direct heat dissipation function, and actually, the heat dissipation of the liquid crystal module can influence the working energy consumption and the functional efficiency of a circuit board chip and also influence the service life of the liquid crystal module.
Disclosure of Invention
In order to solve the problems in the prior art, the utility model discloses a liquid crystal module, which comprises a heat dissipation total frame arranged in a wrapping manner, wherein a light filtering processing component is fixedly arranged at the upper part of the heat dissipation total frame, a first heat dissipation boundary strip is horizontally arranged at the lower part of the light filtering processing component in a penetrating manner, the two ends of the first heat dissipation boundary strip are connected with the heat dissipation total frame, a light filtering processing circuit integrated board is arranged at the two ends of the first heat dissipation boundary strip, a bearing plate is arranged at the lower part of the light filtering processing circuit integrated board, the first heat dissipation boundary strip is specifically arranged in a penetrating manner through the light filtering processing circuit integrated board, a liquid crystal composition layer is arranged at the lower part of the bearing plate, a horizontal second heat dissipation boundary strip is also arranged between the bearing plate and the liquid crystal composition layer, a horizontal third heat dissipation boundary strip is also arranged between the first heat dissipation boundary strip and the second heat dissipation boundary strip and in a penetrating manner through the light filtering processing circuit integrated board, the two ends of the second heat dissipation boundary strip are connected with the heat dissipation total frame, and the two ends of the third heat dissipation boundary strip are also connected with the heat dissipation total frame.
Furthermore, the filtering processing component adopts an infrared filtering structure, and the filtering processing circuit integrated board adopts an infrared processing circuit.
Furthermore, a toughened glass layer is arranged between the first heat dissipation boundary strip and the third heat dissipation boundary strip.
Furthermore, the filtering processing circuit integrated board and the supporting plate are electrically connected through a conducting wire.
Further, the heat dissipation total frame and/or the first heat dissipation boundary strip and/or the third heat dissipation boundary strip and/or the second heat dissipation boundary strip are made of aluminum alloy materials.
Furthermore, a mainboard circuit is fixedly arranged on the outer side of the liquid crystal composition layer, and the liquid crystal composition layer is connected with a control unit of the mainboard circuit.
Has the advantages that:
first heat dissipation boundary strip can gather the heat on upper strata and transmit the total frame of heat dissipation, third heat dissipation boundary strip can gather the heat on middle level and transmit the total frame of heat dissipation, second heat dissipation boundary strip can gather the heat of lower floor and transmit the total frame of heat dissipation, the total frame of heat dissipation be used for to outside whole heat dissipation, the utility model discloses can dispose the liquid crystal module and have good heat dispersion.
Description of the drawings:
fig. 1 is a schematic structural diagram of an embodiment of the present invention;
in the figure: a heat dissipation main frame 1; a filter processing component 2; a first heat dissipation boundary strip 3; a filter processing circuit integrated board 4; a second heat dissipation boundary strip 5; a support plate 6; a liquid crystal composition layer 7; and a third heat dissipation border strip 8.
Detailed Description
In specific implementation, the embodiment of the present invention shown in fig. 1 includes a heat dissipation frame 1 disposed in a wrapping manner, wherein a filter processing component 2 is fixedly disposed on an upper portion of the heat dissipation frame 1, a first heat dissipation boundary strip 3 is disposed below the filter processing component 2 in a horizontal penetrating manner, two ends of the first heat dissipation boundary strip 3 are connected to the heat dissipation frame 1, two ends of the first heat dissipation boundary strip 3 are disposed with a filter processing circuit integrated board 4, a supporting board 6 is disposed below the filter processing circuit integrated board 4, the first heat dissipation boundary strip 3 is disposed specifically in a penetrating manner through the filter processing circuit integrated board 4, a liquid crystal composition layer 7 is disposed below the supporting board 6, a horizontal second heat dissipation boundary strip 5 is disposed between the supporting board 6 and the liquid crystal composition layer 7, a horizontal third heat dissipation boundary strip 8 is disposed between the first heat dissipation boundary strip 3 and the second heat dissipation boundary strip 5 and in a penetrating manner through the filter processing circuit integrated board 4, the two ends of the second heat dissipation boundary strip 5 are connected with the heat dissipation main frame 1, and the two ends of the third heat dissipation boundary strip 8 are also connected with the heat dissipation main frame 1. In concrete implementation, first heat dissipation boundary strip 3 can gather the heat on upper strata and transmit the total frame 1 of heat dissipation, third heat dissipation boundary strip 8 can gather the heat on middle level and transmit the total frame 1 of heat dissipation, second heat dissipation boundary strip 5 can gather the heat on lower floor and transmit the total frame 1 of heat dissipation, total frame 1 of heat dissipation be used for to outside whole heat dissipation, the utility model discloses can dispose the liquid crystal module and have good heat dispersion
In a more preferable implementation, the embodiment of the present invention includes a heat dissipation frame 1 disposed in a wrapping manner, wherein a light filtering processing component 2 is fixedly disposed on an upper portion of the heat dissipation frame 1, a first heat dissipation boundary strip 3 is disposed below the light filtering processing component 2 in a horizontal manner, two ends of the first heat dissipation boundary strip 3 are connected to the heat dissipation frame 1, two ends of the first heat dissipation boundary strip 3 are disposed with a light filtering processing circuit integrated board 4, a supporting board 6 is disposed below the light filtering processing circuit integrated board 4, the first heat dissipation boundary strip 3 is specifically disposed below the light filtering processing circuit integrated board 4, a liquid crystal composition layer 7 is disposed below the supporting board 6, a horizontal second heat dissipation boundary strip 5 is further disposed between the supporting board 6 and the liquid crystal composition layer 7, a horizontal third heat dissipation boundary strip 8 is disposed between the first heat dissipation boundary strip 3 and the second heat dissipation boundary strip 5 and through the light filtering processing circuit integrated board 4, the two ends of the second heat dissipation boundary strip 5 are connected with the heat dissipation main frame 1, and the two ends of the third heat dissipation boundary strip 8 are also connected with the heat dissipation main frame 1. The filtering processing component 2 adopts an infrared filtering structure, and the filtering processing circuit integrated board 4 adopts an infrared processing circuit.
In a more preferable implementation, the embodiment of the present invention includes a heat dissipation frame 1 disposed in a wrapping manner, wherein a light filtering processing component 2 is fixedly disposed on an upper portion of the heat dissipation frame 1, a first heat dissipation boundary strip 3 is disposed below the light filtering processing component 2 in a horizontal manner, two ends of the first heat dissipation boundary strip 3 are connected to the heat dissipation frame 1, two ends of the first heat dissipation boundary strip 3 are disposed with a light filtering processing circuit integrated board 4, a supporting board 6 is disposed below the light filtering processing circuit integrated board 4, the first heat dissipation boundary strip 3 is specifically disposed below the light filtering processing circuit integrated board 4, a liquid crystal composition layer 7 is disposed below the supporting board 6, a horizontal second heat dissipation boundary strip 5 is further disposed between the supporting board 6 and the liquid crystal composition layer 7, a horizontal third heat dissipation boundary strip 8 is disposed between the first heat dissipation boundary strip 3 and the second heat dissipation boundary strip 5 and through the light filtering processing circuit integrated board 4, the two ends of the second heat dissipation boundary strip 5 are connected with the heat dissipation main frame 1, and the two ends of the third heat dissipation boundary strip 8 are also connected with the heat dissipation main frame 1. And a toughened glass layer is also arranged between the first heat dissipation boundary strip 3 and the third heat dissipation boundary strip 8.
In a more preferable implementation, the embodiment of the present invention includes a heat dissipation frame 1 disposed in a wrapping manner, wherein a light filtering processing component 2 is fixedly disposed on an upper portion of the heat dissipation frame 1, a first heat dissipation boundary strip 3 is disposed below the light filtering processing component 2 in a horizontal manner, two ends of the first heat dissipation boundary strip 3 are connected to the heat dissipation frame 1, two ends of the first heat dissipation boundary strip 3 are disposed with a light filtering processing circuit integrated board 4, a supporting board 6 is disposed below the light filtering processing circuit integrated board 4, the first heat dissipation boundary strip 3 is specifically disposed below the light filtering processing circuit integrated board 4, a liquid crystal composition layer 7 is disposed below the supporting board 6, a horizontal second heat dissipation boundary strip 5 is further disposed between the supporting board 6 and the liquid crystal composition layer 7, a horizontal third heat dissipation boundary strip 8 is disposed between the first heat dissipation boundary strip 3 and the second heat dissipation boundary strip 5 and through the light filtering processing circuit integrated board 4, the two ends of the second heat dissipation boundary strip 5 are connected with the heat dissipation main frame 1, and the two ends of the third heat dissipation boundary strip 8 are also connected with the heat dissipation main frame 1. The filtering processing circuit integrated board 4 and the supporting board 6 are electrically connected through a conducting wire.
In a more preferable implementation, the embodiment of the present invention includes a heat dissipation frame 1 disposed in a wrapping manner, wherein a light filtering processing component 2 is fixedly disposed on an upper portion of the heat dissipation frame 1, a first heat dissipation boundary strip 3 is disposed below the light filtering processing component 2 in a horizontal manner, two ends of the first heat dissipation boundary strip 3 are connected to the heat dissipation frame 1, two ends of the first heat dissipation boundary strip 3 are disposed with a light filtering processing circuit integrated board 4, a supporting board 6 is disposed below the light filtering processing circuit integrated board 4, the first heat dissipation boundary strip 3 is specifically disposed below the light filtering processing circuit integrated board 4, a liquid crystal composition layer 7 is disposed below the supporting board 6, a horizontal second heat dissipation boundary strip 5 is further disposed between the supporting board 6 and the liquid crystal composition layer 7, a horizontal third heat dissipation boundary strip 8 is disposed between the first heat dissipation boundary strip 3 and the second heat dissipation boundary strip 5 and through the light filtering processing circuit integrated board 4, the two ends of the second heat dissipation boundary strip 5 are connected with the heat dissipation main frame 1, and the two ends of the third heat dissipation boundary strip 8 are also connected with the heat dissipation main frame 1. The heat dissipation frame 1 and/or the first heat dissipation boundary strip 3 and/or the third heat dissipation boundary strip 8 and/or the second heat dissipation boundary strip 5 are made of aluminum alloy.
In a more preferable implementation, the embodiment of the present invention includes a heat dissipation frame 1 disposed in a wrapping manner, wherein a light filtering processing component 2 is fixedly disposed on an upper portion of the heat dissipation frame 1, a first heat dissipation boundary strip 3 is disposed below the light filtering processing component 2 in a horizontal manner, two ends of the first heat dissipation boundary strip 3 are connected to the heat dissipation frame 1, two ends of the first heat dissipation boundary strip 3 are disposed with a light filtering processing circuit integrated board 4, a supporting board 6 is disposed below the light filtering processing circuit integrated board 4, the first heat dissipation boundary strip 3 is specifically disposed below the light filtering processing circuit integrated board 4, a liquid crystal composition layer 7 is disposed below the supporting board 6, a horizontal second heat dissipation boundary strip 5 is further disposed between the supporting board 6 and the liquid crystal composition layer 7, a horizontal third heat dissipation boundary strip 8 is disposed between the first heat dissipation boundary strip 3 and the second heat dissipation boundary strip 5 and through the light filtering processing circuit integrated board 4, the two ends of the second heat dissipation boundary strip 5 are connected with the heat dissipation main frame 1, and the two ends of the third heat dissipation boundary strip 8 are also connected with the heat dissipation main frame 1. The outer side of the liquid crystal composition layer 7 is also fixedly provided with a main board circuit, and the liquid crystal composition layer 7 is connected with a control unit of the main board circuit.
It should be noted that the above-mentioned embodiments are only examples of the present invention, and it should be understood that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principle and spirit of the present invention to obtain other embodiments, and the scope of protection of the present invention should be within the scope of the claims of the present invention.
Claims (6)
1. The liquid crystal module is characterized by comprising a heat dissipation total frame arranged in a wrapping manner, wherein a light filtering processing assembly is fixedly arranged at the upper part of the heat dissipation total frame, a first heat dissipation boundary strip is horizontally arranged at the lower part of the light filtering processing assembly in a penetrating manner, the two ends of the first heat dissipation boundary strip are connected with the heat dissipation total frame, light filtering processing circuit integrated boards are arranged at the two ends of the first heat dissipation boundary strip, a bearing plate is arranged at the lower part of the light filtering processing circuit integrated boards, the first heat dissipation boundary strip is specifically arranged in a penetrating manner through the light filtering processing circuit integrated boards, a liquid crystal composition layer is arranged at the lower part of the bearing plate, a horizontal second heat dissipation boundary strip is further arranged between the bearing plate and the liquid crystal composition layer, a horizontal third heat dissipation boundary strip is further arranged between the first heat dissipation boundary strip and the second heat dissipation boundary strip in a penetrating manner through the light filtering processing circuit integrated boards, and a horizontal third heat dissipation boundary strip is connected with the two ends of the heat dissipation total frame, and both ends of the third heat dissipation boundary strip are also connected with the heat dissipation main frame.
2. The liquid crystal module as claimed in claim 1, wherein the filter processing module employs an infrared filter structure, and the filter processing circuit board employs an infrared processing circuit.
3. The liquid crystal module of claim 1, wherein a tempered glass layer is further disposed between the first and third heat dissipation boundary strips.
4. The liquid crystal module as claimed in claim 1, wherein the filter processing circuit board is electrically connected to the supporting board via a wire.
5. The liquid crystal module of claim 1, wherein the heat dissipation frame and/or the first heat dissipation border strip and/or the third heat dissipation border strip and/or the second heat dissipation border strip are made of aluminum alloy.
6. The liquid crystal module of claim 1, wherein a main board circuit is further fixed outside the liquid crystal composition layer, and the liquid crystal composition layer is connected to a control unit of the main board circuit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202023202488.6U CN213904000U (en) | 2020-12-26 | 2020-12-26 | Liquid crystal module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202023202488.6U CN213904000U (en) | 2020-12-26 | 2020-12-26 | Liquid crystal module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213904000U true CN213904000U (en) | 2021-08-06 |
Family
ID=77106271
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202023202488.6U Expired - Fee Related CN213904000U (en) | 2020-12-26 | 2020-12-26 | Liquid crystal module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213904000U (en) |
-
2020
- 2020-12-26 CN CN202023202488.6U patent/CN213904000U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20210806 |