CN213903387U - Contact thermal resistance testing system with variable pressure and temperature in deep low-temperature region - Google Patents
Contact thermal resistance testing system with variable pressure and temperature in deep low-temperature region Download PDFInfo
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- CN213903387U CN213903387U CN202022010064.3U CN202022010064U CN213903387U CN 213903387 U CN213903387 U CN 213903387U CN 202022010064 U CN202022010064 U CN 202022010064U CN 213903387 U CN213903387 U CN 213903387U
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Abstract
The patent discloses a contact thermal resistance testing system with variable pressure and temperature in a deep low temperature region, wherein a testing device of the system comprises a vacuum cavity, a heat insulation multilayer material, a radiation-proof cold screen, a solid heat insulation material, a sample clamp, a testing platform and a vacuum cavity bottom plate; the pressure loading device of the system comprises a pressure sensor, an air inlet pipeline, a pressure-bearing corrugated pipe and a heat insulation screw rod; the heating temperature measuring device of the system comprises a heating plate, a temperature sensor and a heating wire; the refrigerating device of the system comprises an oxygen-free copper cold head, a refrigerator and a compressor. The pressure loading device and the heating temperature measuring device are both arranged in the vacuum cavity; the refrigerating device is arranged on the vacuum cavity bottom plate; all the devices are fastened and connected through screws; the low-temperature cold source of the testing device is provided by the refrigerating device; in the experimental test process, the temperature of each part and the heating quantity of the sample are collected in real time through the heating temperature measuring device. This patent has advantages such as easy operation, temperature fluctuation are little, maneuverability is high, test time is short, the precision is high.
Description
Technical Field
This patent belongs to the low temperature heat transfer field, concretely relates to contact thermal resistance test system of dark low temperature district variable pressure and temperature.
Background
The vigorous development of aerospace science and technology provides great assistance for human exploration universe. The superconducting quantum interference device, the superconducting photon detector, the millimeter and submillimeter wave detection and other deep space detectors need a space refrigeration system to provide deep low-temperature, so a high-reliability and long-service-life low-temperature system is a necessary condition. The cryogenic system usually works in the environments of high vacuum, cryogenic temperature and microgravity, the predominant heat exchange mode is not gas convection heat exchange, the influence is almost negligible, heat conduction and radiation are the main heat exchange modes in the satellite, and the heat conduction condition is usually analyzed by analyzing the heat resistance on a heat conduction path. The solid interface thermal resistance is a ubiquitous and necessary-to-solve analysis calculation and design manufacturing problem in electronic technology, deep space exploration and superconducting technology. The research on the contact thermal resistance of the solid interface in the low-temperature region is very important for seeking a more effective heat dissipation method to reduce the proportion of the thermal control system in the total weight of the deep space exploration refrigeration system. The method is an important link in the thermal control design and thermal control implementation process of the deep space probe, and the accurate analysis and calculation of the contact thermal resistance can improve the thermal simulation accuracy and the thermal design rationality.
The solid interface contact thermal resistance is influenced by various factors and is often obtained through experimental tests in practical research. In the testing process of the contact thermal resistance of the solid interface in the deep low-temperature region, the solid interface is often required to be placed in a vacuum cavity due to the influence of temperature and heat loss, so that the difficulty of variable pressure and temperature testing is increased. It is desirable that the pressure loading device and test platform temperature be adjustable outside the vacuum chamber.
Disclosure of Invention
This patent has improved a dark low temperature district can realize that pressure and temperature are adjustable at any time in vacuum environment, the thermal contact resistance test system of measurement accuracy height, maneuverability is strong, has solved and has got back to the normal atmospheric temperature and destroy the vacuum environment among the thermal contact resistance test process and just can change pressure and temperature etc. many times long-time operation, refrigerator temperature fluctuation influence big, the maneuverability low grade problem to measurement accuracy.
The technical scheme of this patent is:
the patent provides a contact thermal resistance test system of dark low temperature district variable pressure and temperature, including testing arrangement 1, pressure loading device 2, heating temperature measuring device 3, refrigerating plant 4. The testing device 1 comprises a vacuum cavity 1.1, a heat insulation multilayer material 1.2, a radiation-proof cold screen 1.3, a solid heat insulation material 1.4, a sample clamp 1.5, a testing platform 1.6 and a vacuum cavity bottom plate 1.7; the pressure loading device 2 comprises a pressure sensor 2.1, an air inlet pipeline 2.2, a pressure-bearing corrugated pipe 2.3 and a heat-insulating screw rod 2.4; the heating temperature measuring device 3 comprises a heating plate 3.1, a temperature sensor 3.2 and a heating wire 3.3; the refrigerating device 4 comprises an oxygen-free copper cold head 4.1, a refrigerator 4.2 and a compressor 4.3. The method is characterized in that: in order to reduce the radiant Europe heat on the surface of the sample, a pressure loading device 2, a heating temperature measuring device 3, an oxygen-free copper cold head 4.1 and a refrigerator 4.2 are arranged in a vacuum cavity 1.1, and vacuumizing treatment is carried out in the experimental process; the low-temperature cold source of the testing device 1 is provided by a refrigerating device 4; the two samples are respectively fixed on a heating plate 3.1 and a testing platform 1.6 through threaded connection by a sample clamp 1.5, the testing platform 1.6 is fixed on an oxygen-free copper cold head 4.1, wherein the heating plate 3.1 is a sample hot end, and the oxygen-free copper cold head 4.1 is a sample cold end; the pressure-bearing corrugated pipe 2.3 is fixed on a solid heat-insulating material 1.4 and an oxygen-free copper cold head 4.1 through a heat-insulating screw 2.4; the refrigerator 4.2 is fixed on the vacuum chamber bottom plate 1.7 through screw connection.
The sample clamp 1.5 is made of an oxygen-free copper material with high heat conductivity coefficient, a cylindrical groove with the diameter equal to that of the sample is machined on the upper end face of the sample clamp, the sample clamp is cut into two halves and connected by threads, the sample clamp is convenient to mount and fix in the testing process, and thermal contact resistance between the sample and the clamp is reduced. In order to reduce the radiation heat leakage of the surface of the sample, a radiation-proof cold screen 1.3 is arranged on the periphery of the sample, and a heat-insulating multilayer material 1.2 is wrapped on the periphery. In order to enable the heat to pass through the sample contact surface, a solid heat-insulating material 1.4 is arranged between the heating plate 3.1 and the pressure-bearing corrugated pipe 2.3, so that the heat leakage is effectively reduced, and the accuracy of a test result is improved.
The pressure loading device 2 is connected with the upper end face of the pressure-bearing corrugated pipe 2.3 and the oxygen-free copper cold head 4.1 through six heat-insulating screws 2.4 which are uniformly distributed on the circumference, and the pressure-bearing corrugated pipe 2.3 is fixed on the heat-insulating solid material 1.4 and the transverse displacement of the pressure-bearing corrugated pipe 2.3 is limited. The air inlet pipeline 2.2 realizes the connection of the inside and the outside of the vacuum cavity 1.1 through a plate penetrating clamping sleeve. The external gas filling platform of the gas inlet pipeline 2.2 can realize the gas filling and discharging of the pressure-bearing corrugated pipe 2.3 to change the longitudinal deformation of the corrugated pipe, thereby achieving the effect of loading pressure and unloading pressure on the sample contact surface. The pressure in the pressure-bearing corrugated pipe 2.3 can be obtained by monitoring the pressure sensor 2.1 in real time. The pressure loading device 2 can apply pressure to the sample and unload the pressure without damaging the vacuum environment, and the pressure is adjustable, so that the testing time is effectively reduced, and the operability is improved.
The temperature of the surface of the sample and the surface of the oxygen-free copper cold head 4.1 is measured by a temperature sensor 3.2, heating wires 3.3 are uniformly distributed on the lower bottom surface of the oxygen-free copper cold head 4.1, the temperature of the oxygen-free copper cold head 4.1 is changed by changing the heating amount, and the temperature of the contact surface of the sample is increased or reduced. A test platform 1.6 made of a solid material with high heat capacity and low heat conductivity coefficient is arranged between the oxygen-free copper cold head 4.1 and the sample clamp 1.5, so that temperature fluctuation caused by the refrigerator 4.2 can be effectively reduced, and the accuracy of thermal contact resistance measurement is improved. The heating plate 3.1, the temperature sensor 3.2 and the heating wire 3.3 are connected with a computer through a data cable and a data acquisition board card to realize the control of heating quantity, the heating and the acquisition of temperature data and the sealing of vacuum environment.
The advantage of this patent lies in: this dark low temperature district variable pressure and temperature's thermal contact resistance test system gives up through aerifing to the pressure-bearing bellows in the vacuum chamber to implement pressure loading and uninstallation and has replaced artifical manual change pressure to avoided needing to get back to the normal atmospheric temperature and open many times long-time operations such as vacuum chamber and can change pressure, can be at any time at the experimentation simultaneously pressure regulation, effectively reduced the time of test and improved maneuverability. The solid heat-insulating material is arranged between the sample and the pressure loading device, the low-temperature radiation-proof cold screen is arranged outside the sample, and the heat-insulating multilayer material is wrapped, so that heat conduction and radiation heat leakage of the test sample are effectively reduced, and the test precision is improved. A test platform made of a high-heat-capacity low-heat-conduction solid material is arranged between the sample clamp and the oxygen-free copper cold head, so that the temperature fluctuation of the refrigerating machine can be effectively inhibited, and the accuracy of a test result is effectively improved. The method has the advantages of high precision, short experimental time, variable adjustment, high operability and the like.
Drawings
FIG. 1 is a schematic diagram of a contact thermal resistance test system with variable pressure and temperature in a cryogenic region;
in the figure: 1.1 vacuum cavity, 1.2 heat-insulating multilayer material, 1.3 radiation-proof cold screen, 1.4 solid heat-insulating material, 1.5 sample clamp, 1.6 test platform, 1.7 vacuum cavity bottom plate, 2.1 pressure sensor, 2.2 air inlet pipeline, 2.3 pressure-bearing corrugated pipe, 2.4 heat-insulating screw, 3.1 heating plate, 3.2 temperature sensor, 3.3 heating wire, 4.1 oxygen-free copper cold head, 4.2 refrigerator, 4.3 compressor.
Detailed Description
The patent is further described with reference to the accompanying drawings and examples.
As shown in FIG. 1, the patent provides a contact thermal resistance test system with variable pressure and temperature in a deep low temperature region, and the high-precision test device is applied to the measurement of the solid contact thermal resistance in the deep low temperature region. The testing device is integrally placed in a vacuum cavity 1.1, a radiation-proof cold screen 1.3 is arranged, and a heat-insulating multilayer material 1.2 is wrapped outside the cold screen, so that the radiation heat leakage of a test sample during measurement in a deep low-temperature area is effectively reduced. Wherein the vacuum cavity 1.1 is made of stainless steel material and has a thickness of 20 mm; the heat-insulating multilayer material 1.2 is formed by overlapping 10 layers of double-sided aluminized film perforations and 10 layers of non-woven fabrics, and can effectively reduce the radiation amount of the radiation-proof cold screen to the outside; the radiation-proof cold screen 1.3 is made of oxygen-free copper material; the solid heat-insulating material 1.4 is made of polyimide material, and a threaded hole is arranged on the solid heat-insulating material and is in threaded connection with the sample clamp 1.5; the sample clamp 1.5 is made of an oxygen-free copper material and is cut into two parts, a sample groove is arranged at the central part, the diameter of the groove is equal to the diameter of the sample, the sample clamp 1.5 and the sample can be ensured to be in full contact through threaded connection, and the thermal contact resistance between the sample clamp and the sample is reduced; the test platform 1.6 is made of a stainless steel material with high heat capacity and low heat conduction, and the 200mK temperature fluctuation can be effectively reduced to below 10mK by superposing 8 stainless steel sheets with the thickness of 4mm, so that the accuracy of a test result is further improved; the vacuum cavity bottom plate 1.7 is made of stainless steel material, has the thickness of 20mm and is in threaded connection with the vacuum cavity 1.1; the pressure-bearing corrugated pipe 2.3 adopts a disc type corrugated pipe, one end of the corrugated pipe is sealed, and the other end of the corrugated pipe is provided with an inflation inlet which is connected with the air inlet pipeline 2.2; the heat insulation screw 2.4 is made of polyimide materials, so that heat conduction and heat leakage of the whole system in the test process are reduced; the pressure sensor 2.1 adopts a standard static pressure sensor; the refrigerating device 4 adopts a JT refrigerator or a pulse tube refrigerator to provide low temperature for the cold end of the sample. Aerify and bleed pressure-bearing bellows 2.3 through aerifing the platform, change the pressure between the sample under adiabatic screw rod 2.4 stop device's cooperation to through pressure sensor 2.1 real-time supervision pressure variation and with this feedback regulation pressure, thereby avoided needing to get back to the normal atmospheric temperature and pressure and could change many times long-time operations such as pressure, can be at any time at the experimentation simultaneously regulated pressure, effectively reduced the time of test and improved maneuverability.
When the system is actually used, the high-precision contact thermal resistance testing system with variable pressure and temperature in the deep low-temperature region carries out vacuum pumping treatment, and the vacuum degree of a vacuum cavity is kept at 10-6Pa above, used to reduce convective heat transfer in the device. After the vacuum degree of the contact thermal resistance high-precision testing system meets the requirement, the refrigerating device is opened to carry out the same test on the platform and the radiation-proof cold screenThe temperature reduction treatment is carried out step by step, so that the radiation heat leakage quantity of the test sample is further reduced, and the test precision is improved.
The working process of the patent comprises the following steps:
the installation process comprises the following steps:
when the solid interface thermal contact resistance is measured by adopting a steady state method, a test sample is fixed in a sample clamp 1.5 and is clamped by an assembly screw hole, the contact area between the sample and the clamp is increased, and the thermal contact resistance is reduced by coating heat-conducting silicone grease between contact surfaces; and simultaneously fixing the lower clamp on the test platform and fixing the upper clamp on the solid heat-insulating material. And the pressure-bearing corrugated pipe is arranged above the solid heat-insulating material, and six heat-insulating screws sequentially penetrate through the pressure-bearing corrugated pipe, the solid heat-insulating material, the test platform and the refrigerator cold head and are fixed by bolts, so that the position and the transverse displacement of the pressure-bearing corrugated pipe are limited. Four temperature sensors are arranged on the circumference of the surface of the sample, and a data cable of the temperature acquisition unit is connected with the temperature sensors in the vacuum cavity through fifty-five cores to realize temperature data acquisition and sealing of the vacuum cavity.
And (3) vacuumizing:
in order to reduce the convective heat exchange loss of a sample, after a high-precision measuring device of contact thermal resistance is installed, the testing device needs to be vacuumized, and the vacuum degree of the whole testing device needs to be kept at 10-6Pa or above. And then, vacuumizing and replacing the pipeline of the refrigerator, and opening the refrigerator to synchronously cool the radiation-proof cold screen of the test platform until the expected test temperature is reached.
And (3) pressurizing process:
when the precooling gas pipeline in the pressure device is vacuumized, the gas is inflated according to the required pressure value. And the pressure of the pipeline is measured in real time according to the pressure sensor 2.1, real-time pressure data is fed back and then is regulated at best, and further the pressure value of a sample contact interface is changed.
The heating temperature measuring device (3) comprises a heating plate (3.1), a temperature sensor (3.2) and a heating wire (3.3). The heating plate (3.1) is connected to the upper end of the sample clamp (1.5) through a screw and serves as the hot end of the sample. The surface temperature of the sample and the surface temperature of the oxygen-free copper cold head (4.1) are measured by a temperature sensor (3.2), heating wires (3.3) are uniformly distributed on the lower bottom surface of the oxygen-free copper cold head (4.1), and the temperature of the oxygen-free copper cold head (4.1) is changed by changing the heating amount, so that the temperature of the contact surface of the sample is increased or reduced. The heating plate, the temperature sensor and the heating wire are connected with a computer through a data cable and a data acquisition board card to realize the control of heating quantity, the heating and the acquisition of temperature data and the sealing of a vacuum environment.
Temperature control process:
the heating quantity of the heating wire 3.3 on the lower surface of the oxygen-free copper cold head 4.1 is controlled, so that the temperature of the oxygen-free copper cold head 4.1 is changed, the temperature of the contact surface of a sample is increased or reduced, and the temperature is considered to be the temperature when the temperature change is less than 10mK within ten minutes of the temperature of the cold head.
Heating process:
the hot end of the sample is heated by starting the heating power supply of the heating plate 3.1, the temperature of the contact surface of the sample is monitored in real time by the temperature sensor 3.2, and the axial heat flow transfer of the sample can be considered to reach a stable state when the mean value of the temperature of the sample to be tested does not change obviously.
The data acquisition process comprises the following steps:
after the heat flow is stable, the resistance value of the temperature sensor changes along with the change of the temperature of the measuring points, the resistance value is transmitted to a temperature computer through a data cable and a board card to be converted into the temperature of each measuring point of the two solid contact surfaces, and a temperature change curve graph along with time is stored and drawn in real time.
A temperature return process:
the high-precision contact thermal resistance testing system with variable pressure and temperature in the deep low-temperature region still has lower temperature when the operation is finished, and in order to protect system components, the temperature is returned firstly. Firstly, the pressure device is unloaded, and the heating temperature measuring device is closed. Then the compressor 4.3 is closed, and as the whole system is in a vacuum environment and heat can only be introduced through radiation heat exchange, the passive temperature return mode is long in time, and active heating temperature return is needed. The heating wire 3.3 on the lower surface of the oxygen-free copper cold head 4.1 can be independently opened to provide heat required by temperature return, and the time required by the temperature return of the system is shortened.
Finally, it should be noted that: it will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, and that the embodiments and descriptions are only illustrative of the principles of the patent, and that various changes and modifications may be made without departing from the spirit and scope of the patent, which shall fall within the scope of the claims. The scope of the patent claims is defined by the appended claims and their equivalents.
Claims (5)
1. A contact thermal resistance test system with variable pressure and temperature in a deep low temperature region comprises a test device (1), a pressure loading device (2), a heating temperature measuring device (3) and a refrigerating device (4); the method is characterized in that:
the pressure loading device (2) and the heating temperature measuring device (3) are both arranged in the vacuum cavity (1.1); the refrigerating device (4) is arranged on the vacuum cavity bottom plate (1.7); all the devices are fastened and connected through screws; the low-temperature cold source of the testing device (1) is provided by the refrigerating device (4).
2. The system for testing contact thermal resistance of cryogenic temperature zone with variable pressure and temperature according to claim 1, wherein:
the testing device (1) comprises a testing device and a testing device, wherein the testing device comprises a vacuum cavity (1.1), a heat-insulating multilayer material (1.2), a radiation-proof cold screen (1.3), a solid heat-insulating material (1.4), a sample clamp (1.5), a testing platform (1.6) and a vacuum cavity bottom plate (1.7); the sample clamp (1.5) is made of an oxygen-free copper material with high heat conductivity coefficient, a cylindrical groove with the diameter equal to that of the sample is processed on the upper end surface, and the sample clamp is cut into two halves and connected by threads; the whole sample stage is placed in a vacuum cavity (1.1), a radiation-proof cold screen (1.3) is arranged on the periphery of the sample, and a heat-insulating multilayer material (1.2) is wrapped outside the cold screen; a solid heat insulating material (1.4) is arranged between the heating plate (3.1) and the pressure-bearing corrugated pipe (2.3).
3. The system for testing contact thermal resistance of cryogenic temperature zone with variable pressure and temperature according to claim 1, wherein:
the pressure loading device (2) comprises a pressure sensor (2.1), an air inlet pipeline (2.2), a pressure-bearing corrugated pipe (2.3) and a heat-insulating screw (2.4); six adiabatic screw rods (2.4) through circumference equipartition connect pressure-bearing bellows (2.3) up end and oxygen-free copper cold head (4.1), have restricted the lateral displacement of pressure-bearing bellows (2.3) when fixing pressure-bearing bellows (2.3) on adiabatic solid material (1.4), and air inlet pipe way (2.2) realize the connection inside and outside vacuum chamber body (1.1) through wearing the board cutting ferrule, and air inlet pipe way (2.2) external gas filling platform.
4. The system for testing contact thermal resistance of cryogenic temperature zone with variable pressure and temperature according to claim 1, wherein:
the heating temperature measuring device (3) comprises a heating plate (3.1), a temperature sensor (3.2) and a heating wire (3.3); the heating plate (3.1) is connected to the upper end of the sample clamp (1.5) through screws, the heating wires (3.3) are uniformly distributed on the lower bottom surface of the oxygen-free copper cold head (4.1), and the heating plate, the temperature sensor and the heating wires are connected with a computer through a data cable and a data acquisition board card to realize heating control, heating, temperature data acquisition and sealing in a vacuum environment.
5. The system for testing contact thermal resistance of cryogenic temperature zone with variable pressure and temperature according to claim 1, wherein:
the refrigerating device (4) comprises an oxygen-free copper cold head (4.1), a refrigerating machine (4.2) and a compressor (4.3); a test platform (1.6) made of solid materials with high heat capacity and low heat conductivity coefficient is arranged between the oxygen-free copper cold head (4.1) and the sample clamp (1.5).
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115355664A (en) * | 2022-08-26 | 2022-11-18 | 兰州空间技术物理研究所 | Mechanical and thermal coupling structure between refrigerating finger and cooling object of refrigerating machine |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115355664A (en) * | 2022-08-26 | 2022-11-18 | 兰州空间技术物理研究所 | Mechanical and thermal coupling structure between refrigerating finger and cooling object of refrigerating machine |
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