CN213901542U - Semiconductor heat sink for medical temperature controller - Google Patents
Semiconductor heat sink for medical temperature controller Download PDFInfo
- Publication number
- CN213901542U CN213901542U CN202023153619.6U CN202023153619U CN213901542U CN 213901542 U CN213901542 U CN 213901542U CN 202023153619 U CN202023153619 U CN 202023153619U CN 213901542 U CN213901542 U CN 213901542U
- Authority
- CN
- China
- Prior art keywords
- fan
- semiconductor
- heat dissipation
- refrigeration piece
- semiconductor refrigeration
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Thermotherapy And Cooling Therapy Devices (AREA)
Abstract
The utility model belongs to the heat-radiating equipment field relates to a medical accuse temperature appearance semiconductor heat abstractor. The utility model provides a medical temperature control appearance semiconductor heat abstractor, includes the semiconductor refrigeration piece, the semiconductor refrigeration piece includes refrigeration end and heat dissipation end, the heat dissipation end is connected with the fan, the fan is vertical to be placed, it has the inner loop pipeline of refrigerant to be provided with between fan and the heat dissipation end to fill, the inner loop pipeline includes the semiconductor refrigeration piece cooling area with heat dissipation end contact and the fan heat dissipation area that sets up with fan contact, be provided with the pressure boost valve between fan cooling area and the semiconductor refrigeration piece cooling area, be provided with the one-way water valve between pressure boost valve and the semiconductor refrigeration piece cooling area. The utility model discloses a set up the booster pump and pressurize liquid refrigerant, make gaseous state refrigerant condense to get into semiconductor refrigeration piece cooling area through one-way water valve after the liquid to accomplish the cooling process. The condensing agent circulation can be completed without a compressor and the like, and the internal space of the temperature control instrument is saved.
Description
Technical Field
The utility model belongs to the heat-radiating equipment field relates to a medical accuse temperature appearance semiconductor heat abstractor.
Background
Medical temperature control instruments are commonly used to regulate the temperature of an external circulation line (e.g., an external water blanket) to meet the needs of a user. When the external water blanket is an external circulation pipeline, the external water blanket can be divided into a blanket, a cap, an elbow sleeve, an ankle sleeve, a waist sleeve, a shoulder sleeve and the like according to different body parts, and the capacity of each external circulation pipeline is different. In the conventional medical temperature controller, an evaporator or a heater is generally arranged in a water tank, liquid in the water tank is cooled or heated to a set temperature, and the liquid in the water tank is circularly conveyed in the water tank and an external circulating pipeline, so that the liquid circulation and the temperature control of the medical temperature controller are realized.
The medical temperature control instrument on the market realizes heat exchange through a built-in condensing device, wherein a water pump and a water tank are arranged to realize the internal circulation of condensing agents, and then the condensing device is cooled, but the volume of the water pump in the condensing device or the condensing device is large, so that the volume of the medical temperature control instrument is large. However, in the modern day of increasingly miniaturized and intelligent equipment, the size of the equipment is reduced as much as possible, so that the equipment is convenient to place, and the internal equipment is required to be reduced in size, and the space of the internal equipment is also required to be reasonably utilized.
SUMMERY OF THE UTILITY MODEL
The utility model provides a semiconductor refrigeration piece heat abstractor of simple structure, easily operation to the problem that foretell medical temperature control appearance exists.
In order to achieve the purpose, the utility model discloses a technical scheme do, a medical temperature control appearance semiconductor heat abstractor, including the semiconductor refrigeration piece, the semiconductor refrigeration piece includes refrigeration end and heat dissipation end, the heat dissipation end is connected with the fan, the fan is vertical to be placed, it has the inner loop pipeline of refrigerant to be provided with to fill between fan and the heat dissipation end, the inner loop pipeline include with the semiconductor refrigeration piece cooling zone of heat dissipation end contact and with the fan heat dissipation district that the fan contact set up, be provided with the pressure boost valve between fan heat dissipation district and the semiconductor refrigeration piece cooling zone, be provided with the one-way water valve between pressure boost valve and the semiconductor refrigeration piece cooling zone.
Preferably, the internal circulation pipeline is a copper pipe.
Preferably, the internal circulation pipeline is further provided with a radiating fin, and the radiating fin is arranged between the cooling area of the semiconductor refrigerating fin and the radiating area of the fan.
Preferably, the heat dissipation fins are arranged at intervals from top to bottom.
Compared with the prior art, the utility model has the advantages and positive effects that,
1. the utility model discloses a set up the booster pump and pressurize liquid refrigerant, make gaseous state refrigerant condense to get into semiconductor refrigeration piece cooling area through one-way water valve after the liquid to accomplish the cooling process. The condensing agent circulation can be completed without a compressor and the like, and the internal space of the temperature control instrument is saved. The utility model discloses simple structure, easily operation suit use widely.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without inventive labor.
FIG. 1 is a schematic structural view of a semiconductor heat sink of a medical temperature controller;
FIG. 2 is a cross-sectional view of a semiconductor heat sink of the medical temperature controller;
in the above figures, 1, a semiconductor refrigeration piece; 2. an internal circulation line; 3. a fan heat dissipation area; 4. a fan; 5. a semiconductor refrigerating plate cooling area; 6. a pressure increasing valve; 7. a one-way water valve; 8. a heat dissipation end; 9. and a heat sink.
Detailed Description
In order to make the above objects, features and advantages of the present invention more clearly understood, the present invention will be further described with reference to the accompanying drawings and examples. It should be noted that the embodiments and features of the embodiments of the present application may be combined with each other without conflict.
In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention, however, the present invention may be practiced in other ways than those specifically described herein, and therefore the present invention is not limited to the limitations of the specific embodiments of the present disclosure.
As shown in figures 1 and 2, the utility model relates to a semiconductor heat dissipation device of a medical temperature control instrument, which is used for cooling a semiconductor refrigeration sheet in the temperature control instrument, the utility model comprises a semiconductor refrigeration sheet 1, the semiconductor refrigeration sheet comprises a refrigeration end for refrigeration and a heat dissipation end 8 for heat dissipation, in order to realize the cooling of the semiconductor refrigeration piece and solve the defect that the temperature control instrument is too large due to the cooling by a compressor, the heat dissipation end 8 of the semiconductor refrigeration piece is connected with a fan 4, an internal circulation pipeline 2 filled with refrigerant, namely condensing agent, is arranged between the fan 4 and the heat dissipation end 8, in order to make the best use of space, it is necessary that the fan 4 not only be able to lie flat, but also be able to be vertically positioned, which allows more mounting options for the heat sink, when the refrigerant circulating device is vertically placed, the refrigerant in the internal circulation pipeline 2 needs to be capable of realizing circulation in the vertical direction against the gravity. The internal circulation pipeline 2 comprises a semiconductor chilling plate cooling area 5 in contact with a heat dissipation end 8 and a fan cooling area 3 in contact with a fan 4, vaporized refrigerants are cooled and liquefied in the fan cooling area 3, a pressure increasing valve 6 is arranged in the fan cooling area 3 and used for increasing the pressure of the refrigerants cooled and liquefied in the fan cooling area 3, the pressure increasing valve 6 is a device for increasing the pressure of liquid and gas commonly used in equipment such as an air compressor and the like, so that the number of the devices is not limited, a one-way water valve 7 is arranged between the pressure increasing valve 6 and the semiconductor chilling plate cooling area 5, and the one-way water valve 7 only allows the refrigerants in the fan cooling area 3 to flow to the semiconductor chilling plate cooling area 5. The pressurized refrigerant overcomes the hydraulic pressure and gravity of the refrigerant in the semiconductor refrigeration piece cooling area 5 and is conveyed into the semiconductor refrigeration piece cooling area 5.
In order to facilitate heat exchange of the refrigerant, the semiconductor refrigeration piece 1 is a copper pipe with good heat conductivity and corrosion resistance.
In order to dissipate heat of the internal circulation pipeline, a radiating fin 9 is further arranged on the internal circulation pipeline 2, the radiating fin 9 is arranged between the semiconductor refrigerating fin cooling area 5 and the fan radiating area 3, and the radiating fin 9 made of metal materials is used for facilitating heat dissipation.
In order to make the radiating effect of the radiating fins 9 better, the radiating fins 9 are arranged at intervals up and down, so that heat exchange is facilitated.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the present invention in other forms, and any person skilled in the art may use the above-mentioned technical contents to change or modify the equivalent embodiment into equivalent changes and apply to other fields, but any simple modification, equivalent change and modification made to the above embodiments according to the technical matters of the present invention will still fall within the protection scope of the technical solution of the present invention.
Claims (4)
1. The utility model provides a medical temperature control appearance semiconductor heat abstractor, includes the semiconductor refrigeration piece, the semiconductor refrigeration piece includes refrigeration end and heat dissipation end, its characterized in that, the heat dissipation end is connected with the fan, the fan is vertical to be placed, it has the inner loop pipeline of refrigerant to be provided with between fan and the heat dissipation end to fill, the inner loop pipeline includes the semiconductor refrigeration piece cooling zone with heat dissipation end contact and the fan heat dissipation district that sets up with fan contact, be provided with the booster valve between fan heat dissipation district and the semiconductor refrigeration piece cooling zone, be provided with the one-way water valve between booster valve and the semiconductor refrigeration piece cooling zone.
2. The semiconductor heat sink for medical temperature control instruments according to claim 1, wherein the internal circulation pipeline is a copper pipe.
3. The semiconductor heat sink for medical temperature controller according to claim 2, wherein a heat sink is further disposed on the internal circulation pipeline, and the heat sink is disposed between the cooling region of the semiconductor cooling fin and the heat dissipating region of the fan.
4. The semiconductor heat sink for medical temperature control instrument according to claim 3, wherein the heat sink is spaced up and down.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202023153619.6U CN213901542U (en) | 2020-12-24 | 2020-12-24 | Semiconductor heat sink for medical temperature controller |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202023153619.6U CN213901542U (en) | 2020-12-24 | 2020-12-24 | Semiconductor heat sink for medical temperature controller |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213901542U true CN213901542U (en) | 2021-08-06 |
Family
ID=77105721
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202023153619.6U Active CN213901542U (en) | 2020-12-24 | 2020-12-24 | Semiconductor heat sink for medical temperature controller |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213901542U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114521547A (en) * | 2022-02-08 | 2022-05-24 | 孙志万 | Hair transplantation split device based on semiconductor refrigeration |
-
2020
- 2020-12-24 CN CN202023153619.6U patent/CN213901542U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114521547A (en) * | 2022-02-08 | 2022-05-24 | 孙志万 | Hair transplantation split device based on semiconductor refrigeration |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN205783408U (en) | Electric controller based on hot superconductive radiating plate and air-conditioner outdoor unit | |
| CN213901542U (en) | Semiconductor heat sink for medical temperature controller | |
| CN103557571B (en) | Inner heat pipe heat-exchange type semiconductor refrigeration device | |
| CN207881290U (en) | Flat-plate heat pipe expanded type condensing unit | |
| US20020135961A1 (en) | Efficient cooler | |
| CN206895115U (en) | A kind of radiator of electronics | |
| CN106403073A (en) | Cooling device | |
| WO2024002183A1 (en) | Heat exchange system for semiconductor cooling sheet | |
| CN112230741A (en) | Computer CPU cooling device | |
| CN203561013U (en) | Internal heat pipe heat exchange type semiconductor refrigeration device | |
| CN203561016U (en) | Heat pipe heat exchange type semiconductor refrigeration device | |
| CN206073777U (en) | A kind of gravity force heat pipe radiator | |
| CN103542737A (en) | Skin sweat gland simulating type liquid seepage vaporization radiator | |
| US11317536B2 (en) | High-efficiency phase-change condenser of a supercomputer | |
| CN111212553A (en) | Multi-temperature-zone liquid cooling system | |
| CN207662020U (en) | A kind of condenser | |
| CN106247819A (en) | A kind of Air-conditioning Cycle radiating tube | |
| CN104733603A (en) | Heat pipe exchanger used for heat radiation of semiconductor chip | |
| CN204425864U (en) | Closed enclosure heat abstractor and steam compressing air conditioner | |
| CN215597547U (en) | Air conditioner outdoor unit and air conditioner | |
| CN211120253U (en) | Device convenient for cooling water | |
| CN219349476U (en) | Refrigerant radiator | |
| CN220039205U (en) | Reverse gravity loop heat pipe | |
| CN218669548U (en) | Combined variable agricultural vehicle radiator | |
| CN219014707U (en) | Supercooling liquid storage device and fluorine pump air conditioner |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |