CN213880257U

CN213880257U - Microphone

Info

Publication number: CN213880257U
Application number: CN202120069962.8U
Authority: CN
Inventors: 李�浩; 梅嘉欣
Original assignee: Suzhou Debei Electronics Co ltd
Current assignee: Suzhou Debei Electronics Co ltd
Priority date: 2021-01-12
Filing date: 2021-01-12
Publication date: 2021-08-03
Anticipated expiration: 2031-01-12

Abstract

The utility model relates to a microphone technical field discloses a microphone, include: a substrate; a first chip for outputting a low frequency electrical signal; the second chip is electrically connected with the first chip and can convert the low-frequency electric signal output by the first chip into a high-frequency electric signal; and the shielding wire covers the second chip to prevent the high-frequency electric signals from interfering with the low-frequency electric signals. The utility model discloses a microphone, owing to the shielded wire that adds can cover on the second chip for the shielded wire can obstruct the interference of high frequency signal of telecommunication to the low frequency signal of telecommunication, has increased the SNR of microphone, has improved the speech recognition degree of accuracy and has increased the speech recognition distance.

Description

Microphone

Technical Field

The utility model relates to a microphone technical field especially relates to a microphone.

Background

In order to make the speech recognition accuracy of the microphone higher and the speech recognition distance more distant, the microphone with high signal-to-noise ratio is more popular, and the higher the signal-to-noise ratio of the microphone indicates that the microphone generates less noise, i.e. the noise doped in the signal is less, and the quality of the sound is higher. For a microphone comprising a first chip capable of outputting a low-frequency electrical signal and a second chip capable of converting the low-frequency electrical signal into a high-frequency electrical signal, the high-frequency electrical signal interferes with the low-frequency electrical signal, so that the output signal of the microphone can be subjected to intermodulation and coupling to a certain degree inside the microphone, and the signal-to-noise ratio of the microphone is reduced.

SUMMERY OF THE UTILITY MODEL

Based on the above, an object of the utility model is to provide a microphone and microphone can strengthen the stability of the signal of transmission between first chip and the second chip, improves the SNR of microphone.

In order to achieve the purpose, the utility model adopts the following technical proposal:

a microphone, comprising: a substrate; a first chip for outputting a low frequency electrical signal; the second chip is electrically connected with the first chip and is used for converting the low-frequency electric signal output by the first chip into a high-frequency electric signal; and the shielding wire covers the second chip to prevent the high-frequency electric signal from interfering with the low-frequency electric signal.

As a preferable mode of the microphone, the number of the shielding wires is at least two, and at least two shielding wires are distributed at intervals or are interwoven into a mesh structure.

As a preferable scheme of the microphone, the microphone further includes a signal line, two ends of the signal line are respectively connected to the first chip and the second chip, and the signal line can transmit the low-frequency electrical signal of the first chip to the second chip.

As a preferred scheme of the microphone, one end of the shielding wire is connected to the second chip, one end of the shielding wire connected to the second chip is disposed close to the signal line, and the other end of the shielding wire is connected to the substrate.

As a preferable scheme of the microphone, one end of the shielding wire is connected to the substrate, and the other end of the shielding wire crosses over the second chip and then is connected to the substrate.

As a preferable scheme of the microphone, the microphone further includes a ground line, one end of the ground line is connected to the second chip, and the other end of the ground line is connected to the substrate.

As a preferable mode of the microphone, the shielding wire includes a gold wire.

As a preferable scheme of the microphone, the first chip includes a MEMS chip, the second chip includes an ASIC chip, the substrate includes a PCB, and the MEMS chip and the ASIC chip are both fixedly disposed on the PCB.

As a preferred scheme of the microphone, the MEMS chip includes a polar plate and a diaphragm, the diaphragm is disposed on the polar plate, and the diaphragm is electrically connected to the polar plate.

As a preferable mode of the microphone, the microphone further includes a high frequency input line and a high frequency output line, both of which are connected to the second chip.

The utility model has the advantages that: the utility model discloses a microphone, owing to the shielded wire that adds can cover on the second chip for the shielded wire can obstruct the interference of high frequency signal of telecommunication to the low frequency signal of telecommunication, has increased the SNR of microphone, has improved the speech recognition degree of accuracy and has increased the speech recognition distance.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required to be used in the description of the embodiments of the present invention will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the contents of the embodiments of the present invention and the drawings without creative efforts.

Fig. 1 is a schematic diagram of a microphone according to an embodiment of the present invention;

fig. 2 is a schematic diagram of a microphone according to a second embodiment of the present invention.

In the figure:

1. a substrate; 2. a first chip; 21. a polar plate; 22. vibrating diaphragm; 3. a second chip; 4. a shielded wire; 5. a signal line; 6. a ground line; 7. a connecting wire; 81. a high frequency input line; 82. a high frequency output line; 83. a power line; 84. left and right channel lines.

Detailed Description

In order to make the technical problems, technical solutions and technical effects achieved by the present invention more clear, the embodiments of the present invention will be described in further detail with reference to the accompanying drawings, and obviously, the described embodiments are only some embodiments, not all embodiments of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by those skilled in the art without creative efforts belong to the protection scope of the present invention.

In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance. Wherein the terms "first position" and "second position" are two different positions.

In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection or a removable connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

Example one

The present embodiment provides a microphone, as shown in fig. 1, the microphone includes a substrate 1, a first chip 2, a second chip 3 and a shielding wire 4, the first chip 2 is disposed on the substrate 1 and is used for outputting a low-frequency electrical signal, the second chip 3 is disposed on the substrate 1, the second chip 3 is electrically connected to the first chip 2, the second chip 3 can convert the low-frequency electrical signal output by the first chip 2 into a high-frequency electrical signal, the shielding wire 4 is disposed on the substrate 1, and the shielding wire 4 can cover a portion of the second chip 3 to prevent the high-frequency electrical signal from interfering with the low-frequency electrical signal.

Specifically, the frequency of the low-frequency signal output by the first chip 2 is in the KHz level, and the frequency of the high-frequency signal output by the second chip 3 is in the MHz level, and during the operation of the first chip 2 and the second chip 3, the high-frequency signal in the MHz level output by the second chip 3 is easily coupled into the low-frequency electrical signal in the KHz level output by the first chip 2, so that the performance of the microphone is reduced, and the signal-to-noise ratio of the microphone is reduced.

It should be noted that the signal-to-noise ratio is a ratio of the power of the output signal of the amplifier to the power of the noise output at the same time. Specifically, when the microphone emits a sound signal of 1KHz, 94dB, the output signal is the sensitivity of the microphone; when the microphone is placed in an anechoic room in an environment isolated from noise, the measured background noise is the background noise, the difference value between the sensitivity and the background noise in a logarithmic mode is the signal-to-noise ratio of the microphone, the larger the signal-to-noise ratio is, the higher the accuracy of voice recognition is, correct voice can be recognized in a longer distance, and the common signal-to-noise ratio in the current market is 70 dB. Specifically, the frequency of the low-frequency electrical signal generated by the first chip 2 of the present embodiment is within 20kHz to 22kHz, and in the limit, the low-frequency electrical signal with the frequency of 40kHz can be generated, but the frequency of the high-frequency electrical signal generated by the second chip 3 is within 0.7MHz to 4.8MHz, and the high-frequency electrical signal is easily coupled into the low-frequency electrical signal, so that the performance of the microphone is reduced, and the signal-to-noise ratio of the microphone is reduced. The shielding wire 4 of this embodiment covers on the second chip 3 to make the high frequency electric signal that the second chip 3 produced not interfere with the low frequency electric signal, i.e. the low frequency electric signal and the high frequency electric signal do not interfere with each other, thereby reducing the noise produced by the mutual interference of the low frequency electric signal and the high frequency electric signal and improving the signal-to-noise ratio.

The microphone provided by the embodiment has the advantages that the shielding wire 4 additionally arranged can cover the second chip 3, so that the shielding wire 4 can block the interference of high-frequency electric signals to low-frequency electric signals, the signal-to-noise ratio of the microphone is increased, the voice recognition accuracy is improved, and the voice recognition distance is increased.

Specifically, as shown in fig. 1, the number of the shielding lines 4 of this embodiment is two, two shielding lines 4 are gold wires, two shielding lines 4 are parallel and distributed at intervals, one end of each shielding line 4 is connected to the second chip 3, the other end of each shielding line 4 is connected to the substrate 1, one end of each shielding line 4 connected to the second chip 3 is close to the signal line 5, and one end of each shielding line 4 connected to the substrate 1 is inclined toward the direction close to the first chip 2. In other embodiments, the number of the shielding wires 4 may also be one, three, four, five or more than five, and the shielding wires 4 are distributed at intervals or interwoven into a mesh structure according to the actual requirement. In other embodiments, the shielding wire 4 is not limited to the gold wire of this embodiment, and may also be a copper wire or an aluminum wire, which is specifically selected according to actual needs.

As shown in fig. 1, the microphone of the present embodiment further includes a signal line 5 and a ground line 6, two ends of the signal line 5 are respectively connected to the first chip 2 and the second chip 3, the signal line 5 can transmit the low-frequency electrical signal of the first chip 2 to the second chip 3, and a shielding line 4 is located directly above the signal line 5 to further reduce the mutual interference between the high-frequency electrical signal and the low-frequency electrical signal. One end of the grounding wire 6 is connected with the second chip 3, the other end of the grounding wire 6 is connected with the substrate 1, and the grounding wire 6 is used for leading current to the ground when the microphone leaks electricity or the voltage is too high, so that the effect of safety protection is achieved.

The first chip 2 of this embodiment is the MEMS chip, and the second chip 3 is the ASIC chip, and base plate 1 is the PCB, and the MEMS chip is connected with the ASIC chip electricity, and MEMS chip and ASIC chip all fix the setting on PCB. The MEMS chip is used for converting sound into an electric signal, the electric signal is a low-frequency electric signal, and the ASIC chip can process and calculate the electric signal to obtain a high-frequency signal. The analog-digital converter of the ASIC chip can convert a low-frequency electric signal into a high-frequency pulse width signal and output the high-frequency pulse width signal, and the ASIC chip has the advantage of high anti-interference capability. As shown in fig. 1, the MEMS chip includes a plate 21 and a diaphragm 22, the diaphragm 22 is disposed on the plate 21, and the diaphragm 22 is electrically connected to the plate 21, and the diaphragm 22 can convert a sound signal of vibration into an electrical signal, and then transmit the electrical signal to the second chip 3 through the plate 21. As shown in fig. 1, the microphone of the present embodiment further includes a connection line 7, and both ends of the connection line 7 are electrically connected to the first chip 2 and the second chip 3, respectively. The bonding wires 7 are used for transmitting the power of the second chip 3 to the first chip 2, so that the second chip 3 supplies the power to the first chip 2 through the bonding wires 7. The connecting wire 7 of the embodiment is a gold wire with better conductivity.

The microphone of the present embodiment is electrically connected to the PCB of the user side, the PCB of the user side is provided with a main chip, in order to achieve the electrical connection between the main chip and the first chip 2 of the present embodiment and the more accurate analysis of the signal output by the second chip 3 by the main chip, the microphone of the present embodiment further comprises a high frequency input line 81 and a high frequency output line 82, both the high frequency input line 81 and the high frequency output line 82 are gold wires with better electrical conductivity, the same end of the high frequency input line 81 and the high frequency output line 82 are connected to the second chip 3, and the other end of the high frequency input line can be electrically connected to the main chip on the PCB of the user side, so that the signal clock frequency of the main chip is consistent with the signal clock frequency of the second chip 3, in order to achieve a faster voice recognition function, the signal clock frequency is required to be slightly higher, the existing signal clock frequency is generally 3.072MHz, however, in some low-delay application scenarios, the signal clock frequency may be set to 4.8 MHz.

As shown in fig. 1, the microphone of this embodiment further includes a power line 83 and left and right channel lines 84, the power line 83 and the left and right channel lines 84 are all gold wires with good conductivity, the power line 83 and the left and right channel lines 84 are all connected to the second chip 3, the power line 83 is used for connecting a power source to the second chip 3 so as to supply power to the second chip 3, and the left and right channel lines 84 are used for playing the same or different sounds to generate a stereo sound change effect from left to right or from right to left.

The microphone provided by the embodiment has the advantages of large signal-to-noise ratio, high voice recognition accuracy and large voice recognition distance.

Example two

The difference between the present embodiment and the first embodiment is that, as shown in fig. 2, the number of the shielded wires 4 in the present embodiment is five, and five shielded wires 4 are distributed in parallel at intervals. In other embodiments, the number of the shielding wires 4 may also be one, two, three, four or more than five, and the shielding wires 4 are distributed at intervals or interwoven into a mesh structure according to the actual requirement. The shielding wires 4 of this embodiment are gold wires, one end of each shielding wire 4 is connected to the substrate 1, and the other end of each shielding wire 4 crosses over the second chip 3 and then is connected to the substrate 1. In other embodiments, the shielding wire 4 is not limited to the gold wire of this embodiment, and may also be a copper wire or an aluminum wire, which is specifically selected according to actual needs.

In other embodiments, the second chip 3 of the microphone is provided with a plurality of shielding wires 4, wherein two ends of some of the shielding wires 4 are disposed on the substrate 1, one end of the other shielding wires 4 is disposed on the substrate 1, the other end is disposed on the second chip 3, the shielding wires 4 are interwoven into a mesh structure, and the specific arrangement mode of the shielding wires 4 is selected according to actual needs.

The microphone of the present embodiment is not limited to the length and the width of the substrate 1, that is, the microphone of the present embodiment is not only suitable for the substrate 1 having a small length and a small width, but also suitable for the substrate 1 having a large length and a large width, and the microphone of the present embodiment has a wider applicability.

It should be noted that the foregoing is only a preferred embodiment of the present invention and the technical principles applied. It will be understood by those skilled in the art that the present invention is not limited to the particular embodiments described herein, but is capable of various obvious changes, rearrangements and substitutions as will now become apparent to those skilled in the art without departing from the scope of the invention. Therefore, although the present invention has been described in greater detail with reference to the above embodiments, the present invention is not limited to the above embodiments, and may include other equivalent embodiments without departing from the scope of the present invention.

Claims

1. A microphone, comprising:

a substrate (1);

a first chip (2) for outputting a low-frequency electrical signal;

the second chip (3) is electrically connected with the first chip (2) and is used for converting the low-frequency electric signal output by the first chip (2) into a high-frequency electric signal;

and the shielding wire (4) is covered on the second chip (3) to prevent the high-frequency electric signal from interfering with the low-frequency electric signal.

2. The microphone according to claim 1, wherein the number of the shielding wires (4) is at least two, and at least two shielding wires (4) are distributed at intervals or are interwoven into a mesh structure.

3. Microphone according to claim 2, characterized in that it further comprises a signal line (5), the two ends of the signal line (5) being connected to the first chip (2) and the second chip (3), respectively, the signal line (5) being capable of transmitting the low frequency electrical signal of the first chip (2) to the second chip (3).

4. The microphone according to claim 3, wherein one end of the shield wire (4) is connected to the second chip (3), one end of the shield wire (4) connected to the second chip (3) is disposed near the signal line (5), and the other end of the shield wire (4) is connected to the substrate (1).

5. The microphone according to claim 1, wherein one end of the shield wire (4) is connected to the substrate (1), and the other end of the shield wire (4) is connected to the substrate (1) after crossing the second chip (3).

6. The microphone according to claim 1, further comprising a ground line (6), wherein one end of the ground line (6) is connected to the second chip (3), and the other end of the ground line (6) is connected to the substrate (1).

7. Microphone according to claim 1, characterized in that the shielding wire (4) comprises a gold wire.

8. The microphone of claim 1, wherein the first chip (2) comprises a MEMS chip, the second chip (3) comprises an ASIC chip, the substrate (1) comprises a PCB, and the MEMS chip and the ASIC chip are both fixedly arranged on the PCB.

9. The microphone of claim 8, wherein the MEMS chip comprises a plate (21) and a diaphragm (22), wherein the diaphragm (22) is disposed on the plate (21) and the diaphragm (22) is electrically connected to the plate (21).

10. Microphone according to claim 1, characterized in that it further comprises a high frequency input line (81) and a high frequency output line (82), both the high frequency input line (81) and the high frequency output line (82) being connected to the second chip (3).