CN213878037U

CN213878037U - Device is pasted in paster diode location

Info

Publication number: CN213878037U
Application number: CN202023100071.9U
Authority: CN
Inventors: 黄小锋
Original assignee: Changzhou Starsea Electronics Co ltd
Current assignee: Changzhou Starsea Electronics Co ltd
Priority date: 2020-12-18
Filing date: 2020-12-18
Publication date: 2021-08-03
Anticipated expiration: 2030-12-18

Abstract

The utility model discloses a positioning and pasting device for a surface mount device diode, which comprises a positioning mechanism, a glue mechanism and an ejection mechanism; the glue dispensing mechanism is positioned right above the positioning mechanism; the ejection mechanism is positioned below the positioning mechanism and can lift relative to the positioning mechanism; the positioning mechanism comprises a disc and a rotating shaft; the glue dispensing mechanism comprises a glue barrel; the rubber barrel is provided with a discharge channel, a feed inlet, a rubber pushing plug, a ball core and a return spring; the ejection mechanism comprises a plurality of thimbles; a plurality of placing through holes are uniformly distributed in the circumferential direction of the disc, so that positioning and dispensing of a plurality of diodes are realized at one time, and the production efficiency is high; when the rubber pushing plug moves upwards, the glue extrusion force disappears, the ball core is pressed on the top surface of the diameter expansion section under the reset of the compression spring to block the glue from flowing out, meanwhile, the rubber pushing plug moves upwards, the glue barrel forms negative pressure to suck the residual glue in the discharge channel back into the glue barrel, and the phenomenon that the glue overflows at first and influences the quality of a diode product is avoided.

Description

Device is pasted in paster diode location

Technical Field

The utility model relates to a processing equipment technical field of diode especially relates to a device is pasted in paster diode location.

Background

Diodes, electronic components, a device with two electrodes, allow current to flow only in a single direction, and many applications use the rectifying function.

In the production process of the diode, a gluing machine is needed to glue the diode for bonding, but the existing diode gluing process has a series of defects, for example, the diode can not glue a plurality of diodes at one time, so that the gluing efficiency of the diode is too low, and the production efficiency of the diode is low; meanwhile, when the gluing is stopped, a part of glue is remained at the gun mouth of the glue gun, and the phenomenon of excessive overflow of the glue can occur at the beginning when the next gluing is performed, so that the quality of the diode product is influenced.

SUMMERY OF THE UTILITY MODEL

The utility model discloses the main technical problem who solves is: the positioning and pasting device for the surface mounted diodes is high in gluing efficiency and can avoid the influence on the quality of diode products caused by glue residue.

In order to solve the main technical problems, the following technical scheme is adopted:

a positioning and pasting device for a surface mount diode comprises a positioning mechanism, a glue dispensing mechanism and an ejection mechanism; the glue dispensing mechanism is positioned right above the positioning mechanism; the ejection mechanism is positioned below the positioning mechanism and can lift relative to the positioning mechanism; the positioning mechanism comprises a disc and a rotating shaft; the rotating shaft is fixed in the center of the disc and can enable the disc to rotate step by taking the rotating shaft as an axis; a plurality of placing through holes which are uniformly distributed on the periphery of the disc and used for placing diodes are formed in the surface of the disc; the glue dispensing mechanism comprises a glue barrel; a discharging channel is arranged at the bottom of the rubber barrel; the bottom of the discharging channel is opposite to one of the placing through holes; the ejection mechanism comprises a plurality of thimbles which are positioned right below the placing through holes and correspond to the placing through holes one by one; the thimble can go up and down and pass and place the through-hole.

Preferably, the bottom of the rotating shaft is connected with a stepping motor.

Preferably, the ejection mechanism further comprises a mounting disc and a cylinder; the thimble is fixed at the upper surface of mounting disc, and the piston rod of cylinder is fixed at the lower surface of mounting disc and can drive the thimble and go up and down to pass and place the through-hole.

Preferably, the glue barrel is fixed by a bracket; a feeding hole is formed in the upper part of the rubber barrel; an electric control valve is arranged on the feeding hole; a pushing assembly capable of pushing the glue to the discharging channel is arranged in the glue barrel; the middle part of the discharge channel is provided with an expanding section; a ball core and a compression spring are arranged in the diameter expansion section; the ball core is matched with the diameter expanding section and can ascend and descend along the diameter expanding section; the compression spring is fixed between the bottom of the ball core and the discharge channel.

Preferably, the pushing assembly comprises a rubber pushing plug and a hydraulic telescopic rod; one end of the hydraulic telescopic rod is fixed on the inner wall of the top of the rubber barrel, and the other end of the hydraulic telescopic rod is fixedly connected with the rubber pushing plug; the rubber pushing plug can tightly cling to the inner wall of the rubber barrel to slide under the driving of the power of the hydraulic telescopic rod.

Preferably, the glue dispensing mechanism further comprises a storage barrel; the storage barrel is communicated with the feed inlet through a peristaltic pump and a pipeline.

Preferably, the shells of the storage barrel and the glue barrel are internally provided with electric heating wires.

Preferably, the hot air device also comprises a hot air assembly; the hot air assembly is positioned on the side edge of the positioning mechanism; the hot-blast subassembly is towards one and places the through-hole, should place the through-hole and be located the just front side of placing the through-hole of point gum machine structure and both are adjacent.

Compared with the prior art, the utility model discloses be applied to the location of diode and paste the utensil and possess following advantage:

(1) the circumference equipartition of disc has a plurality of through-holes of placing, can place a plurality of diodes, and a plurality of diodes rotate in proper order to glue under the bucket to realize once only gluing to the location of a plurality of diodes, production efficiency is high.

(2) The hydraulic telescopic rod moves downwards to supply a downward extrusion force to the glue entering the glue barrel, so that the glue can flow to the discharge channel; when the rubber pushing plug moves upwards, the extrusion force above the glue disappears, the ball core is pressed on the top surface of the diameter expanding section under the reset action of the compression spring to block the glue of the discharging channel from flowing out, meanwhile, the rubber pushing plug moves upwards, the glue barrel forms negative pressure, the residual glue in the discharging channel is sucked back into the glue barrel, and the phenomenon that the glue overflows too much at first when next gluing is avoided, so that the quality of a diode product is influenced.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some examples of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without inventive work.

FIG. 1 is a schematic view of the overall structure;

FIG. 2 is an enlarged schematic view of the glue barrel;

fig. 3 is a schematic view of the relative positions of the positioning mechanism and the hot air assembly when viewed from above.

In the figure: the device comprises a positioning mechanism 1, a disc 11, a rotating shaft 12, a placing through hole 13, a glue dispensing mechanism 2, a glue barrel 21, a discharge channel 22, an expanding section 221, a feed inlet 23, an electric control valve 231, a support 24, a ball core 25, a compression spring 26, a storage barrel 27, a peristaltic pump 271, a hydraulic telescopic rod 28, a rubber push plug 29, an ejection mechanism 3, an ejector pin 31, an installation plate 32, an air cylinder 33 and a hot air assembly 4.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention. In addition, all the connection relations mentioned herein do not mean that the components are directly connected, but mean that a better connection structure can be formed by adding or reducing connection accessories according to specific implementation conditions.

Referring to fig. 1-3, a positioning and adhering device for a chip diode includes a positioning mechanism 1, a glue mechanism and an ejection mechanism 3.

The positioning mechanism 1 comprises a disc 11 and a rotating shaft 12; the rotating shaft 12 is fixed at the center of the disc 11, and the bottom of the rotating shaft 12 is connected with a stepping motor, so that the disc 11 can rotate in a stepping manner by taking the rotating shaft 12 as an axis; the surface of the disc 11 is provided with placing through holes 13 uniformly distributed in a circle, and the diodes are placed in the placing through holes 13 to wait for gluing.

The glue dispensing mechanism 2 comprises a glue barrel 21, and the glue barrel 21 is fixed above the disc 11 through a support 24; the bottom of the glue barrel 21 is provided with a discharge channel 22, the top of the glue barrel is provided with a feed inlet 23, the feed inlet 23 is communicated with a storage barrel 27 for storing glue through a pipeline, the pipeline is provided with an electric control valve 231 and a peristaltic pump 271, when the peristaltic pump 271 feeds the glue into the glue barrel 21, the electric control valve 231 is opened, and the electric control valve 231 is kept closed in the rest time; in order to avoid that the fluidity of the glue in the glue barrel 21 and the glue barrel 27 is affected due to too low temperature, electric heating wires (not shown in the figures) are arranged in the outer shells of the glue barrel 21 and the glue barrel 27 so as to keep the temperature of the glue in the glue barrel 21 and the glue barrel 27 constant; the bottom of the discharging channel 22 is opposite to one of the placing through holes 13.

A pushing component capable of pushing the glue to the discharging channel 22 is arranged in the glue barrel 21; the pushing assembly comprises a rubber pushing plug 29 and a hydraulic telescopic rod 28; one end of the hydraulic telescopic rod 28 is fixed on the inner wall of the top of the rubber barrel 21, and the other end of the hydraulic telescopic rod is fixedly connected with the rubber pushing plug 29; under the power drive of the hydraulic telescopic rod 28, the rubber pushing plug 29 can tightly cling to the inner wall of the rubber barrel 21 to slide; the power drive of the hydraulic telescopic rod 28 is also fixed in the rubber barrel 21; the downward movement of the hydraulic telescopic rod 28 gives the glue entering the glue vat 21 a squeezing force, which causes the glue to flow to the outlet channel 22.

The middle part of the discharge channel 22 is provided with an expanding section 221, namely the diameter of the middle part of the discharge channel 22 is large, and the diameters of the two ends are small; a ball core 25 and a compression spring 26 are arranged in the diameter expanding section 221; the transverse size of the ball core 25 is larger than the diameter of the small-diameter section of the discharging channel 22 and smaller than the diameter of the diameter expanding section 221; a compression spring 26 which is coaxial with the discharge channel 22 is arranged between the bottom of the ball core 25 and the inner wall of the discharge channel 22; after the glue presses the ball core 25, the ball core 25 presses the compression spring 26, so that the ball core 25 moves downwards, and the glue flows out of the discharging channel 22 from the diameter expanding section 221; when the rubber pushing plug 29 moves upwards, the extrusion force above the glue disappears, the ball core 25 is pressed on the top surface of the diameter expanding section 221 under the reset action of the compression spring 26 to block the glue of the discharging channel 22 from flowing out, meanwhile, the rubber pushing plug 29 moves upwards, the glue barrel 21 forms negative pressure, the residual glue in the discharging channel 22 is sucked back into the glue barrel 21, and the phenomenon that the glue overflows too much at first in the next gluing process is avoided, so that the quality of a diode product is influenced.

The ejection mechanism 3 comprises a thimble 31, a mounting disc 32 and a cylinder 33; the plurality of thimbles 31 are positioned under the placing through holes 13 and correspond to the placing through holes 13 one by one; the thimble 31 can pass through the placing through hole 13; the ejector pin 31 is fixed on the upper surface of the mounting plate 32, and a piston rod of the air cylinder 33 is fixed on the lower surface of the mounting plate 32 and can drive the ejector pin 31 to lift and fall to penetrate through the placing through hole 13; the rotating shaft 12 penetrates through the mounting disc 32, and the mounting disc 32 can lift up and down along the rotating shaft 12; in order to ensure that the glue can be dried quickly after dispensing, a hot air component 4 is also arranged on the side edge of the disc 11, and the hot air component 4 is an electric heating fan; an air outlet of the electric heating fan faces to one placing through hole 13, the placing through hole 13 facing to the electric heating fan is adjacent to the glue dispensing mechanism 2, and the electric heating fan is located on the front side of the glue dispensing mechanism 2, namely, the diodes on the disc 11 are firstly subjected to glue dispensing and then are subjected to hot air drying by the electric heating fan; after all the diodes in the placing through holes 13 on one disc 11 are dried, the mounting disc 32 moves upwards, the thimble 31 pushes the diodes out of the placing through holes 13, and therefore automatic blanking is achieved.

The utility model discloses a working process does: when the glue bucket is used, the peristaltic pump 271 is started, and the electric control valve 231 is opened to fill glue with a certain liquid level into the glue bucket 21; then the peristaltic pump 271 and the electric control valve 231 are closed; placing a diode in each placing through hole 13 on the disc 11, enabling the rubber pushing plug 29 to move downwards to give a downward extrusion force to the glue in the glue barrel 21, compressing the compression spring 26 under the downward extrusion force, enabling the ball core 25 to move downwards, and enabling the glue to flow out from the large-diameter end of the discharge channel 22 and be dispensed on the diode positioned right below the discharge channel; after the first dispensing is finished, the hydraulic telescopic rod 28 moves upwards, the ball core 25 and the rubber pushing plug 29 move upwards, the glue is blocked, the rotating shaft 12 rotates the diode subjected to the dispensing to the front of the hot air component 4 for drying, and meanwhile, the next diode to be dispensed rotates to the position right below the discharge channel 22; after drying all the diodes on the disc 11 is completed in sequence, the thimble 31 goes upward to push out the diodes and place the through holes 13.

It should be noted that, in the present invention, "upper, lower, left, right, inner and outer" are defined based on the relative position of the components in the drawings, and are only for the clarity and convenience of describing the technical solution, it should be understood that the application of the directional terms does not limit the protection scope of the present application.

Although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described in the foregoing embodiments, or some of the technical features may be substituted by equivalent substitutions, modifications and the like, all of which are within the spirit and principle of the present invention.

Claims

1. The utility model provides a device is pasted in paster diode location which characterized in that: comprises a positioning mechanism, a glue dispensing mechanism and an ejection mechanism; the glue dispensing mechanism is positioned right above the positioning mechanism; the ejection mechanism is positioned below the positioning mechanism and can lift relative to the positioning mechanism;

the positioning mechanism comprises a disc and a rotating shaft; the rotating shaft is fixed in the center of the disc and can enable the disc to rotate step by taking the rotating shaft as an axis; a plurality of placing through holes which are uniformly distributed on the periphery of the disc and used for placing diodes are formed in the surface of the disc;

the glue dispensing mechanism comprises a glue barrel; a discharging channel is arranged at the bottom of the rubber barrel; the bottom of the discharging channel is opposite to one of the placing through holes;

the ejection mechanism comprises a plurality of thimbles which are positioned right below the placing through holes and correspond to the placing through holes one by one; the thimble can go up and down and pass and place the through-hole.

2. A patch diode positioning and affixing device according to claim 1 wherein: the bottom of the rotating shaft is connected with a stepping motor.

3. A patch diode positioning and affixing device according to claim 1 wherein: the ejection mechanism further comprises a mounting disc and an air cylinder; the thimble is fixed at the upper surface of mounting disc, and the piston rod of cylinder is fixed at the lower surface of mounting disc and can drive the thimble and go up and down to pass and place the through-hole.

4. A patch diode positioning and affixing device according to claim 1 wherein: the glue barrel is fixed through a bracket; a feeding hole is formed in the upper part of the rubber barrel; an electric control valve is arranged on the feeding hole; a pushing assembly capable of pushing the glue to the discharging channel is arranged in the glue barrel; the middle part of the discharge channel is provided with an expanding section; a ball core and a compression spring are arranged in the diameter expansion section; the ball core is matched with the diameter expanding section and can ascend and descend along the diameter expanding section; the compression spring is fixed between the bottom of the ball core and the discharge channel.

5. A patch diode positioning and affixing device according to claim 4, wherein: the pushing assembly comprises a rubber pushing plug and a hydraulic telescopic rod; one end of the hydraulic telescopic rod is fixed on the inner wall of the top of the rubber barrel, and the other end of the hydraulic telescopic rod is fixedly connected with the rubber pushing plug; the rubber pushing plug can tightly cling to the inner wall of the rubber barrel to slide under the driving of the power of the hydraulic telescopic rod.

6. A patch diode positioning and affixing device according to claim 4, wherein: the glue dispensing mechanism further comprises a storage barrel; the storage barrel is communicated with the feed inlet through a peristaltic pump and a pipeline.

7. A patch diode positioning and affixing device according to claim 6 wherein: electric heating wires are arranged in the shells of the storage barrel and the glue barrel.

8. A patch diode positioning and affixing device according to claim 1 wherein: the hot air component is also included; the hot air assembly is positioned on the side edge of the positioning mechanism; the hot-blast subassembly is towards one and places the through-hole, should place the through-hole and be located the just front side of placing the through-hole of point gum machine structure and both are adjacent.