CN213860278U - A quick cooling device for modified epoxy processing - Google Patents
A quick cooling device for modified epoxy processing Download PDFInfo
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- CN213860278U CN213860278U CN202022820942.8U CN202022820942U CN213860278U CN 213860278 U CN213860278 U CN 213860278U CN 202022820942 U CN202022820942 U CN 202022820942U CN 213860278 U CN213860278 U CN 213860278U
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- pipeline
- cooling
- fixed connection
- modified epoxy
- cooler bin
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Abstract
The utility model discloses a quick cooling device for modified epoxy processing relates to cooling device technical field, for the modified epoxy who solves among the prior art is adding the problem that the high temperature was difficult for adorning and get man-hour. Still including installing the cooler bin in the top of processing platform, and processing platform and cooler bin pass through bolt fixed connection, the internally mounted of cooler bin has the heat insulating layer, and the cooler bin passes through bolt fixed connection with the heat insulating layer, charge-in pipeline is installed to the top of cooler bin, and cooler bin and charge-in pipeline pass through bolt fixed connection, first cooling tube is installed to one side of charge-in pipeline, and charge-in pipeline and first cooling tube pass through flange fixed connection, the second cooling tube is installed to charge-in pipeline's opposite side, and charge-in pipeline and second cooling tube pass through flange fixed connection.
Description
Technical Field
The utility model relates to a cooling device technical field specifically is a quick cooling device for modified epoxy processing.
Background
The excellent physical mechanical and electrical insulation performance, the adhesion performance with various materials and the flexibility of the using process of the epoxy resin are not possessed by other thermosetting plastics, so that it can be made into coating material, composite material, casting material, adhesive, mould-pressing material and injection moulding material, but organic high molecular compounds containing two or more than two epoxy groups in the epoxy resin molecules are not high in relative molecular mass except individual ones, therefore, the epoxy resin has the defects of high brittleness, poor weather resistance and aging resistance, flammability and unstable long-term performance, and the epoxy resin is modified by taking the requirements of reinforcing engineering on strong cohesive force, durability, aging resistance, fire resistance and the like into consideration and avoiding the defects of the epoxy resin.
The modified epoxy resin has strong adhesion, low shrinkage, high dielectric property, surface leakage resistance, alkali resistance, acid resistance and solvent resistance, and extremely excellent adhesion to various structures, but the modified epoxy resin is difficult to assemble and disassemble due to overhigh temperature when being processed; therefore, the market is urgently needed to develop a quick cooling device for processing modified epoxy resin to help people solve the existing problems.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a quick cooling device for modified epoxy processing to the modified epoxy who proposes in solving above-mentioned background art is adding the problem that the too high difficult dress of processing temperature was got.
In order to achieve the above object, the utility model provides a following technical scheme: a quick cooling device for processing modified epoxy resin comprises a screw pump and a cooling box arranged above a processing platform, wherein the processing platform is fixedly connected with the cooling box through a bolt, a heat insulation layer is arranged inside the cooling box, the cooling box is fixedly connected with the heat insulation layer through a bolt, a feeding pipeline is arranged above the cooling box and is fixedly connected with the feeding pipeline through a bolt, a first cooling pipeline is arranged on one side of the feeding pipeline, the feeding pipeline is fixedly connected with the first cooling pipeline through a flange, a second cooling pipeline is arranged on the other side of the feeding pipeline, the feeding pipeline is fixedly connected with the second cooling pipeline through a flange, the first cooling pipeline and the second cooling pipeline are both arranged inside the cooling box, a material discharging pipeline is arranged on one side of the first cooling pipeline, and the first cooling pipeline is fixedly connected with the material discharging pipeline through a flange, the discharging pipeline is fixedly connected with the second cooling pipeline through a flange, and the discharging pipeline penetrates through the cooling box.
Preferably, the heat-conducting plate is all installed to one side of first cooling duct, second cooling duct, and first cooling duct passes through bolt fixed connection with the heat-conducting plate, the inside of heat-conducting plate is provided with the ventilation hole, the internally mounted of cooler bin has first fan, and cooler bin and first fan pass through bolt fixed connection, the internally mounted of cooler bin has the second fan, and cooler bin and second fan pass through bolt fixed connection.
Preferably, the refrigerator is installed above the processing platform, the processing platform is fixedly connected with the refrigerator through bolts, the air inlet pipeline is installed on one side of the refrigerator, and the refrigerator is fixedly connected with the air inlet pipeline through a hoop.
Preferably, the cooling pipeline is installed to one side of refrigerator, and refrigerator and cooling pipeline pass through flange fixed connection, the inside that the cooling pipeline penetrated the cooler bin, the air conditioning spout is installed to the top of cooling pipeline, and air conditioning spout threaded connection.
Preferably, a conveying pipeline is installed on one side of the screw pump, the screw pump is fixedly connected with the conveying pipeline through a flange, and the conveying pipeline is fixedly connected with the discharging pipeline through a flange.
Preferably, a discharge pipeline is installed above the screw pump, and the screw pump is fixedly connected with the discharge pipeline through a flange.
Compared with the prior art, the beneficial effects of the utility model are that:
1. the utility model discloses a through the setting of first cooling tube, heat-conducting plate and second cooling tube, increase modified epoxy's pipeline path length in the cooler bin, make modified epoxy's pipeline increase with the area of contact of air conditioning in the cooler bin, improve modified epoxy's cooling rate, through the inside ventilation hole that sets up of heat-conducting plate, improve the heat-conducting plate radiating rate, increase modified epoxy's cooling efficiency.
2. The utility model discloses a through the setting of heat insulating layer, first fan and second fan, the isolated cooler bin external temperature in heat insulating layer makes the inside temperature of cooler bin can not receive external temperature's influence, and first fan and second fan can increase the inside air-out speed of cooler bin, make cooler bin top heating installation in time discharge to the air conditioning that drives the bottom rises, increases modified epoxy's cooling rate.
Drawings
FIG. 1 is a front view of a rapid cooling device for processing modified epoxy resin according to the present invention;
FIG. 2 is a cross-sectional view of the cooling box of the present invention;
fig. 3 is a schematic view of the heat-conducting plate of the present invention.
In the figure: 1. a processing platform; 2. supporting legs; 3. an air intake duct; 4. a refrigerator; 5. a cooling duct; 6. a cooling tank; 7. a feed conduit; 8. a discharge conduit; 9. a delivery conduit; 10. a screw pump; 11. a discharge duct; 12. a thermal insulation layer; 13. a first cooling duct; 14. a heat conducting plate; 15. a cold air nozzle; 16. a first fan; 17. a second fan; 18. a second cooling conduit; 19. a vent hole.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.
Referring to fig. 1-3, the present invention provides an embodiment: a quick cooling device for processing modified epoxy resin comprises a screw pump 10, wherein supporting legs 2 are arranged below a processing platform 1, the processing platform 1 is fixedly connected with the supporting legs 2 through bolts, a cooling box 6 is arranged above the processing platform 1, the processing platform 1 is fixedly connected with the cooling box 6 through bolts, a heat insulation layer 12 is arranged inside the cooling box 6, the cooling box 6 is fixedly connected with the heat insulation layer 12 through bolts, a feeding pipeline 7 is arranged above the cooling box 6, the cooling box 6 is fixedly connected with the feeding pipeline 7 through bolts, a first cooling pipeline 13 is arranged on one side of the feeding pipeline 7, the feeding pipeline 7 is fixedly connected with the first cooling pipeline 13 through a flange, a second cooling pipeline 18 is arranged on the other side of the feeding pipeline 7, the feeding pipeline 7 is fixedly connected with the second cooling pipeline 18 through a flange, the first cooling pipeline 13 and the second cooling pipeline 18 are both arranged inside the cooling box 6, the discharge pipeline 8 is installed to one side of first cooling pipeline 13, and first cooling pipeline 13 passes through flange fixed connection with discharge pipeline 8, and discharge pipeline 8 passes through flange fixed connection with second cooling pipeline 18, and discharge pipeline 8 runs through cooling tank 6.
Further, the heat-conducting plate 14 is installed on one side of the first cooling pipeline 13 and the second cooling pipeline 18, the first cooling pipeline 13 is fixedly connected with the heat-conducting plate 14 through bolts, the ventilation holes 19 are formed in the heat-conducting plate 14, the first fan 16 is installed in the cooling box 6, the cooling box 6 is fixedly connected with the first fan 16 through bolts, the second fan 17 is installed in the cooling box 6, the cooling box 6 is fixedly connected with the second fan 17 through bolts, the heat-conducting plate 14 is made of die-cast aluminum, the heat transfer speed is increased, and the cooling efficiency of the modified epoxy resin is improved.
Further, refrigerator 4 is installed to processing platform 1's top, and processing platform 1 passes through bolt fixed connection with refrigerator 4, and inlet channel 3 is installed to one side of refrigerator 4, and refrigerator 4 passes through clamp fixed connection with inlet channel 3, and refrigerator 4 adopts the equipment that the refrigeration effect is strong, increases the inside air conditioning production speed of cooling box 6.
Further, cooling pipeline 5 is installed to one side of refrigerator 4, and refrigerator 4 passes through flange fixed connection with cooling pipeline 5, and cooling pipeline 5 penetrates the inside of cooler bin 6, and air conditioning spout 15 is installed to cooling pipeline 5's top, and cooling pipeline 5 and air conditioning spout 15 threaded connection, and cooling pipeline 5 top is provided with multiunit air conditioning spout 15, increases air conditioning blowout speed.
Further, a conveying pipeline 9 is installed on one side of the screw pump 10, the screw pump 10 is fixedly connected with the conveying pipeline 9 through a flange, the conveying pipeline 9 is fixedly connected with the discharging pipeline 8 through a flange, and lubricating coating is coated inside the conveying pipeline 9 to prevent the modified epoxy resin on the inner wall of the pipeline from being sticky.
Further, a discharge pipeline 11 is installed above the screw pump 10, the screw pump 10 is fixedly connected with the discharge pipeline 11 through a flange, and lubricating paint is coated inside the discharge pipeline 11 to prevent the modified epoxy resin on the inner wall of the pipeline from being bonded.
The working principle is as follows: when the modified epoxy resin cooling device is used, the screw pump 10 is started, the modified epoxy resin enters the cooling box 6 from the feeding pipeline 7 under the action of the screw pump 10, respectively enters the first cooling pipeline 13 and the second cooling pipeline 18 through shunting, the heat of the modified epoxy resin is volatilized to the inside of the cooling box 6 through the heat transfer of the heat conducting plate 14, the refrigerator 4 is started, the outside air enters the refrigerator 4 from the air inlet pipeline 3, generates cold air through the work of the refrigerator 4 and is discharged into the cooling pipeline 5, then the cold air is discharged into the cooling box 6 through the cold air nozzle 15, the cold air starts to rise from the bottom of the cooling box 6 to cool the modified epoxy resin, the modified epoxy resin is converted into hot air when the modified epoxy resin rises to the top, the first fan 16 and the second fan 17 are started to discharge the hot air at the top in the cooling box 6 in time, meanwhile, the cold air at the bottom is driven to rise, the modified epoxy resin is cooled and then gathered into the discharge pipeline 8, the delivery through the delivery pipe 9 enters the screw pump 10 and finally exits through the discharge pipe 11.
It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Claims (6)
1. The utility model provides a quick cooling device for modified epoxy processing, includes screw pump (10), its characterized in that: the processing platform is characterized by further comprising a cooling box (6) arranged above the processing platform (1), the processing platform (1) is fixedly connected with the cooling box (6) through bolts, a heat insulation layer (12) is arranged inside the cooling box (6), the cooling box (6) is fixedly connected with the heat insulation layer (12) through bolts, a feeding pipeline (7) is arranged above the cooling box (6), the cooling box (6) is fixedly connected with the feeding pipeline (7) through bolts, a first cooling pipeline (13) is arranged on one side of the feeding pipeline (7), the feeding pipeline (7) is fixedly connected with the first cooling pipeline (13) through a flange, a second cooling pipeline (18) is arranged on the other side of the feeding pipeline (7), the feeding pipeline (7) is fixedly connected with the second cooling pipeline (18) through a flange, the first cooling pipeline (13) and the second cooling pipeline (18) are both arranged inside the cooling box (6), discharge pipe (8) are installed to one side of first cooling duct (13), and first cooling duct (13) passes through flange fixed connection with discharge pipe (8), discharge pipe (8) passes through flange fixed connection with second cooling duct (18), discharge pipe (8) runs through cooler bin (6).
2. The rapid cooling device for modified epoxy resin processing according to claim 1, wherein: heat-conducting plate (14) are all installed to one side of first cooling tube (13), second cooling tube (18), and first cooling tube (13) and heat-conducting plate (14) through bolt fixed connection, the inside of heat-conducting plate (14) is provided with ventilation hole (19), the internally mounted of cooler bin (6) has first fan (16), and cooler bin (6) and first fan (16) pass through bolt fixed connection, the internally mounted of cooler bin (6) has second fan (17), and cooler bin (6) and second fan (17) pass through bolt fixed connection.
3. The rapid cooling device for modified epoxy resin processing according to claim 1, wherein: refrigerator (4) are installed to the top of machining platform (1), and machining platform (1) passes through bolt fixed connection with refrigerator (4), admission line (3) are installed to one side of refrigerator (4), and refrigerator (4) pass through clamp fixed connection with admission line (3).
4. The rapid cooling device for modified epoxy resin processing according to claim 3, wherein: cooling pipeline (5) are installed to one side of refrigerator (4), and refrigerator (4) and cooling pipeline (5) pass through flange fixed connection, cooling pipeline (5) penetrate the inside of cooler bin (6), air conditioning spout (15) are installed to the top of cooling pipeline (5), and air conditioning spout (15) threaded connection.
5. The rapid cooling device for modified epoxy resin processing according to claim 1, wherein: pipeline (9) is installed to one side of screw pump (10), and screw pump (10) and pipeline (9) pass through flange fixed connection, pipeline (9) and row material pipeline (8) pass through flange fixed connection.
6. The rapid cooling device for modified epoxy resin processing according to claim 1, wherein: discharge pipeline (11) are installed to the top of screw pump (10), and screw pump (10) pass through flange fixed connection with discharge pipeline (11).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022820942.8U CN213860278U (en) | 2020-11-30 | 2020-11-30 | A quick cooling device for modified epoxy processing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022820942.8U CN213860278U (en) | 2020-11-30 | 2020-11-30 | A quick cooling device for modified epoxy processing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213860278U true CN213860278U (en) | 2021-08-03 |
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ID=77064884
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022820942.8U Active CN213860278U (en) | 2020-11-30 | 2020-11-30 | A quick cooling device for modified epoxy processing |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213860278U (en) |
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2020
- 2020-11-30 CN CN202022820942.8U patent/CN213860278U/en active Active
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