CN213857656U

CN213857656U - Laser cutting device for semiconductor material

Info

Publication number: CN213857656U
Application number: CN202022755107.0U
Authority: CN
Inventors: 李彩梅
Original assignee: Ezhou Kebei Laser Co ltd
Current assignee: Ezhou Kebei Laser Co ltd
Priority date: 2020-11-25
Filing date: 2020-11-25
Publication date: 2021-08-03
Anticipated expiration: 2030-11-25

Abstract

The utility model discloses a laser cutting device for semiconductor material, including first backup pad, second backup pad and laser cutting ware, the lower terminal surface fixed mounting of first backup pad has the supporting leg that a plurality of symmetries set up, one side fixed mounting that the supporting leg was kept away from to first backup pad has the second backup pad, one side fixed mounting of second backup pad up end has electronic straight push rod, electronic straight push rod's output fixed mounting has the installation horizontal pole that the level set up, the one end fixed mounting that electronic straight push rod was kept away from to the installation horizontal pole has laser cutting ware, one side movable mounting that electronic straight push rod was kept away from to second backup pad up end has the work piece to place the platform, the downside that the platform was placed to the work piece is provided with removal drive mechanism. The utility model discloses simple structure, convenient operation, the position that can multi-direction automatically regulated work piece place the platform and the distance that the platform was placed to laser cutter and work piece, improved semiconductor material laser cutting's precision.

Description

Laser cutting device for semiconductor material

Technical Field

The utility model relates to a material processing technology field especially relates to a laser cutting device for semiconductor material.

Background

Semiconductor laser materials based on electrical excitation generally employ heterostructures, are composed of semiconductor thin films, and are produced by epitaxial methods and vapor deposition methods. According to different laser wavelengths, different doped semiconductor materials are adopted. In the visible light region, group compound semiconductors are mainly used; in the near infrared region, a group compound semiconductor is mainly used; in the mid-infrared region, group IV-VI compound semiconductors are the main components.

The existing laser cutting device for semiconductor materials is difficult to automatically adjust the position, when the laser cutting device is used for processing and production, a worker is required to manually adjust the position when placing a workpiece, and although a tool clamp is used for positioning the position of the workpiece, the precision is not high, so that the product quality is not high.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a laser cutting device for semiconductor material to solve the problem that proposes among the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme:

the utility model provides a laser cutting device for semiconductor material, includes first backup pad, second backup pad and laser cutting ware, the lower terminal surface fixed mounting of first backup pad has the supporting leg that a plurality of symmetries set up, one side fixed mounting that the supporting leg was kept away from to first backup pad has the second backup pad, one side fixed mounting of second backup pad up end has electronic straight push rod, the output fixed mounting of electronic straight push rod has the installation horizontal pole that the level set up, the one end fixed mounting that electronic straight push rod was kept away from to the installation horizontal pole has laser cutting ware, one side movable mounting that electronic straight push rod was kept away from to second backup pad up end has the work piece to place the platform, the downside that the platform was placed to the work piece is provided with removal drive mechanism.

As a further aspect of the present invention: the moving transmission mechanism comprises a first side plate, a first threaded rod, a second side plate and a second threaded rod, two first side plates are symmetrically arranged at the front end and the rear end of one side of the upper end surface of the second supporting plate away from the electric straight push rod, a first threaded rod is movably arranged between the two first side plates, first guide rods are arranged on the left side and the right side of the first threaded rod, first movable blocks are movably sleeved on the outer surfaces of the first threaded rod and the first guide rods, second side plates are symmetrically arranged at the left end and the right end of the first movable block, a second threaded rod is movably arranged between a pair of the second side plates, the side of the second threaded rod is provided with a second guide rod, a second movable block is movably sleeved on the outer surfaces of the second threaded rod and the second guide rod, and a workpiece placing table is fixedly mounted on the upper end face of the second movable block.

As a further aspect of the present invention: the one end of first threaded rod is fixed with the output end of first motor and is linked to each other, first motor fixed mounting is in the outside of first curb plate, the one end of second threaded rod is fixed with the output end of second motor and is linked to each other, second motor fixed mounting is in the outside of second curb plate.

As a further aspect of the present invention: and a supporting side plate is fixedly arranged between the first supporting plate and the second supporting plate.

As a further aspect of the present invention: the bottom of the supporting leg is fixedly provided with a universal wheel.

Compared with the prior art, the beneficial effects of the utility model are that: the utility model discloses simple structure, convenient operation, the position that can multi-direction automatically regulated work piece place the platform and the distance that the platform was placed to laser cutter and work piece, improved semiconductor material laser cutting's precision.

Drawings

Fig. 1 is a schematic structural diagram of a laser cutting apparatus for semiconductor materials.

Fig. 2 is a side view of a laser cutting apparatus for semiconductor material.

Fig. 3 is a schematic structural view of a movement transmission mechanism of a laser cutting device for semiconductor materials.

In the figure: 1-a first supporting plate, 11-a supporting leg, 12-a universal wheel, 2-a second supporting plate, 21-a supporting side plate, 3-an electric straight push rod, 4-a laser cutter, 41-an installation cross rod, 5-a first side plate, 51-a first guide rod, 6-a first threaded rod, 61-a first motor, 7-a first movable block, 71-a second side plate, 711-a second guide rod, 8-a second threaded rod, 81-a second motor, 9-a workpiece placing table and 91-a second movable block.

Detailed Description

In the description of the present invention, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically limited otherwise.

In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," and "fixed" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

The technical solution of the present patent will be described in further detail with reference to the following embodiments.

Example 1:

referring to fig. 1 to 3, a laser cutting apparatus for semiconductor material includes a first supporting plate 1, a second supporting plate 2 and a laser cutter 4, a plurality of symmetrically arranged supporting legs 11 are welded on the lower end surface of the first supporting plate 1, a second supporting plate 2 is fixedly arranged on one side of the first supporting plate 1 far away from the supporting legs 11 through bolts, an electric straight push rod 3 is fixedly arranged on one side of the upper end surface of the second supporting plate 2 through a bolt, a horizontally arranged installation cross rod 41 is fixedly arranged at the output end of the electric straight push rod 3 through a bolt, one end of the mounting cross bar 41 far away from the electric straight push rod 3 is fixedly provided with a laser cutter 4 through a bolt, one side of the upper end surface of the second supporting plate 2, which is far away from the electric straight push rod 3, is movably provided with a workpiece placing table 9, and the lower side of the workpiece placing table 9 is provided with a movable transmission mechanism.

The movable transmission mechanism comprises two first side plates 5, two first threaded rods 6, two second side plates 71 and two second threaded rods 8, the two first side plates 5 are symmetrically welded at the front end and the rear end of one side, far away from the electric straight push rod 3, of the upper end face of the second support plate 2, the first threaded rods 6 are movably installed between the two first side plates 5, first guide rods 51 are arranged at the left side and the right side of each first threaded rod 6, first movable blocks 7 are movably sleeved on the outer surfaces of the first threaded rods 6 and the first guide rods 51, the second side plates 71 are symmetrically welded at the left end and the right end of each first movable block 7, the second threaded rods 8 are movably installed between the pair of second side plates 71, second guide rods 711 are arranged at the side edges of the second threaded rods 8, and second movable blocks 91 are movably sleeved on the outer surfaces of the second threaded rods 8 and the second guide rods 711, the upper end face of the second movable block 91 is fixedly provided with a workpiece placing table 9 through bolts.

The one end of first threaded rod 6 passes through the shaft coupling with the output of first motor 61 and fixes linking to each other, first motor 61 passes through bolt fixed mounting in the outside of first curb plate 5, the one end of second threaded rod 8 passes through the shaft coupling with the output of second motor 81 and fixes linking to each other, second motor 81 passes through bolt fixed mounting in the outside of second curb plate 71.

Working principle of example 1: an operator places a semiconductor material to be processed on the upper end face of the workpiece placing table 9, the first motor 61 drives the first threaded rod 6 to rotate, the front and rear positions of the semiconductor material on the workpiece placing table 9 can be changed, the second motor 81 drives the second threaded rod 8 to rotate, the left and right positions of the semiconductor material on the workpiece placing table 9 can be changed, the workpiece placing table 9 is located under the laser cutter 4, the distance between the laser cutter 4 and the workpiece placing table 9 can be adjusted through the electric straight push rod 3 at the moment, the light gathering strength of the laser cutter 4 is changed, and laser cutting is performed.

Example 2:

referring to fig. 1 to 3, in an embodiment 1, a supporting side plate 21 is fixedly installed between a first supporting plate 1 and a second supporting plate 2, a region between the first supporting plate 1 and the second supporting plate 2, which is divided by the supporting side plate 21, can be used for placing a workpiece to be processed, and a universal wheel 12 is fixedly installed at the bottom of a supporting leg 11, so that an operator can move the device conveniently.

The above description is only a preferred embodiment of the present invention, and should not be taken as limiting the invention, and any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention. Any reference sign in a claim should not be construed as limiting the claim concerned.

Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.

Claims

1. A laser cutting device for semiconductor materials comprises a first supporting plate (1), a second supporting plate (2) and a laser cutter (4), and is characterized in that a plurality of symmetrically arranged supporting legs (11) are fixedly arranged on the lower end face of the first supporting plate (1), the second supporting plate (2) is fixedly arranged on one side, away from the supporting legs (11), of the first supporting plate (1), an electric straight push rod (3) is fixedly arranged on one side of the upper end face of the second supporting plate (2), an installation cross rod (41) which is horizontally arranged is fixedly arranged on the output end of the electric straight push rod (3), the laser cutter (4) is fixedly arranged at one end, away from the electric straight push rod (3), of the installation cross rod (41), the workpiece placing table (9) is movably arranged on one side, away from the electric straight push rod (3), of the upper end face of the second supporting plate (2), a moving transmission mechanism is arranged on the lower side of the workpiece placing table (9).

2. The laser cutting device for semiconductor materials according to claim 1, wherein the moving transmission mechanism comprises a first side plate (5), a first threaded rod (6), a second side plate (71) and a second threaded rod (8), two first side plates (5) are arranged, the two first side plates (5) are symmetrically arranged at the front end and the rear end of one side of the upper end face of the second support plate (2) far away from the electric straight push rod (3), the first threaded rod (6) is movably arranged between the two first side plates (5), first guide rods (51) are arranged at the left side and the right side of the first threaded rod (6), first movable blocks (7) are movably sleeved on the outer surfaces of the first threaded rod (6) and the first guide rods (51), the second side plates (71) are symmetrically arranged at the left end and the right end of the first movable blocks (7), a second threaded rod (8) is movably mounted between the second side plates (71), a second guide rod (711) is arranged on the side edge of the second threaded rod (8), a second movable block (91) is movably sleeved on the outer surfaces of the second threaded rod (8) and the second guide rod (711), and a workpiece placing table (9) is fixedly mounted on the upper end face of the second movable block (91).

3. The laser cutting device for semiconductor materials as claimed in claim 2, characterized in that one end of the first threaded rod (6) is fixedly connected with the output end of a first motor (61), the first motor (61) is fixedly arranged on the outer side of the first side plate (5), one end of the second threaded rod (8) is fixedly connected with the output end of a second motor (81), and the second motor (81) is fixedly arranged on the outer side of the second side plate (71).

4. A laser cutting device for semiconductor material according to claim 1, characterized in that a support side plate (21) is fixedly mounted between the first support plate (1) and the second support plate (2).

5. The laser cutting device for semiconductor materials as claimed in claim 1, characterized in that the bottom of the supporting leg (11) is fixedly mounted with a universal wheel (12).