CN213850589U

CN213850589U - Medical endoscope

Info

Publication number: CN213850589U
Application number: CN202021692354.4U
Authority: CN
Inventors: 张敏
Original assignee: Beijing Gaoxin Huitong Medical Technology Co Ltd
Current assignee: Beijing Gaoxin Huitong Medical Technology Co Ltd
Priority date: 2020-08-14
Filing date: 2020-08-14
Publication date: 2021-08-03
Anticipated expiration: 2030-08-14

Abstract

The utility model provides a medical endoscope, which solves the technical problem that the prior observation process is limited by the shape of an image sensor to cause the image acquisition part of the endoscope and the acquisition efficiency to be limited. The lens body is a straight tubular coating cavity, a sealed flat lens is arranged at one axial end of the coating cavity, a chip body of an image sensor chip is coaxially arranged on the inner side of the sealed flat lens, the chip body comprises a hollow sealing cavity, the hollow sealing cavity is partially inscribed with the coating cavity, and parallel light sources are distributed between the hollow sealing cavity and the coating cavity along the circumferential direction of the hollow sealing cavity. The diameter is reduced and optimized by structural optimization of the image sensor chip, handheld operation is further refined, image deformation sensing and processing are further accurate by structural optimization of the image sensor chip, so that the acquisition part can be deeper, the operation space margin is larger, and the high-quality image acquisition and processing efficiency is improved.

Description

Medical endoscope

Technical Field

The utility model relates to an image sensor technical field, concretely relates to medical endoscope.

Background

Endoscopic techniques are widely used in the industrial and medical fields. In the endoscope use practice in the medical field, the electronic endoscope is limited by the chip manufacturing technology, so that the diameter of a lens module based on an image sensor chip cannot be reasonably reduced, the reasonable arrangement of an illumination light source and the controlled rotation of a lens in a narrow cavity cannot be further realized, the field processing difficulty of acquired video images is increased, and the cost of an image signal processor is high. How to effectively optimize the pixel structure and the packaging structure of the existing image sensor is the key for improving the quality of the endoscope and reducing the overall cost.

SUMMERY OF THE UTILITY MODEL

In view of the above problem, the embodiment of the utility model provides a medical endoscope solves current observation process and receives the shape restriction to result in endoscope image acquisition position and the limited technical problem of collection efficiency.

The utility model discloses medical endoscope includes the mirror body and image sensor chip, the mirror body is straight pipy cladding cavity axial one end sets up sealed plano lens inboard coaxial setting the chip body of image sensor chip, the chip body includes cavity seal chamber, cavity seal chamber with cladding cavity part inscription cavity seal chamber with follow between the cladding cavity the parallel light source is laid to cavity seal chamber circumference.

In an embodiment of the present invention, the chip body further includes a chip substrate, the chip substrate includes an image sensor array, the chip substrate is accommodated in a hollow sealed cavity, the inner wall of the hollow sealed cavity and the outline of the chip substrate are similar to the outline of the image sensor array, and the hollow sealed cavity, the chip substrate and the image sensor array are coaxial.

In an embodiment of the present invention, all vertices of the contour of the image sensor array are on the same circumcircle, and a vertex angle of the contour of the image sensor array is an obtuse angle.

In an embodiment of the present invention, the outline of the image sensor array is a regular polygon, and the number of sides of the regular polygon is at least 8.

In an embodiment of the present invention, the contour of the image sensor array includes eight sides, the eight sides sequentially form an octagon, a first side is parallel to a fifth side and is projected and overlapped with each other, a third side is parallel to a seventh side and is projected and overlapped with each other, the first side is perpendicular to the third side, a distance between the first side and the fifth side is greater than a distance between the third side and the seventh side, two ends of the second side are respectively connected to adjacent ends of the first side and the third side, two ends of the fourth side are respectively connected to adjacent ends of the third side and the fifth side, two ends of the sixth side are respectively connected to adjacent ends of the fifth side and the seventh side, and two ends of the eighth side are respectively connected to adjacent ends of the seventh side and the first side.

In one embodiment of the invention, the image sensor array comprises a reference location structure formed by a defined pattern disposed on the edges of the image sensor array.

In an embodiment of the present invention, the determined pattern has a symmetry axis, and an extension line of the symmetry axis points to the center of the image sensor array.

In an embodiment of the present invention, the determination pattern includes an isosceles triangle, the isosceles triangle is located at the edge of the image sensor array, one vertex of the isosceles triangle points to the center of the image sensor array, and the bottom side of the isosceles triangle coincides with the edge of the image sensor array.

The utility model discloses medical endoscope constitutes the diameter and realizes decrement optimization by the configuration optimization of image sensor chip, and the configuration optimization who receives the image sensor chip realizes that handheld operation is further become more meticulous, image deformation perception and handles further the exactness for gather the position and can more deepen, and operation space margin is bigger, and high quality image is gathered and the treatment effeciency obtains improving.

Drawings

Fig. 1 is a schematic diagram showing a pixel arrangement outline of a CMOS image sensor chip for a medical endoscope according to an embodiment of the present invention.

Fig. 2 is a schematic diagram illustrating a difference between an image sensor array in a CMOS image sensor chip for a medical endoscope according to an embodiment of the present invention and the prior art.

Fig. 3 is a schematic cross-sectional view illustrating a package structure of a CMOS image sensor chip for a medical endoscope according to an embodiment of the present invention.

Fig. 4 is a schematic sectional view of a medical endoscope according to an embodiment of the present invention.

Fig. 5 is a schematic diagram of a reference positioning structure of a CMOS image sensor chip for a medical endoscope according to an embodiment of the present invention.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention clearer and more obvious, the present invention will be further described with reference to the accompanying drawings and embodiments. It is to be understood that the embodiments described are only some embodiments of the invention, and not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.

The pixel arrangement of the CMOS image sensor chip for a medical endoscope according to an embodiment of the present invention is shown in fig. 1. In fig. 1, this embodiment includes picture elements 10, which are arranged in a matrix between the picture elements 10 to form an image sensor array 20.

As will be understood by those skilled in the art, the pixel structure in the prior art includes a photosensor and a signal output device formed on a (silicon substrate) wafer, the photosensor is used for forming photoelectric conversion of energy to form an electrical signal, the photosensor may be a photodiode semiconductor device, etc. generally; the signal output device is used for controlled reading and/or amplifying of the electrical signal, and the signal output device may generally include, but is not limited to, a metal flat cable, a reading circuit or an amplifying circuit formed by a MOS triode, and the like. Those skilled in the art will appreciate that the ordered groups of pixels form an array of image sensitive elements, and the associated circuitry formed on the (silicon substrate) wafer associated with the array of image sensitive elements includes, but is not limited to, horizontal shift registers and horizontal scan switch circuitry, vertical shift registers and vertical scan switch circuitry, a/D conversion circuitry, etc., each of which controls the enabling, signal reading, and signal dumping of the pixels. Formed on the (silicon substrate) wafer in association with the array of image sensitive elements also includes ancillary devices for effecting light flux, wavelength filtering, including but not limited to filters, microlenses, and the like. The photosensitive diode, the metal flat cable and other circuits can respectively form a corresponding photosensitive element layer, a wiring layer, a circuit layer and the like.

As will be appreciated by those skilled in the art, the array of image sensing elements, together with associated circuitry and ancillary devices, form a sensor core circuit that is packaged to form the chip body of the image sensor.

As shown in fig. 1, in an embodiment of the present invention, the contour of the image sensor array 20 (formed by arranging pixels) includes eight sides, the eight sides sequentially form an octagon, the first side is parallel to the fifth side and coincides with the projection of the fifth side, the third side is parallel to the seventh side and coincides with the projection of the seventh side, the first side is perpendicular to the third side, the distance between the first side and the fifth side is greater than the distance between the third side and the seventh side, the two ends of the second side are respectively connected to the adjacent ends of the first side and the third side, the two ends of the fourth side are respectively connected to the adjacent ends of the third side and the fifth side, the two ends of the sixth side are respectively connected to the adjacent ends of the fifth side and the seventh side, and the two ends of the eighth side are respectively connected to the adjacent ends of the seventh side and the first side. The edges intersect to form a vertex of the profile, and the vertex angle formed by the vertex and the adjacent edge is an obtuse angle.

The CMOS image sensor chip for a medical endoscope of the embodiment of the present invention optimizes the arrangement profile of the image sensor array 20. In the prior art, the arrangement profile of the image sensor array 20 is usually rectangular, and when image acquisition is performed, reflected light formed by enough uniform illumination can ensure the balance of the acquisition quality of each local signal, and if not, the related image signals at the vertex need to be subjected to complex post-image processing. The embodiment of the utility model provides a through with like 20 rectangle profile summits of quick tuple array and optimize for the continuous summits shape of more passivation for the profile edge is more gentle with the interval transition like quick tuple array 20 center, makes more be favorable to receiving more main reflected light under the peeping environment, obtains more balanced relevant signal acquisition quality, has avoided the very unfavorable vignetting signal acquisition to image post processing. Therefore, the signal processing in the image imaging stage avoids dark corner interference signals, and the original image with more balanced illumination can be directly obtained, thereby avoiding the processing loss of the original image information. The processing cost of the invalid pixels of the pixel sensitive element array 20 is reduced, the effective pixel area of the image sensor is effectively increased, the requirements of complex design and signal processing speed of an acquisition control circuit and an image signal processing circuit for reducing the invalid pixels are avoided, and the image sensor can obtain more effective pixels under the same photosensitive area to improve the signal quality.

As shown in fig. 1, in an embodiment of the present invention, in the outline of the image sensor array 20, the connection lines of the large-distance end points of the first edge, the second edge, the eighth edge, the second edge and the eighth edge form an isosceles trapezoid 25, the isosceles trapezoid 25 is formed by arranging a plurality of pixel rows in the image sensor array 20, and the pixels in the pixel rows from the top (the first edge) of the isosceles trapezoid 25 to the bottom gradually increase. For example, the pels in the top pel row are 600, incremented in 4 pel steps, and the pels in the bottom pel row are 640. The slope of the hypotenuse of the isosceles trapezoid 25 is proportional to the step size.

The difference between the image sensor array in the CMOS image sensor chip for a medical endoscope and the prior art according to an embodiment of the present invention is shown in fig. 2. In fig. 2, in the profile of the image sensor array in the embodiment of the present invention, the diagonal length 21 crossing the vertex through the center of the profile is significantly smaller than the diagonal length 22 of the corresponding rectangular image sensor array (having the same effective pixels) in the prior art. Inevitably, the circumcircle of the image sensor array in the embodiment of the present invention is also obviously smaller than the circumcircle of the corresponding rectangular image sensor array.

The utility model discloses a CMOS image sensor chip for medical endoscope is through optimizing the range profile of quick element array 20 of object to for can utilize the circumscribed circle of less diameter to surround quick element array 20 of object, this means can realize the packaging structure of less diameter, make CMOS image sensor chip's diameter compare that to have prior art's CMOS image sensor chip littleer, more be favorable to forming the medical endoscope that the diameter is more tiny. Meanwhile, invalid pixels which are easy to form acquisition signal interference in the existing rectangular image sensing element array are directly eliminated from the arrangement outline of the image sensing element array 20, and the chip cost is reduced.

As shown in fig. 1, in an embodiment of the present invention, the first side, the third side, the fifth side and the seventh side have the same length, the second side, the fourth side, the sixth side and the seventh side have the same length, and the length of the first side is twice as long as that of the seventh side.

The utility model discloses a CMOS image sensor chip for medical endoscope is guaranteeing effective pixel density in unit area to the arrangement profile of quick element array 20, when quantity is equivalent with the CMOS image sensor chip that prior art corresponds, the summit of having guaranteed like the arrangement profile of quick element array 20 is located a minimum external circumference, it can maintain better equilibrium like the marginal luminance of quick element array 20 to have guaranteed that peep the environment down reflected light, can make quick correlation processing to the color change of arranging the profile summit and the even luminance like quick element array 20 during image signal processing, guarantee the adaptation rationality of whole image luminance, be the optimization structure of taking into account current pixel acquisition density and manufacturing process.

In an embodiment of the present invention, the arrangement profile of the image sensor array 20 is a regular polygon.

Those skilled in the art will appreciate that a regular polygon with a sufficient number of edges can form a true circular-like arrangement contour, which further satisfies the fast correlation process of color change at the vertices of the arrangement contour and uniform brightness of the image sensor array 20. The number of regular polygon sides is at least 8. The number of excessive edges limited by the structural size and arrangement density of the pixels is reduced in the effective pixel density per unit area, and even a sawtooth effect is formed.

The utility model discloses a CMOS image sensor chip for medical endoscope is as far as possible under the prerequisite of maintaining great effective pixel density like the arrangement profile of quick element array 20, has further reduced like the external diameter of quick element array, is favorable to the formation of minimum encapsulation cross-section.

An embodiment of the present invention is a CMOS image sensor chip package structure for a medical endoscope as shown in fig. 3. In fig. 3, a photosensitive element layer, a wiring layer and a circuit layer are formed on a (silicon substrate) wafer according to an arrangement profile of an image sensor array 20, and a chip substrate 30 is formed by cutting the (silicon substrate) wafer according to the arrangement profile of the image sensor array 20, the wiring layer profile and the circuit layer profile being similar to the arrangement profile of the image sensor array 20, the photosensitive element layer, the wiring layer profile, the circuit layer profile and the chip substrate 30 being coaxial.

In an embodiment of the present invention, the associated circuit and the auxiliary device are disposed on the circuit board, the circuit board is bonded to the chip substrate 30, the projection of the circuit board is located within the outline of the chip substrate 30 or similar to the outline of the chip substrate 30, and the projection of the circuit board is coaxial with the chip substrate 30.

The packaging structure of the chip body comprises a hollow sealed cavity 40 for accommodating the chip substrate 30 and the circuit board, wherein the chip substrate 30 and the circuit board are fixed in the hollow sealed cavity 40 in a stacking mode, and the chip substrate 30 and the hollow sealed cavity 40 are coaxial. The hollow sealed cavity 40 is formed with an opening at one axial end, and the opening is sealed by a light transmitting material.

The utility model discloses a CMOS image sensor chip for medical endoscope utilizes like quick component array 20, circuit board and hollow seal chamber 40's coaxial nature to form the chip body, has guaranteed that the chip body after the encapsulation has minimum radial encapsulation size. The coaxiality also ensures the quality control detection efficiency in the manufacturing process of the medical endoscope, and the alignment reference is provided in the assembling process of the endoscope part and the chip body by utilizing the contour similarity so as to ensure the consistency of products.

As shown in FIG. 3, in one embodiment of the present invention, the cross-sectional profile of the inner wall of the hollow sealed cavity 40 is adapted to the profile of the image sensor array 20. The optimized structure can form a necessary assembly alignment structure, and the assembly quality and the assembly efficiency are improved.

As shown in FIG. 3, in one embodiment of the present invention, the cross-sectional profile of the outer wall of the hollow sealed cavity 40 is adapted to the profile of the image sensor array 20. The optimized structure can form a necessary assembly alignment structure of the endoscope accessory, and the assembly quality and the assembly efficiency are improved.

The structure of the medical endoscope according to one embodiment of the present invention is shown in fig. 4. In fig. 4, the medical endoscope includes a straight tube-shaped covering cavity 50, a sealed flat lens is disposed at one axial end of the covering cavity 50, the chip body is coaxially disposed inside the sealed flat lens, a hollow sealed cavity 40 of the chip body is inscribed with the covering cavity 50, and a parallel light source 51 is disposed between the hollow sealed cavity 40 and the covering cavity 50 along the circumferential direction of the hollow sealed cavity 40.

The utility model discloses medical endoscope utilizes the little radial structural feature of high integration degree that the packaging structure of chip body brought to obtain further radial improvement, has realized laying the common axial of parallel light source around the photosurface simultaneously, has satisfied the even illuminance to the observation object.

An embodiment of the present invention is a reference positioning structure of a CMOS image sensor chip for a medical endoscope as shown in fig. 5. In fig. 5, the image sensor array 20 includes a reference location structure for use as a coordinate reference for signals acquired by the photosensors, the reference location structure being formed by a defined pattern 60 disposed on one of the longer edges of the image sensor array 20.

As shown in FIG. 5, in one embodiment of the present invention, the defined pattern 60 comprises an isosceles triangle formed at the midpoint of a longer side of the edge of the image sensor array 20, and a vertex of the isosceles triangle points to the center of the image sensor array 20. The base of the isosceles triangle coincides with the longer side, and the extension line of the connecting line between the vertex of the base and the center of the image sensor array 20 coincides with the height of the base.

The utility model discloses a CMOS image sensor chip for medical endoscope utilizes and confirms the figure and provides the coordinate reference thing for the image of gathering. The chip body moves in the organ cavity and is influenced by friction and extrusion of the endoscope and the cavity wall to form irregular precession and nutation, so that the collected image can rotate circumferentially relative to the image sensitive element array 20, and meanwhile, the collected image is influenced by body fluid in the cavity to have distortion.

As shown in FIG. 5, in one embodiment of the present invention, defined pattern 60 is formed by placing inactive pixels at the edges of image sensor array 20. The invalid image element, namely the image element at the edge of the image sensitive element array 20 and the position corresponding to the determined image, is always in the disabled state.

The utility model discloses a CMOS image sensor chip for medical endoscope directly shields the pixel that corresponds definite figure 60 in switch circuit and is in the disability state for gather the definite figure of real-time embedding in the image, avoided the complicated design of extra device and circuit. The real-time property of determining the image calibration ensures the accurate positioning of the real-time deviation of the image.

As shown in FIG. 5, in one embodiment of the present invention, defined pattern 60 is formed by missing pixels at the edge of image sensor array 20. I.e. no picture elements are arranged at the edges of the array of picture elements 20 corresponding to the determined pattern.

The utility model discloses a CMOS image sensor chip for medical endoscope has simplified the complexity that on-the-spot image signal judges and later stage image processing through reducing the inherent figure of confirming in the picture element direct formation collection image, has ensured the reference precision.

In an embodiment of the present invention, the determination pattern may be other determination patterns having a symmetry axis and an extension line of the symmetry axis pointing to the center of the image sensor array 20.

In an embodiment of the present invention, the determination pattern may include a plurality of determination patterns of the above embodiment distributed on at least two longer sides.

The utility model discloses a CMOS image sensor chip for medical endoscope forms the quantization standard that has the correlation of gathering image distortion, color skew through the reasonable distribution of confirming the figure for signal processing process utilizes the local treatment accuracy of correlation quantization standard formation complete image.

The utility model discloses a design method for medical endoscope's CMOS image sensor chip of embodiment, include:

and cutting pixels at the edge of the image sensing element array to form a polygonal outline with all vertexes on the same circumcircle by the rectangular outline.

The utility model discloses a CMOS image sensor chip design method for medical endoscope has obtained when utilizing to improve the effective pixel in the unit area to the optimization of photosensitive element array edge and has reduced the radial technique of encapsulation probably, further directly cuts out the photosensing signal of edge vignetting attribute from the physical structure, and the creative mutual interference information of in the relevant pixel quantization process is directly eliminated from the signal source.

In one embodiment of the present invention, the contour of the image sensor array 20 forms a regular polygon.

In an embodiment of the present invention, the contour of the image sensor array 20 forms an octagon, the first edge and the fifth edge are parallel and project mutually and coincide, the third edge and the seventh edge are parallel and project mutually and coincide, the first edge is perpendicular to the third edge, the distance between the first edge and the fifth edge is greater than the distance between the third edge and the seventh edge, the two ends of the second edge are connected to the adjacent ends of the first edge and the third edge respectively, the two ends of the fourth edge are connected to the adjacent ends of the third edge and the fifth edge respectively, the two ends of the sixth edge are connected to the adjacent ends of the fifth edge and the seventh edge respectively, and the two ends of the eighth edge are connected to the adjacent ends of the seventh edge and the first edge respectively.

In an embodiment of the present invention, based on the above embodiment, the lengths of the first side, the third side, the fifth side and the seventh side are the same, the lengths of the second side, the fourth side, the sixth side and the seventh side are the same, and the length of the first side is twice as long as that of the seventh side.

The design method of the CMOS image sensor chip for a medical endoscope according to an embodiment of the present invention further includes, on the basis of the above method embodiment:

cutting the wafer according to the polygonal outline of the image sensitive element array to form a chip substrate, and forming a photosensitive element layer, a wiring layer and a circuit layer on the chip substrate, wherein the photosensitive element layer, the wiring layer and the circuit layer are coaxially arranged;

the associated circuit and the auxiliary device are arranged on the circuit board, the projection of the circuit board is positioned in the outline of the chip substrate or similar to the outline of the chip substrate, and the projection of the circuit board is coaxial with the chip substrate;

the chip substrate and the circuit board are packaged in the hollow sealed cavity and coaxially arranged.

The utility model discloses a CMOS image sensor chip design method for medical endoscope will be like sensitive component array, correlation circuit and auxiliary device's wholeness respectively around coaxial formation based on the axiality for the encapsulation of chip body can realize that the axial is piled up, radial coaxial optimization, forms the special packaging structure towards medical interior peeping the environment.

In an embodiment of the present invention, a hollow sealed cavity for accommodating the chip substrate and the circuit board is formed, the chip substrate and the circuit board are stacked and fixed in the hollow sealed cavity, and the chip substrate and the hollow sealed cavity are coaxial. The hollow sealed cavity forms an opening at one axial end and is sealed by the light-transmitting material.

In an embodiment of the present invention, the cross-sectional profile of the inner wall of the hollow sealed cavity is adapted to the profile of the image sensor array.

In an embodiment of the present invention, the cross-sectional profile of the outer wall of the hollow sealed cavity is adapted to the profile of the image sensor array.

the reference positioning structure is arranged on the image sensitive element array and comprises a determined graph with a symmetry axis and an extension line of the symmetry axis pointing to the center of the image sensitive element array, and the determined graph is arranged at the edge of the image sensitive element array.

The utility model discloses a CMOS image sensor chip design method for medical endoscope is through the coordinate basis of establishing image signal collection, satisfies medical endoscopic environment department's native data demand of medical image acquisition location and distortion processing.

In an embodiment of the present invention, the determined pattern forms an isosceles triangle, and a vertex of the isosceles triangle points to the center of the isogram sensor array. The base of the isosceles triangle is coincident with the longer side, and the vertex of the base is coincident with the height of the extension line of the center of the image sensing element array and the base.

In one embodiment of the present invention, the determination pattern is formed by setting an invalid pixel at the edge of the image sensor array.

In an embodiment of the present invention, the determination pattern is formed by setting pixels missing at the edge of the image sensor array.

The utility model discloses a medical endoscope's application method of embodiment, include:

forming uniform irradiation of the object in the organ cavity by using a parallel light source;

the image sensor follows the coating cavity of the medical endoscope to move axially and rotate randomly in the circumferential direction;

establishing a polar coordinate reference of an acquired image according to the determined graphs of the center and the edge of an image sensitive element array in the image sensor;

adjusting the circumferential angle of the medical endoscope according to the polar coordinate reference to provide accurate position reference for the medical endoscope accessory;

and determining the distortion data of the acquired image according to the deformation variation degree between the determined graphs of the center and the edge of the image sensitive element array.

The utility model discloses medical endoscope image acquisition method has established the most accurate positioning basis of rotating the operation to medical endoscope, has guaranteed the operation precision of medical endoscope annex. Meanwhile, a quantitative reference of the distortion of the acquired image is formed by utilizing the determined graph, so that the judgment and correction of the acquired image can more effectively combine an image processing closed-loop feedback control loop with a human-in-control loop, and the observation and operation precision is improved.

The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present invention should be covered by the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.

Claims

1. A medical endoscope comprises an endoscope body and an image sensor chip and is characterized in that the endoscope body is a straight tubular coating cavity, a sealing plano lens is arranged at one axial end of the coating cavity, a chip body of the image sensor chip is coaxially arranged on the inner side of the sealing plano lens, the chip body comprises a hollow sealing cavity, the hollow sealing cavity is partially inscribed with the coating cavity, and parallel light sources are distributed between the hollow sealing cavity and the coating cavity along the circumferential direction of the hollow sealing cavity.

2. The medical endoscope of claim 1 wherein said chip body further comprises a chip substrate, said chip substrate comprising an array of image-sensitive cells, said chip substrate being contained within a hollow sealed cavity, the contours of the inner walls of said hollow sealed cavity and said chip substrate being similar to the contours of said array of image-sensitive cells, said hollow sealed cavity, said chip substrate and said array of image-sensitive cells being coaxial.

3. The medical endoscope according to claim 2, wherein all vertices of the contour of said image sensor array are on the same circumcircle, and the vertex angle of said contour of said image sensor array is obtuse.

4. The medical endoscope of claim 3 wherein said array of image sensing elements has the outline of a regular polygon having at least 8 sides.

5. The medical endoscope of claim 3 wherein the contour of the image sensor array comprises eight sides, the eight sides sequentially enclosing an octagon, a first side being parallel to and projectively coincident with a fifth side, a third side being parallel to and projectively coincident with a seventh side, the first side being perpendicular to the third side, the distance between the first side and the fifth side being greater than the distance between the third side and the seventh side, two ends of the second side being connected to adjacent ends of the first side and the third side, respectively, two ends of the fourth side being connected to adjacent ends of the third side and the fifth side, two ends of the sixth side being connected to adjacent ends of the fifth side and the seventh side, respectively, and two ends of the eighth side being connected to adjacent ends of the seventh side and the first side, respectively.

6. The medical endoscope of claim 3 wherein said image sensitive element array includes a referencing structure formed by a defined pattern disposed on an edge of said image sensitive element array.

7. The medical endoscope of claim 6 wherein said defined pattern has an axis of symmetry and said axis of symmetry extends toward the center of said array of image sensing elements.

8. The medical endoscope of claim 7 wherein said defined pattern comprises an isosceles triangle, said isosceles triangle being at the edge of said array of image-sensitive elements, one vertex of said isosceles triangle pointing toward the center of said array of image-sensitive elements, and the base of said isosceles triangle coinciding with the edge of said array of image-sensitive elements.