CN213850099U

CN213850099U - Thick film heating electric appliance

Info

Publication number: CN213850099U
Application number: CN202022248459.7U
Authority: CN
Inventors: 胡旭
Original assignee: Shenzhen Ruisente Electronic Technology Co ltd
Current assignee: Shenzhen Ruisente Electronic Technology Co ltd
Priority date: 2020-10-10
Filing date: 2020-10-10
Publication date: 2021-08-03
Anticipated expiration: 2030-10-10

Abstract

The application discloses thick film heating electrical apparatus. The kettle body is provided with a plurality of bulges which are distributed at intervals; the edge of the bottom substrate of the thick film heating component is provided with a plurality of gaps which are distributed at intervals; the thickness of the bottom base material is larger than or equal to the distance between the plurality of bulges and the pot body, and when the thick film heating component rotates for a first angle relative to the pot body, each bulge is positioned at a corresponding notch and can pass through the notch; when the thick film heating component rotates a second angle relative to the kettle body, the bulges are not completely aligned with the corresponding notches, and part or all of the bulges are pressed on the base substrate so as to keep the base substrate and the kettle body relatively fixed. Based on this, this application is favorable to the assembly of thick film heating element and kettle body.

Description

Thick film heating electric appliance

Technical Field

The application relates to the technical field of electric heating, in particular to a thick film heating electric appliance.

Background

An electric heating kettle, also called an electric kettle, is a water boiling tool commonly used in daily life of people, and the electric kettle on the market at present usually adopts a thick film heating mode to realize heating. The electric kettle of the type is provided with a thick film heating component at the bottom of the kettle body (namely, the kettle bottom), the thick film heating component comprises a bottom base material and a heating thick film, the heating thick film is attached to the outer side of the bottom base material, and the inner side of the bottom base material is welded and fixed at the kettle bottom. The welding mode not only needs the base material to be fixed at the preset position of the kettle bottom, thereby ensuring the highest heating efficiency and requiring higher alignment precision during assembly. In addition, the kettle bottom is a plane, and the bottom base material is protruded outwards after the bottom base material is welded with the kettle bottom, so that the protruded size of the thick film heating assembly is larger, and the occupied shell space of the thick film heating assembly is not reduced. Therefore, the current assembly mode of the thick film heating component and the kettle body still has certain limitation.

SUMMERY OF THE UTILITY MODEL

In view of this, the present application provides a thick film heating apparatus, so as to solve the problem that the prior art is not favorable for the assembly of the thick film heating assembly and the kettle body.

The application provides a thick film heating electrical apparatus includes:

the kettle body is provided with a plurality of bulges which are distributed at intervals;

the thick film heating assembly comprises a bottom base material and a heating thick film arranged on the bottom base material, wherein a plurality of gaps distributed at intervals are formed in the edge of the bottom base material;

the thickness of the bottom base material is larger than or equal to the distance between the plurality of bulges and the kettle body, and when the thick film heating component rotates relative to the kettle body by a first angle, each bulge is positioned at a corresponding notch and can pass through the notch; when the thick film heating component rotates a second angle relative to the kettle body, all of the bulges are not aligned with the corresponding notches, and part or all of the bulges are pressed on the base substrate so as to keep the base substrate and the kettle body relatively fixed.

Optionally, the number of protrusions and indentations is equal, or the number of protrusions is smaller than the number of indentations.

Optionally, the plurality of protrusions are all the same, or at least two protrusions have different shapes and sizes.

Optionally, the thickness of the protrusion is equal to the thickness of the base substrate.

Optionally, the plurality of indentations and the base substrate are an integrally formed structural member.

Optionally, the kettle body comprises a kettle wall and a kettle bottom, a ring body is arranged on one side of the kettle bottom back to the kettle wall, the bottom base material can be placed in the ring body, and the plurality of protrusions are arranged on the inner side of the ring body.

Optionally, the kettle body comprises a kettle wall and a kettle bottom, a groove is formed in one side, back to the kettle wall, of the kettle bottom, the bottom base material can be placed in the groove, and the plurality of protrusions are arranged on the inner side of the groove.

Optionally, the outer plane of the plurality of projections is lower than or flush with the opening plane of the recess.

Optionally, the kettle bottom with the groove is a punch forming structural member.

Optionally, the base substrate comprises a high heat region and an edge region arranged at the periphery of the high heat region, the heating thick film is located in the high heat region, and when the thick film heating assembly rotates relative to the kettle body by a second angle, part or all of the protrusion is pressed on the edge region of the base substrate.

This application revolves wrong cooperation mode through arch and breach and assembles the kettle body and thick film heating element, when the relative kettle body of thick film heating element rotates first angle, each arch is located a breach department that corresponds and all can pass the breach, make the kettle body and thick film heating element can alternate segregation, and when the relative kettle body of thick film heating element rotates the second angle, a plurality of archs are not all to align with the breach that corresponds, some or whole arch is pressed and is held in the subbase material, in order to keep base material and kettle body relatively fixed, it is visible this kind of to revolve wrong cooperation mode can realize the fixed and separation between the kettle body and the thick film heating element according to the demand, be favorable to the assembly between the two, convenient to overhaul and maintenance.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.

FIG. 1 is a schematic diagram of a thick film heater according to an embodiment of the present application;

FIG. 2 is a cross-sectional view of the thick film heating appliance of FIG. 1;

FIG. 3 is a schematic view of the assembly of the thick film heating assembly of the present application and a kettle body;

FIG. 4 is a bottom plan view of the structure shown in FIG. 3;

FIG. 5 is a schematic structural view of a kettle bottom according to an embodiment of the present application;

FIG. 6 is a sectional view of the kettle bottom shown in FIG. 5 along the A-A direction;

FIG. 7 is a schematic view of the assembly of a thick film heating element with a kettle bottom according to an embodiment of the present application;

FIG. 8 is a cross-sectional view of the structure shown in FIG. 7 taken along the line B-B;

FIG. 9 is a schematic structural view of a thick film heating assembly according to an embodiment of the present application;

fig. 10 is a schematic structural view of a heat generating coil according to an embodiment of the present application;

FIG. 11 is a cross-sectional view of a heated thick film structure according to an embodiment of the present application;

FIG. 12 is a schematic view of the assembly of a thick film heating element with a kettle base according to another embodiment of the present application;

FIG. 13 is a schematic structural view of a thick film heating assembly according to another embodiment of the present application;

figure 14 is a cross-sectional view of the thick film heating assembly shown in figure 13 taken along the direction C-C.

Detailed Description

The technical solutions in the embodiments of the present application are clearly and completely described below with reference to the accompanying drawings, and it is obvious that the described embodiments are only a part of the embodiments, and not all of them. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application. Without conflict, the various embodiments and their technical features described below may be combined with each other and constitute other embodiments.

It should be understood that in the description of the embodiments of the present application, the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc. indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of describing the technical solutions of the embodiments and simplifying the description, but do not indicate or imply that the devices or elements must have specific orientations, be constructed in specific orientations, and be operated, and therefore, should not be construed as limiting the scope of the present application.

Referring to fig. 1 to 4, the thick film heating apparatus 10 may be an electric kettle, a soymilk maker, etc., and includes a thick film heating assembly 11 and a kettle body 12.

The kettle body 12 comprises a kettle wall 121, a kettle bottom 122 and an outer shell 123.

The pot wall 121 is formed in a shape of the pot body 12, such as a cylinder with an equal diameter at the top and bottom, or a cylinder with a smaller top and a larger bottom. The kettle bottom 122 is fixed at the bottom of the kettle wall 121, the two are assembled to form a liquid storage cavity 1231 of the kettle body 12, an opening is arranged at the upper part of the liquid storage cavity 1231, and a fluid medium to be heated (such as water, soybean milk or milk and the like) is poured into the liquid storage cavity 1231 from the opening and is contained in the liquid storage cavity 1231. The kettle wall 121 and the kettle bottom 122 may be integrally formed structural members, and they may be regarded as a stainless steel inner container of the thick film heating appliance 10 after being assembled. The inner wall of the stainless steel inner container can be coated with an anti-scale coating, such as a ceramic anti-scale coating or a Teflon anti-scale coating, so that particles generated in the heating process of a fluid medium are prevented from depositing on the inner wall of the stainless steel inner container to form scales.

As shown in fig. 5 and fig. 6, a groove 1221 is formed on a side of the kettle bottom 122 facing away from the kettle wall 121, that is, an outer side of the kettle bottom 122, and the kettle bottom 122 is used as a stamping forming structural member, and the groove 1221 can be formed by stamping during the stamping forming process.

Within the recess 1221, the kettle body 12 is provided with a plurality of spaced protrusions 124, the protrusions 124 being located inwardly of the recess 1221 and extending towards the centre of the recess 1221. The outer planar surfaces of the projections 124 may be lower than the opening plane of the recess 1221, or the outer planar surfaces of the projections 124 may be flush with the opening plane of the recess 1221.

Further, can the coating have the water barrier in the recess 1221, this water barrier is used for preventing that the fluid medium in the kettle body 12 leaks to recess 1221, and this water barrier has good heat conductivity, guarantees that the fine conduction of heat that thick film heating element 11 produced is to stock solution chamber 1231, and consequently this water barrier can be called as the heat conduction water barrier again.

The outer housing 123 covers the kettle wall 121 and the kettle bottom 122, may be a plastic housing, and is provided with a handle 1232 for a user to hold. The outer shell 123 and the kettle bottom 122 are hollow, and form a heating cavity 1233 of the thick film heating appliance 10, for accommodating circuit structures and components of the thick film heating appliance 10, such as the thick film heating assembly 11, which realize heating.

It should be understood that the specific type of the thick film heating apparatus 10 is not limited by the embodiments of the present application, and is not limited to an electric heating kettle, a soymilk maker, a temperature controlled juicer, etc. In addition, the components of the thick film heating appliance 10 contained in the heating cavity 1233 should be designed adaptively according to different types of thick film heating appliances 10. For example, a power socket may be provided in the heating cavity 1233, which may expose the aforementioned power pads, to which associated components of the thick film heating assembly 11 are connected for connection to a respective power source.

Referring to fig. 7 to 10, the thick film heating element 11 includes a base substrate 111 and a heating thick film 112 disposed on the base substrate 111.

The base substrate 111 may be a plate body having a certain thickness, and corresponds to a bottom plate of the thick film heating apparatus 10. The shape of the bottom substrate 111 (e.g., a shape in a plan view or an orthographic shape) is not limited in the embodiments of the present application, and may be, for example, a circle, a rectangle or a polygon, and only needs to be adapted to the structural design of the thick film heater 10. In addition, according to the design requirement of the thick film heating apparatus 10, other structural properties of the base substrate 111 can be designed adaptively, for example, when the thick film heating assembly 11 needs to have higher structural strength, the base substrate 111 may be a metal substrate, such as a stainless steel plate, but it may also be a material plate with better structural strength.

As shown in fig. 7 and 8, the bottom substrate 111 is placed and fixed in the groove 1221 of the pot bottom 122 such that the heating thick film 112 is also located in the groove 1221. In the process of assembling the thick film heating component 11 and the kettle body 12, the groove 1221 marks the assembling position of the heating thick film 112 on the kettle bottom 122, so that the alignment precision of the base material 111 and the kettle bottom 122 can be reduced for the operation of an operator, and the assembly between the thick film heating component 11 and the kettle body 12 is facilitated.

In addition, a part of the structure of the thick film heating element 11 (e.g. the bottom substrate 111 and the heating thick film 112) is embedded in the recess 1221, so as to reduce the size of the thick film heating element 11 protruding out of the kettle bottom 122 and reduce the housing space (i.e. the heating cavity 1233) occupied by the thick film heating element 11.

In one implementation, the outer plane of the base substrate 111 may be lower than the open plane of the grooves 1221, as shown in fig. 8, with the base substrate 111 completely recessed within the grooves 1221.

In another implementation, the outer plane of the base substrate 111 may be flush with the opening plane of the groove 1221, and flush may be understood as the outer plane of the base substrate 111 and the opening plane of the groove 1221 being located on the same plane. At this time, the edge region of the base substrate 111 where the grooves 1221 are provided is thin, and the other region (region where the heating thick film 112 is provided) is thick.

Further, thick film heating element 11 can also include the silica gel conducting strip, this silica gel conducting strip sets up in the inboard of end substrate 111, one side towards kettle bottom 122 promptly, when base substrate 111 is located recess 1221, the silica gel conducting strip is pressed and is held between the tank bottom of base substrate 111 and recess 1221, because the silica gel conducting strip is flexible material, consequently can compensate the not good defect of the hot contact that the tank bottom unevenness of end substrate 111 and/or recess 1221 caused, make the hot contact of end substrate 111 to kettle body 12 abundant, be favorable to guaranteeing heat conduction efficiency.

The bottom substrate 111 may be an integral stamping structure, and the edges of the bottom substrate are stamped to form a plurality of notches 1111 spaced apart from each other. Referring to the left view of fig. 7, when the thick film heating element 11 is rotated to a first angle relative to the kettle body 12, each protrusion 124 is located at a corresponding notch 1111 and can pass through the notch 1111, and then the bottom substrate 111 descends towards the bottom of the groove 1221. Then, the thick film heating element 11 is rotated relative to the kettle body 12 by a second angle, and the protrusions 124 are not all aligned with the corresponding notches 1111, as shown in the right view of fig. 7 and fig. 8, and the bottom substrate 111 is engaged between the protrusions 124 and the bottom of the groove 1221. Part or all of the protrusions 124 press and fix the base substrate 111 to the kettle bottom 122 to keep the base substrate 111 fixed relative to the kettle body 12.

Therefore, the kettle body 12 and the thick film heating component 11 are assembled in a screwing matching mode of the protrusion 124 and the notch 1111, the kettle body 12 and the thick film heating component 11 can be fixed and separated according to requirements in the screwing matching mode, the assembling operation is simple, compared with a welding mode, the requirement on the assembling level is low, and the assembly can be completed by ordinary operators.

In addition, thick film heating element 11 and kettle body 12 are not welded and fixed, but can be selectively separated, once thick film heating element 11 or circuit devices thereon need to be overhauled and maintained, an operator can easily separate thick film heating element 11 from kettle body 12, and can independently carry out operations such as overhaul and maintenance on thick film heating element 11, and the operation is simple and convenient.

The present application also provides structural designs of other embodiments based on the technical idea that the screwing and matching manner of the protrusion 124 and the notch 1111 does not assemble the kettle body 12 and the thick film heating assembly 11. For example, the pot bottom 122 is not provided with the groove 1221, but is disposed in a plane, for this, a ring body is disposed on one side (i.e. the outer side) of the pot bottom 122 facing away from the pot wall 121, the ring body is perpendicular to the pot bottom 122 and extends towards the outer side, and can be regarded as a ring-shaped enclosure wall, the ring body and the pot bottom 122 form a concave structure similar to the groove 1221, and the plurality of protrusions 124 are disposed on the inner side of the ring body. Here, the base substrate 111 is placed in the ring body, and a screw-fitting manner is realized.

According to the amount of heat, the bottom substrate 111 can be divided into a high-heat area and an edge area located at the periphery thereof, the heating thick film 112 is located in the high-heat area, and when the thick film heating assembly 11 rotates relative to the kettle body 12 by a second angle, part or all of the protrusion 124 is pressed on the edge area of the bottom substrate 111, so that the protrusion 124 is prevented from being pressed to damage the heating thick film 112.

The edge region of the bottom substrate 111 may be provided with a first identifier, correspondingly, the pot body 12 is provided with a second identifier, when the thick film heating element 11 rotates relative to the pot body 12 to align the first identifier and the second identifier, it indicates that the thick film heating element 11 rotates relative to the pot body 12 by a first angle, and the thick film heating element 11 can be kept to stop rotating relative to the pot body 12. Correspondingly, when the thick film heating element 11 is rotated relative to the kettle body 12 until the first mark and the second mark are misaligned, it indicates that the thick film heating element 11 is rotated by a second angle relative to the kettle body 12. The specific patterns of the first mark and the second mark, which are not limited in the embodiments of the present application, are, for example, dots or crosses.

As shown in fig. 8, the thickness of the bottom substrate 111 may be equal to the distance between the protrusion 124 and the pot body 12, and thus, in the assembled state, the bottom substrate 111 and the pot bottom 122 are tightly attached to each other, which is beneficial to maximally transferring the heat generated by heating the thick film 112 to the pot bottom 122, and finally to the fluid medium in the liquid storage cavity 1231, thereby improving the heating efficiency.

Of course, the thickness of the bottom base 111 may be slightly greater than the distance between the protrusion 124 and the can 12, so as to realize the interference fit between the bottom base 111 and the protrusion 124 and the can 12, which is beneficial to improving the stability of the assembly between the corresponding components and is beneficial to heat conduction.

In the present application, the number of the protrusions 124 and the notches 1111 may be equal, and when the protrusions 124 are aligned with the notches 1111 one by one, each protrusion 124 may pass through the corresponding notch 1111. The number of the protrusions 124 and the notches 1111 is not limited in the embodiment of the present application, and four protrusions 124 and four notches 1111 are shown in fig. 7 for exemplary purposes only.

In another implementation, the number of projections 124 may be less than the number of notches 1111.

The shapes and sizes of the protrusions 124 may not be exactly the same, and correspondingly, the shapes and sizes of the notches 1111 are also not exactly the same, but each notch 1111 is identical to the corresponding protrusion 124 in shape (e.g., orthographic shape) and size, so that each protrusion 124 can pass through the corresponding notch 1111 when the protrusions 124 are aligned with the notches 1111 one by one.

Referring to fig. 9, 10 and 11, the heating thick film 112 includes an insulating layer 1121, a heat generating coil and an encapsulation layer 1123.

The insulating layer 1121 is directly disposed on the surface of the base substrate 111 and is used to prevent the heat generating coil from being electrically connected to the base substrate 111 made of metal. The insulating layer 1121 may be formed directly on the base substrate 111 by a film forming method (e.g., sputtering or evaporation) using an insulating material, or the insulating layer 1121 may be attached to the base substrate 111 by an adhesive.

As shown in fig. 9, the heat generating coil includes a first heat generating coil 1122a and a second heat generating coil 1122b having the same cross-sectional area, which are used as heat sources and disposed on the insulating layer 1121, and both of the heat generating coils are disposed in a winding manner on the plane of the insulating layer 1121, i.e., each heat generating coil is disposed on the insulating layer 1121 one turn by one.

In order to reduce the area occupied by the first and second heat-generating

coils

1122a and 1122b, the first and second heat-generating

coils

1122a and 1122b may be respectively arranged along the shape winding of the base substrate 111, and the two heat-generating coils are alternately arranged, as shown in fig. 9, the base substrate 111 is a circular substrate, the first heat-generating coil 1122a may be one heat-generating coil wire, which is arranged in a plurality of circles as a whole, and similarly, the second heat-generating coil 1122b may be a single heat-generating coil wire, the whole is also arranged in a plurality of circles, the circles of the plurality of second heat-generating coils 1122b and the plurality of first heat-generating coils 1122a are alternately arranged, for example, the first heat-generating coil 1122a, the second heat-generating coil 1122b, and the first heat-generating coil 1122a are arranged in this order from the inside to the outside.

The first heating coil 1122a and the second heating coil 1122b are respectively connected with electricity, the first heating coil 1122a and the second heating coil 1122b generate heat under voltage driving, the heat is directly transferred to media such as water through the packaging layer 1123, high heating efficiency is guaranteed, the first heating coil 1122a and the second heating coil 1122b are distributed on the plane where the insulating layer 1121 is located in a winding mode, the distribution area of the heating coils is large, the generated heat is relatively dispersed, a local overheating area is avoided being formed, the time for the expansion of the bubbles after heating is shortened, the number of the bubbles during breakage can be reduced, and the noise generated by water boiling is reduced.

To achieve this, the first and second heat-generating

coils

1122a and 1122b need to be connected to a power source as an electrical heat source, and referring to fig. 9, the thick film heating device 10 may further include a plurality of power pads 1122c for connecting the two heat-generating coils.

In one implementation, the power pads 1122c are four, two of which are provided at both ends of the first heat-generating coil 1122a, and the other two of which are provided at both ends of the second heat-generating coil 1122 b.

In another implementation, as shown in fig. 9, there are three power pads 1122c, one of which is provided at one end of the first heat-generating coil 1122a and the other of which is provided at one end of the second heat-generating coil 1122b, the remaining one of which is connected to both the other end of the first heat-generating coil 1122a and the other end of the second heat-generating coil 1122b, specifically, the other end of the first heat-generating coil 1122a and the other end of the second heat-generating coil 1122b are adjacent to each other, and the remaining one power pad 1122c covers the other end of the first heat-generating coil 1122a and the other end of the second heat-generating coil 1122 b.

As shown in fig. 11, the sealing layer 1123 covers the heat generating coil, and covers the insulating layer 1121 and the base substrate 111. The encapsulation layer 1123 is an electrical insulation layer, and further, has good thermal conductivity, which is beneficial for directly transferring heat generated by the first and second heat-generating

coils

1122a and 1122b to a fluid medium such as water to be heated.

It should be understood that the structural design of the heat generating coil in heating the thick film 112 is not limited to the embodiment depicted in fig. 9. For example, the cross-sectional areas of the two first and second heat-generating

coils

1122a and 1122b may be different, and as shown in fig. 10, the cross-sectional area of the wire of the second heat-generating coil 1122b is smaller than that of the wire of the first heat-generating coil 1122a, and the resistivities of the first and second heat-generating

coils

1122a and 1122b may be the same.

For a wire of uniform thickness, the so-called wire cross-sectional area may mean the thickness of the wire, i.e., the single wire of the second heat-generating coil 1122b is thinner than the single wire of the first heat-generating coil 1122a, in other words, the first heat-generating coil 1122a is thicker and the second heat-generating coil 1122b is thinner.

According to the joule law relation 1-1 and the resistance and heat quantity relation 1-2, it can be known that the resistance and the cross-sectional area of the wire are in an inverse proportion relation, and the resistance and the heat quantity of the wire are in an inverse proportion relation, so that the heat quantity and the cross-sectional area are in a direct proportion relation through calculation.

Q＝U²The relation of/R and t is 1-1

R ═ rho L/S relation 1-2

Wherein Q represents heat in joules (J); u represents a voltage in volts (V); r represents resistance in ohms (Ω); t represents time in seconds(s). ρ represents the resistivity of the wire, S represents the cross-sectional area of the wire, and L represents the length of the wire.

Since the second heat-generating coil 1122b is thin and the first heat-generating coil 1122a is thick for two heat-generating coils having the same resistivity, the amount of heat generated by the second heat-generating coil 1122b is small and the amount of heat generated by the first heat-generating coil 1122a is large when the same voltage is received.

Here, the first heat-generating coil 1122a and the second heat-generating coil 1122b operate together, and the total heat generation amount is the sum of the heat generation amount Q1 of the first heat-generating coil 1122a and the heat generation amount Q2 of the second heat-generating coil 1122b, that is, the total heat generation amount Q0 is larger than the heat generation amount of either heat-generating coil, and Q0 > Q1 and Q0 > Q2 are advantageous for achieving rapid heating. After rapid heating, for example, after water is boiled, the thick film heating appliance 10 may be insulated using only one of the heat generating coils. In summary, the thick film heating apparatus 10 can achieve both the functions of rapid heating and thermal insulation.

In addition, the first and second heat-generating

coils

1122a and 1122b are used as heat sources, and by intelligently adjusting the respective heat generation of the first and second heat-generating

coils

1122a and 1122b, when the initial water temperature is low, the water close to the heat source is not easily vaporized, and the two sets of heat-generating coils can be operated at the same time, and when the water is heated to a certain temperature, only the thicker first heat-generating coil 1122a can be operated, thereby reducing the possibility that the water close to the heat source is vaporized, and when the water is reheated to a higher certain temperature, only the thinner second heat-generating coil 1122b can be operated, thereby reducing the possibility that the water close to the heat source is vaporized again.

For example, the power of the second heat-generating coil 1122b is 600W, the power of the first heat-generating coil 1122a is 1200W, when the initial water temperature is low, the water close to the heat source is not easily vaporized, the two sets of heat-generating coils heat together, and the heating power is 1800W; when the water is heated to a certain temperature, for example, 60 ℃, only the first heating coil 1122a of 1200W is operated, reducing the possibility that the water approaching the heating source is vaporized; when the water is reheated to a certain temperature, such as 90 ℃, only the second heat generating coil 1122b of 600W is operated, again reducing the likelihood that water approaching the heat source will be vaporized. In the whole heating process, the possibility that the water close to the heating source is vaporized is low, and the noise generated during water boiling is favorably reduced.

In the foregoing embodiment, the surface of the base substrate 111 is a plane, and the insulating layer 1121, the heat generating coil, and the encapsulation layer 1123 are sequentially disposed on the plane. Of course, the heat generating coil may also be embedded in the base substrate 111, and specifically, the base substrate 111 is provided with a first groove in which the first heat generating coil 1122a is disposed and a second groove in which the second heat generating coil 1122b is disposed. Further, the top of the first and second heat-generating

coils

1122a and 1122b may be lower than or even with the surface of the base substrate 111, that is, the first and second heat-generating

coils

1122a and 1122b may not be higher than the base substrate 111.

It will be appreciated that the manner of mounting the kettle body 12 to the base substrate 111 (of the thick film heating element 11) is not limited to the aforementioned screw-fitting of the protrusion 124 to the notch 1111, and for example, a screw-fitting manner may be adopted. The structural design using the screw-on mode is described in detail below, wherein the same reference numerals are used to identify the same components.

FIG. 12 is a schematic view of the assembly of a kettle body and a base material according to a second embodiment of the present application. Referring to FIG. 12, the pot 12 has internal threads, the edge of the base 111 has external threads 1112, and the external threads 1112 are engaged with the internal threads of the pot 12.

The base 111 is held fixed or separated relative to the kettle body 12 as the thick film heating element 11 is rotated relative to the kettle body 12. In one implementation, the base 111 rotates clockwise relative to the can 12, and to some extent, the base 111 is fixed to the can 12; the bottom base 111 rotates counterclockwise relative to the can 12 to separate the bottom base 111 from the can 12.

In one implementation, for a base substrate 111 having a plate-like structure with a large thickness, the external threads 1112 may be disposed on a sidewall of an edge of the base substrate 111.

In another implementation, for a thinner base substrate 111, the external threads 1112 may be disposed on an extension of the base substrate 111. Specifically, the side wall of the edge of the bottom substrate 111 is provided with an extension perpendicular to the plane of the bottom substrate 111 and extending outward, which can be regarded as a circle of fence, and the external thread 1112 is disposed outside the extension. The extension and the base substrate 111 may be an integrally formed structural member, such as a stamped member.

In both implementations, the bottom substrate 111 is placed in the groove 1221 of the kettle bottom 122, and the external threads 1112 can be screwed with the internal threads inside the groove 1221.

The kettle bottom 122 is not provided with the groove 1221 but is arranged in a plane, one side of the kettle bottom 122, which faces away from the kettle wall 121, is provided with a ring body, internal threads are arranged on the inner side of the ring body, the base substrate 111 is placed in a concave structure formed by matching the ring body with the kettle bottom 122, and the external threads 1112 can be screwed with the internal threads on the inner side of the ring body.

Therefore, the kettle body 12 and the thick film heating component 11 are assembled in a threaded screwing mode, the kettle body 12 and the thick film heating component 11 can be fixed and separated according to requirements in the threaded screwing mode, the assembling operation is simple, the requirement on the assembling level is low compared with a welding mode, and the assembly can be completed by ordinary operators.

Fig. 13 is a schematic structural view of a thick film heating assembly according to an embodiment of the present application, and fig. 14 is a structural cross-sectional view of the thick film heating assembly shown in fig. 13 taken along the direction C-C. Referring to fig. 13 and 14, the thick film heating element 11 of the present embodiment is not provided with the bottom substrate 111, but includes the heating thick film 112, and the heating thick film 112 is directly disposed and fixed in the recess 1221.

The structure of the heating thick film 112 is the same as that of the foregoing embodiment, and includes an insulating layer 1121, a heat generating coil, and an encapsulating layer 1123 which are sequentially stacked. The structures of these components, such as the heating coil, are referred to above and will not be described herein again.

In contrast, since the bottom substrate 111 is not disposed, the insulating layer 1121 is directly disposed at the bottom of the groove 1221 of the pot bottom 122. In one implementation, the insulating layer 1121 is directly sintered to form the bottom of the groove 1221, and then a layer of resistive paste is formed on the insulating layer 1121 by a screen printing technique and sintered to form a heat generating coil, and then the encapsulation layer 1123 is covered.

In the embodiment, the thick heating film 112 is formed on the bottom 122 of the kettle body 12, and the thick heating film 112 is in direct contact with the bottom 122, so that the heat conduction effect is better.

In addition, in the process of assembling the thick film heating component 11 and the kettle body 12, the groove 1221 marks the assembling position of the heating thick film 112 on the kettle bottom 122, and compared with the process of directly printing the heating thick film 112 on the planar kettle bottom 122, the printing precision of an operator can be reduced, and the assembling between the thick film heating component 11 and the kettle body 12 is facilitated.

Further, as shown in fig. 10, the pot body 12 may be provided with a positioning hole 126 at the bottom of the groove 1221, and the thick film heating assembly 11 further includes a fixing post 211 (as shown in fig. 4), where the fixing post 211 is inserted and fixed in the positioning hole 126, so as to fix the circuit structure for realizing heating on the pot bottom 122 of the pot body 12.

In practical applications, the positioning hole 126 may be a threaded hole, and correspondingly, the fixing post 211 is a bolt. In order to improve the assembly stability and reduce the occupied area of the positioning holes 126, in a top view, as shown in fig. 10, the positioning holes 126 are arranged at the bottom of the groove 1221 in a triangular shape.

It should be noted that the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element, and that elements, features, or elements having the same designation in different embodiments may or may not have the same meaning as that of the other elements, and that the particular meaning will be determined by its interpretation in the particular embodiment or by its context in further embodiments.

In addition, although the terms "first, second, third, etc. are used herein to describe various information, such information should not be limited to these terms. These terms are used only to distinguish one type of information from another. For example, first information may also be referred to as second information, and similarly, second information may also be referred to as first information, depending on the context, without departing from the scope herein. The term "if" can be interpreted as "at … …" or "when … …" or "in response to a determination". Furthermore, as used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context indicates otherwise. The terms "or" and/or "are to be construed as inclusive or meaning any one or any combination. Thus, "A, B or C" or "A, B and/or C" means "any of the following: a; b; c; a and B; a and C; b and C; A. b and C ". An exception to this definition will occur only when a combination of elements, functions, steps or operations are inherently mutually exclusive in some way.

Although the application has been shown and described with respect to one or more implementations, equivalent alterations and modifications will occur to others skilled in the art based upon a reading and understanding of this specification and the annexed drawings. The present application includes all such modifications and variations, and is supported by the technical solutions of the foregoing embodiments. That is, the above-mentioned embodiments are only some of the embodiments of the present application, and not intended to limit the scope of the present application, and all equivalent structural changes made by using the contents of the present specification and the drawings, such as the combination of technical features between the embodiments, or the direct or indirect application to other related technical fields, are included in the scope of the present application.

Claims

1. A thick film heating appliance, said thick film heating appliance comprising:

the thickness of the bottom base material is larger than or equal to the distance between the plurality of bulges and the kettle body, and when the thick film heating component rotates relative to the kettle body by a first angle, each bulge is positioned at a corresponding notch and can pass through the notch; when the thick film heating assembly rotates a second angle relative to the kettle body, all of the protrusions are not aligned with the corresponding notches, and part or all of the protrusions are pressed on the base material so as to keep the base material and the kettle body relatively fixed.

2. A thick film heating appliance as claimed in claim 1 wherein the number of projections and indentations is equal or less than the number of indentations.

3. The thick film heating appliance of claim 1, wherein the shape and size of the plurality of protrusions are the same or at least two of the protrusions are different.

4. The thick film heating appliance of claim 1, wherein the thickness of the protrusion is equal to the thickness of the base substrate.

5. The thick film heating appliance of claim 1, wherein the plurality of indentations and the base substrate are an integrally formed structural member.

6. The thick film heating appliance of any one of claims 1 to 5, wherein the kettle body comprises a kettle wall and a kettle bottom, a ring body is arranged on one side of the kettle bottom facing away from the kettle wall, the bottom substrate can be placed in the ring body, and the plurality of protrusions are arranged on the inner side of the ring body.

7. The thick film heating appliance of any one of claims 1 to 5, wherein the kettle body comprises a kettle wall and a kettle bottom, a groove is arranged on one side of the kettle bottom facing away from the kettle wall, the bottom substrate can be placed in the groove, and the plurality of protrusions are arranged on the inner side of the groove.

8. The thick film heating appliance of claim 7, wherein the outer plane of the plurality of protrusions is lower than or flush with the opening plane of the recess.

9. The thick film heating appliance of claim 7, wherein the kettle base with the recess is a stamped and formed structure.

10. The thick film heating apparatus of claim 1, wherein the bottom substrate comprises a high heat area and an edge region disposed at the periphery of the high heat area, the heating thick film is located in the high heat area, and when the thick film heating assembly rotates relative to the kettle body by the second angle, the part or all of the protrusions are pressed against the edge region of the bottom substrate.