CN213845222U

CN213845222U - High-density NAND flash memory chip TSOP packaging equipment

Info

Publication number: CN213845222U
Application number: CN202022996171.8U
Authority: CN
Inventors: 杜沅羲
Original assignee: Zhejiang Jichengxing Technology Co ltd
Current assignee: Zhejiang Jichengxing Technology Co ltd
Priority date: 2020-12-13
Filing date: 2020-12-13
Publication date: 2021-07-30
Anticipated expiration: 2030-12-13

Abstract

The utility model belongs to the technical field of the encapsulation equipment, especially, be a high density NAND flash memory chip TSOP encapsulation equipment, which comprises a fixed base, the top fixedly connected with encapsulation case of fixing base, the inside of fixing base is seted up flutedly, the inside of recess is rotated through the bearing and is connected with fixed threaded rod, fixed threaded rod's surface is rotated through the screw thread and is connected with the removal seat, the bottom of removing the seat is rotated through the pivot and is connected with the support bar, the bottom of support bar is rotated through the pivot and is connected with the supporting seat, the bottom fixedly connected with base of supporting seat, the bottom fixedly connected with dead lever of fixing base. The utility model discloses a set up base, fixed motor and rotating band, make things convenient for the staff to adjust the support for the bottom of the equipment of placing is more firm, can not rock because the wheel production of bottom, thereby leads to the chip of inside placing to produce and damages.

Description

High-density NAND flash memory chip TSOP packaging equipment

Technical Field

The utility model relates to a packaging equipment technical field specifically is a high density NAND flash memory chip TSOP packaging equipment.

Background

The embodiment of the invention discloses a method and equipment for testing a NAND Flash memory chip, wherein the NAND Flash memory comprises a plurality of data blocks, each data block consists of a plurality of memory units which are arranged into an array and is used for storing data, and the Chinese application patent number is CN 201710212514.7. The method comprises the following steps: receiving a parameter test instruction, and performing parameter test on a selected data block in the NAND flash memory chip according to the parameter test instruction; and receiving a test instruction of programming and erasing cycle attenuation in the parameter test process, and testing the programming and erasing cycle attenuation of the data blocks except the selected data block in the NAND flash memory chip according to the test instruction of the programming and erasing cycle attenuation.

However, the existing packaging equipment has the following problems:

1. general packaging equipment is placed singly, most of the general packaging equipment is provided with wheels, so that workers can carry the packaging equipment conveniently, but the general packaging equipment is not stable enough in placement due to the wheels at the bottom and is easy to shake, so that articles placed inside the general packaging equipment are damaged, and normal use is influenced;

2. the most time of placing is longer, and inside regaining of moisture easily to the article that leads to placing wets, influences staff's normal use, thereby causes unnecessary economic loss.

SUMMERY OF THE UTILITY MODEL

Technical problem to be solved

Not enough to prior art, the utility model provides a high density NAND flash memory chip TSOP encapsulation equipment has solved general encapsulation equipment and has placed more single problem.

(II) technical scheme

In order to achieve the above object, the utility model provides a following technical scheme: a TSOP packaging device for a high-density NAND flash memory chip comprises a fixed seat, wherein a packaging box is fixedly connected to the top of the fixed seat, a groove is formed in the fixed seat, a fixed threaded rod is rotatably connected to the inside of the groove through a bearing, a movable seat is rotatably connected to the surface of the fixed threaded rod through threads, the bottom of the movable seat is rotatably connected with a supporting bar through a rotating shaft, the bottom of the supporting bar is rotatably connected with a supporting seat through a rotating shaft, the bottom of the supporting seat is fixedly connected with a base, the bottom of the fixed seat is fixedly connected with a fixed rod, the fixed threaded rod penetrates through one end of the fixed seat and is fixedly connected with a secondary rotating rod, the surface of the secondary rotating rod is slidably connected with a rotating belt, the inside of the rotating belt is slidably connected with an active rotating rod, the active rotating rod penetrates through one end of the packaging box and is fixedly connected with a fixed motor, the dehumidification device is characterized in that a dehumidification box is fixedly connected inside the packaging box, a dehumidification fan is fixedly connected inside the dehumidification box, a movable door is rotatably connected to the front face of the packaging box through a hinge, and a door handle is fixedly connected to the surface of the movable door.

As an optimized technical scheme of the utility model, the fresh air inlet has been seted up on the surface of dehumidification box, the air inlet duct has been seted up to the side of encapsulation case.

As an optimized technical scheme of the utility model, the inside fixedly connected with rack of encapsulation case, the surface difference fixedly connected with bar check, circular check and square check of rack.

As an optimized technical proposal of the utility model, the inside sliding connection of the packaging box is provided with a movable drawer, and the side of the movable drawer is provided with a drawer groove.

As an optimal technical scheme of the utility model, the bottom fixedly connected with universal wheel of dead lever, the quantity of universal wheel is four.

As a preferred technical scheme of the utility model, the side fixedly connected with stopper of initiative bull stick, the diameter of stopper is greater than the width in rotating band.

(III) advantageous effects

Compared with the prior art, the utility model provides a high density NAND flash memory chip TSOP encapsulation equipment possesses following beneficial effect:

1. this high density NAND flash memory chip TSOP encapsulation equipment through base, fixed motor and rotating band, makes things convenient for the staff to adjust the support for the bottom of the equipment of placing is more firm, can not rock because the wheel production of bottom, thereby leads to the inside chip of placing to produce the damage.

2. This high density NAND flash memory chip TSOP encapsulation equipment, through dehumidification box and dehumidification fan, make things convenient for the staff to keep dry to equipment is inside, avoid placing for a long time, inside produces the moisture regain, influences normal use.

Drawings

FIG. 1 is a schematic structural view of the present invention;

fig. 2 is a bottom view of the structure of the present invention;

FIG. 3 is a side sectional view of the structure of the present invention;

fig. 4 is a sectional view of the structure of the present invention.

In the figure: 1. a fixed seat; 2. packaging the box; 3. a groove; 4. fixing a threaded rod; 5. a movable seat; 6. a supporting strip; 7. a supporting seat; 8. a base; 9. fixing the rod; 10. a secondary rotating rod is moved; 11. a rotating belt; 12. an active rotating rod; 13. fixing a motor; 14. a dehumidification box; 15. a dehumidification fan; 16. an air inlet hole; 17. an air inlet groove; 18. placing a rack; 19. a bar grid; 20. a circular grid; 21. square grids; 22. a movable drawer; 23. a drawer slot; 24. a movable door; 25. a door handle; 26. a universal wheel; 27. and a limiting block.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Examples

Referring to fig. 1-4, the present invention provides the following technical solutions: a high-density NAND flash memory chip TSOP packaging device comprises a fixed seat 1, a packaging box 2 is fixedly connected to the top of the fixed seat 1, a groove 3 is formed in the fixed seat 1, a fixed threaded rod 4 is rotatably connected to the inside of the groove 3 through a bearing, a movable seat 5 is rotatably connected to the surface of the fixed threaded rod 4 through threads, a support bar 6 is rotatably connected to the bottom of the movable seat 5 through a rotating shaft, a support seat 7 is rotatably connected to the bottom of the support bar 6 through a rotating shaft, a base 8 is fixedly connected to the bottom of the support seat 7, a fixed rod 9 is fixedly connected to the bottom of the fixed seat 1, a secondary movable rotating rod 10 is fixedly connected to one end, penetrating through the fixed seat 1, of the fixed threaded rod 4, a rotating belt 11 is slidably connected to the surface of the secondary movable rotating rod 10, an active rotating rod 12 is slidably connected to the inside of the rotating belt 11, and a fixed motor 13 is fixedly connected to one end, penetrating through the packaging box 2, of the active rotating rod 12, the inside fixedly connected with dehumidification box 14 of encapsulation case 2, the inside fixedly connected with dehumidification fan 15 of dehumidification box 14, the front of encapsulation case 2 is connected with dodge gate 24 through the hinge rotation, the fixed surface of dodge gate 24 is connected with door handle 25

In this embodiment, the movable door 24 connected with the front side of the packaging box 2 through the hinge is rotated, and the door handle 25 fixedly connected with the surface of the movable door 24 is convenient for workers to open the movable door 24 and place chips, so that the sealing performance of the interior is better, and the loss is avoided.

Specifically, the surface of the dehumidifying box 14 is provided with an air inlet hole 16, and the side surface of the packaging box 2 is provided with an air inlet groove 17.

In this embodiment, through the intake stack 17 that the encapsulation case 2 side was seted up, make things convenient for the business turn over of wind to make inside more dry, facilitate the use.

Specifically, the interior of the packaging box 2 is fixedly connected with a placing frame 18, and the surface of the placing frame 18 is respectively fixedly connected with a strip grid 19, a round grid 20 and a square grid 21.

In this embodiment, through rack 18 surface respectively fixed connection's strip check 19, circular check 20 and square check 21, make things convenient for the staff to classify and place to make better taking.

Specifically, a movable drawer 22 is slidably connected inside the packaging box 2, and a drawer groove 23 is formed in a side surface of the movable drawer 22.

In this embodiment, through the movable drawer 22 slidably connected inside the casing 2, the worker can conveniently place the irregularly-shaped chip, thereby achieving better protection.

Specifically, the bottom of the fixing rod 9 is fixedly connected with universal wheels 26, and the number of the universal wheels 26 is four.

In this embodiment, through dead lever 9 bottom fixed connection's universal wheel 26, make things convenient for the staff to carry to make and use more convenient and fast.

Specifically, the side surface of the driving rotating rod 12 is fixedly connected with a limiting block 27, and the diameter of the limiting block 27 is larger than the width of the rotating belt 11.

In this embodiment, through the stopper 27 of initiative bull stick 12 side fixed connection, take place to drop when avoiding rotating band 1 to rotate to influence normal use.

The utility model discloses a theory of operation and use flow: when the chip packaging box is used, a worker can conveniently place a longer chip in the strip grid 19, place a circular chip in the circular grid 20 and place a shorter chip in the square grid 21 through the size and the shape of the chip placed according to needs, and carry the chip conveniently through the universal wheel 26 fixedly connected with the bottom of the fixed rod 9, the worker can start the fixed motor 13, the fixed motor 13 penetrates through the output end of the packaging box 2 to drive the driving rotating rod 12 to rotate, the rotating driving rotating rod 12 drives the rotating belt 11 in surface sliding connection to start moving, the rotating belt 11 drives the secondary rotating rod 10 to start rotating, the rotating secondary rotating rod 10 drives the fixed threaded rod 4 fixedly connected with the side surface to start rotating, the rotating fixed threaded rod 4 drives the moving seat 5 to start moving through threaded rotating connection, the bottom of the removal seat 5 that removes rotates 11 through the pivot and moves support bar 6 and begin to remove, the support bar 6 bottom of removal rotates joint support seat 7 through the pivot, it begins to get up base 8 to drive supporting seat 7, thereby reach and carry out the supporting role to packaging box 2, because universal wheel 26 when avoiding placing, lead to circular check 20 to produce and rock, influence normal use, through setting up dehumidification fan 15, the staff is through starting dehumidification fan 15, dehumidification fan 15 passes through intake stack 17 and discharges the wind of outside, thereby reach the inside dehumidification effect to packaging box 2, avoid influencing the use of chip.

Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described in the foregoing embodiments, or equivalents may be substituted for elements thereof. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A high-density NAND flash memory chip TSOP packaging equipment comprises a fixed seat (1), and is characterized in that: the top fixedly connected with encapsulation case (2) of fixing base (1), recess (3) are seted up to the inside of fixing base (1), the inside of recess (3) is rotated through the bearing and is connected with fixed threaded rod (4), the surface of fixed threaded rod (4) is rotated through the screw thread and is connected with removal seat (5), the bottom of removing seat (5) is rotated through the pivot and is connected with support bar (6), the bottom of support bar (6) is rotated through the pivot and is connected with supporting seat (7), the bottom fixedly connected with base (8) of supporting seat (7), the bottom fixedly connected with dead lever (9) of fixing base (1), the one end fixedly connected with secondary rotating rod (10) that fixed threaded rod (4) passed fixing base (1), the surperficial sliding connection of secondary rotating rod (10) has rotating band (11), the inner sliding connection of the rotating belt (11) is provided with a driving rotating rod (12), the driving rotating rod (12) penetrates through one end of the packaging box (2) and is fixedly connected with a fixed motor (13), the inner part of the packaging box (2) is fixedly connected with a dehumidification box (14), the inner part of the dehumidification box (14) is fixedly connected with a dehumidification fan (15), the front face of the packaging box (2) is rotatably connected with a movable door (24) through a hinge, and the surface of the movable door (24) is fixedly connected with a door handle (25).

2. The TSOP packaging device for the high-density NAND flash memory chip of claim 1, wherein: an air inlet hole (16) is formed in the surface of the dehumidification box (14), and an air inlet groove (17) is formed in the side face of the packaging box (2).

3. The TSOP packaging device for the high-density NAND flash memory chip of claim 1, wherein: the packaging box is characterized in that a placing frame (18) is fixedly connected to the inside of the packaging box (2), and strip grids (19), round grids (20) and square grids (21) are fixedly connected to the surface of the placing frame (18) respectively.

4. The TSOP packaging device for the high-density NAND flash memory chip of claim 1, wherein: the packaging box is characterized in that a movable drawer (22) is slidably connected inside the packaging box (2), and a drawer groove (23) is formed in the side face of the movable drawer (22).

5. The TSOP packaging device for the high-density NAND flash memory chip of claim 1, wherein: the bottom fixedly connected with universal wheel (26) of dead lever (9), the quantity of universal wheel (26) is four.

6. The TSOP packaging device for the high-density NAND flash memory chip of claim 1, wherein: the side face of the driving rotating rod (12) is fixedly connected with a limiting block (27), and the diameter of the limiting block (27) is larger than the width of the rotating belt (11).