CN213845214U - Confinement ring and plasma processing device - Google Patents

Abstract

The utility model provides a confinement ring and plasma processing apparatus through set up the vertical kink of non in gas passage, has increased plasma and gas passage collision probability, and the effectual restriction with plasma has reduced the aspect ratio greatly in the treatment area to the air lock has been reduced.

Description

Confinement ring and plasma processing device

Technical Field

The utility model relates to a plasma processing apparatus technical field especially relates to a plasma confinement ring technical field among plasma processing apparatus.

Background

The plasma processing device processes a semiconductor substrate by utilizing the working principle of a vacuum reaction chamber. The working principle of the vacuum reaction chamber is that reaction gas containing proper etchant or deposition source gas is introduced into the vacuum reaction chamber, and then radio frequency energy is input into the reaction chamber to activate the reaction gas to ignite and maintain plasma so as to etch a material layer on the surface of a substrate or deposit the material layer on the surface of the substrate, thereby processing a semiconductor substrate. For example, a capacitive plasma reactor, in which a capacitive discharge is formed between electrodes when radio frequency power is applied to one of the upper or lower electrodes, has been widely used to process semiconductor substrates.

After the plasma is generated, most of the plasma is in the processing area between the upper electrode and the lower electrode, but due to the diffusivity of the plasma, part of the plasma may fill the whole reaction chamber and reach the exhaust area, and if the plasma reaches the non-processing area, such as the exhaust area, the area may be corroded, eroded or deposited by the plasma, so that the particle pollution in the reaction chamber is caused, the service life of the parts in the reaction chamber is reduced, and the processing quality of the semiconductor is affected.

Therefore, it is necessary to confine the plasma in the processing region, and the plasma is generally confined in the processing region by a confinement ring in the prior art, for example, in fig. 1, the confinement ring 200 'is disposed between the processing region 201 and the exhaust region 202, and has a plurality of channels, the distance of the charged particles in the plasma moving through the channels is greater than the mean free path of the charged particles, and the charged particles in the plasma P annihilate due to colliding with the channel sidewall when passing through the channels, so as to reduce the number of leaked plasma P', and effectively confine the plasma in the processing region, but such a design may increase the probability of the charged particles in the plasma colliding with the channel sidewall, the depth and width of the channel may be larger, i.e. the depth D of the channel is larger, and the larger depth D causes the increase of the gas resistance, and brings a great workload to the exhaust pump 140 (as shown in fig. 2), the service life of the exhaust pump 140 is reduced.

SUMMERY OF THE UTILITY MODEL

In order to solve the above technical problem, the present invention provides a confinement ring, which is used for a plasma processing apparatus, and is disposed between a processing area and an exhaust area of the plasma processing apparatus, wherein the confinement ring is characterized in that: the method comprises the following steps: an annular body having an upper surface and a lower surface opposite the upper surface; the annular body includes at least one gas passage extending through the upper and lower surfaces; the gas channel includes at least one non-longitudinal bend between the upper surface and the lower surface.

Optionally, an angle between the gas channel located at the non-longitudinal bending portion and the upper surface or the lower surface is greater than or equal to 0 ° and smaller than 90 °.

Optionally, the angle is 0 °.

Optionally, the gas passages are annular and extend along the circumferential direction of the annular body, and adjacent gas passages are isolated from each other.

Optionally, the gas channel further comprises: the device comprises a main channel and at least two auxiliary channels communicated with the same main channel; the gas inlet of the main channel is positioned on the upper surface, the gas outlet of the auxiliary channel is positioned on the lower surface, and the non-longitudinal bending part is positioned at the joint of the main channel and the auxiliary channel.

Optionally, the gas channel further comprises: the device comprises a main channel and at least two auxiliary channels communicated with the same main channel; the gas outlet of the main channel is positioned on the lower surface, the gas inlet of the auxiliary channel is positioned on the upper surface, and the non-longitudinal bending part is positioned at the joint of the main channel and the auxiliary channel.

Optionally, the confinement ring further comprises a spacer; the auxiliary channels communicated with the same main channel are spaced by the spacing parts, and the main channel and the auxiliary channels are annular and extend along the circumferential direction of the annular body.

Optionally, the spacer has a non-longitudinal face on the side facing the upper face.

Optionally, the spacer has a non-longitudinal face on the side facing the lower surface.

Optionally, the same secondary channel is circumferentially spaced by a connecting portion, one end of the connecting portion is integrally connected to the spacing portion, and the other end of the connecting portion is integrally connected to the sidewall of the annular body.

Optionally, the main channel width is equal to the sum of all the sub-channel widths.

Optionally, the surface of the annular body is anodized.

Optionally, the surface of the annular body that contacts or is close to the plasma is coated with a material that is resistant to plasma erosion.

Further, the utility model also discloses a plasma processing apparatus, include the reaction chamber that is enclosed by the chamber wall, the reaction chamber has treatment area territory and exhaust area territory, its characterized in that: further comprising: the confinement rings, as described above, are disposed between the process region and the exhaust region.

The utility model has the advantages that: the utility model provides a confinement ring and manufacturing method and plasma processing apparatus thereof through set up the vertical kink of non in gas passage, has increased plasma and gas passage collision probability, and the effectual restriction with plasma has reduced the aspect ratio greatly in the treatment area to the air lock has been reduced.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.

FIG. 1 shows a schematic view of a prior art confinement ring;

FIG. 2 shows a schematic diagram of a Capacitively Coupled Plasma (CCP) processing apparatus;

FIG. 3 shows a top view of the confinement rings;

FIG. 4 shows a cross-sectional view of the confinement rings of FIG. 3 taken along the x-x' direction;

FIG. 5 shows the gas distribution inside the gas channel S;

FIG. 6 shows a partial bottom view of the secondary channel;

FIG. 7 shows a further embodiment;

fig. 8 shows a further embodiment.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Fig. 2 shows a schematic diagram of a Capacitively Coupled Plasma (CCP) processing apparatus. In fig. 2, the capacitively coupled plasma processing apparatus is an apparatus for generating plasma in a reaction chamber by capacitively coupling a radio frequency power applied to a plate and etching the plasma. It comprises a vacuum reaction chamber 100 comprising a substantially cylindrical reaction chamber wall 101 made of a metallic material, which is provided with an opening 102 for accommodating the substrate in and out. The upper part of the reaction chamber is provided with a gas spray header 120 and a base 110 opposite to the gas spray header, the gas spray header 120 is connected with a gas supply device 125 and used for conveying reaction gas to the vacuum reaction chamber and simultaneously used as an upper electrode of the vacuum reaction chamber, an electrostatic chuck 112 is arranged above the base 110 and simultaneously used as a lower electrode of the vacuum reaction chamber, and a processing area 201 is formed between the upper electrode and the lower electrode. At least one rf power source 150 is applied to one of the upper electrode or the lower electrode through a matching network 152, and an rf electric field is generated between the upper electrode and the lower electrode to dissociate the reaction gas into plasma, which contains a large number of active particles such as electrons, ions, excited atoms, molecules, and radicals, which can undergo various physical and chemical reactions with the surface of the substrate W to be processed, so that the topography of the surface of the substrate W is changed, i.e., the etching process is completed. An exhaust pump 140 is further disposed below the vacuum reaction chamber 100 for exhausting the reaction by-products out of the reaction chamber to maintain a vacuum environment of the reaction chamber.

An electrostatic electrode 113 is disposed inside the electrostatic chuck 112 for generating electrostatic attraction to support and fix the substrate W to be processed during the process. A heating device 114 is disposed below the electrostatic chuck for controlling the temperature of the substrate during processing. A focus ring 132 and an edge ring 134 are disposed around the susceptor 110 to adjust the electric field or temperature distribution around the substrate and improve the uniformity of substrate processing. A plasma confinement ring 200 is disposed around the edge ring, the confinement ring 200 being disposed between the processing region 201 and the exhaust region 202 to confine plasma to the processing region 201 between the upper and lower electrodes and to prevent plasma from leaking into non-processing regions, such as the exhaust region 202, which could cause damage to components in the non-processing regions. A middle grounding ring 136 is arranged below the plasma confinement ring 200 and is used for providing electric field shielding for the plasma confinement ring; a lower ground ring 137 is disposed below the middle ground ring, and the middle ground ring 136 and the lower ground ring 137 are electrically connected to form a rf ground loop in the reaction chamber. A shielding ring 138 is disposed between the lower ground ring and the base for shielding the rf signal applied to the base within the base to electrically isolate the base from the lower ground ring.

FIG. 3 illustrates a top view of an embodiment of the confinement ring 200 of FIG. 2, the confinement ring 200 including an annular body 210 and a spacer 240, the annular body 210 including an upper surface 230 and a lower surface 231 opposite the upper surface, the upper surface 230 facing the process region 201 and the lower surface 231 facing the exhaust region 202; optionally, the upper surface is parallel to the lower surface; the annular body 210 comprises at least one gas channel S, the gas channel S penetrates through the upper surface 230 and the lower surface 231, the gas channel S extends along the circumferential direction of the annular body 210 in an annular shape, adjacent gas channels S are isolated from each other, and every two gas channels S are parallel to each other in the circumferential direction to form a plurality of concentric rings. In the longitudinal direction, i.e., the direction perpendicular to the upper and lower surfaces, each gas passage S is substantially parallel to the longitudinal direction.

Fig. 4 shows a cross-sectional view of the confinement rings of fig. 3 along the x-x' direction. As shown in fig. 4, each of the gas passages S includes: a main passage S1, and a first sub-passage S2a and a second sub-passage S2b respectively communicating with the same main passage S1; wherein the gas inlet 220 of the main channel S1 is located on the upper surface 230, and the gas outlet 221 of the sub channel is located on the lower surface 231; each gas channel S further comprises two non-longitudinal bends. The left side and the right side are distinguished by the orientation of the plane of the paper, the two non-longitudinal bending parts 260 are a non-longitudinal bending part on the left side and a non-longitudinal bending part on the right side, and the non-longitudinal bending parts 260 are positioned at the connecting part of the main channel and the auxiliary channel; for one of the gas passages S, the first secondary passage S2a is connected to the main passage S1 by a left non-longitudinal bend 260, the second secondary passage S2b is connected to the main passage S1 by a right non-longitudinal bend 260, the non-longitudinal bend 260 having a tendency to extend generally in a transverse direction, wherein the transverse direction is a direction parallel to the upper and lower surfaces, and the angle of the gas passage at the non-longitudinal bend with the upper or lower surface is 0 ° or more and less than 90 °, alternatively 0 ° or more and 45 ° or less, alternatively 0 °, and fig. 4 only shows the case where the angle is 0 °.

Further, as can be seen from fig. 4: the gas G passes through S1, is split into two paths by the non-longitudinal bend 260, where the gas G is forced to flow in a generally transverse direction at the non-longitudinal bend 260. Since the charged particles in the plasma have directionality and a high velocity in the electric field of the processing region 201, most of the charged particles contained in the used reaction gas may collide against the upper surface 230 of the confinement rings 200 and may not pass therethrough due to directionality and velocity while being pumped by the exhaust pump 140, and a small portion of the charged particles that do not collide against the upper surface 230 may flow toward the gas passage S.

Fig. 5 shows a gas distribution pattern inside one gas channel S. The confinement ring 200 includes an annular body 210 and a spacer 240, the annular body 210 including a plurality of sidewalls 250. The gas channel S is composed of two opposite side walls 250 and a spacer 240, the spacer 240 is disposed between the two opposite side walls 250, the side walls 250 include an upper side wall 252, a side wall non-longitudinal surface 251, and a lower side wall 253 which are sequentially connected from top to bottom, wherein the upper side wall 252 and the lower side wall 253 substantially extend along the longitudinal direction, and the side wall non-longitudinal surface 251 forms an angle with the upper surface or the lower surface, the angle is greater than or equal to 0 ° and less than 90 °, alternatively, the angle is greater than or equal to 0 ° and less than 45 °, alternatively, the angle is 0 °; the partition 240 includes a non-longitudinal surface 241 and two side surfaces 242, the side surfaces 242 extend substantially along the longitudinal direction, the non-longitudinal surface 241 may be parallel to the upper and lower surfaces (i.e. the angle is equal to 0 °), and the non-longitudinal surface is connected with the side surfaces at two sides to form a wall shape; optionally, the non-longitudinal surface 241 is a peak-shaped surface, the slope of the peak-shaped surface is parallel to the non-longitudinal surface 251 of the sidewall, and an angle formed by the non-longitudinal bending portion and the upper surface or the lower surface is an angle (that is, the angle is greater than 0 ° and smaller than 90 °); alternatively, a downward extension of the upper sidewall 252 intersects the non-longitudinal face 241 of the spacer 240.

Due to the presence of the non-longitudinal bend 260, after entering the gas channel S, the charged particles may hit the non-longitudinal surface 241 of the spacer 240, for a large percentage, and a small amount of charged particles that do not hit the non-longitudinal surface 241 may hit the lower sidewall 253 due to the turning of the gas flow, and these hits neutralize the charges on the charged particles, so that the particles leaving the gas channel S after the hits are neutral. Therefore, the number of charged particles in the non-processing area is greatly reduced, discharged gas can not enable the discharge of the plasma to extend to the non-processing area, the discharge phenomenon of the non-processing area is eliminated, the corrosion of the reaction cavity is avoided, and in addition, particles in the exhaust area can be blocked by the non-longitudinal surface 251 of the side wall when the particles upwards swell, so that the problem that the upswell of the particles in the exhaust area affects the quality of a semiconductor process can be solved.

Fig. 6 shows a partial bottom view of the sub-channel, wherein at least one of the first sub-channel S2a and the second sub-channel S2b is discontinuous in the circumferential direction and is separated by a connecting portion 270, one end of the connecting portion 270 is integrally connected with the separating portion 240, and the other end of the connecting portion 270 is integrally connected with the side wall 250; for example, the second sub-passage S2b is circumferentially spaced by the connecting portions 270, the number of the connecting portions 270 is at least one, and optionally 3 or 4, and the plurality of connecting portions 270 are circumferentially evenly spaced. The connecting portion 270 is arranged to facilitate the integral forming of the limit ring 200, specifically, the integral forming is completed by machining, the integral manufacturing mode is convenient for production and manufacturing, and the formed limit ring has high strength.

Alternatively, referring to fig. 5, the width of the main channel S1 is uniform, the width is W1, the widths of the sub channel S2a and the sub channel S2b are also uniform, the width of the sub channel S2a is W2, and the width of the sub channel S2b is W2'; optionally, W1 ═ W2+ W2 ', optionally, W2 ═ W2 ', although W2 may not be equal to W2 '. This has the advantages that: since the gas entry and exit ports are the same, the gas resistance will decrease.

The above embodiment exemplifies only the case where there are two sub-channels. Of course, there may be only one secondary channel, and then the primary channel is connected to one secondary channel by a non-longitudinal bend; optionally, at this time, in order to ensure that the air resistance is as low as possible, the widths of the main channel and the sub channel are the same.

Moreover, other embodiments are possible. The number of the sub-channels may be two or more. For example, a gas channel may also be provided on the partition 240, which gas channel penetrates the non-longitudinal face 241 and the lower face, and which gas channel comprises a main channel and one or two secondary channels connected by a non-longitudinal bend; optionally, to ensure that the air resistance is as low as possible, the main channel width is equal to the sum of all the secondary channel widths.

Fig. 7 shows another embodiment of the present application. The figure shows the case of 4 non-longitudinal folds, although there may of course be more non-longitudinal folds. For clarity and conciseness of description, the same parts as those described above are described by the same reference numerals. In this embodiment, the difference from the above embodiment is only 4 in the non-longitudinal bend portion. The primary channel communicates with one of the secondary channels through two non-longitudinal bends, in this embodiment the spacer 40 has three non-longitudinal faces 241, which greatly increases the likelihood of charged particle collisions; optionally, the extension of the upper sidewall extending downward intersects the non-longitudinal face 241. In this embodiment, to ensure that the air resistance is as low as possible, the main channel width is equal to the sum of all the sub-channel widths. In addition, the sub-passages are not limited to only two, and include one or more of the sub-passages as described above.

Fig. 8 shows another embodiment of the present application. This embodiment differs from the above embodiments only in that the primary and secondary channels are upside down, i.e.: the gas outlet of the main channel of the gas channel is positioned on the lower surface, the gas inlet of the auxiliary channel is positioned on the upper surface, and the non-longitudinal bending part is positioned at the joint of the main channel and the auxiliary channel; specifically, referring to fig. 8, the gas enters through two secondary channels S1a, S1b and then flows through a non-longitudinal bend towards the primary channel S2', in this embodiment, the charged particles tend to strike the non-longitudinal faces of the side walls and the lower side walls; optionally, the downwardly extending extensions of the sides of the spacer 240 intersect the sidewall non-longitudinal faces.

In conclusion, because the utility model discloses a limit ring 200's degree of depth design need not to consider that the charged particle of plasma passes through the distance that gas passage removed must be greater than charged particle's mean free path, consequently the utility model discloses a limit ring's degree of depth can be less than among the prior art limit ring 200's degree of depth, and the depth-to-width ratio has been reduced greatly to reduce the air resistance, reduced the load to the pump.

Selection of materials for the above examples. The confinement rings are made of metal, such as aluminum, stainless steel, tungsten, etc., and to protect the confinement rings, the faces are first anodized and then coated with a plasma-resistant material on the face facing the treated area, such as: coating a layer of Y₂O₃Material to further prevent plasma erosion.

As the manufacturing method of the confinement ring, the method of integrated processing has been mentioned above, that is: and the integrated processing is realized through mechanical processing.

Optionally, the limiting ring may also be processed separately, first, the annular body and the spacer are processed separately, and then the annular body and the spacer are assembled, where the assembling step includes assembling the annular body and the spacer by an annular frame disposed on the lower surfaces of the annular body and the spacer; optionally, the assembling step may further include assembling the annular body and the spacer together using the above connecting portion, and the connecting portion in the method is discrete and is not integrally manufactured with the spacer and the annular body.

The limiting ring of the present invention is not limited to the application to the plasma processing apparatus, and can be applied to other plasma processing apparatuses, and is not described herein again.

While the present invention has been described in detail with reference to the preferred embodiments thereof, it should be understood that the above description should not be taken as limiting the present invention. Numerous modifications and alterations to the present invention will become apparent to those skilled in the art upon reading the foregoing description. Accordingly, the scope of the invention should be limited only by the attached claims.

Claims (15)

1. A confinement ring for a plasma processing apparatus disposed between a processing region and an exhaust region of the plasma processing apparatus, comprising: the method comprises the following steps:

an annular body having an upper surface and a lower surface opposite the upper surface;

the annular body includes at least one gas passage extending through the upper and lower surfaces; the gas channel includes at least one non-longitudinal bend between the upper surface and the lower surface.

2. The confinement ring of claim 1, wherein: the angle between the gas channel positioned at the non-longitudinal bending part and the upper surface or the lower surface is more than or equal to 0 degree and less than 90 degrees.

3. The confinement ring of claim 2, wherein: the angle is 0 °.

4. The confinement ring of claim 1, wherein: the gas channels are annular and extend along the circumferential direction of the annular body, and the adjacent gas channels are isolated from each other.

5. The confinement ring of claim 4, wherein: the gas channel further comprises: the device comprises a main channel and at least two auxiliary channels communicated with the same main channel; the gas inlet of the main channel is positioned on the upper surface, the gas outlet of the auxiliary channel is positioned on the lower surface, and the non-longitudinal bending part is positioned at the joint of the main channel and the auxiliary channel.

6. The confinement ring of claim 4, wherein: the gas channel further comprises: the device comprises a main channel and at least two auxiliary channels communicated with the same main channel; the gas outlet of the main channel is positioned on the lower surface, the gas inlet of the auxiliary channel is positioned on the upper surface, and the non-longitudinal bending part is positioned at the joint of the main channel and the auxiliary channel.

7. The confinement ring of claim 5, wherein: the confinement ring further comprises a spacer; the auxiliary channels communicated with the same main channel are spaced by the spacing parts, and the main channel and the auxiliary channels are annular and extend along the circumferential direction of the annular body.

8. The confinement ring of claim 6, wherein: the confinement ring further comprises a spacer; the auxiliary channels communicated with the same main channel are spaced by the spacing parts, and the main channel and the auxiliary channels are annular and extend along the circumferential direction of the annular body.

9. The confinement ring of claim 7, wherein: the spacer has a non-longitudinal face on a side facing the upper face.

10. The confinement ring of claim 8, wherein: the spacer has a non-longitudinal face on the side facing the lower surface.

11. The confinement ring of any one of claims 7-10, wherein: the same auxiliary channel is spaced by a connecting part in the circumferential direction of the annular body, one end of the connecting part is integrally connected with the spacing part, and the other end of the connecting part is integrally connected with the side wall of the annular body.

12. The confinement ring of any one of claims 5-10, wherein: the main channel width is equal to the sum of all the sub-channel widths.

13. The confinement ring of any one of claims 1-10, wherein: the surface of the annular body is anodized.

14. The confinement ring of any one of claims 1-10, wherein: the surface of the annular body, which is in contact with or close to the plasma, is coated with a material resistant to plasma corrosion.

15. A plasma processing apparatus comprising a reaction chamber bounded by chamber walls, the reaction chamber having a processing region and an exhaust region, characterized in that: further comprising: the confinement ring of any of claims 1-14, wherein the confinement ring is disposed between the process region and the exhaust region.

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