CN213825652U

CN213825652U - Glue dispenser for semiconductor

Info

Publication number: CN213825652U
Application number: CN202022706018.7U
Authority: CN
Inventors: 黄昌民
Original assignee: Wuxi Deli Core Semiconductor Technology Co ltd
Current assignee: Wuxi Deli Core Semiconductor Technology Co ltd
Priority date: 2020-11-20
Filing date: 2020-11-20
Publication date: 2021-07-30
Anticipated expiration: 2030-11-20

Abstract

The utility model discloses a point gum machine for semiconductor relates to semiconductor equipment technical field. The utility model discloses a PMKD and rotatory bucket, rotatory bucket is located PMKD's one end, PMKD's top is fixed with the semiconductor and places the board, PMKD's top and the outside that is located the semiconductor and places the board are fixed with the support frame, the inside sliding connection of support frame has the probe mount, the top of probe mount is fixed with the water pump, the water pump passes through the hose connection with rotatory bucket, the bottom of probe mount is fixed with a bit and glues the probe, the water pump passes through the pipe connection with some glue probes, the top of rotatory bucket is fixed with the rotating electrical machines. The utility model discloses a cooperation of probe and stirring leaf and heating pipe is glued with the point to the water pump for the device can prevent that glue from producing when using and solidifying, and through the cooperation of lift connecting plate and threaded rod and probe mount and slider, makes the device can be more stable go up and down when using.

Description

Glue dispenser for semiconductor

Technical Field

The utility model belongs to the technical field of semiconductor equipment, especially, relate to a point gum machine for semiconductor.

Background

The semiconductor refers to a material with the electric conductivity between a conductor and an insulator at normal temperature, the semiconductor is widely applied to the fields of consumer electronics, communication systems, medical instruments and the like, a glue dispenser is often used for packaging the semiconductor, glue is easy to solidify when the existing glue dispenser is used, and glue dispensing of the glue dispenser for the semiconductors with different thicknesses is not accurate enough when the glue dispenser is used.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a point gum machine for semiconductor to current problem has been solved: the glue of the existing glue dispenser is easy to solidify when in use.

In order to solve the technical problem, the utility model discloses a realize through following technical scheme:

the utility model relates to a point gum machine for semiconductor, including PMKD and rotatory bucket, rotatory bucket is located PMKD's one end, PMKD's top is fixed with the semiconductor and places the board, PMKD's top and the outside that is located the semiconductor and places the board are fixed with the support frame, the inside sliding connection of support frame has the probe mount, the top of probe mount is fixed with the water pump, the water pump passes through the hose connection with rotatory bucket, the bottom of probe mount is fixed with some glue probe, the water pump passes through the pipe connection with some glue probe, the top of rotatory bucket is fixed with the rotating electrical machines, the output of rotating electrical machines and the internal connection that is located rotatory bucket have the stirring leaf, the inside top of rotatory bucket is fixed with the protecting crust, the inside of protecting crust is fixed with the heating pipe.

Further, the inside of support frame and the one end that is located the probe mount and is close to rotatory bucket are fixed with the slider, the top of support frame and the one end that is located the probe mount and keeps away from the slider are fixed with elevator motor, elevator motor's output is connected with the threaded rod, the outside threaded connection of threaded rod has the lift connecting plate, the one end and the probe mount welding of lift connecting plate.

Furthermore, a T-shaped groove is formed in the support frame and in a position corresponding to the sliding block, and the support frame is connected with the sliding block in a sliding mode through the T-shaped groove.

Further, the output end of the rotating motor is connected with the stirring blade through a flat key.

Further, the top of rotatory bucket and the one end that is located the rotating electrical machines are fixed with a feeding section of thick bamboo, the bleeder vent has all been seted up to the bottom of protecting crust.

Furthermore, a thread groove is formed in the lifting connecting plate, and the lifting connecting plate is in threaded connection with the threaded rod through the thread groove.

The utility model discloses following beneficial effect has:

1. the utility model discloses a cooperation of probe and stirring leaf and heating pipe is glued with the point to the water pump for the device can prevent that glue from producing when using and solidifying, and then reduces the processing cost.

2. The utility model discloses a lift connecting plate and threaded rod and the cooperation of probe mount and slider for the device can be more stable go up and down when using, and then can carry out accurate point to the semiconductor of different thickness and glue.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without creative efforts.

Fig. 1 is a schematic overall structure diagram of the present invention;

fig. 2 is an overall bottom view of the present invention;

FIG. 3 is a schematic view of the internal structure of the rotary barrel of the present invention;

fig. 4 is a schematic view of the internal structure of the protective shell of the present invention.

In the drawings, the components represented by the respective reference numerals are listed below:

1. fixing the bottom plate; 2. a semiconductor placement board; 3. a support frame; 4. heating a tube; 5. a lifting motor; 6. a probe fixing frame; 7. a water pump; 8. a slider; 9. a rotating electric machine; 10. a feeding cylinder; 11. rotating the barrel; 12. dispensing a probe; 13. lifting the connecting plate; 14. a threaded rod; 15. a protective shell; 16. stirring the leaves.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by a person of ordinary skill in the art without creative efforts belong to the protection scope of the present invention.

Referring to fig. 1-4, the utility model relates to a semiconductor dispenser, including a fixed base plate 1 and a rotary barrel 11, the rotary barrel 11 is located at one end of the fixed base plate 1, the top of the fixed base plate 1 is fixed with a semiconductor placing plate 2, the top of the fixed base plate 1 and the outer side of the semiconductor placing plate 2 are fixed with a supporting frame 3, the inside of the supporting frame 3 is connected with a probe fixing frame 6 in a sliding manner, the top of the probe fixing frame 6 is fixed with a water pump 7, the water pump 7 is connected with the rotary barrel 11 through a hose, the bottom of the probe fixing frame 6 is fixed with a dispensing probe 12, the water pump 7 is connected with the dispensing probe 12 through a pipeline;

the rotary motor 9 is fixed at the top of the rotary barrel 11, the feeding barrel 10 is fixed at the top of the rotary barrel 11 and at one end of the rotary motor 9, air holes are formed in the bottom of the protective shell 15, the stirring blade 16 is connected to the output end of the rotary motor 9 and inside the rotary barrel 11, the output end of the rotary motor 9 is connected with the stirring blade 16 through a flat key, the protective shell 15 is fixed at the top end inside the rotary barrel 11, and the heating pipe 4 is fixed inside the protective shell 15, so that glue can be prevented from being solidified when the device is used, and the processing cost is reduced;

inside of support frame 3 and the one end that is located probe mount 6 and is close to rotatory bucket 11 are fixed with slider 8, the T-slot has been seted up to the inside of support frame 3 and the position corresponding with slider 8, support frame 3 passes through T-slot sliding connection with slider 8, the top of support frame 3 and the one end that is located probe mount 6 and keeps away from slider 8 are fixed with elevator motor 5, elevator motor 5's output is connected with threaded rod 14, threaded rod 14's outside threaded connection has lifting connection board 13, the thread groove has been seted up to lifting connection board 13's inside, lifting connection board 13 passes through thread groove threaded connection with threaded rod 14, lifting connection board 13's one end and probe mount 6 welding, make the device can be more stable go up and down when using, and then can carry out accurate point to the semiconductor of different thickness.

One specific application of this embodiment is: at first place the semiconductor that will carry out some glue at the top that board 2 was placed to the semiconductor, then gain the electricity through water pump 7, make water pump 7 extract the inside glue of rotatory bucket 11 through the hose and carry the inside of some glue probe 12 through the pipeline, simultaneously gain the electricity through rotating electrical machines 9, make rotating electrical machines 9 drive stirring leaf 16 and rotate, and then carry out continuous stirring to glue, then gain the electricity through heating pipe 4, make heating pipe 4 can heat glue, and then prevent that glue from solidifying because the temperature is lower, then carry out some glue to the semiconductor through some glue probe 12, then gain the electricity through elevator motor 5, make elevator motor 5 drive threaded rod 14 and rotate, then it goes up and down to drive lift connecting plate 13 through threaded rod 14 rotation, then go up and down to drive probe mount 6 through lift connecting plate 13, and down to make probe mount 6 can be more steady when going up and down through the sliding connection of slider 8 and support frame 3, it can go up and down to make probe mount 6 go up and down to go up and down And (4) determining.

In the description herein, references to the description of "one embodiment," "an example," "a specific example," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

The preferred embodiments of the present invention disclosed above are intended only to help illustrate the present invention. The preferred embodiments are not intended to be exhaustive or to limit the invention to the precise embodiments disclosed. Obviously, many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to best explain the principles of the invention and its practical applications, to thereby enable others skilled in the art to best understand the invention for and utilize the invention. The present invention is limited only by the claims and their full scope and equivalents.

Claims

1. The utility model provides a point gum machine for semiconductor, includes PMKD (1) and rotatory bucket (11), and rotatory bucket (11) are located the one end of PMKD (1), its characterized in that: a semiconductor placing plate (2) is fixed on the top of the fixed bottom plate (1), a supporting frame (3) is fixed on the top of the fixed bottom plate (1) and positioned on the outer side of the semiconductor placing plate (2), a probe fixing frame (6) is connected inside the supporting frame (3) in a sliding way, a water pump (7) is fixed at the top of the probe fixing frame (6), the water pump (7) is connected with the rotary barrel (11) through a hose, the bottom of the probe fixing frame (6) is fixed with a dispensing probe (12), the water pump (7) is connected with the dispensing probe (12) through a pipeline, the top of the rotary barrel (11) is fixed with a rotary motor (9), the output end of the rotating motor (9) and the inner part of the rotating barrel (11) are connected with a stirring blade (16), a protective shell (15) is fixed at the top end inside the rotary barrel (11), and a heating pipe (4) is fixed inside the protective shell (15).

2. The dispensing machine for semiconductors according to claim 1, characterized in that a slider (8) is fixed inside the support frame (3) and at one end of the probe holder (6) close to the rotating barrel (11), a lifting motor (5) is fixed at the top of the support frame (3) and at one end of the probe holder (6) far away from the slider (8), a threaded rod (14) is connected to the output end of the lifting motor (5), a lifting connection plate (13) is connected to the outer side of the threaded rod (14) in a threaded manner, and one end of the lifting connection plate (13) is welded to the probe holder (6).

3. The dispenser for semiconductor according to claim 2, wherein a T-shaped groove is formed in the support frame (3) at a position corresponding to the slider (8), and the support frame (3) and the slider (8) are slidably connected through the T-shaped groove.

4. The dispenser for semiconductor according to claim 1, wherein the output end of the rotating motor (9) is connected with the stirring blade (16) through a flat key.

5. The dispensing machine for semiconductors according to claim 1, wherein a feeding cylinder (10) is fixed at one end of the rotating motor (9) and at the top of the rotating barrel (11), and air holes are formed at the bottom of the protective shell (15).

6. The dispenser for semiconductors as claimed in claim 2, wherein the lifting connection plate (13) has a threaded groove therein, and the lifting connection plate (13) is in threaded connection with the threaded rod (14) via the threaded groove.