CN213816103U - Silicon wafer processing device - Google Patents
Silicon wafer processing device Download PDFInfo
- Publication number
- CN213816103U CN213816103U CN202022673983.9U CN202022673983U CN213816103U CN 213816103 U CN213816103 U CN 213816103U CN 202022673983 U CN202022673983 U CN 202022673983U CN 213816103 U CN213816103 U CN 213816103U
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- Prior art keywords
- fixedly connected
- plate
- silicon chip
- moving
- silicon wafer
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 49
- 239000010703 silicon Substances 0.000 title claims abstract description 49
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 45
- 238000005096 rolling process Methods 0.000 claims 1
- 238000000034 method Methods 0.000 abstract description 6
- 230000001737 promoting effect Effects 0.000 abstract description 4
- 150000003376 silicon Chemical class 0.000 abstract description 4
- 230000009286 beneficial effect Effects 0.000 description 1
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model provides a silicon chip processingequipment relates to silicon chip processing field. This silicon chip processingequipment, including the organism, the upper surface fixedly connected with backing plate of organism, the shifting chute has been seted up to the upper surface of backing plate, the upper surface overlap joint of backing plate has the movable plate, the lower fixed surface of movable plate is connected with the mount, the bottom fixedly connected with shaft of mount, the gyro wheel has been cup jointed on the surface of shaft, the surface of gyro wheel and the inside roll connection in shifting chute, the upper surface fixedly connected with curb plate of movable plate. This silicon chip processingequipment through the mutually supporting between curb plate, flexible groove, slider, first spring, clamp plate and the fastener, reaches and to fix the silicon chip before promoting to the processing position, avoids promoting the silicon chip skew to appear in the silicon chip, has solved current silicon chip processingequipment and is carrying out the silicon chip and promote the in-process, owing to do not fix a position the silicon chip for the problem of skew appears in the silicon chip position before processing.
Description
Technical Field
The utility model relates to a silicon chip processing technology field specifically is a silicon chip processingequipment.
Background
The chip made of silicon chip is a famous "magic calculator" and has remarkable computing power. No matter how complex mathematical problems, physical problems and engineering problems are, and no matter how large the calculation workload is, a worker can tell the problems to the computer through a computer keyboard and issue thinking and instructions for solving the problems, and the computer can tell the answers to the user in a very short time. Thus, those problems that take years and decades of manual calculations, which may only take minutes to solve, are solved by a computer. Even if some manpower can not calculate the result, the computer can also tell the answer very quickly, and the existing silicon wafer processing device can not position the silicon wafer before processing because the silicon wafer is not positioned in the process of pushing the silicon wafer.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a silicon chip processingequipment has solved current silicon chip processingequipment and is carrying out the silicon chip and promote the in-process, owing to do not advance line location to the silicon chip for the problem of skew appears in silicon chip position before processing.
Technical scheme
In order to achieve the above purpose, the utility model discloses a following technical scheme realizes: the utility model provides a silicon chip processingequipment, includes the organism, the last fixed surface of organism is connected with the backing plate, the shifting chute has been seted up to the upper surface of backing plate, the upper surface overlap joint of backing plate has the movable plate, the lower fixed surface of movable plate is connected with the mount, the bottom fixedly connected with shaft of mount, the gyro wheel has been cup jointed on the surface of shaft, the surface of gyro wheel and the inside roll connection of shifting chute, the last fixed surface of movable plate is connected with the curb plate, flexible groove has been seted up on the right side of curb plate, the inside sliding connection in flexible groove has the slider, the lower fixed surface of slider is connected with first spring, the bottom of first spring is connected with the last fixed surface of movable plate, the right side fixedly connected with clamp plate of slider, the last fixed surface of movable plate is connected with the fastener.
Further, the right side fixedly connected with rubber slab of backing plate, the left side of rubber slab and the right side overlap joint of movable plate.
Furthermore, a second spring is fixedly connected to the inner wall of the right side of the moving groove, a moving block is fixedly connected to the left end of the second spring, and the upper surface of the moving block is fixedly connected with the lower surface of the moving plate.
Furthermore, a movable hole communicated with the inside of the movable groove is formed in the left side of the base plate, a pull rod is movably connected inside the movable hole, and the right end of the pull rod is fixedly connected with the left side of the fixing frame.
Furthermore, the left end of the pull rod is fixedly connected with a right pull ring.
Furthermore, the lower surface of the backing plate is provided with a jack communicated with the inside of the moving groove, and a bolt is inserted into the jack.
The utility model provides a silicon chip processingequipment. The method has the following beneficial effects:
1. this silicon chip processingequipment through the mutually supporting between curb plate, flexible groove, slider, first spring, clamp plate and the fastener, reaches and to fix the silicon chip before promoting to the processing position, avoids promoting the silicon chip skew to appear in the silicon chip, has solved current silicon chip processingequipment and is carrying out the silicon chip and promote the in-process, owing to do not fix a position the silicon chip for the problem of skew appears in the silicon chip position before processing.
2. This silicon chip processingequipment through the cooperation of movable block and second spring, reaches the shrink through the second spring to be convenient for drive the silicon chip on movable plate surface and remove to processing position, through the cooperation of mount, shaft and gyro wheel, reach at the movable plate steady more fast when removing, through the setting of bolt, reach when the silicon chip of treating processing is placed on the movable plate surface, avoid the movable plate to appear removing.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is an enlarged view of a portion A of FIG. 1;
FIG. 3 is an enlarged view of a portion B of FIG. 1 according to the present invention;
fig. 4 is an enlarged view of a portion C of fig. 1 according to the present invention.
The device comprises a machine body 1, a backing plate 2, a moving groove 3, a pull rod 4, a moving plate 5, a side plate 6, a telescopic groove 7, a sliding block 8, a first spring 9, a pressing plate 10, a fixed frame 11, a wheel shaft 12, a roller 13, a moving block 14, a second spring 15, a rubber plate 16, a clamping piece 17, a movable hole 18, a pull ring 19, a jack 20 and a plug pin 21.
Detailed Description
As shown in fig. 1-4, an embodiment of the present invention provides a silicon wafer processing apparatus, which includes a machine body 1, a backing plate 2 fixedly connected to an upper surface of the machine body 1, a moving groove 3 formed on an upper surface of the backing plate 2, a jack 20 communicated with an interior of the moving groove 3 formed on a lower surface of the backing plate 2, a plug 21 inserted into the jack 20, a moving plate 5 lapped on the upper surface of the backing plate 2, a rubber plate 16 fixedly connected to a right side of the backing plate 2, a left side of the rubber plate 16 lapped on a right side of the moving plate 5, a fixed frame 11 fixedly connected to a lower surface of the moving plate 5, a moving hole 18 communicated with an interior of the moving groove 3 formed on a left side of the backing plate 2, a pull rod 4 movably connected to an interior of the moving hole 18, a right end of the pull rod 4 fixedly connected to a left side of the fixed frame 11, a left end of the pull rod 4 fixedly connected to a right side 19, and a wheel shaft 12 fixedly connected to a bottom end of the fixed frame 11, the gyro wheel 13 has been cup jointed on the surface of shaft 12, the inside roll connection of the surface of gyro wheel 13 and shifting chute 3, the right side inner wall fixedly connected with second spring 15 of shifting chute 3, the left end fixedly connected with movable block 14 of second spring 15, the upper surface of movable block 14 and the lower fixed surface of movable plate 5 are connected, the last fixed surface of movable plate 5 is connected with curb plate 6, flexible groove 7 has been seted up on the right side of curb plate 6, the inside sliding connection of flexible groove 7 has slider 8, the lower fixed surface of slider 8 is connected with first spring 9, the bottom of first spring 9 and the last fixed surface of movable plate 5 are connected, the right side fixedly connected with clamp plate 10 of slider 8, the last fixed surface of movable plate 5 is connected with fastener 17.
The working principle is as follows: the pull ring 19 is pulled leftwards, so that the moving plate 5 is driven to move leftwards through the pull rod 4, the moving plate 5 moves leftwards to stretch the second spring 15 and drive the roller 13 to roll leftwards, when the roller 13 comes into contact with the left inner wall of the moving slot 3, the latch 21 is pushed upward, so that the latch 21 blocks the right side of the roller 13, then the pressing plate 10 is pulled upward, and the silicon wafer to be processed is placed on the surface of the moving plate 5, so that the right side of the silicon chip is clamped in the clamping piece 17, the pressing plate 10 is released, the first spring 9 contracts to drive the pressing plate 10 to move downwards and clamp the silicon chip, finally the plug pin 21 is pulled downwards, the bolt 21 is separated from the roller 13, at this time, the second spring 15 contracts and drives the moving plate 5 to move rightwards through the moving block 14, the moving plate 5 stops moving when contacting the rubber plate 16, and at this time, the machine body 1 can be started to process the silicon wafer.
Claims (6)
1. A silicon wafer processing device comprises a machine body (1), and is characterized in that: the upper surface of the machine body (1) is fixedly connected with a backing plate (2), the upper surface of the backing plate (2) is provided with a moving groove (3), the upper surface of the backing plate (2) is lapped with a moving plate (5), the lower surface of the moving plate (5) is fixedly connected with a fixed frame (11), the bottom end of the fixed frame (11) is fixedly connected with a wheel shaft (12), the surface of the wheel shaft (12) is sleeved with a roller (13), the surface of the roller (13) is in rolling connection with the inside of the moving groove (3), the upper surface of the moving plate (5) is fixedly connected with a side plate (6), the right side of the side plate (6) is provided with a telescopic groove (7), the inside of the telescopic groove (7) is in sliding connection with a sliding block (8), the lower surface of the sliding block (8) is fixedly connected with a first spring (9), and the bottom end of the first spring (9) is fixedly connected with the upper surface of the moving plate (5), the right side of the sliding block (8) is fixedly connected with a pressing plate (10), and the upper surface of the moving plate (5) is fixedly connected with a clamping piece (17).
2. The silicon wafer processing apparatus according to claim 1, wherein: the right side fixedly connected with rubber slab (16) of backing plate (2), the left side of rubber slab (16) and the right side overlap joint of movable plate (5).
3. The silicon wafer processing apparatus according to claim 1, wherein: the inner wall of the right side of the moving groove (3) is fixedly connected with a second spring (15), the left end of the second spring (15) is fixedly connected with a moving block (14), and the upper surface of the moving block (14) is fixedly connected with the lower surface of the moving plate (5).
4. The silicon wafer processing apparatus according to claim 1, wherein: the left side of backing plate (2) is seted up with the inside movable hole (18) that is linked together of shifting chute (3), the inside swing joint of movable hole (18) has pull rod (4), the right-hand member of pull rod (4) and the left side fixed connection of mount (11).
5. The silicon wafer processing apparatus according to claim 4, wherein: the left end of the pull rod (4) is fixedly connected with a right pull ring (19).
6. The silicon wafer processing apparatus according to claim 1, wherein: the lower surface of the backing plate (2) is provided with a jack (20) communicated with the inside of the moving groove (3), and a bolt (21) is inserted into the jack (20).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022673983.9U CN213816103U (en) | 2020-11-18 | 2020-11-18 | Silicon wafer processing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022673983.9U CN213816103U (en) | 2020-11-18 | 2020-11-18 | Silicon wafer processing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213816103U true CN213816103U (en) | 2021-07-27 |
Family
ID=76935543
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022673983.9U Expired - Fee Related CN213816103U (en) | 2020-11-18 | 2020-11-18 | Silicon wafer processing device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213816103U (en) |
-
2020
- 2020-11-18 CN CN202022673983.9U patent/CN213816103U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20210727 |