CN213797926U - Mould heat dissipation mechanism - Google Patents
Mould heat dissipation mechanism Download PDFInfo
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- CN213797926U CN213797926U CN202022085413.8U CN202022085413U CN213797926U CN 213797926 U CN213797926 U CN 213797926U CN 202022085413 U CN202022085413 U CN 202022085413U CN 213797926 U CN213797926 U CN 213797926U
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- mold core
- insert
- heat conduction
- dissipation mechanism
- heat dissipation
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Abstract
A mold heat dissipation mechanism comprises a mold core and a sectional insert. The mold core comprises an upper mold core and a lower mold core, the upper mold core and the lower mold core jointly enclose a mold cavity, and cooling water channels are formed in the upper mold core and the lower mold core; the sectional type insert comprises a heat conduction insert and two contact pins, wherein two guide holes are formed in the heat conduction insert, a wedge-shaped boss is arranged on the heat conduction insert, the heat conduction insert is used for being matched with an upper die to form an area for forming a groove structure on a product, the contact pins and the guide holes in the heat conduction insert are matched to form an area for forming a post structure in the groove structure, and the heat conduction insert is matched with the contact pins to reduce the processing difficulty of the sectional type insert and the manufacturing cost of the die; the heat conduction insert is embedded in the lower die core, and the heat conduction insert is cooled by the cooling water path during injection molding, so that the setting difficulty of the cooling water path is reduced, and the cooling efficiency of the die is improved.
Description
Technical Field
The utility model relates to a mould field especially relates to a mould heat dissipation mechanism.
Background
When a product has a thin and deep groove, a boss structure matched with the groove structure needs to be arranged on the die, however, the higher the boss height is, the more difficult the design of a corresponding cooling water path is;
because the height of boss is big, the width is little, and the cooling water route is difficult to cool off the boss, and the cooling rate of this position department is far less than the cooling rate of other positions, consequently, produces the heat concentration at product groove department easily in the process of moulding plastics, influences the production efficiency of product, and makes the defective products production rate rise.
In order to ensure the success rate of injection molding of products and improve the injection molding efficiency, the structure of the existing mold needs to be optimized.
SUMMERY OF THE UTILITY MODEL
The utility model aims at overcoming the weak point among the prior art, provide a make simple, the good mould heat dissipation mechanism of just being convenient for replace of cooling effect.
The purpose of the utility model is realized through the following technical scheme:
a mold heat dissipation mechanism includes: a mold core and a segment insert;
the mold core comprises an upper mold core and a lower mold core, the upper mold core and the lower mold core are arranged in opposite directions, the upper mold core and the lower mold core jointly enclose a cavity, and cooling water channels are formed in the upper mold core and the lower mold core;
the sectional type insert comprises a heat conduction insert and two contact pins, the heat conduction insert is embedded in the lower die core, the heat conduction insert is provided with two guide holes, the guide holes penetrate through two ends of the heat conduction insert, the two contact pins correspondingly penetrate through the two guide holes, each contact pin pair is used for sealing the guide hole corresponding to the contact pin pair, a wedge-shaped boss is arranged at the first end of the heat conduction insert, and the wedge-shaped boss is positioned in the die cavity;
in one embodiment, two avoiding grooves are formed in one side, away from the wedge-shaped boss, of the heat conducting insert, and the two avoiding grooves are correspondingly communicated with the two guide holes.
In one embodiment, the segmented insert further includes a positioning pin disposed on the heat conducting insert, the lower mold core is provided with a positioning groove matching with the positioning pin, and the positioning pin abuts against a groove wall of the positioning groove.
In one embodiment, the lower mold core is provided with a cylindrical boss, the upper mold core is provided with a conical boss, the cylindrical boss and the conical boss are oppositely arranged, and the axis of the cylindrical boss coincides with the axis of the conical boss.
In one embodiment, the edge of the lower mold core is provided with a plurality of butt-joint platforms, and the upper mold core is provided with a plurality of corresponding alignment grooves.
In one embodiment, one of the docking stations is provided with a mistake-proofing mark.
In one embodiment, the lower mold core is provided with mounting holes, and one heat-conducting insert is embedded in each mounting hole.
In one embodiment, the lower mold core is provided with a main runner and a plurality of sub-runners, the plurality of sub-runners are all communicated with the main runner, and the plurality of sub-runners are correspondingly arranged towards the plurality of heat conducting inserts.
In one embodiment, a plurality of ejection holes are arranged around the mounting hole, and an ejector pin is arranged in each ejection hole.
In one embodiment, the contact pin comprises a limiting cap and a sealing rod, a hemispherical groove is formed in one side, away from the limiting cap, of the sealing rod, the hemispherical groove is located in the guide hole, and the limiting cap is used for abutting against the outer wall of the heat conducting insert.
Compared with the prior art, the utility model discloses at least, following advantage has:
1. the heat-conducting insert is used for being matched with the upper die to form an area for forming a groove structure on a product, the contact pin is matched with the guide hole on the heat-conducting insert to form an area for forming a support column structure in the groove structure, and the heat-conducting insert is matched with the contact pin to reduce the processing difficulty of the sectional insert and the manufacturing cost of the die;
2. the heat conduction insert is embedded in the lower die core, and the heat conduction insert is cooled by the cooling water path during injection molding, so that the setting difficulty of the cooling water path is reduced, and the cooling efficiency of the die is improved.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention, and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
Fig. 1 is a schematic structural view of a mold heat dissipation mechanism according to an embodiment of the present invention;
FIG. 2 is a partial cross-sectional view of the heat dissipation mechanism of the mold shown in FIG. 1;
fig. 3 is a schematic view illustrating the matching of the upper mold core and the lower mold core when the mold is closed according to an embodiment of the present invention;
fig. 4 is a schematic structural view of a sectional insert according to an embodiment of the present invention;
fig. 5 is a schematic structural view of the housing.
Detailed Description
In order to facilitate understanding of the present invention, the present invention will be described more fully hereinafter with reference to the accompanying drawings. The preferred embodiments of the present invention are shown in the drawings. The invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only and do not represent the only embodiments.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
Referring to fig. 1 and 5, a mold heat dissipation mechanism 10 includes: mold core 100 and sectional insert 200, which are used for injection molding of a housing 20 shown in fig. 5, the housing 20 includes a main body 21 and flanges 22 located at two sides of the main body, a tapered hole 23 is provided on the flange 22, a groove structure 24 is provided in the main body, a pillar 25 is provided in the groove structure 24, the sectional insert 200 and the mold core 100 cooperate to enclose an area for forming the groove structure 24 and the pillar 25, and damage to the housing 20 when the mold is opened due to inconsistency of cooling speed and other parts at the groove structure 24 and the pillar 25 in the injection molding process is avoided.
Referring to fig. 1 and 3, the mold core 100 includes an upper mold core 110 and a lower mold core 120, the upper mold core 110 and the lower mold core 120 are disposed opposite to each other, the upper mold core 110 and the lower mold core 120 together define a cavity 300, and cooling water channels 130 are disposed on both the upper mold core 110 and the lower mold core 120; the cavity 300 defined by the upper mold core 110 and the lower mold core 120 is a molding area of the housing 20, and the molten plastic is cooled and molded in the cavity 300.
Referring to fig. 3 and 4, the sectional insert 200 includes a heat conducting insert 210 and two pins 220, the heat conducting insert 210 and the pins 220 are made of a material with good heat conductivity, such as beryllium copper, so that heat on the groove structure 24 and the support 25 can be transferred to the cooling water channel 130 during injection molding to avoid adverse phenomena caused by inconsistent heat dissipation on the housing 20, the heat conducting insert 210 is embedded in the lower mold core 120, two guide holes 211 are formed on the heat conducting insert 210, the guide holes 211 penetrate through two ends of the heat conducting insert 210, the two pins 220 correspondingly penetrate the two guide holes 211, each pin 220 is used for sealing the corresponding guide hole 211, the two pins 220 and the guide holes 211 form a blind hole structure on the heat conducting insert 210, the blind hole structure is a forming region of the support 25, a wedge-shaped boss 212 is disposed on a first end of the heat conducting insert 210, the wedge-shaped boss 212 is disposed in the cavity 300 for facilitating mold release, the thickness of the wedge-shaped boss 212 is gradually increased from one side close to the upper die core 110 to one side far away from the upper die core 110, the wedge-shaped boss 212 is a forming part of the groove structure 24, because the wedge-shaped boss 212 and the heat-conducting insert 210 are integrated, and the outer diameter of the wedge-shaped boss 212 is close to that of the heat-conducting insert 210, heat on the wedge-shaped boss 212 can be rapidly diffused to the heat-conducting insert 210 during injection molding, the heat-conducting insert 210 is located in the lower die core 120, and the heat on the heat-conducting insert 210 is absorbed by cooling liquid in the cooling water channel 130, so that the effect of rapid cooling is achieved.
Because the forming area of the groove structure 24 is composed of the heat conducting insert 210, a special convex structure is not required to be arranged on the lower mold core 120, the processing difficulty of the lower mold core 120 is reduced, and because the special convex structure is not required to be arranged, the cooling requirement of the convex structure is not required to be considered when the cooling water channel 130 is arranged, the difficulty of arranging the cooling water channel 130 is reduced, and the design difficulty of the mold is reduced.
In the actual production process, due to the design defect of the product or the need to update the product, the dimension of the housing 20 may be improved, for example, the length of the support 25 is changed, the segmented insert 200 is composed of the heat-conducting insert 210 and the pins 220, at this time, only the pins 220 need to be dismounted, and the new pins 220 with different lengths are replaced, or the width or depth of the groove structure 24 on the housing 20 needs to be changed, so that the heat-conducting insert 210 can be replaced alone without re-manufacturing the insert, thereby reducing the mold-changing cost.
Referring to fig. 4, in particular, the pin 220 includes a limiting cap 221 and a sealing rod 222, a hemispherical groove 222a is formed on a side of the sealing rod 222 away from the limiting cap 221, the hemispherical groove 222a is located in the guide hole 211, and the limiting cap 221 is used for abutting against an outer wall of the heat conducting insert 210. When the contact pin 220 is assembled, the sealing rod 222 is inserted into the guide hole 211, when the limit cap 221 abuts against the outer wall of the heat conducting insert 210, the contact pin 220 is mounted in place, and the limit cap 221 limits the depth of a blind hole surrounded by the sealing rod 222 and the guide hole 211, so that the length of the support 25 on the shell 20 after opening the mold is controlled.
Referring to fig. 3 and 4, in an embodiment, two avoiding grooves 213 are formed on a side of the heat conducting insert 210 away from the wedge-shaped boss 212, and the two avoiding grooves 213 are correspondingly communicated with the two guide holes 211. The avoiding groove 213 is used for accommodating the limiting cap 221, when the limiting cap 221 abuts against the groove wall of the avoiding groove 213, the pin 220 is installed in place, and at this time, the limiting cap 221 is located in the avoiding groove 213.
Referring to fig. 2 and 4, in one embodiment, the segment insert 200 further includes a positioning pin 230, the positioning pin 230 is disposed on the heat conducting insert 210, the lower mold core 120 is formed with a positioning groove 123 matching with the positioning pin 230, and the positioning pin 230 abuts against a groove wall of the positioning groove 123. The positioning pin 230 is located at an end of the heat conducting insert 210 away from the wedge-shaped boss 212, and the positioning pin 230 improves the installation accuracy of the heat conducting insert 210 in the lower die core 120.
Referring to fig. 2, when the conventional mold is used to manufacture the housing 20, the tapered holes 23 on the flanges 22 on both sides of the mold need to be additionally processed on a drilling machine, so as to improve the production efficiency of the housing 20, the lower mold core 120 is provided with the cylindrical boss 121, the upper mold core 110 is provided with the tapered boss 111, the cylindrical boss 121 and the tapered boss 111 are oppositely arranged, and the axial line of the cylindrical boss 121 coincides with the axial line of the tapered boss 111, so that the tapered holes 23 are directly formed on the flanges 22 during injection molding, thereby reducing the processing steps and improving the processing efficiency.
Referring to fig. 1, in order to improve the mold clamping accuracy, a plurality of abutting platforms 122 are disposed on the edge of the lower mold core 120, a plurality of aligning grooves 112 corresponding to the abutting platforms 122 are disposed on the upper mold core 110, the abutting platforms 122 are engaged with the aligning grooves 112 during mold clamping, in order to avoid an installation error, an error-proof mark 122a is disposed on the abutting platforms 122, and whether the installation direction of the lower mold core 120 is correct is identified through the error-proof mark 122 a.
In one embodiment, the lower mold core 120 has mounting holes, and each mounting hole has a heat conducting insert 210 embedded therein. The mounting hole is a mounting portion of the heat conducting insert 210.
Referring to fig. 1, it should be noted that the lower mold core 120 is provided with a main flow channel 124 and a plurality of sub-flow channels 125, the plurality of sub-flow channels 125 are all communicated with the main flow channel 124, and the plurality of sub-flow channels 125 are correspondingly disposed toward the plurality of heat conducting inserts 210. Each thermally conductive insert 210 is positioned to form a molding zone of the housing 20 within the cavity 300, and the molten plastic is directed into each molding zone through the runners 125.
To facilitate demolding of the housing 20, a plurality of ejection holes 126 are disposed around the mounting hole, and each ejection hole 126 has an ejection pin disposed therein. When the mold is opened, the ejector pins protrude from the ejector holes 126 and push up the molded housing 20.
In one embodiment, the stop cap 221 is provided with size markings.
Compared with the prior art, the utility model discloses at least, following advantage has:
1. the heat-conducting insert 210 is used for being matched with an upper die to form an area for forming a groove structure on a product, the contact pin 220 is matched with the guide hole 211 on the heat-conducting insert 210 to form an area for forming a post structure in the groove structure, and the heat-conducting insert 210 is matched with the contact pin 220 to reduce the processing difficulty of the sectional insert 200 and the manufacturing cost of the die;
2. the heat-conducting insert 210 is embedded in the lower mold core 120, and the heat-conducting insert 210 is cooled by a cooling water path during injection molding, so that the setting difficulty of the cooling water path is reduced, and the cooling efficiency of the mold is improved.
The above-mentioned embodiments only represent some embodiments of the present invention, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.
Claims (10)
1. A mold heat dissipation mechanism, comprising:
the mold core comprises an upper mold core and a lower mold core, the upper mold core and the lower mold core are arranged in opposite directions, the upper mold core and the lower mold core jointly enclose a cavity, and cooling water channels are formed in the upper mold core and the lower mold core;
the sectional type mold insert comprises a heat conduction insert and two contact pins, the heat conduction insert is embedded in the lower mold core, two guide holes are formed in the heat conduction insert, the guide holes penetrate through two ends of the heat conduction insert, the two contact pins correspondingly penetrate through the two guide holes, each contact pin is used for sealing the corresponding guide hole, a wedge-shaped boss is arranged at the first end of the heat conduction insert, and the wedge-shaped boss is located in the mold cavity.
2. The mold heat dissipation mechanism of claim 1, wherein two avoiding grooves are formed on a side of the heat conduction insert away from the wedge-shaped boss, and the two avoiding grooves are correspondingly communicated with the two guide holes.
3. The mold heat dissipation mechanism of claim 1, wherein the segment insert further comprises a positioning pin disposed on the heat conducting insert, the lower mold core is provided with a positioning groove matching with the positioning pin, and the positioning pin abuts against a groove wall of the positioning groove.
4. The mold heat dissipation mechanism of claim 1, wherein the lower mold core is provided with a cylindrical boss, the upper mold core is provided with a conical boss, the cylindrical boss and the conical boss are oppositely arranged, and an axial lead of the cylindrical boss coincides with an axial lead of the conical boss.
5. The mold heat dissipation mechanism of claim 1, wherein the lower mold core has a plurality of docking stations at an edge thereof, and the upper mold core has a plurality of corresponding alignment slots.
6. The mold heat dissipation mechanism of claim 5, wherein the docking station has error proofing indicia disposed thereon.
7. The mold heat dissipation mechanism of claim 1, wherein the lower mold core has mounting holes, and one of the heat conducting inserts is embedded in each of the mounting holes.
8. The mold heat dissipation mechanism of claim 7, wherein the lower mold core is provided with a main runner and a plurality of sub-runners, the plurality of sub-runners are all communicated with the main runner, and the plurality of sub-runners are correspondingly arranged toward the plurality of heat conducting inserts.
9. The mold heat dissipation mechanism of claim 7, wherein a plurality of ejection holes are disposed around the mounting hole, and each ejection hole has an ejector pin disposed therein.
10. The mold heat dissipation mechanism of claim 1, wherein the pin comprises a limiting cap and a sealing rod, a hemispherical groove is disposed on a side of the sealing rod away from the limiting cap, the hemispherical groove is located in the guiding hole, and the limiting cap is configured to abut against an outer wall of the heat conducting insert.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022085413.8U CN213797926U (en) | 2020-09-21 | 2020-09-21 | Mould heat dissipation mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022085413.8U CN213797926U (en) | 2020-09-21 | 2020-09-21 | Mould heat dissipation mechanism |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213797926U true CN213797926U (en) | 2021-07-27 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022085413.8U Active CN213797926U (en) | 2020-09-21 | 2020-09-21 | Mould heat dissipation mechanism |
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| Country | Link |
|---|---|
| CN (1) | CN213797926U (en) |
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2020
- 2020-09-21 CN CN202022085413.8U patent/CN213797926U/en active Active
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