CN213792932U - Semiconductor component grading device - Google Patents

Semiconductor component grading device Download PDF

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Publication number
CN213792932U
CN213792932U CN202022224195.1U CN202022224195U CN213792932U CN 213792932 U CN213792932 U CN 213792932U CN 202022224195 U CN202022224195 U CN 202022224195U CN 213792932 U CN213792932 U CN 213792932U
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China
Prior art keywords
limiting plate
transmission belt
stepping
sub
baffle
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Active
Application number
CN202022224195.1U
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Chinese (zh)
Inventor
周伟
李永备
潘小华
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Yangzhou Zexu Electronic Technology Co ltd
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Yangzhou Zexu Electronic Technology Co ltd
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Priority to CN202022224195.1U priority Critical patent/CN213792932U/en
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Abstract

The utility model discloses a semiconductor components and parts stepping device, including horizontal drive belt, the horizontal drive belt both sides are equipped with the baffle, the baffle is opened there is the breach, breach department below is provided with the branch drive belt, divide the drive belt both sides also to be provided with the branch baffle, breach department is provided with the limiting plate, the limiting plate rotates to be connected in the stepping board, it has the second breach also to open on the stepping board, second breach department below is provided with the second and divides the drive belt, second divides the drive belt both sides to be provided with the second and divides the baffle, second breach department still is provided with the second limiting plate, the second limiting plate rotates the stepping board of one side of connecting in dividing the baffle with the second. The utility model discloses thereby set up horizontal drive belt, divide drive belt, second to divide the drive belt to carry out the stepping of semiconductor components and parts, carry out spacing direction to the semiconductor components and parts in the removal through the limiting plate, realize the completion of components and parts stepping, simple structure, the setting of three conveyer belt can carry out three types of stepping to semiconductor components and parts at least, and the effect of stepping is also more excellent.

Description

Semiconductor component grading device
Technical Field
The utility model relates to a semiconductor stepping technical field, concretely relates to semiconductor components and parts stepping device.
Background
In the production and processing process of semiconductor components, unqualified component products generally exist, and the unqualified products also have different damage degrees, and at the moment, the semiconductor components need to be graded after being detected. The current chinese utility model patent with patent number 201420218309.3 discloses a semiconductor components and parts stepping device, and this stepping device carries out the stepping through elevating gear, but, elevating gear continuation work can have elevating gear easily to send out the trouble during the stepping, and leads to stepping unreasonable condition to appear.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a simple structure, the reasonable semiconductor components and parts stepping device of stepping to the not enough of existence among the above-mentioned background art.
In order to achieve the above object, the utility model relates to a semiconductor components and parts stepping device has adopted following technical scheme:
a semiconductor component grading device comprises a horizontal transmission belt, wherein two sides of the horizontal transmission belt are provided with baffles for preventing components from deviating from the horizontal transmission belt, the baffle is provided with a gap, a sub-transmission belt is arranged below the gap and deviates to the end far away from the feeding end of the horizontal transmission belt for feeding components, the two sides of the sub-transmission belt are also provided with sub-baffles, the gap is provided with a limiting plate for changing the transmission direction of the components, the limiting plate is rotatably connected with the grading plate at one side of the grading plate far away from the component feeding end on the horizontal transmission belt, a second gap is also arranged on the baffle plate, a second branch transmission belt is arranged below the second gap, the two sides of the second sub-transmission belt are provided with second sub-baffles, the second notch is further provided with a second limiting plate, and the second limiting plate is rotatably connected with the sub-baffles on one side of the second sub-baffles. Thereby set up the water skin drive belt, divide drive belt, the second and divide the drive belt to carry out the stepping of semiconductor components and parts, carry out spacing direction through the limiting plate to the semiconductor components and parts in moving, realize the completion of components and parts stepping, simple structure.
The utility model relates to a semiconductor components and parts stepping device's further improvement part lies in, limiting plate, second limiting plate structure are the same, are the deflection piece, the deflection piece includes that two contained angles of integrated into one piece are obtuse diaphragm, and the junction and the stepping board or the second of two diaphragms divide the baffle to rotate and be connected. The semiconductor components are guided to the baffle plates which are not attached to the two sides of the transmission belt, and the semiconductor components cannot be damaged.
The utility model relates to a semiconductor components and parts stepping device's further improvement part lies in, the obtuse angle with divide the drive belt to keeping away from horizontal drive belt on components and parts material loading one end skew angle the same.
The utility model relates to a semiconductor components and parts stepping device's further improvement part lies in, be provided with the elasticity cushion on limiting plate, the second limiting plate. Further protecting the semiconductor components.
Compared with the prior art, the beneficial effects of the utility model are that:
the utility model discloses thereby set up horizontal drive belt, divide drive belt, second to divide the drive belt to carry out the stepping of semiconductor components and parts, carry out spacing direction to the semiconductor components and parts in the removal through the limiting plate, realize the completion of components and parts stepping, simple structure, the setting of three conveyer belt can carry out three types of stepping to semiconductor components and parts at least, and the effect of stepping is also more excellent.
Drawings
Fig. 1 is a schematic structural view of the present invention;
in the figure: 10 horizontal transmission belts, 20 baffles, 21 gaps, 30-minute transmission belts, 31-minute baffles, 40 second-minute transmission belts, 41 second-minute baffles, 51 limiting plates and 52 second limiting plates.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
As shown in fig. 1, a semiconductor component grading device comprises a horizontal transmission belt 10, wherein two sides of the horizontal transmission belt are provided with a baffle 20 for preventing components from deviating from the horizontal transmission belt, the baffle is provided with a notch 21, a sub transmission belt 30 is arranged below the notch, the sub transmission belt deviates from one end of the horizontal transmission belt away from the component feeding end, two sides of the sub transmission belt are also provided with a sub baffle 31, the notch is provided with a limiting plate 51 for changing the transmission direction of the components, the limiting plate is rotatably connected to the sub baffle on one side of the horizontal transmission belt away from the component feeding end, the sub baffle is also provided with a second notch, a second sub transmission belt 40 is arranged below the second notch, two sides of the second sub transmission belt are provided with a second sub baffle 41, and the second notch is also provided with a second limiting plate 52, the second limiting plate is rotatably connected with the sub baffle on one side of the second sub baffle. Specifically, limiting plate, second limiting plate structure are the same, are the piece of deviating, the piece of deviating includes that two contained angles of integrated into one piece are obtuse diaphragm, obtuse angle with divide the drive belt to keeping away from horizontal drive belt and go up components and parts material loading one end skew angle the same. The connecting position of the two transverse plates is rotatably connected with the baffle plate or the second baffle plate. Specifically, a fixed rack is arranged above the transmission belt structure, a motor is fixed on the fixed rack, and the motor is fixed with the limiting plate and the second limiting plate, so that the motor drives the limiting plate and the second limiting plate to rotate.
Furthermore, elastic cushions are arranged on the limiting plate and the second limiting plate. So as to ensure the safety of the component without damage when the component is contacted with the semiconductor component.
The material loading end the place ahead of horizontal drive belt is provided with the detection structure that detects semiconductor components and parts, detects the structure can with the motor between electric connection to the realization detects the switching of accomplishing back control motor, realizes stepping, efficiency is than artifical stepping height.
The utility model discloses a theory of operation does: after the semiconductor component is detected, the motor is controlled to be started, one or more of the limiting plate and the second limiting plate can be opened and closed, whether the semiconductor component is qualified or not is achieved, and feasible operation of further grading according to the size of the fault is achieved. If the gear shifting is not limited to three-level gear shifting, the gear shifting transmission belt and the limiting plate can be continuously added to ensure the gear shifting effect.
It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Claims (4)

1. A semiconductor component grading device is characterized in that: comprises a horizontal transmission belt, wherein two sides of the horizontal transmission belt are provided with baffles for preventing components from deviating from the horizontal transmission belt, the baffle is provided with a gap, a sub-transmission belt is arranged below the gap and deviates to the end far away from the feeding end of the horizontal transmission belt for feeding components, the two sides of the sub-transmission belt are also provided with sub-baffles, the gap is provided with a limiting plate for changing the transmission direction of the components, the limiting plate is rotatably connected with the grading plate at one side of the grading plate far away from the component feeding end on the horizontal transmission belt, a second gap is also arranged on the baffle plate, a second branch transmission belt is arranged below the second gap, the two sides of the second sub-transmission belt are provided with second sub-baffles, the second notch is further provided with a second limiting plate, and the second limiting plate is rotatably connected with the sub-baffles on one side of the second sub-baffles.
2. A semiconductor component grading device according to claim 1, wherein: the limiting plate and the second limiting plate are identical in structure and are deflection parts, each deflection part comprises two transverse plates which are integrally formed and have obtuse included angles, and the joints of the two transverse plates are rotatably connected with the baffle plates or the second baffle plates.
3. A semiconductor component grading device according to claim 2, characterized in that: the obtuse angle is the same as the offset angle of the component feeding end far away from the horizontal transmission belt.
4. A semiconductor component grading device according to claim 3, wherein: and the limiting plate and the second limiting plate are provided with elastic cushions.
CN202022224195.1U 2020-10-08 2020-10-08 Semiconductor component grading device Active CN213792932U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202022224195.1U CN213792932U (en) 2020-10-08 2020-10-08 Semiconductor component grading device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202022224195.1U CN213792932U (en) 2020-10-08 2020-10-08 Semiconductor component grading device

Publications (1)

Publication Number Publication Date
CN213792932U true CN213792932U (en) 2021-07-27

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CN202022224195.1U Active CN213792932U (en) 2020-10-08 2020-10-08 Semiconductor component grading device

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CN (1) CN213792932U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113640314A (en) * 2021-10-14 2021-11-12 深圳市赛元微电子有限公司 Semiconductor quality detection device and method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113640314A (en) * 2021-10-14 2021-11-12 深圳市赛元微电子有限公司 Semiconductor quality detection device and method

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