CN213780215U - Dielectric property testing device - Google Patents

Dielectric property testing device Download PDF

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CN213780215U
CN213780215U CN202021352954.6U CN202021352954U CN213780215U CN 213780215 U CN213780215 U CN 213780215U CN 202021352954 U CN202021352954 U CN 202021352954U CN 213780215 U CN213780215 U CN 213780215U
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dielectric property
film sample
mirror
property testing
resonant cavity
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宋锡滨
孙莹莹
奚洪亮
艾辽东
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Shandong Sinocera Functional Material Co Ltd
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Shandong Sinocera Functional Material Co Ltd
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Abstract

The utility model provides a dielectric property testing arrangement. This dielectric property testing arrangement includes: the resonant cavity comprises a concave mirror and a plane mirror which are oppositely arranged, wherein the concave surface of the concave mirror faces the plane mirror, and the plane mirror is provided with a bearing surface close to one side of the concave mirror and used for placing a film sample; the ring body is arranged on one side of the plane mirror close to the concave mirror, and is provided with a plane close to one side of the plane mirror and used for flattening the film sample; an input waveguide disposed through the resonant cavity; the output waveguide is fixed on the plane mirror and is arranged corresponding to the input waveguide; and the network analyzer is respectively connected with the input waveguide and the output waveguide. The resonant cavity is suitable for testing a thin film sample, the thickness can reach the micron level, a higher quality factor can be obtained by adopting the resonant cavity, and the testing precision is higher; the film sample ring body can completely flatten the film sample, the film is not required to be made into a sample with certain thickness and strength, and the operation method is simple.

Description

Dielectric property testing device
Technical Field
The utility model relates to a dielectric property test field particularly, relates to a dielectric property testing arrangement.
Background
With the development of microwave and millimeter wave theory and technical research, the application of the film material is greatly expanded, the film material is more and more widely applied in the fields of radar antennas, communication, composite materials and the like, and the requirements of different application requirements on the dielectric property of a film sample are greatly different. However, thin film materials are thin and small in volume, and are generally coated on a specific substrate when a thin film sample is tested, wherein the measurement of high-frequency dielectric properties is difficult when a massive homogeneous medium is tested.
At present, the dielectric constant measuring method of a film sample mainly comprises a resonant cavity method and a transmission/reflection method, wherein the resonant cavity method can only be used for point frequency measurement, and a plurality of different resonant cavities are required to be manufactured when a plurality of frequency points are measured; the transmission/reflection method is a single-end or double-port transmission line method, and in the method, the reference sample which has known electromagnetic parameters and the same size and thickness as the thin film to be tested needs to be tested in advance by the most widely applied microstrip method in the test process, but the reference sample is difficult to obtain, so that the realization is difficult.
SUMMERY OF THE UTILITY MODEL
A primary object of the utility model is to provide a dielectric property testing arrangement to the dielectric constant that adopts the resonant cavity method to measure the film sample among the solution prior art can only realize the problem of point frequency measurement.
In order to achieve the above object, according to the present invention, there is provided a dielectric property testing device, comprising: the resonant cavity comprises a concave mirror and a plane mirror which are oppositely arranged, wherein the concave surface of the concave mirror faces the plane mirror, and the plane mirror is provided with a bearing surface close to one side of the concave mirror and used for placing a film sample; the ring body is arranged on one side of the plane mirror close to the concave mirror, and is provided with a plane close to one side of the plane mirror and used for flattening the film sample; an input waveguide disposed through the resonant cavity; the output waveguide is fixed on the plane mirror and is arranged corresponding to the input waveguide; and the network analyzer is respectively connected with the input waveguide and the output waveguide.
Further, the resonant cavity has a coupling hole penetrating to the center of the concave surface, and the input waveguide is located in the coupling hole.
Further, the output waveguide is disposed at a central position of the plane mirror.
Further, the bearing surface is parallel to the plane.
Further, the concave surface is a hemispherical concave surface.
Further, a tangent plane passing through the center point of the hemispherical concave surface is parallel to the plane.
Further, the ring body presses the film sample against the support surface.
Further, the device also comprises an adhesive layer, wherein the adhesive layer is positioned on the plane and used for fixing the film sample.
Further, the dielectric property testing device further comprises: the vector network analyzer is connected with the input waveguide through the first coaxial cable; and the second coaxial cable and the vector network analyzer are connected with the output waveguide through the second coaxial cable.
Further, the dielectric property testing device further comprises: and the heating component is used for heating the resonant cavity.
The technical scheme of the utility model is applied, a dielectric property testing device is provided, which comprises a resonant cavity, a ring body, an input waveguide, an output waveguide and a network analyzer, wherein the resonant cavity comprises a concave mirror and a plane mirror which are arranged oppositely, the concave surface of the concave mirror faces to the plane mirror, and the plane mirror is provided with a bearing surface close to one side of the concave mirror and used for placing a film sample; the ring body is arranged on one side of the plane mirror close to the concave mirror, and the ring body is provided with a plane close to one side of the plane mirror and used for flattening a sample to be measured; the input waveguide penetrates through the resonant cavity; the output waveguide is fixed on the plane mirror; the network analyzer is connected with the input waveguide and the output waveguide respectively. The resonant cavity is suitable for testing a film sample, the thickness of the tested sample can reach micron level, meanwhile, the resonant cavity can obtain higher quality factor, the testing precision is higher, and the testing of a plurality of frequency points can be carried out in a wider frequency band; in addition, the film sample ring body can be used for completely flattening the film sample, the film is not required to be made into a sample with certain thickness and strength, and the operation method is simple.
Drawings
The accompanying drawings, which form a part of the specification, are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the invention without unduly limiting the scope of the invention. On the attachment
In the figure:
fig. 1 shows a schematic structural diagram of a dielectric property testing apparatus provided by an embodiment of the present invention;
FIG. 2 shows a schematic diagram of the configuration of the ring body of the dielectric property testing apparatus shown in FIG. 1.
Wherein the figures include the following reference numerals:
1. a concave mirror; 2. a plane mirror; 3. a ring body; 4. an input waveguide; 5. an output waveguide; 6. a network analyzer.
Detailed Description
It should be noted that, in the present invention, the embodiments and features of the embodiments may be combined with each other without conflict. The present invention will be described in detail below with reference to the accompanying drawings in conjunction with embodiments.
In order to make the technical solution of the present invention better understood, the technical solution of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts shall belong to the protection scope of the present invention.
It should be noted that the terms "first," "second," and the like in the description and claims of the present invention and in the drawings described above are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used may be interchanged under appropriate circumstances for purposes of describing the embodiments of the invention herein. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed, but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.
As described in the background, the prior art resonant cavity method for measuring the dielectric constant of a thin film sample can only achieve spot frequency measurement. In order to solve the technical problems, the utility model provides a dielectric property testing device, which comprises a semi-resonant cavity, a ring body 3, an input waveguide 4, an output waveguide 5 and a network analyzer 6, wherein the resonant cavity comprises a concave mirror 1 and a plane mirror 2 which are oppositely arranged, the concave surface of the concave mirror 1 faces the plane mirror 2, and the plane mirror 2 is provided with a bearing surface close to one side of the concave mirror and used for placing a film sample; the ring body 3 is arranged on one side of the plane mirror 2 close to the concave mirror 1, and the ring body 3 is provided with a plane close to one side of the plane mirror and used for flattening the film sample; the input waveguide 4 is arranged through the resonant cavity; the output waveguide 5 is fixed on the plane mirror, and the output waveguide 5 is arranged corresponding to the input waveguide 4; the network analyzer 6 is connected to the input waveguide 4 and the output waveguide 5, respectively.
The resonant cavity is suitable for testing a film sample, the thickness of the tested sample can reach micron level, meanwhile, the resonant cavity can obtain higher quality factor, the testing precision is higher, and the testing of a plurality of frequency points can be carried out in a wider frequency band; in addition, the film sample ring body can be used for completely flattening the film sample, the film is not required to be made into a sample with certain thickness and strength, and the operation method is simple.
The utility model discloses an among the above-mentioned dielectric property testing arrangement, input waveguide 4 and output waveguide 5 are connected with network analyzer 6 respectively, input waveguide 4 is used for receiving the initial electromagnetic wave that comes from network analyzer 6, and carry initial electromagnetic wave to the resonant cavity in, output waveguide 5 is used for receiving the target electromagnetic wave of resonant cavity postback, and transmit to network analyzer 6 in, the resonant cavity passes through input waveguide 4, output waveguide 5 is connected with vector network analyzer 6, form test circuit.
To enable testing of the film sample, in an alternative embodiment, the film sample is placed in the center of the planar mirror 2 of the resonator, and the ring 3 is pressed against the film sample to flatten it.
In another alternative embodiment, the film sample is secured to the ring body 3 by an adhesive layer, and the ring body 3 is placed in the center of the flat mirror 2 with the film sample facing downward.
After the film sample is arranged between the plane of the ring body 3 and the bearing surface of the plane mirror 2, the input waveguide 4 and the output waveguide 5 are correspondingly arranged on two sides of the film sample. Preferably, the resonant cavity has a coupling hole penetrating to the center of the concave surface, and the input waveguide is located in the coupling hole; the output waveguide 5 is provided at the center of the plane mirror 2.
In the above-mentioned dielectric properties testing arrangement of the utility model, the resonant cavity is the high Q resonant cavity, and quality is described with quality factor Q, and Q is the ability of weighing optical resonator's energy storage and selective frequency. The Q value is defined by the formula: q2 pi f (E2/E1). Where f is the resonant frequency of the cavity, E2 is the energy stored in the cavity, and E1 is the energy lost per second. The more energy stored in the cavity or the less energy lost per second, the better the quality of the cavity, i.e. the higher the value of the quality factor Q.
The utility model discloses an among the above-mentioned dielectric property testing arrangement, the material of ring body 3 can be for absorbing material, like polyvinyl chloride, the individual that the diameter variation in size can be makeed into according to the size of film sample to ring body 3, and its main action is to prop the film sample flat to can reduce electromagnetic wave's interference.
In order to improve the detection effect on the dielectric property of the film sample, preferably, the concave surface of the resonant cavity is a hemispherical concave surface, a tangent plane passing through the central point of the hemispherical concave surface is parallel to the plane of the plane mirror 2, and at this time, after the film sample is placed on the ring body 3, the film sample can be placed in parallel.
The dielectric property testing device of the present invention may further include a first coaxial cable and a second coaxial cable, the vector network analyzer 6 is connected to the input waveguide 4 through the first coaxial cable, and the first coaxial cable transmits the initial electromagnetic wave from the network analyzer 6 to the resonant cavity through the input waveguide 4; the vector network analyzer 6 is connected to the output waveguide 5 through a second coaxial cable, and the second coaxial cable transmits the target electromagnetic wave received by the output waveguide 5 back to the vector network analyzer 6.
The utility model discloses an above-mentioned dielectric property testing arrangement can also include heating element for heat the resonance chamber. Technical personnel in the field can rationally select above-mentioned heating element according to prior art, like above-mentioned heating element can be for the induction electric heating coil of winding outside the resonant cavity, through putting into the heater with dielectric property testing arrangement to realize the heating to the resonant cavity through induction electric heating coil.
Utilize the utility model provides an above-mentioned dielectric property testing arrangement to carry out the concrete step as follows of dielectric property test to the film sample:
1. preheating the resonant cavity for half an hour, performing cavity test, storing data, and recording the resonant frequency f of the cavity0And a cavity quality factor Q0
2. Sticking the film sample to the ring body 3, and then placing the ring body 3 to the center of the resonant cavity in the downward direction of the film sample;
3. testing the loaded resonant frequency and f after loading the film sample by using the network analyzer 6sAnd a load quality factor Qs
4. And calculating the dielectric constant and the dielectric loss tangent value of the film sample by using the changes of the resonant frequency and the quality factor before and after loading the film sample.
It should be noted that the calculation formula of the relative dielectric constant ∈' of the film sample to be measured is as follows:
ε′=n2
Figure BDA0002580050190000041
in the formula:
k=2πfs/c;
Figure BDA0002580050190000042
Figure BDA0002580050190000043
Figure BDA0002580050190000044
Figure BDA0002580050190000045
Figure BDA0002580050190000051
d=Dq-t;
Figure BDA0002580050190000052
wherein R is0Is the curvature radius of the curved surface of the concave mirror 1, and the unit is mm; q is corresponding TEM00qAxial mode number of modes; f. ofqThe resonant frequency of the cavity after loading the film sample is in Hz; omega0Is the girdling radius, in mm; c is the speed of light, and c is 3 multiplied by 1011 mm/s; dq is the distance from the sample to the concave mirror in mm; f is the resonance frequency in Hz; ω (z) is the beam waist radius at a distance z from the plane mirror, in mm.
From the above description, it can be seen that the above-mentioned embodiments of the present invention achieve the following technical effects:
1. the open type electromagnetic wave resonant cavity with the concave mirror can obtain higher quality factors, the test precision is higher, the test of a plurality of frequency points can be carried out in a wider frequency band, and meanwhile, the thickness of a test sample of the open type double-spherical resonant cavity can reach micron level, so that the open type double-spherical resonant cavity is suitable for testing a film sample;
2. the ring body is arranged to completely flatten the film sample, the film is not required to be made into a sample with certain thickness and strength, and the operation method is simple.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
It is noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of example embodiments according to the present application. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, and it should be understood that when the terms "comprises" and/or "comprising" are used in this specification, they specify the presence of stated features, steps, operations, devices, components, and/or combinations thereof, unless the context clearly indicates otherwise.
Unless specifically stated otherwise, the relative arrangement of the components and steps, the numerical expressions, and numerical values set forth in these embodiments do not limit the scope of the present invention. Meanwhile, it should be understood that the sizes of the respective portions shown in the drawings are not drawn in an actual proportional relationship for the convenience of description. Techniques, methods, and apparatus known to those of ordinary skill in the relevant art may not be discussed in detail but are intended to be part of the specification where appropriate. In all examples shown and discussed herein, any particular value should be construed as merely illustrative, and not limiting. Thus, other examples of the exemplary embodiments may have different values. It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, further discussion thereof is not required in subsequent figures.
In the description of the present invention, it should be understood that the orientation or positional relationship indicated by the orientation words such as "front, back, up, down, left, right", "horizontal, vertical, horizontal" and "top, bottom" etc. are usually based on the orientation or positional relationship shown in the drawings, and are only for convenience of description and simplification of description, and in the case of not making a contrary explanation, these orientation words do not indicate and imply that the device or element referred to must have a specific orientation or be constructed and operated in a specific orientation, and therefore, should not be interpreted as limiting the scope of the present invention; the terms "inner and outer" refer to the inner and outer relative to the profile of the respective component itself.
Spatially relative terms, such as "above … …," "above … …," "above … …," "above," and the like, may be used herein for ease of description to describe one device or feature's spatial relationship to another device or feature as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if a device in the figures is turned over, devices described as "above" or "on" other devices or configurations would then be oriented "below" or "under" the other devices or configurations. Thus, the exemplary term "above … …" can include both an orientation of "above … …" and "below … …". The device may be otherwise variously oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.
It should be noted that the terms "first", "second", and the like are used to define the components, and are only used for convenience of distinguishing the corresponding components, and if not stated otherwise, the terms have no special meaning, and therefore, the scope of the present invention should not be construed as being limited.

Claims (10)

1. A dielectric property testing device, comprising:
the resonant cavity comprises a concave mirror (1) and a plane mirror (2) which are oppositely arranged, the concave surface of the concave mirror (1) faces the plane mirror (2), and the plane mirror (2) is provided with a bearing surface close to one side of the concave mirror (1) and used for placing a film sample;
the ring body (3) is arranged on one side, close to the concave mirror (1), of the plane mirror (2), and the ring body (3) is provided with a plane close to one side of the plane mirror (2) and used for flattening the film sample;
an input waveguide (4) disposed through the resonant cavity;
the output waveguide (5) is fixed on the plane mirror (2), and the output waveguide (5) is arranged corresponding to the input waveguide (4);
and the network analyzer (6) is respectively connected with the input waveguide (4) and the output waveguide (5).
2. The dielectric property testing apparatus of claim 1, wherein the resonant cavity has a coupling hole through to the center of the concave surface, the input waveguide (4) being located in the coupling hole.
3. The dielectric property testing apparatus of claim 2, wherein the output waveguide (5) is disposed at a central position of the plane mirror (2).
4. The dielectric property testing device of claim 1 wherein the bearing surface is parallel to the plane.
5. The dielectric property testing device of claim 4, wherein the concave surface is a hemispherical concave surface.
6. The dielectric property testing device of claim 5, wherein a tangent plane passing through the center point of the hemispherical concave surface is parallel to the plane.
7. The dielectric property testing device of any one of claims 1 to 6, wherein the ring (3) presses the film sample against the bearing surface.
8. The dielectric property testing device of any one of claims 1 to 6, further comprising an adhesive layer on the planar surface for securing the thin film sample.
9. The dielectric property testing device of any one of claims 1-6, further comprising:
a first coaxial cable through which the network analyzer (6) is connected with the input waveguide (4);
a second coaxial cable through which the network analyzer (6) is connected with the output waveguide (5).
10. The dielectric property testing device of any one of claims 1-6, further comprising:
and the heating component is used for heating the resonant cavity.
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115166373A (en) * 2022-07-01 2022-10-11 同济大学 Device and method for measuring dielectric coefficient of polymer Bao Mofu under low vacuum

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115166373A (en) * 2022-07-01 2022-10-11 同济大学 Device and method for measuring dielectric coefficient of polymer Bao Mofu under low vacuum
CN115166373B (en) * 2022-07-01 2024-03-26 同济大学 Device and method for measuring complex dielectric coefficient of polymer film under low vacuum

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