CN213763673U - Punching die for notebook computer frame - Google Patents
Punching die for notebook computer frame Download PDFInfo
- Publication number
- CN213763673U CN213763673U CN202022095794.8U CN202022095794U CN213763673U CN 213763673 U CN213763673 U CN 213763673U CN 202022095794 U CN202022095794 U CN 202022095794U CN 213763673 U CN213763673 U CN 213763673U
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- China
- Prior art keywords
- plate
- buffer
- fixedly connected
- spring
- stamping
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- 238000004080 punching Methods 0.000 title claims abstract description 38
- 239000000463 material Substances 0.000 claims description 13
- 239000010720 hydraulic oil Substances 0.000 claims description 10
- 230000000712 assembly Effects 0.000 claims description 3
- 238000000429 assembly Methods 0.000 claims description 3
- 230000003139 buffering effect Effects 0.000 abstract description 3
- 239000000047 product Substances 0.000 description 9
- 230000005540 biological transmission Effects 0.000 description 2
- 238000007664 blowing Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 230000005489 elastic deformation Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052755 nonmetal Inorganic materials 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 239000011265 semifinished product Substances 0.000 description 1
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Abstract
The utility model discloses a notebook computer frame punching die, one end of a buffer mechanism is fixedly connected with a workbench, the other end of the buffer mechanism is fixedly connected with a backing plate, a buffer plate is fixedly connected with the workbench and is positioned below the backing plate, a lower die is detachably connected with the backing plate and is positioned above the backing plate, an upper die is detachably connected with the punching mechanism and is positioned below the punching mechanism, the upper die corresponds to the lower die, the buffer mechanism comprises a connecting plate and four buffer components, each buffer component comprises a connecting post, a resisting post and a first spring, the punching mechanism drives the upper die to move downwards for punching, when the backing plate is forced to move downwards to the buffer plate, a punching die is carried out, and the force borne by the backing plate at the moment is transmitted to the four buffer components, the first spring is deformed under stress, partial force is removed, the buffering effect is achieved, and the yield is improved.
Description
Technical Field
The utility model relates to the technical field of mold, especially, relate to a notebook computer frame cut-out press.
Background
The punching die is a special technological equipment for processing materials (metal or nonmetal) into parts (or semi-finished products) in cold punching processing, and is called cold punching die (commonly called cold stamping die), and the punching is a pressure processing method for obtaining required parts by applying pressure to the materials by using a die arranged on a press machine at room temperature to separate or plastically deform the materials.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a notebook computer frame cut-out press aims at solving the current cut-out press among the prior art, and the impact force is too big, causes the frame skew easily, leads to the technical problem that the yield is not high.
In order to achieve the purpose, the utility model discloses a notebook computer frame cut-out press that adopts, including workstation, punching press mechanism, buffer board, backing plate, lower mould, upper die and buffer gear, punching press mechanism with workstation fixed connection, and be located the top of workstation, buffer gear's one end with workstation fixed connection, buffer gear's the other end with backing plate fixed connection, the buffer board with workstation fixed connection, and be located the below of backing plate, the lower mould can be dismantled with the backing plate and be connected, and be located the top of backing plate, the upper die can be dismantled with punching press mechanism and be connected, and be located the below of punching press mechanism, the upper die with the lower mould is corresponding;
the buffer mechanism comprises a connecting plate and four buffer assemblies, wherein the four end points of the connecting plate are respectively provided with one buffer assembly, one end, far away from the connecting plate, of each buffer assembly is fixedly connected with the base plate, each buffer assembly comprises a connecting column, a resisting column and a first spring, one end, far away from the connecting plate, of each resisting column is provided with a groove, one end, far away from the base plate, of each connecting column is located in the groove, the first spring is arranged in the groove, one end of the first spring is fixedly connected with the bottom of the groove, and the other end of the first spring is fixedly connected with one end, far away from the base plate, of each connecting column.
The buffer plate is provided with four end points, wherein the four end points of the buffer plate are respectively provided with a second spring, and each second spring is far away from one end of the buffer plate and is fixedly connected with the base plate.
The stamping mechanism comprises a connecting block, a supporting column, a top plate, a stamping plate and a hydraulic oil cylinder, wherein the connecting block is arranged on each of two sides of the workbench, the supporting column is arranged at each of two ends of each connecting block, one end, far away from the connecting block, of each supporting column is fixedly connected with the top plate, the stamping plate is slidably connected with the supporting column, the stamping plate is located below the top plate, the stamping plate is parallel to the top plate, one end of the hydraulic oil cylinder is fixedly connected with the top plate, and the other end of the hydraulic oil cylinder is fixedly connected with the stamping plate.
The stamping mechanism further comprises a third spring, the third spring is arranged between the stamping plate and the connecting block, and the third spring is sleeved outside each supporting column.
The workbench comprises a main board and two side boards, wherein each side board is fixedly connected with the main board and respectively positioned on two sides of the main board.
The notebook computer frame punching die further comprises a material placing frame and a finished product frame, wherein the material placing frame and the finished product frame are respectively located on two sides of the workbench, the material placing frame is fixedly connected with one side plate, and the finished product frame is fixedly connected with the other side plate.
The beneficial effects of the utility model are embodied in: one end of the buffer mechanism is fixedly connected with the workbench, the other end of the buffer mechanism is fixedly connected with the base plate, the buffer plate is fixedly connected with the workbench and positioned below the base plate, the lower die is detachably connected with the base plate and positioned above the base plate, the upper die is detachably connected with the stamping mechanism and positioned below the stamping mechanism, the upper die corresponds to the lower die, the buffer mechanism comprises a connecting plate and four buffer components, each buffer component comprises a connecting column, a resisting column and a first spring, the stamping mechanism drives the upper die to move downwards for stamping, when the base plate is stressed to move downwards to the position of the buffer plate, stamping is carried out, the force borne by the base plate is transmitted to the four buffer components, and the first spring is stressed to deform, thereby removing part of the force, achieving the buffering effect and improving the productivity.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a schematic structural view of the notebook computer frame punching die of the present invention.
Fig. 2 is a front view of the notebook computer frame punching die of the present invention.
Fig. 3 is a cross-sectional view of the a-a line structure of fig. 2 according to the present invention.
The punching die comprises a 1-notebook computer frame punching die, a 2-workbench, a 3-punching mechanism, a 4-buffer plate, a 5-base plate, a 6-lower die, a 7-upper die, an 8-buffer mechanism, an 81-connecting plate, a 82-buffer component, an 83-connecting column, an 84-resisting column, an 85-first spring, an 86-groove, a 91-second spring, a 31-connecting block, a 32-supporting column, a 33-top plate, a 34-punching plate, a 35-hydraulic oil cylinder, a 92-third spring, a 21-main plate, a 22-side plate, an 11-discharging frame and a 12-finished product frame.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary and intended to be used for explaining the present invention, and should not be construed as limiting the present invention.
In the description of the present invention, it is to be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on those shown in the drawings, and are merely for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. In addition, in the description of the present invention, "a plurality" means two or more unless specifically limited otherwise.
Referring to fig. 1 to 3, the utility model provides a notebook computer frame punching die 1, including workstation 2, punching mechanism 3, buffer board 4, backing plate 5, lower mould 6, upper die 7 and buffer mechanism 8, punching mechanism 3 with workstation 2 fixed connection, and be located the top of workstation 2, one end of buffer mechanism 8 with workstation 2 fixed connection, the other end of buffer mechanism 8 with backing plate 5 fixed connection, buffer board 4 with workstation 2 fixed connection, and be located the below of backing plate 5, lower mould 6 with backing plate 5 detachable connection, and be located the top of backing plate 5, upper die 7 with punching mechanism 3 detachable connection, and be located the below of punching mechanism 3, upper die 7 with lower mould 6 corresponding;
the buffer mechanism 8 comprises a connecting plate 81 and four buffer components 82, the buffer components 82 are respectively arranged at four end points of the connecting plate 81, one end, away from the connecting plate 81, of each buffer component 82 is fixedly connected with the backing plate 5, each buffer component 82 comprises a connecting column 83, a resisting column 84 and a first spring 85, a groove 86 is formed in one end, away from the connecting plate 81, of each resisting column 84, one end, away from the backing plate 5, of each connecting column 83 is located in the groove 86, the first spring 85 is arranged in the groove 86, one end of the first spring 85 is fixedly connected with the bottom of the groove 86, and the other end of the first spring 85 is fixedly connected with one end, away from the backing plate 5, of each connecting column 83.
In this embodiment, one end of the buffer mechanism 8 is fixedly connected to the workbench 2, the other end of the buffer mechanism 8 is fixedly connected to the pad 5, the buffer plate 4 is fixedly connected to the workbench 2 and located below the pad 5, the lower die 6 is detachably connected to the pad 5 and located above the pad 5, the upper die 7 is detachably connected to the stamping mechanism 3 and located below the stamping mechanism 3, the upper die 7 corresponds to the lower die 6, when stamping is performed, the stamping mechanism 3 drives the upper die 7 to stamp the lower die 6, the pad 5 moves down to above the buffer plate 4 to perform stamping, the buffer mechanism 8 includes a connecting plate 81 and four buffer assemblies 82, each buffer assembly 82 includes a connecting column 83, a resisting column 84 and a first spring 85, punching press mechanism 3 drives go up mould 7 downstream and carry out the punching press, backing plate 5 atress downstream arrives during buffer board 4 departments, carry out the die, the power transmission that backing plate 5 received this moment gives four buffer assembly 82, spliced pole 83 will do all can the power transmission give first spring 85, this moment first spring 85 atress compression, through the elasticity of first spring 85 self to unload some component, make buffer assembly 82 can play the buffering effect, thereby reduces the rejection rate.
Further, all be provided with second spring 91 on four extreme points of buffer plate 4, every second spring 91 is kept away from the one end of buffer plate 4 all with backing plate 5 fixed connection.
In this embodiment, when the backing plate 5 moves downward, the second spring 91 releases part of the force applied to the backing plate 5 by its elastic deformation, so that the cushioning effect is further enhanced.
Further, the stamping mechanism 3 comprises a connecting block 31, a supporting column 32, a top plate 33, a stamping plate 34 and a hydraulic oil cylinder 35, the connecting block 31 is arranged on each of two sides of the workbench 2, the supporting columns 32 are arranged at two ends of each connecting block 31, one end, far away from the connecting block 31, of each supporting column 32 is fixedly connected with the top plate 33, the stamping plate 34 is slidably connected with the supporting column 32, the stamping plate 34 is located below the top plate 33, the stamping plate 34 is parallel to the top plate 33, one end of the hydraulic oil cylinder 35 is fixedly connected with the top plate 33, and the other end of the hydraulic oil cylinder 35 is fixedly connected with the stamping plate 34.
In this embodiment, the stamping plate 34 is movably connected to the supporting pillar 32, the hydraulic cylinder 35 applies a force to the stamping plate 34 to reciprocate on the supporting pillar 32, the upper die 7 is disposed below the stamping plate 34, and the hydraulic cylinder 35 drives the stamping plate 34 to move downward, so that the upper die 7 completes stamping of the lower die 6.
Further, the stamping mechanism 3 further includes a third spring 92, the third spring 92 is disposed between the stamping plate 34 and the connecting block 31, and the third spring 92 is sleeved outside each supporting column 32.
In the present embodiment, the third spring 92 is compressed when the press plate 34 moves downward, and achieves a cushioning effect by its own elastic performance.
Further, the workbench 2 comprises a main board 21 and two side boards 22, wherein each side board 22 is fixedly connected with the main board 21 and is respectively located on two sides of the main board 21.
In this embodiment, the side plate 22 is fixedly connected to the main plate 21, and is integrally formed during manufacturing, so that the structure is more firm.
Further, the notebook computer frame punching die 1 further comprises a material placing frame 11 and a finished product frame 12, the material placing frame 11 and the finished product frame 12 are respectively located on two sides of the workbench 2, the material placing frame 11 is fixedly connected with one side plate 22, and the finished product frame 12 is fixedly connected with the other side plate 22.
In this embodiment, work platform 2 both sides have been placed respectively blowing frame 11 with finished product frame 12 for all light when material loading or getting, blowing frame 11 with finished product frame 12 respectively with work platform 2 fixed connection adopts integrated into one piece to make during the manufacturing, and the structure is more firm.
While the invention has been described with reference to a preferred embodiment, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention.
Claims (6)
1. A notebook computer frame punching die is characterized in that,
the stamping mechanism is fixedly connected with the workbench and positioned above the workbench, one end of the buffer mechanism is fixedly connected with the workbench, the other end of the buffer mechanism is fixedly connected with the backing plate, the buffer plate is fixedly connected with the workbench and positioned below the backing plate, the lower die is detachably connected with the backing plate and positioned above the backing plate, the upper die is detachably connected with the stamping mechanism and positioned below the stamping mechanism, and the upper die corresponds to the lower die;
the buffer mechanism comprises a connecting plate and four buffer assemblies, wherein the four end points of the connecting plate are respectively provided with one buffer assembly, one end, far away from the connecting plate, of each buffer assembly is fixedly connected with the base plate, each buffer assembly comprises a connecting column, a resisting column and a first spring, one end, far away from the connecting plate, of each resisting column is provided with a groove, one end, far away from the base plate, of each connecting column is located in the groove, the first spring is arranged in the groove, one end of the first spring is fixedly connected with the bottom of the groove, and the other end of the first spring is fixedly connected with one end, far away from the base plate, of each connecting column.
2. The notebook computer frame punching die of claim 1,
all be provided with the second spring on four endpoints of buffer board, every the second spring is kept away from the one end of buffer board all with backing plate fixed connection.
3. The notebook computer frame punching die of claim 1,
the stamping mechanism comprises a connecting block, a supporting column, a top plate, a stamping plate and a hydraulic oil cylinder, wherein the connecting block is arranged on each of two sides of the workbench, the supporting column is arranged at each of two ends of each connecting block, each supporting column is arranged at one end, far away from the connecting block, of each supporting column and fixedly connected with the top plate, the stamping plate is slidably connected with the supporting column and located below the top plate, the stamping plate is parallel to the top plate, one end of the hydraulic oil cylinder is fixedly connected with the top plate, and the other end of the hydraulic oil cylinder is fixedly connected with the stamping plate.
4. The notebook computer frame punching die of claim 3,
the stamping mechanism further comprises a third spring, the third spring is arranged between the stamping plate and the connecting blocks, and the third spring is sleeved on each supporting column.
5. The notebook computer frame punching die of claim 1,
the workbench comprises a main board and two side boards, wherein each side board is fixedly connected with the main board and respectively positioned on two sides of the main board.
6. The notebook computer frame punching die of claim 5,
the notebook computer frame punching die further comprises a material placing frame and a finished product frame, wherein the material placing frame and the finished product frame are respectively located on two sides of the workbench, the material placing frame is fixedly connected with one side plate, and the finished product frame is fixedly connected with the other side plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022095794.8U CN213763673U (en) | 2020-09-22 | 2020-09-22 | Punching die for notebook computer frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022095794.8U CN213763673U (en) | 2020-09-22 | 2020-09-22 | Punching die for notebook computer frame |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213763673U true CN213763673U (en) | 2021-07-23 |
Family
ID=76905668
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022095794.8U Expired - Fee Related CN213763673U (en) | 2020-09-22 | 2020-09-22 | Punching die for notebook computer frame |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213763673U (en) |
-
2020
- 2020-09-22 CN CN202022095794.8U patent/CN213763673U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20210723 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |