CN213752638U

CN213752638U - Etching water washing device

Info

Publication number: CN213752638U
Application number: CN202022843477.XU
Authority: CN
Inventors: 陈冲; 杨晓君; 仲伟佳; 任现坤; 宋超; 曹振; 葛永见; 郭瑞静; 韩其家; 张洪岩
Original assignee: Linuo Solar Power Co Ltd
Current assignee: Linuo Solar Power Co Ltd
Priority date: 2020-11-30
Filing date: 2020-11-30
Publication date: 2021-07-20
Anticipated expiration: 2030-11-30

Abstract

The utility model relates to the technical field of solar cells, in particular to an etching and water washing device, which comprises an etching device, a water washing device, a conveying device and a controller, wherein the etching device comprises a first etching component and a second etching component; the water washing device comprises a spray head and a water tank which are correspondingly arranged; the conveying device comprises an etching conveying roller set, a rotary absorber and a washing conveying roller set, wherein the first etching assembly and the second etching assembly are sequentially arranged on the etching conveying roller set along the advancing direction of the silicon wafer, the rotary absorber is arranged between the first etching assembly and the second etching assembly, and the washing conveying roller set is arranged above the water tank and below the spray head; the etching device, the water washing device and the conveying device are respectively and electrically connected with the controller. The device etches four side faces of the silicon wafer at first, solves the problem that a battery has a short circuit ring, and removes phosphorosilicate glass through the washing device.

Description

Etching water washing device

Technical Field

The utility model relates to a solar cell technical field, concretely relates to sculpture water washing device.

Background

Solar cells can directly convert solar light energy into electric energy, and can be classified into solar cells working on the principle of photovoltaic effect or photochemical effect according to different working principles, and currently, solar cells working on the principle of photovoltaic effect are the mainstream of research.

The production process of the solar cell generally comprises the steps of silicon wafer cutting, texturing, diffusion sintering, etching cleaning, antireflection layer deposition and screen printing sintering, wherein the purpose of the diffusion sintering is to form a p-n junction, phosphorus is generally adopted for n-type doping, however, phosphorus is diffused on all surfaces of silicon in the diffusion process, and at the moment, the front surface and the back surface of the p-n junction and diffusion layers formed on four side edges of the silicon wafer form short circuit rings, so that the parallel resistance of the cell is reduced. On the other hand, due to the addition of oxygen in the diffusion process, a layer of silicon dioxide is formed on the surface of the silicon wafer, and part of phosphorus is left in the silicon dioxide to form phosphorosilicate glass, so that the moisture resistance of the battery in the air is reduced, and the current and the power are attenuated.

Based on this, it is necessary to provide an etching water washing apparatus.

SUMMERY OF THE UTILITY MODEL

There is phosphorosilicate glass and four sides on the silicon chip surface when diffusing to the battery to influence the technical problem of battery performance, the utility model provides an sculpture water washing device, the device at first carry out the sculpture to four sides of silicon chip, solve the battery and have the problem of short circuit ring, the phosphorosilicate glass is got rid of to rethread water washing device.

The utility model provides an etching water washing device, the etching water washing device comprises an etching device, a water washing device, a conveying device and a controller, the etching device comprises a first etching component and a second etching component, the first etching component comprises a plurality of laser generators, and the second etching component comprises a plurality of laser generators;

the washing device comprises a spray head and a water tank which are correspondingly arranged, the spray head comprises an acid washing spray head and a washing spray head, and the water tank comprises an acid washing tank and a washing tank;

the conveying device comprises an etching conveying roller set, a rotary absorber and a washing conveying roller set, wherein the first etching assembly and the second etching assembly are sequentially arranged on the etching conveying roller set along the advancing direction of the silicon wafer, the rotary absorber is arranged between the first etching assembly and the second etching assembly, and the washing conveying roller set is arranged above the water tank and below the spray head;

the etching device, the water washing device and the conveying device are respectively and electrically connected with the controller.

Furthermore, the first etching component and the second etching component comprise a plurality of groups of laser generator groups, each group of laser generator group comprises two laser generators which are oppositely arranged, and the space between the two laser generators of each group of laser generator group is used for placing a silicon wafer. The silicon wafer is placed between the two laser generators which are oppositely arranged, the laser generators work to etch two side faces, opposite to the laser generators, of the silicon wafer, the rotating absorber can rotate the silicon wafer after the etching of the first etching assembly is finished, and then the second etching assembly etches the remaining two opposite faces which are not etched.

Furthermore, the pickling spray head is communicated with the pickling tank through a pickling circulating pipe and a pump, and the washing spray head is communicated with the washing tank through a washing circulating pipe and a pump. The pickling solution (such as hydrofluoric acid solution) in the pickling tank is sprayed out from the pickling nozzle through a pipeline and a pump to clean the silicon wafer, and the cleaned pickling solution falls into the pickling tank for recycling; the water used in the water washing cycle can also be realized through a loop between the water washing spray head and the water washing tank.

Further, rotatory suction means includes hydraulic stem and vacuum device, the hydraulic stem bottom is connected with the rotary driving piece, the adsorption plate is installed to rotary driving piece bottom, the adsorption plate has the vacuum cavity of opening down, the vacuum cavity passes through trachea and vacuum device intercommunication. Under the control of the controller, the hydraulic rod can control the up-and-down displacement of the adsorption plate, the hydraulic rod extends before the silicon wafer reaches the position of the rotary suction device, so that the adsorption plate descends, when the silicon wafer reaches, the negative pressure device works, the vacuum cavity becomes a vacuum state, so that the silicon wafer is adsorbed to the bottom of the adsorption plate, the hydraulic rod is shortened, the adsorption plate is driven to ascend, the rotary driving piece controls the adsorption plate and the silicon wafer to horizontally rotate by 90 degrees, then the hydraulic rod extends, the adsorption plate descends again, the negative pressure device is matched to place the silicon wafer, at the moment, two sides of the silicon wafer which are not etched are oppositely arranged with the laser generator of the second etching component, the laser generator works, and two sides which are not etched are etched.

Further, the rotary driving member is a stepping motor. The step motor controls the adsorption plate to rotate, so that the silicon wafer adsorbed below the adsorption plate rotates.

Furthermore, an electromagnetic valve is arranged at the joint of the vacuum cavity and the air pipe. The electromagnetic valve can control the on-off of the air pipe, and the vacuum cavity can be switched between a vacuum state and a non-vacuum state through the switch of the electromagnetic valve, so that the adsorption and placement of the silicon wafer are realized.

The utility model has the advantages that,

the etching and washing device provided by the utility model can etch four sides of the silicon wafer diffused to phosphorus, and wash the silicon wafer through the pickling tank and the pickling spray head to remove the surface phosphorosilicate glass, and then the silicon wafer is washed by the pickling tank and the pickling spray head with the pickling solution remained on the surface; compare in the method that uses the sculpture liquid to carry out the sculpture to the edge, the utility model discloses utilize laser etching more to guarantee the complete removal of four side diffusion layers, and can not cause the damage to the front and the reverse side of silicon chip, simultaneously because contain nitric acid in the sculpture liquid, adopt the utility model discloses can also avoid the production of nitrogenous waste water, reduction in production cost.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without creative efforts.

Fig. 1 is a right side view of the present invention;

fig. 2 is a top view of the present invention.

In the figure, 1-a first etching component, 2-a second etching component, 3-a rotary extractor, 4-a laser generator, 5-a silicon wafer, 6-an acid washing spray head, 7-an acid washing tank, 8-a water washing spray head, 9-a water washing tank, 10-a hydraulic rod, 11-a rotary driving piece, 12-an adsorption plate and 13-a conveying device.

Detailed Description

In order to make the technical solutions in the present invention better understood, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, but not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts shall belong to the protection scope of the present invention.

Example 1

As shown in fig. 1 and 2, an etching and washing device comprises an etching device, a washing device, a conveying device 13 and a controller, wherein the etching device comprises a first etching component 1 and a second etching component 2, the washing device comprises a spray head and a water tank which are correspondingly arranged, the conveying device 13 comprises an etching conveying roller set, a rotary suction device 3 and a washing conveying roller set, and the conveying device 13 can be a conveying roller which is driven by a structure such as a driving belt or a motor gear to rotate so as to convey a silicon wafer;

the first etching component 1 and the second etching component 2 are sequentially arranged on the etching conveying roller set along the advancing direction of the silicon wafer 5, the first etching component 1 and the second etching component 2 both comprise a plurality of groups of laser generator groups, each group of laser generator group comprises two laser generators 4 which are oppositely arranged, the space between the two laser generators 4 of each group of laser generator group is used for placing the silicon wafer 5, the emission heads of the laser generators 4 are aligned to the circumference of the side surface of the silicon wafer 5 so that the laser emitted by the emission heads can remove a diffusion layer on the side surface of the silicon wafer 5, the rotary absorber 3 is arranged between the first etching component 1 and the second etching component 2, and the washing conveying roller set is arranged above the water tank and below the spray heads;

the spray head comprises an acid washing spray head 6 and a water washing spray head 8, the water tank comprises an acid washing tank 7 and a water washing tank 9, the acid washing spray head 6 and the water washing spray head 8 can be fixed through a bracket and other structures, the acid washing spray head 6 is communicated with the acid washing tank 7 through an acid washing circulating pipe and a pump, and the water washing spray head 8 is communicated with the water washing tank 9 through a water washing circulating pipe and a pump;

the rotary suction device 3 comprises a hydraulic rod 10 and a negative pressure device, the bottom of the hydraulic rod 10 is connected with a rotary driving piece 11, the rotary driving piece 11 is a stepping motor, the bottom of the rotary driving piece 11 is provided with an adsorption plate 12, the adsorption plate 12 is provided with a vacuum cavity with a downward opening, the vacuum cavity is communicated with the negative pressure device through an air pipe, a solenoid valve is arranged at the joint of the vacuum cavity and the air pipe, and the rotary suction device 3 can be fixed through a bracket and other structures;

the etching device, the water washing device and the conveying device 13 are respectively electrically connected with the controller.

Although the present invention has been described in detail by referring to the drawings in conjunction with the preferred embodiments, the present invention is not limited thereto. Various equivalent modifications or substitutions can be made on the embodiments of the present invention by those skilled in the art without departing from the spirit and substance of the present invention, and these modifications or substitutions are intended to be within the scope of the present invention/any person skilled in the art can easily conceive of changes or substitutions within the technical scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.

Claims

1. The etching water washing device is characterized by comprising an etching device, a water washing device, a conveying device (13) and a controller, wherein the etching device comprises a first etching component (1) and a second etching component (2), the first etching component (1) comprises a plurality of laser generators (4), and the second etching component (2) comprises a plurality of laser generators (4);

the washing device comprises a spray head and a water tank which are correspondingly arranged, the spray head comprises an acid washing spray head (6) and a washing spray head (8), and the water tank comprises an acid washing tank (7) and a washing tank (9);

the conveying device (13) comprises an etching conveying roller set, a rotary absorber (3) and a washing conveying roller set, the first etching component (1) and the second etching component (2) are sequentially arranged on the etching conveying roller set along the advancing direction of the silicon wafer (5), the rotary absorber (3) is arranged between the first etching component (1) and the second etching component (2), and the washing conveying roller set is arranged above the water tank and below the spray head;

the etching device, the water washing device and the conveying device (13) are respectively and electrically connected with the controller.

2. Etching water washing device according to claim 1, characterized in that the first etching component (1) and the second etching component (2) each comprise a plurality of groups of laser generators, each group of laser generators comprises two oppositely arranged laser generators (4), and the space between the two laser generators (4) of each group of laser generators is used for placing the silicon wafer (5).

3. The etching water washing device according to claim 1, wherein the pickling nozzle (6) and the pickling tank (7) are communicated with each other through a pickling circulation pipe and a pump, and the washing nozzle (8) and the washing tank (9) are communicated with each other through a washing circulation pipe and a pump.

4. The etching water washing device according to claim 1, wherein the rotary extractor (3) comprises a hydraulic rod (10) and a negative pressure device, a rotary driving member (11) is connected to the bottom of the hydraulic rod (10), an adsorption plate (12) is mounted at the bottom of the rotary driving member (11), the adsorption plate (12) is provided with a vacuum cavity with a downward opening, and the vacuum cavity is communicated with the negative pressure device through a gas pipe.

5. Etching water rinse device according to claim 4, characterized in that the rotary drive (11) is a stepper motor.

6. The etching water washing apparatus according to claim 4, wherein a solenoid valve is provided at a connection of the vacuum chamber and the gas pipe.