CN213750417U - Anti-electrostatic interference heat dissipation structure of optical module - Google Patents
Anti-electrostatic interference heat dissipation structure of optical module Download PDFInfo
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- CN213750417U CN213750417U CN202022886947.0U CN202022886947U CN213750417U CN 213750417 U CN213750417 U CN 213750417U CN 202022886947 U CN202022886947 U CN 202022886947U CN 213750417 U CN213750417 U CN 213750417U
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Abstract
The utility model discloses an optical module prevent electrostatic interference heat radiation structure, including circuit board, the chip that generates heat, fixed plate and pvc baffle are all installed on the circuit board top, the fixed plate is located the chip both sides that generate heat, the pvc baffle is located the chip front surface that generates heat, is equipped with the heat-conducting plate between the fixed plate, heat-conducting plate one end is connected with the fixed plate rotation through the bull stick, and the heat-conducting plate other end is close to the pvc baffle inboard, the inboard fixedly connected with of pvc baffle is used for restricting the blend stop of the heat-conducting plate other end removal, and the pvc baffle other end is located blend stop bottom surface; through install the pvc baffle additional at the chip front surface that generates heat, when needing to change carbon fiber heat conduction pad and anti-static interference heat-conducting medium, the heat-conducting plate other end is enclosing the bull stick and is rotating, accomplishes the separation to heat-conducting plate and circuit board, takes out carbon fiber heat conduction pad and anti-static interference heat-conducting medium again, makes things convenient for the staff to open the heat-conducting plate, promotes the staff and to the maintenance efficiency of optical module.
Description
Technical Field
The utility model relates to a heat radiation structure especially relates to an optical module prevent electrostatic interference heat radiation structure.
Background
An optical module is an integrated module for converting an optical signal into an electrical signal and/or converting an electrical signal into an optical signal, and is generally mounted on a printed circuit board, and plays an important role in optical fiber communication in the field of communication. With the rapid development of 4G communication and even 5G communication, the market demand for high-speed optical modules is increasing day by day. In the working process of the optical module, a large amount of heat is generated, and heat dissipation needs to be performed through a heat dissipation structure.
Among the heat radiation structure, still install carbon fiber heat conduction pad and the antistatic interference heat-conducting medium that is used for promoting the radiating efficiency, but its life is limited, needs regularly to change, because current heat radiation mechanism fixes through screw and circuit board more, and it is troublesome to dismantle it.
SUMMERY OF THE UTILITY MODEL
In order to overcome the not enough of prior art, the utility model provides an optical module prevent electrostatic interference heat radiation structure can solve among the heat radiation structure, still installs carbon fiber heat conduction pad and the antistatic interference heat-conducting medium that is used for promoting the radiating efficiency, and its life is limited, needs regularly to change, because current heat dissipation mechanism fixes through screw and circuit board more, dismantles troublesome technical problem to it.
In order to solve the technical problem, the utility model provides a following technical scheme: the utility model provides an optical module prevent electrostatic interference heat radiation structure, includes the circuit board, generates heat chip, fixed plate and pvc baffle, chip, fixed plate and the pvc baffle of generating heat are all installed on the circuit board top, the fixed plate is located the chip both sides that generate heat, the pvc baffle is located the chip front surface that generates heat, be equipped with the heat-conducting plate between the fixed plate, heat-conducting plate one end is passed through the bull stick and is connected with the fixed plate rotation, the heat-conducting plate other end is close to the pvc baffle inboard, the inboard fixedly connected with of pvc baffle is used for restricting the blend stop that the heat-conducting plate other end removed, the pvc baffle other end is located blend stop bottom surface.
As an optimized technical solution of the utility model, blend stop length is greater than the heat-conducting plate width.
As an optimized technical scheme of the utility model, blend stop top surface is the inclined plane.
As an optimized technical scheme of the utility model, blend stop bottom surface is the horizontal straight face.
As a preferred technical scheme of the utility model, heat-conducting plate and the chip that generates heat still are equipped with carbon fiber heat conduction pad and antistatic interference heat-conducting medium between, antistatic interference heat-conducting medium is located the chip top that generates heat to in close contact with, carbon fiber heat conduction pad bottom and the chip top surface in close contact with that generates heat, antistatic interference heat-conducting medium top surface and heat-conducting plate bottom surface in close contact with.
As an optimal technical scheme of the utility model, heat-conducting plate top equidistance is equipped with rather than integrated into one piece's fin.
As a preferred technical scheme of the utility model, the installing frame is installed on the heat-conducting plate top, the fin is located the installing frame, the installing frame top is equipped with the dust screen, the dust screen can effectively reduce the dust and adsorb on the fin, fixedly connected with radiator fan in the middle of the dust screen bottom.
As a preferred technical scheme of the utility model, fixedly connected with embedding ring is still gone back in the installing frame bottom outside, the installing frame top surface is seted up with the spread groove of embedding ring looks adaptation, the embedding ring is located the spread groove, the embedding of embedding ring bottom end has first magnetic ring, the embedding of spread groove bottom have with first magnetic ring assorted second magnetic ring, first magnetic ring and second magnetic ring are the actuation each other under magnetic force.
Compared with the prior art, the utility model discloses the beneficial effect that can reach is:
1. by additionally arranging the pvc baffle on the front surface of the heating chip, when the carbon fiber heat conduction pad and the antistatic interference heat conduction medium need to be replaced, the top end of the pvc baffle is moved outwards, the pvc baffle has certain elasticity, the pvc baffle drives the barrier strip to be separated from one end of the top surface of the heat conduction plate, when the barrier strip is completely separated from the heat conduction plate, one end of the heat conduction plate is lifted at the moment, the other end of the heat conduction plate rotates around the rotating rod to complete the separation of the heat conduction plate and the circuit board, and then the carbon fiber heat conduction pad and the antistatic interference heat conduction medium are taken out, so that a worker can conveniently open the heat conduction plate, and the maintenance efficiency of the worker on the optical module is improved;
2. through install the embedding ring additional in the dust screen bottom outside, when needing to wash dust screen surface adsorption's dust, earlier with dust screen and installing frame separation, mention the dust screen, move the embedding ring by the dust screen and shift up, shift up by embedding ring drive first magnetic ring again, make first magnetic ring and second magnetic ring separation, leave the spread groove completely until the embedding ring in, accomplish the separation to the dust screen, make things convenient for the clean dust screen surface adsorption's of staff dust, further promote the circulation of air efficiency in the installing frame.
Drawings
Fig. 1 is a schematic view of a heat dissipation structure of the present invention;
fig. 2 is a schematic side view of the barrier strip of the present invention;
fig. 3 is a schematic top view of the heat dissipation structure of the present invention;
FIG. 4 is an enlarged view of a portion a of FIG. 1;
wherein: 1. a circuit board; 2. a heat generating chip; 3. a carbon fiber heat-conducting pad; 4. an antistatic interference heat-conducting medium; 5. installing a frame; 51. a heat sink; 52. a dust screen; 53. a heat radiation fan; 521. an insert ring; 522. a first magnetic ring; 523. a second magnetic ring; 6. a heat conducting plate; 7. a fixing plate; 8. a pvc baffle; 81. and (6) blocking strips.
Detailed Description
In order to make the technical means, the creation features, the achievement purposes and the functions of the invention easy to understand, the invention is further explained below with reference to the specific embodiments, but the following embodiments are only the preferred embodiments of the invention, not all. Based on the embodiments in the implementation, other embodiments obtained by those skilled in the art without any creative work belong to the protection scope of the present invention. The experimental methods in the following examples are conventional methods unless otherwise specified, and materials, reagents and the like used in the following examples are commercially available unless otherwise specified.
Example 1
Referring to fig. 1 and 2, the present invention provides an anti-electrostatic interference heat dissipation structure of an optical module, including a circuit board 1, a heat generating chip 2, a fixing plate 7 and a pvc baffle 8, wherein the heat generating chip 2, the fixing plate 7 and the pvc baffle 8 are all mounted on the top end of the circuit board 1, the fixing plate 7 is located on both sides of the heat generating chip 2, the pvc baffle 8 is located on the front surface of the heat generating chip 2, a heat conducting plate 6 is disposed between the fixing plates 7, one end of the heat conducting plate 6 is rotatably connected to the fixing plate 7 through a rotating rod, the other end of the heat conducting plate 6 is close to the inner side of the pvc baffle 8, a blocking strip 81 for limiting the movement of the other end of the heat conducting plate 6 is fixedly connected to the inner side of the pvc baffle 8, the other end of the pvc baffle 8 is located on the bottom surface of the blocking strip 81, the length of the blocking strip 81 is greater than the width of the heat conducting plate 6, which is helpful for improving the connection firmness between the fixing plate 7 and the circuit board 1, the top surface of the barrier strip 81 is an inclined plane, the inclined plane can be better for facilitating the heat-conducting plate 6 to compress the barrier strip 81, the bottom surface of the barrier strip 81 is a horizontal straight surface, and the horizontal straight surface can better limit the heat-conducting plate 6.
Referring to fig. 2, a carbon fiber heat conduction pad 3 and an anti-static interference heat conduction medium 4 are further disposed between the heat conduction plate 6 and the heat generating chip 2, the anti-static interference heat conduction medium 4 is located at the top end of the heat generating chip 2 and is in close contact with the top surface of the heat generating chip 2, the top surface of the anti-static interference heat conduction medium 4 is in close contact with the bottom surface of the heat conduction plate 6, the carbon fiber heat conduction pad 3 and the anti-static interference heat conduction medium 4 are used for improving the heat dissipation efficiency and the anti-static performance of the heat dissipation structure, heat dissipation fins 51 are disposed at the top end of the heat conduction plate 6 at equal intervals and are integrally formed with the top end of the heat conduction plate, and the heat dissipation fins 51 are used for improving the contact area between the mounting frame 5 and the air and improving the heat dissipation efficiency.
During the use, when needing to change carbon fiber heat conduction pad 3 and anti-static interference heat conduction medium 4, remove 8 tops of pvc baffle toward its outside, pvc baffle 8 has certain elasticity, it breaks away from with 6 top surfaces one end of heat-conducting plate to drive blend stop 81 by pvc baffle 8, when blend stop 81 breaks away from with heat-conducting plate 6 completely, at this moment, mention 6 one end of heat-conducting plate, the rotating rod rotation is being enclosed to the 6 other end of heat-conducting plate, the completion is to the separation of heat-conducting plate 6 and circuit board 1, take out carbon fiber heat conduction pad 3 and anti-static interference heat conduction medium 4 again, make things convenient for the staff to open heat-conducting plate 6, promote the staff and to the maintenance efficiency of optical module.
Example 2
Referring to fig. 2 to 4, the present invention provides an anti-electrostatic interference heat dissipation structure of an optical module, the embodiment adopts the same technical solution as the first embodiment, except that a mounting frame 5 is installed on the top end of a heat conduction plate 6, a heat dissipation plate 51 is located in the mounting frame 5, a dust screen 52 is disposed on the top end of the mounting frame 5, the dust screen 52 can effectively reduce dust absorption on the heat dissipation plate 51, a heat dissipation fan 53 is fixedly connected to the middle of the bottom end of the dust screen 52, the heat dissipation fan 53 is used for increasing the air circulation speed in the mounting frame 5, so as to further improve the heat dissipation efficiency of the heat conduction plate 6, an embedding ring 521 is further fixedly connected to the outer side of the bottom end of the mounting frame 5, a connection groove adapted to the embedding ring 521 is formed on the top surface of the mounting frame 5, the embedding ring 521 is located in the connection groove, a first magnetic ring 522 is embedded in the bottom end of the embedding ring 521, the bottom end of the connecting groove is embedded with a second magnetic ring 523 matched with the first magnetic ring 522, the first magnetic ring 522 and the second magnetic ring 523 attract each other under the action of magnetic force, the embedded ring 521 is fixed in the connecting groove, and the dust screen 52 is fixed.
During the use, when needing to wash the dust that adsorbs on dust screen 52 surface, earlier separate dust screen 52 and installing frame 5, mention dust screen 52, it shifts up to drive embedded ring 521 by dust screen 52, it shifts up to drive first magnetic ring 522 by embedded ring 521 again, make first magnetic ring 522 and second magnetic ring 523 separate, in embedded ring 521 leaves the spread groove completely, accomplish the separation to dust screen 52, make things convenient for the staff to clean the dust that adsorbs on dust screen 52 surface, further promote the circulation of air efficiency in the installing frame 5.
The utility model provides a pair of optical module prevent electrostatic interference heat radiation structure, through install pvc baffle 8 additional at 2 front surfaces of chip that generates heat, when needing to change carbon fiber heat conduction pad 3 and antistatic interference heat-conducting medium 4, move pvc baffle 8 top toward its outside, pvc baffle 8 has certain elasticity, it breaks away from with heat-conducting plate 6 top surface one end to drive blend stop 81 by pvc baffle 8, when blend stop 81 breaks away from heat-conducting plate 6 completely, this moment, mention heat-conducting plate 6 one end, the other end of heat-conducting plate 6 encloses the bull stick and rotates, accomplish the separation to heat-conducting plate 6 and circuit board 1, take out carbon fiber heat conduction pad 3 and antistatic interference heat-conducting medium 4 again, make things convenient for the staff to open heat-conducting plate 6, promote the staff to the maintenance efficiency of optical module; through install the embedded ring 521 additional in the dust screen 52 bottom outside, when needing to wash the adsorbed dust in dust screen 52 surface, separate dust screen 52 and installing frame 5 earlier, mention dust screen 52, it shifts up to drive the embedded ring 521 by dust screen 52, it shifts up to drive first magnetic ring 522 by embedded ring 521 again, make first magnetic ring 522 and second magnetic ring 523 separate, until embedded ring 521 leaves the spread groove completely, accomplish the separation to dust screen 52, make things convenient for the clean adsorbed dust in dust screen 52 surface of staff, further promote the circulation of air efficiency in the installing frame 5.
In the present disclosure, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact between the first and second features, or may comprise contact between the first and second features not directly. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.
The foregoing shows and describes the general principles, essential features, and advantages of the invention. It should be understood by those skilled in the art that the present invention is not limited by the above embodiments, and the description in the above embodiments and the description is only preferred examples of the present invention, and is not intended to limit the present invention, and that the present invention can have various changes and modifications without departing from the spirit and scope of the present invention, and these changes and modifications all fall into the scope of the claimed invention. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (8)
1. The utility model provides an optical module prevent electrostatic interference heat radiation structure, includes circuit board (1), chip (2), fixed plate (7) and pvc baffle (8) generate heat, its characterized in that: generate heat chip (2), fixed plate (7) and pvc baffle (8) all install on circuit board (1) top, fixed plate (7) are located chip (2) both sides that generate heat, pvc baffle (8) are located chip (2) front surface that generates heat, be equipped with heat-conducting plate (6) between fixed plate (7), heat-conducting plate (6) one end is passed through the bull stick and is rotated with fixed plate (7) and be connected, heat-conducting plate (6) other end is close to pvc baffle (8) inboard, inboard fixedly connected with of pvc baffle (8) is used for restricting blend stop (81) that the heat-conducting plate (6) other end removed, pvc baffle (8) other end is located blend stop (81) bottom surface.
2. The structure of claim 1, wherein: the length of the barrier strip (81) is larger than the width of the heat conducting plate (6).
3. The structure for preventing electrostatic interference and dissipating heat of a light module according to claim 1 or 2, wherein: the top end surface of the barrier strip (81) is an inclined plane.
4. The structure of claim 3, wherein: the bottom end surface of the barrier strip (81) is a transverse plane.
5. The structure of claim 4, wherein the heat sink structure comprises: heat-conducting plate (6) and generate heat still are equipped with carbon fiber heat conduction pad (3) and antistatic interference heat-conducting medium (4) between chip (2), antistatic interference heat-conducting medium (4) are located chip (2) top of generating heat to in close contact with, carbon fiber heat conduction pad (3) bottom and chip (2) top surface in close contact with generate heat, antistatic interference heat-conducting medium (4) top surface and heat-conducting plate (6) bottom surface in close contact with.
6. The structure of claim 1, wherein: the top of the heat conducting plate (6) is equidistantly provided with radiating fins (51) which are integrally formed with the heat conducting plate.
7. The structure of claim 6, wherein: mounting frame (5) are installed on heat-conducting plate (6) top, fin (51) are located mounting frame (5), mounting frame (5) top is equipped with dust screen (52), dust screen (52) can effectively reduce the dust and adsorb on fin (51), fixedly connected with radiator fan (53) in the middle of dust screen (52) bottom.
8. The structure of claim 7, wherein: the magnetic ring installing structure is characterized in that an embedded ring (521) is fixedly connected to the outer side of the bottom end of the installing frame (5), a connecting groove matched with the embedded ring (521) is formed in the top surface of the installing frame (5), the embedded ring (521) is located in the connecting groove, a first magnetic ring (522) is embedded into the bottom end of the embedded ring (521), a second magnetic ring (523) matched with the first magnetic ring (522) is embedded into the bottom end of the connecting groove, and the first magnetic ring (522) and the second magnetic ring (523) are attracted mutually under the action of magnetic force.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022886947.0U CN213750417U (en) | 2020-12-05 | 2020-12-05 | Anti-electrostatic interference heat dissipation structure of optical module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022886947.0U CN213750417U (en) | 2020-12-05 | 2020-12-05 | Anti-electrostatic interference heat dissipation structure of optical module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213750417U true CN213750417U (en) | 2021-07-20 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022886947.0U Active CN213750417U (en) | 2020-12-05 | 2020-12-05 | Anti-electrostatic interference heat dissipation structure of optical module |
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| Country | Link |
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| CN (1) | CN213750417U (en) |
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- 2020-12-05 CN CN202022886947.0U patent/CN213750417U/en active Active
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