CN213749551U

CN213749551U - Communication system subelement encapsulation chip paster adhesion degree detection device in a poor light

Info

Publication number: CN213749551U
Application number: CN202022724066.9U
Authority: CN
Inventors: 张利
Original assignee: Wuhan Kors Communication Technology Co ltd
Current assignee: Wuhan Kors Communication Technology Co ltd
Priority date: 2020-11-23
Filing date: 2020-11-23
Publication date: 2021-07-20
Anticipated expiration: 2030-11-23

Abstract

The utility model discloses a communication system subelement encapsulation chip paster adhesion degree detection device in a poor light, comprising a base plate, a cell body mechanism has been seted up on the bottom plate, install a welding mechanism in the cell body mechanism, elevating system of last fixed surface of bottom plate is connected with, fixture of last fixedly connected with of elevating system, the upper surface of bottom plate is provided with a chip mechanism, cell body mechanism includes four spread grooves, four the spread groove is all seted up in the upper surface of bottom plate, and four the spread groove is the symmetry form and sets up, the beneficial effects of the utility model are that: the detection device is convenient for detecting the adhesion degree of the backlight chip paster after installation, is convenient to operate and simple to use, and effectively solves the problems that the adhesion degree of the backlight chip paster after installation cannot be detected more accurately and the like because no device is specially used for detecting the adhesion degree of the backlight chip paster after installation.

Description

Communication system subelement encapsulation chip paster adhesion degree detection device in a poor light

Technical Field

The utility model relates to a check out test set technical field specifically is a chip paster adhesion degree detection device is shaded in communication system subelement encapsulation.

Background

The communication system is a general term for technical systems used to complete information transmission processes, modern communication systems are mainly realized by means of transmission mechanisms of electromagnetic waves in free space or in guiding media, and the backlight chip patch is one of the components of the communication system.

At present, after a communication system sub-element vest chip patch is installed, the adhesion degree of the installed communication system sub-element vest chip patch is usually detected, and the adhesion degree of the backlight chip patch cannot be known more accurately because a device for specially detecting the adhesion degree of the backlight chip patch is not provided.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a communication system subelement encapsulation chip paster adhesion degree detection device in a poor light to solve the problem that proposes in the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a communication system subelement encapsulation chip paster adhesion degree detection device in a poor light, includes the bottom plate, a cell body mechanism has been seted up on the bottom plate, install a welding mechanism in the cell body mechanism, elevating system is connected with to the last fixed surface of bottom plate, fixture of last fixedly connected with of elevating system, the upper surface of bottom plate is provided with a chip mechanism.

Preferably, the cell body mechanism includes four spread grooves, four the upper surface at the bottom plate is all seted up to the spread groove, and four the spread groove is the symmetry form setting, two of keeping away from mutually the tank bottom of spread groove is the symmetry form and has all seted up two screw holes.

Preferably, welding mechanism includes two welding plates, two welding plate difference sliding connection is in two spread grooves of keeping away from mutually, two the position that the upper surface of welding plate corresponds the screw hole is the symmetry form and has all seted up two counter bores, four all be equipped with a screw in the counter bore, and four the screw is close to the one end of screw hole and all passes counter bore and threaded connection in the screw hole.

Preferably, elevating system includes the support body, support body fixed connection is on the top of bottom plate upper surface, a recess has been seted up on the support body is close to the lateral wall on spread groove one side, the last fixed surface of support body is connected with a motor, just the output of motor runs through the upper surface of support body and flushes mutually with the top cell wall of recess, a lead screw of fixedly connected with on the output that motor and recess top cell wall flushed mutually, just the one end that the motor was kept away from to the lead screw is passed through the bearing and is connected with the bottom cell wall rotation of recess, threaded connection has a supporting shoe on the pole wall of lead screw, just the supporting shoe is close to the one end of recess notch and is passed the recess and extends to the support body, the supporting shoe is located tensile meter of one end fixedly connected with outside the support body.

Preferably, the clamping mechanism comprises a connecting plate, the connecting plate is fixedly connected to the lower end of the tension meter, a moving groove is formed in the lower surface of the connecting plate, a bidirectional screw rod is rotatably connected between the opposite groove walls of the moving groove through a bearing, threads on the rod wall of the bidirectional screw rod are symmetrically arranged about a central point, two moving blocks are symmetrically and respectively in threaded connection with the rod walls at the two ends of the bidirectional screw rod, one ends of the two moving blocks, which are close to the notch of the moving groove, are flush with the lower surface of the connecting plate, the lower surfaces of the two moving blocks are symmetrically and respectively and fixedly connected with a connecting frame, two L-shaped blocks are symmetrically and respectively and fixedly connected with the lower surfaces of the two connecting frames, which correspond to the two connecting grooves, the ends of the two L-shaped blocks, which are close to the connecting grooves, extend in the connecting grooves, and one end of the bidirectional screw rod, which is far away from the frame, is fixedly connected with a handle, and one end of the handle, which is far away from the bidirectional screw rod, penetrates through the groove wall of the moving groove and extends outwards from the connecting plate.

Preferably, the chip mechanism includes four L type stoppers, four the equal fixed connection of L type stopper in the upper surface of bottom plate, and four L type stopper is the matrix setting, four be equipped with a backlight chip paster jointly between the L type stopper, the outer wall of backlight chip paster is laminated mutually with the inboard wall of four L type stoppers, the outer wall of backlight chip paster is laminated mutually with the inboard wall of two L type pieces, just the both ends of backlight chip paster are through welding respectively with two welded plate fixed connection.

Compared with the prior art, the beneficial effects of the utility model are that: through the L type stopper that sets up, can place the backlight chip paster, welding plate through setting up, can weld the backlight chip paster through welding glue and fix, fixture through the setting, can be through rotatory handle, make two-way lead screw drive two L type pieces and carry out the centre gripping to the backlight chip paster, through setting up elevating system, can be through opening the motor, make the lead screw drive tensiometer pulling connecting plate rebound through the supporting shoe, through tensiometer pulling connecting plate rebound, thereby can make the adhesion degree of backlight chip paster obtain detecting, effectual solution because do not have the device that detects to the adhesion degree after the backlight chip paster installation specially, thereby can not more accurate detect scheduling problem to the adhesion degree of backlight chip paster adhesion.

Drawings

FIG. 1 is a schematic view of the overall cutting structure of the present invention;

FIG. 2 is a side view of the cutting structure of the present invention;

fig. 3 is a schematic top view of the middle bottom plate of the present invention;

fig. 4 is a schematic view of the overall structure of the middle bottom plate of the present invention;

fig. 5 is a schematic view of the overall structure of the L-shaped block of the present invention.

In the figure: 1. a base plate; 2. a trough mechanism; 21. connecting grooves; 22. a threaded hole; 3. a welding mechanism; 31. welding the plate; 32. a countersunk hole; 33. a screw; 4. a lifting mechanism; 41. a frame body; 42. a groove; 43. a motor; 44. a screw rod; 45. a support block; 46. a tension meter; 5. a clamping mechanism; 51. a connecting plate; 52. a moving groove; 53. a bidirectional screw rod; 54. a moving block; 55. a connecting frame; 56. an L-shaped block; 57. a handle; 6. a chip mechanism; 61. an L-shaped limiting block; 62. and (6) backlight chip paster.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-5, the present invention provides a technical solution: the utility model provides a communication system subelement encapsulation chip paster adhesion degree detection device in a poor light, includes bottom plate 1, has seted up a cell body mechanism 2 on the bottom plate 1, installs a welding mechanism 3 in the cell body mechanism 2, and elevating system 4 is connected with to the last fixed surface of bottom plate 1, and elevating system 4 goes up fixture 5 of fixedly connected with, and the upper surface of bottom plate 1 is provided with a chip mechanism 6.

The groove body mechanism 2 comprises four connecting grooves 21, the four connecting grooves 21 are arranged on the upper surface of the bottom plate 1, the four connecting grooves 21 are symmetrically arranged, the bottoms of the two connecting grooves 21 which are far away from each other are symmetrically provided with two threaded holes 22, and the connection of subsequent mechanisms is facilitated.

Welding mechanism 3 includes two welding plates 31, two welding plates 31 are sliding connection respectively in two spread grooves 21 of keeping away from mutually, two counter bores 32 have all been seted up to the symmetry form to the position that the upper surface of two welding plates 31 corresponds screw hole 22, all be equipped with a screw 33 in four counter bores 32, and four screws 33 are close to the one end of screw hole 22 and all pass counter bore 32 and threaded connection in screw hole 22, thereby be convenient for dismantle welding plate 31 through dismantling screw 33 and be convenient for clear up welding residue etc. on the welding plate 31.

Elevating system 4 includes support body 41, support body 41 fixed connection is on the top of 1 upper surface of bottom plate, support body 41 has seted up a recess 42 on being close to the lateral wall on spread groove 21 one side, the last fixed surface of support body 41 is connected with a motor 43, and the output of motor 43 runs through the upper surface of support body 41 and flushes mutually with the top cell wall of recess 42, motor 43 and recess 42 top cell wall on the output that flushes mutually fixedly connected with a lead screw 44, and lead screw 44 keeps away from the one end of motor 43 and passes through the bearing and be connected with the bottom cell wall rotation of recess 42, threaded connection has a supporting shoe 45 on the pole wall of lead screw 44, and the one end that supporting shoe 45 is close to the recess 42 notch passes recess 42 and extends to support body 41, supporting shoe 45 is located the outer one end fixedly connected with tensiometer 46 of support body 41.

The clamping mechanism 5 comprises a connecting plate 51, the connecting plate 51 is fixedly connected to the lower end of the tension meter 46, a moving groove 52 is formed in the lower surface of the connecting plate 51, a bidirectional screw 53 is rotatably connected between the opposite groove walls of the moving groove 52 through a bearing, threads on the rod wall of the bidirectional screw 53 are symmetrically arranged about a central point, two moving blocks 54 are symmetrically and respectively in threaded connection with the rod walls at the two ends of the bidirectional screw 53, one ends of the two moving blocks 54 close to the notch of the moving groove 52 are flush with the lower surface of the connecting plate 51, the lower surfaces of the two moving blocks 54 are symmetrically and respectively and fixedly connected with a connecting frame 55, two L-shaped blocks 56 are symmetrically and respectively and fixedly connected with the lower surfaces of the two connecting frames 55 corresponding to the two connecting grooves 21, one ends of the two L-shaped blocks 56 close to the connecting grooves 21 extend in the connecting grooves 21, and one end of the bidirectional screw 53 far away from the frame body 41 is fixedly connected with a handle 57, and one end of the handle 57 far away from the bidirectional screw 53 penetrates through the groove wall of the moving groove 52 and extends out of the connecting plate 51, so that the backlight chip patch 62 is fixed conveniently.

Chip mechanism 6 includes four L type stoppers 61, the equal fixed connection of four L type stoppers 61 in bottom plate 1's upper surface, and four L type stoppers 61 are the matrix setting, be equipped with a chip paster 62 in a poor light between four L type stoppers 61 jointly, the outer wall of chip paster 62 in a poor light is laminated mutually with the inboard wall of four L type stoppers 61, the outer wall of chip paster 62 in a poor light is laminated mutually with the inboard wall of two L type pieces 56, and the both ends of chip paster 62 in a poor light pass through the welding respectively with two welded plates 31 fixed connection, be convenient for the installation of chip paster 62 in a poor light.

Specifically, when the utility model is used, the backlight chip patch 62 is placed between the four L-shaped stoppers 61, then the two ends of the backlight chip patch 62 are welded on the two welding plates 31 respectively by using welding glue, then the motor 43 is turned on, the motor 43 drives the lead screw 44 to rotate, the rotation of the lead screw 44 can drive the tension meter 46 to move downwards through the supporting block 45, the downward movement of the tension meter 46 can push the four L-shaped blocks 56 to enter the connecting groove 21 through the connecting plate 51, after the four L-shaped blocks 56 enter the connecting groove 21, the motor 43 is turned off and the handle 57 is rotated, the handle 57 drives the bidirectional lead screw 53 to rotate, the rotation of the bidirectional lead screw 53 can drive the two moving blocks 54 to move in opposite directions and clamp the backlight chip patch 62, after the backlight chip patch 62 is clamped by the two moving blocks 54, the motor 43 is turned on again, the motor 43 drives the screw rod 44 to rotate, the rotation of the screw rod 44 can drive the tension meter 46 to move upwards through the supporting block 45, the tension meter 46 can drive the L-shaped block 56 to move upwards through the connecting plate 51, the L-shaped block 56 can drive the backlight chip patch 62 to move upwards through the upward movement, and as the backlight chip patch 62 is welded on the welding plate 31, when the L-shaped block 56 moves the backlight chip patch 62 upward, the value on the tension meter 46 changes, after the backlight chip patch 62 is separated from the base plate 1, the result of the adhesion degree can be obtained by observing the value on the tension meter 46, and the problems that the adhesion degree of the backlight chip patch after being mounted cannot be detected more accurately due to the absence of a device for detecting the adhesion degree of the backlight chip patch after being mounted are solved effectively.

In the description of the present invention, it is to be understood that the terms "coaxial", "bottom", "one end", "top", "middle", "other end", "upper", "one side", "top", "inner", "front", "center", "both ends", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.

Furthermore, the terms "first", "second", "third", "fourth" are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated, whereby the features defined as "first", "second", "third", "fourth" may explicitly or implicitly include at least one such feature.

In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "disposed," "connected," "fixed," "screwed" and the like are to be construed broadly, e.g., as meaning fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; they may be directly connected or indirectly connected through an intermediate medium, and may be connected through the inside of two elements or in an interaction relationship between two elements, unless otherwise specifically defined, and the specific meaning of the above terms in the present invention will be understood by those skilled in the art according to specific situations.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a communication system subelement encapsulation chip paster adhesion degree detection device in a poor light, a serial communication port, including bottom plate (1), a cell body mechanism (2) has been seted up on bottom plate (1), install a welding mechanism (3) in cell body mechanism (2), last fixed surface of bottom plate (1) is connected with an elevating system (4), a fixture of fixedly connected with (5) on elevating system (4), the upper surface of bottom plate (1) is provided with a chip mechanism (6).

2. The device for detecting the adhesion degree of the communication system sub-element packaging backlight chip patch according to claim 1, wherein: cell body mechanism (2) are including four spread groove (21), four the upper surface in bottom plate (1) is all seted up in spread groove (21), and four spread groove (21) are the symmetry form and set up, two of keeping away from mutually the tank bottom of spread groove (21) is the symmetry form and has all seted up two screw holes (22).

3. The device for detecting the adhesion degree of the communication system sub-element packaging backlight chip patch according to claim 1, wherein: welding mechanism (3) are including two welding board (31), two welding board (31) sliding connection respectively is in two spread grooves (21) of keeping away from mutually, two the position that the upper surface of welding board (31) corresponds screw hole (22) is the symmetry form and has all seted up two counter sink (32), four all be equipped with one screw (33) in counter sink (32), and four one end that screw (33) are close to screw hole (22) all passes counter sink (32) and threaded connection in screw hole (22).

4. The device for detecting the adhesion degree of the communication system sub-element packaging backlight chip patch according to claim 1, wherein: the lifting mechanism (4) comprises a frame body (41), the frame body (41) is fixedly connected to the top end of the upper surface of the bottom plate (1), a groove (42) is formed in the side wall, close to one side of the connecting groove (21), of the frame body (41), a motor (43) is fixedly connected to the upper surface of the frame body (41), the output end of the motor (43) penetrates through the upper surface of the frame body (41) and is flush with the top groove wall of the groove (42), a lead screw (44) is fixedly connected to the output end, flush with the top groove wall of the groove (42), of the motor (43), one end, far away from the motor (43), of the lead screw (44) is rotatably connected with the bottom groove wall of the groove (42) through a bearing, a supporting block (45) is connected to the rod wall of the lead screw (44) in a threaded mode, and the end, close to the notch of the groove (42), of the supporting block (45) penetrates through the groove (42) and extends out of the frame body (41), one end of the supporting block (45) positioned outside the frame body (41) is fixedly connected with a tension meter (46).

5. The device for detecting the adhesion degree of the communication system sub-element packaging backlight chip patch according to claim 1, wherein: the clamping mechanism (5) comprises a connecting plate (51), the connecting plate (51) is fixedly connected to the lower end of the tension meter (46), a moving groove (52) is formed in the lower surface of the connecting plate (51), a bidirectional screw rod (53) is rotatably connected between the opposite groove walls of the moving groove (52) through a bearing, threads on the rod wall of the bidirectional screw rod (53) are symmetrically arranged around a central point, two moving blocks (54) are symmetrically and respectively in threaded connection with the rod walls at the two ends of the bidirectional screw rod (53), one ends of the two moving blocks (54) close to the notch of the moving groove (52) are respectively flush with the lower surface of the connecting plate (51), a connecting frame (55) is fixedly connected to the lower surfaces of the two moving blocks (54) in a symmetrical shape, two L-shaped blocks (56) are respectively and fixedly connected to the lower surfaces of the two connecting frames (55) in a symmetrical shape corresponding to the positions of the two connecting grooves (21), and two the L type piece (56) are close to the one end of connecting groove (21) and carry out the extension in connecting groove (21), one end fixedly connected with handle (57) that support body (41) were kept away from in two-way lead screw (53), just one end that two-way lead screw (53) were kept away from in handle (57) runs through the cell wall of shifting chute (52) and extends to connecting plate (51) is outer.

6. The device for detecting the adhesion degree of the communication system sub-element packaging backlight chip patch according to claim 1, wherein: chip mechanism (6) are including four L type stopper (61), four equal fixed connection in the upper surface of bottom plate (1) of L type stopper (61), and four L type stopper (61) is the matrix setting, four be equipped with a backlight chip paster (62) jointly between L type stopper (61), the outer wall of backlight chip paster (62) is laminated mutually with the inboard wall of four L type stopper (61), the outer wall of backlight chip paster (62) is laminated mutually with the inboard wall of two L type pieces (56), just the both ends of backlight chip paster (62) are through the welding respectively with two welded plates (31) fixed connection.