CN213718125U - ICSP wireless local area network module - Google Patents

ICSP wireless local area network module Download PDF

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Publication number
CN213718125U
CN213718125U CN202023114885.8U CN202023114885U CN213718125U CN 213718125 U CN213718125 U CN 213718125U CN 202023114885 U CN202023114885 U CN 202023114885U CN 213718125 U CN213718125 U CN 213718125U
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CN
China
Prior art keywords
electromagnetic interference
local area
area network
board
circuit board
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Expired - Fee Related
Application number
CN202023114885.8U
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Chinese (zh)
Inventor
陈俊松
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Shanghai Banmeng Technology Co ltd
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Shanghai Banmeng Technology Co ltd
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Priority to CN202023114885.8U priority Critical patent/CN213718125U/en
Application granted granted Critical
Publication of CN213718125U publication Critical patent/CN213718125U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The utility model discloses a wireless LAN module of ICSP, including the bar board, the inner of bar board is connected with the LAN circuit board, the centre of LAN circuit board is provided with the signal pole, is located the bilateral symmetry of bar board is provided with the post pole, the inner of post pole is provided with the accent to the piece, the accent is provided with the recess to the inner of piece, the inside of recess is provided with the axis of rotation, is located the outside of axis of rotation is connected with the telescopic link, the end connection of telescopic link has rotatable anti-electromagnetic interference board, anti-electromagnetic interference board is semi-circular arc body, and two anti-electromagnetic interference board is rotatable to be set up in the outside of signal pole, is located the symmetrical back of LAN circuit board is provided with two buffer structure. The utility model discloses an it is rotatable to the electromagnetic interference board in the signal pole outside to have added in the both sides of LAN circuit board, can shield the inside electromagnetic interference of electron device to can promote wireless signal's external transmission, it is comparatively practical.

Description

ICSP wireless local area network module
Technical Field
The utility model relates to an electronic equipment technical field specifically is ICSP wireless local area network module.
Background
Wireless lan modules have three main categories of wireless network modules compared with mainstream ones: wireless network card, wireless network card and bluetooth module. The wireless network card is actually one of three important modules of the fast moving technology of intel, namely a WIFI module. The wireless network card is a wireless local area network card, and solves the problem that the local area network is wireless from a router to a computer terminal. The wireless network card can be divided into IEEE802.11b, IEEE802.11a, IEEE802.11g and IEEE802.11n according to the wireless communication standard, and the wireless network module is divided into a transmitting end module and a receiving end module, which are generally main modules respectively used for the master and the slave of the wireless network bridge. The principle is simple, the signal transmitting module is responsible for transmitting signals, and the signal receiving module is responsible for receiving signals. There is a one-to-one correspondence, and certainly there may be multiple receiving ends at one transmitting end. One-to-one is called POINTTO POINT system and one-to-many is called multispot system.
Most of the existing wireless local area network modules are matched with the signal rod for use, however, the signal rod is easy to receive internal electromagnetic interference, wireless transmission is affected, meanwhile, due to the fact that a buffer structure is lacked, vibration is easy to generate, stability is poor, and therefore the technical problems existing in the corresponding technical scheme are needed to be designed.
SUMMERY OF THE UTILITY MODEL
Technical problem to be solved
Not enough to prior art, the utility model provides a ICSP wireless local area network module has solved: most of the existing wireless local area network modules are matched with the signal rod for use, but the signal rod is easy to receive internal electromagnetic interference, wireless transmission is affected, and meanwhile, due to the lack of a buffer structure, vibration is easy to generate, and the stability is poor.
(II) technical scheme
In order to achieve the above purpose, the utility model discloses a following technical scheme realizes: ICSP wireless local area network module, including the bar shaped plate, the inner of bar shaped plate is connected with the LAN circuit board, the centre of LAN circuit board is provided with the signal pole, is located the bilateral symmetry of bar shaped plate is provided with the post barre, the inner of post barre is provided with the accent to the piece, the accent is provided with the recess to the inner of piece, the inside of recess is provided with the axis of rotation, is located the outside of axis of rotation is connected with the telescopic link, the end connection of telescopic link has rotatable anti-electromagnetic interference board, anti-electromagnetic interference board is semi-circular arc body, and two anti-electromagnetic interference board is rotatable to be set up in the outside of signal pole, is located the back symmetry of LAN circuit board is provided with two buffer structure.
As the utility model discloses a further preferred mode, buffer structure includes lamina tecti and end cover plate, the inside cavity that is provided with of lamina tecti, the end cover plate inserts to the lamina tecti cavity and slides with the lamina tecti and is connected, the bottom of lamina tecti is provided with the pressure spring, the bottom and the end cover plate stationary phase of pressure spring are connected.
As a further preferred mode of the utility model, the bilateral symmetry of end cover plate is provided with the guide arm, be provided with the spout on the inner wall of lamina tecti, the guide arm imbeds to the inside of spout.
As a further preferred mode of the present invention, the strip-shaped plate bilateral symmetry is provided with through holes.
As a further preferred mode of the present invention, the bilateral symmetry of the lan circuit board is provided with a plurality of heat dissipation holes.
(III) advantageous effects
The utility model provides a ICSP wireless local area network module. The method has the following beneficial effects:
the utility model discloses an it is rotatable to the electromagnetic interference board in the signal pole outside to have added in the both sides of LAN circuit board, can shield the inside electromagnetic interference of electron device to can promote wireless signal's external transmission, it is comparatively practical.
The utility model discloses an added two buffer structure in the bottom of LAN circuit board, warp through the pressure spring that uses lamina tecti and bottom cover board between and, reach the shock attenuation buffering.
Drawings
Fig. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is a schematic structural diagram of a direction-adjusting block of the present invention;
fig. 3 is a schematic structural diagram of the buffer structure of the present invention.
In the figure, 1, a strip-shaped plate; 2. a local area network circuit board; 3. a signal lever; 4. a pole rod; 5. a direction adjusting block; 6. a rotating shaft; 7. a telescopic rod; 8. an anti-electromagnetic interference plate; 9. a buffer structure; 10. a top cover plate; 11. a bottom cover plate; 12. a pressure spring; 13. a guide bar; 14. a through hole; 15. and (4) heat dissipation holes.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-3, an embodiment of the present invention provides a technical solution: ICSP wireless local area network module, including strip shaped plate 1, the inner of strip shaped plate 1 is connected with LAN circuit board 2, LAN circuit board 2's centre is provided with signal pole 3, is located strip shaped plate 1's bilateral symmetry is provided with post strip pole 4, the inner of post strip pole 4 is provided with transfers to piece 5, it is provided with the recess to transfer to the inner of piece 5, the inside of recess is provided with axis of rotation 6, is located the outside of axis of rotation 6 is connected with telescopic link 7, the end connection of telescopic link 7 has rotatable anti-electromagnetic interference board 8, anti-electromagnetic interference board 8 is the semicircle arc, and two anti-electromagnetic interference board 8 is rotatable to be set up in signal pole 3's outside, is located LAN circuit board 2's back is symmetrical and is provided with two buffer structure 9.
Buffer structure 9 includes lamina tecti 10 and end cover board 11, lamina tecti 10 inside is provided with the cavity, lamina tecti 11 inserts to lamina tecti 10 cavity and slides with lamina tecti 10 and be connected, the bottom of lamina tecti 10 is provided with pressure spring 12, the bottom of pressure spring 12 is connected with lamina tecti 11 is fixed, can use lamina tecti 10 and end cover board 11 and pressure spring 12 to cushion the shock attenuation through such design, strengthens stable effect.
Guide rods 13 are symmetrically arranged on two sides of the bottom cover plate 11, sliding grooves are formed in the inner wall of the top cover plate 10, the guide rods 13 are embedded into the sliding grooves, and the guide rods 13 can be inserted into the sliding grooves through the design, so that the moving stability of the top cover plate 10 is enhanced.
Strip shaped plate 1 bilateral symmetry is provided with through-hole 14, can use through-hole 14 on strip shaped plate 1 to install fixedly through such design.
The two sides of the LAN circuit board 2 are symmetrically provided with a plurality of heat dissipation holes 15, and the heat dissipation holes 15 can be used to enhance the heat dissipation effect through the design.
The working principle is as follows: during the use, the accessible uses 1 inboard installation LAN circuit board 2 of bar shaped plate, then can use through-hole 14 on the bar shaped plate 1 to carry out fixed mounting, and then the accessible uses the axis of rotation 6 of transferring to on the piece 5 to adjust the position of telescopic link 7, then use and rotate anti-electromagnetic interference version 8, the cladding is in the outside of signal pole 3, prevent that the electromagnetic interference that the internal circuit device produced from producing influence signal pole 3, can use lamina tecti 10 and lamina tecti 11 and pressure spring 12 to cushion the shock attenuation simultaneously, strengthen stable effect.
The utility model 1, a strip-shaped plate; 2. a local area network circuit board; 3. a signal lever; 4. a pole rod; 5. a direction adjusting block; 6. a rotating shaft; 7. a telescopic rod; 8. an anti-electromagnetic interference plate; 9. a buffer structure; 10. a top cover plate; 11. a bottom cover plate; 12. a pressure spring; 13. a guide bar; 14. a through hole; 15. the utility model solves the problems that the prior wireless local area network module is mostly matched with a signal rod for use, but the signal rod is easy to receive internal electromagnetic interference to influence wireless transmission, and simultaneously, vibration is easy to generate due to lack of a buffer structure and the stability is poor, and the electromagnetic interference plate which can be rotated to the outer side of the signal rod is added at both sides of the local area network circuit board to shield the electromagnetic interference inside an electronic device, thereby promoting the external transmission of wireless signals and being practical, the utility model adds two buffer structures at the bottom of the local area network circuit board, and uses a top cover plate, a bottom cover plate and a pressure spring between the top cover plate and the bottom cover plate to deform, achieving the shock absorption and buffering.
The basic principles and the main features of the invention and the advantages of the invention have been shown and described above, it will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, but that the invention may be embodied in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.

Claims (5)

  1. An ICSP wireless local area network module, characterized by: comprises a strip-shaped plate (1), the inner end of the strip-shaped plate (1) is connected with a local area network circuit board (2), a signal rod (3) is arranged in the middle of the local area network circuit board (2), column rods (4) are symmetrically arranged at two sides of the strip-shaped plate (1), the inner end of the pole rod (4) is provided with a direction adjusting block (5), the inner end of the direction adjusting block (5) is provided with a groove, a rotating shaft (6) is arranged in the groove, a telescopic rod (7) is connected with the outer side of the rotating shaft (6), the end part of the telescopic rod (7) is connected with a rotatable anti-electromagnetic interference plate (8), the anti-electromagnetic interference plate (8) is in a semicircular arc shape, and the two anti-electromagnetic interference boards (8) can be rotatably arranged outside the signal rod (3), and two buffer structures (9) are symmetrically arranged on the back surface of the local area network circuit board (2).
  2. 2. The ICSP wlan module as claimed in claim 1, wherein: buffer structure (9) are including lamina tecti (10) and end cover board (11), lamina tecti (10) inside is provided with the cavity, end cover board (11) insert lamina tecti (10) cavity and with lamina tecti (10) slip be connected, the bottom of lamina tecti (10) is provided with pressure spring (12), the bottom and the end cover board (11) of pressure spring (12) are fixed to be connected.
  3. 3. The ICSP wlan module as claimed in claim 2, wherein: guide rods (13) are symmetrically arranged on two sides of the bottom cover plate (11), a sliding groove is formed in the inner wall of the top cover plate (10), and the guide rods (13) are embedded into the sliding groove.
  4. 4. The ICSP wlan module as claimed in claim 1, wherein: through holes (14) are symmetrically formed in the two sides of the strip-shaped plate (1).
  5. 5. The ICSP wlan module as claimed in claim 1, wherein: and a plurality of heat dissipation holes (15) are symmetrically formed in two sides of the local area network circuit board (2).
CN202023114885.8U 2020-12-22 2020-12-22 ICSP wireless local area network module Expired - Fee Related CN213718125U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202023114885.8U CN213718125U (en) 2020-12-22 2020-12-22 ICSP wireless local area network module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202023114885.8U CN213718125U (en) 2020-12-22 2020-12-22 ICSP wireless local area network module

Publications (1)

Publication Number Publication Date
CN213718125U true CN213718125U (en) 2021-07-16

Family

ID=76789636

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202023114885.8U Expired - Fee Related CN213718125U (en) 2020-12-22 2020-12-22 ICSP wireless local area network module

Country Status (1)

Country Link
CN (1) CN213718125U (en)

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Granted publication date: 20210716