CN213703704U

CN213703704U - Anti-adhesion flexible circuit board stamping die

Info

Publication number: CN213703704U
Application number: CN202022681517.5U
Authority: CN
Inventors: 杨晓飞
Original assignee: Suzhou Dongxing Mould Co ltd
Current assignee: Suzhou Dongxing Mould Co ltd
Priority date: 2020-11-19
Filing date: 2020-11-19
Publication date: 2021-07-16
Anticipated expiration: 2030-11-19

Abstract

The utility model provides an anti-adhesion flexible circuit board stamping die, which belongs to the technical field of stamping dies, and comprises a movable upper die, wherein the lower end of the movable upper die is provided with a plurality of stamping parts, an anti-adhesion mechanism is arranged below the movable upper die, the anti-adhesion mechanism comprises a clamping plate, a telescopic rod, a reset spring and two first through holes, the number of the telescopic rod and the reset spring is two, the number of the first through holes is multiple, the clamping plate is fixed at the lower end of the movable upper die through the two telescopic rods, the two reset springs are respectively fixed between the movable upper die and the clamping plate, the two reset springs are respectively sleeved on the surfaces of the two telescopic rods, the first through holes are all arranged at the upper end of the clamping plate, the problems that the flexible circuit board is easy to be adhered on the die and is not easy to be collected and the like in the, meanwhile, the whole anti-adhesion mechanism is automatically prevented, and the production efficiency is improved.

Description

Anti-adhesion flexible circuit board stamping die

Technical Field

The utility model belongs to the technical field of stamping die, concretely relates to flexible circuit board stamping die of antiseized even.

Background

The mould is various moulds and tools for obtaining required products by injection molding, blow molding, extrusion, die casting or forging forming, smelting, stamping and other methods in industrial production. In short, a mold is a tool used to make a shaped article, the tool being made up of various parts, different molds being made up of different parts. The processing of the appearance of an article is realized mainly through the change of the physical state of a formed material. The element has the name of "industrial mother". The blank is formed into a tool with a specific shape and size under the action of external force. The method is widely applied to blanking, die forging, cold heading, extrusion, powder metallurgy part pressing, pressure casting and the forming processing of compression molding or injection molding of products such as engineering plastics, rubber, ceramics and the like. The die has a specific contour or cavity shape, and the blank can be separated (blanked) according to the contour shape by applying the contour shape with the cutting edge. The blank can obtain a corresponding three-dimensional shape by using the shape of the inner cavity. The mold generally comprises a movable mold and a fixed mold (or a male mold and a female mold), which can be separated or combined. When the blank is closed, the blank is injected into the die cavity for forming. The die is a precise tool, has a complex shape, bears the expansion force of a blank, and has higher requirements on structural strength, rigidity, surface hardness, surface roughness and processing precision, the development level of die production is one of important marks of the mechanical manufacturing level, and the flexible circuit board is a printed circuit made of a flexible insulating base material. In the production process of the flexible circuit board, a stamping die is required to perform a stamping process on the flexible circuit board.

However, the traditional flexible circuit board stamping die has the defects that the punch of the traditional flexible circuit board stamping die is too rough, the flexible circuit board is easily adhered to the die in the punching process, the flexible circuit board is not easy to collect, and the reject ratio of products is high.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide an antiseized even flexible circuit board stamping die aims at solving the flexible circuit board stamping die of the traditional chinese clothing of prior art mesology, and its drift is too coarse, and at die-cut in-process, flexible circuit board easily glues on the mould, is difficult for collecting, the scheduling problem of defective rate of product height.

In order to achieve the above object, the utility model provides a following technical scheme:

an anti-adhesion flexible circuit board stamping die comprises a movable upper die, wherein a plurality of stamping parts are arranged at the lower end of the movable upper die, an anti-adhesion mechanism is arranged below the movable upper die, the anti-adhesion marker comprises a clamping plate, a telescopic rod, a return spring and a first through hole, the number of the telescopic rods and the number of the reset springs are two, the number of the first through holes is multiple, the clamping plate is fixed at the lower end of the movable upper die through the two telescopic rods, the two reset springs are respectively fixed between the movable upper die and the clamping plate, and two reset springs are respectively sleeved on the surfaces of the two telescopic rods, a plurality of first through holes are all arranged at the upper end of the clamping plate, a lower die is arranged below the clamping plate, a plurality of punched holes are arranged at the upper end of the lower die, and a plurality of punches a hole respectively with a plurality of stamping workpiece phase-matchs, be provided with guiding mechanism between activity mould and the lower mould.

In order to do, as the utility model relates to a preferred, guiding mechanism includes a plurality of connecting blocks, first guide bar, lower connecting block and second guide bar, and is a plurality of go up the connecting block and be fixed in the activity respectively with lower connecting block and go up the mould and the lower mould about both ends two, a plurality of in the second guide bar is fixed in a plurality of connecting blocks down respectively, a plurality of first guide bar is fixed in the lower extreme of a plurality of connecting blocks of going up respectively, and a plurality of connecting blocks of going up the activity respectively are pegged graft in a plurality of second guide bars.

In order to, as the utility model relates to an it is preferred, the lower extreme of cardboard is fixed with the backing plate, it perforates to have seted up a plurality of seconds on the backing plate, and a plurality of seconds perforate respectively with a plurality of first perforation phase-matches.

In order to do, the utility model relates to an it is preferred, the lower extreme of lower mould is fixed with ejection of compact slide, the blown down tank has been seted up to ejection of compact slide's front end, and blown down tank and a plurality of intercommunication that punch a hole.

In order to be preferable in the present invention, the lower end of the stamping part is set to be a smooth mirror surface.

In order to be preferable in the present invention, the discharging chute is provided with a downward-inclined radian.

Compared with the prior art, the beneficial effects of the utility model are that:

1. in this scheme, can effectively prevent at die-cut in-process through the setting of antiseized even mechanism on stamping die, flexible circuit board easily glues on the mould, be difficult for collecting the scheduling problem, whole antiseized even mechanism is automatic prevention simultaneously, production efficiency is improved, go up the in-process of carrying out the punching press downwards through the activity, a plurality of first perforation that a plurality of stamping parts passed on the cardboard are to the punching press of a plurality of flexible circuit board cooperations of lower mould, after accomplishing, mould area a plurality of stamping parts u when moving back mould upwards in the activity, two telescopic links can be because two telescopic links of connecting promote the cardboard under the effect of elastic and make the flexible circuit board after the cardboard extrudees downwards, effectively prevent the punching press face formation bonding of flexible circuit board and a plurality of stamping parts, cause the mould difficulty of moving back and lead to the fact the damage to the circuit board that bonds.

2. In the scheme, the arrangement of the guide mechanism can ensure that the punching positions of a plurality of punching parts under the movable upper die are more accurate when the movable upper die punches downwards, prevent the punching position from shifting, improve the processing efficiency and the yield, limit the movable upper die and the lower die by the up-and-down movable insertion of the four first guide rods on the four second guide rods, prevent the clamping plate from damaging the surface of the flexible circuit board in the punching process and reduce the contact force, the arrangement of a plurality of second through holes is matched with the first through holes to ensure that the plurality of punching parts can perform punching operation in the process, the arrangement of the discharging slide way and the discharging groove can automatically remove waste materials after punching through the discharging groove by a plurality of punched holes, the waste materials are not required to be cleared by additional time and labor cost, the punching efficiency is improved, the roughness of the plurality of the punching parts can be effectively reduced by arranging the lower ends of the plurality of punching parts into smooth mirror surfaces, prevent die-cut back, a plurality of stamping workpiece cause the circuit line fracture easily, be provided with the radian of downward sloping with ejection of compact slide and can let in a plurality of punching a hole through the blown down tank with the waste material through the radian of slope and self normal force automatic elimination.

Drawings

The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention, and together with the description serve to explain the invention and not to limit the invention. In the drawings:

fig. 1 is a schematic structural view of the present invention;

fig. 2 is a perspective view of the present invention;

fig. 3 is a front view of the present invention.

In the figure: 1-moving an upper die; 2-stamping parts; 3-clamping board; 4, a telescopic rod; 5-a return spring; 6-first perforation; 7-lower die; 8-punching; 9-a discharge chute; 10-a discharge chute; 11-connecting the block; 12-a first guide bar; 13-lower connecting block; 14-a second guide bar; 15-a backing plate; 16-second perforation.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Example 1

Referring to fig. 1 and 2, the present invention provides the following technical solutions: an anti-adhesion flexible circuit board stamping die comprises a movable upper die 1, a plurality of stamping parts 2 are arranged at the lower end of the movable upper die 1, an anti-adhesion mechanism is arranged below the movable upper die 1, the anti-adhesion marker comprises a clamping plate 3, an expansion link 4, a reset spring 5 and a first through hole 6, the expansion link 4 and the reset spring 5 are provided with two, the first through hole 6 is provided with a plurality of clamping plates 3, the clamping plate 3 is fixed at the lower end of the movable upper die 1 through the two expansion links 4, the two reset springs 5 are respectively fixed between the movable upper die 1 and the clamping plate 3, and two reset springs 5 are respectively sleeved on the surfaces of the two telescopic rods 4, a plurality of first through holes 6 are all arranged at the upper end of the clamping plate 3, a lower die 7 is arranged below the clamping plate 3, a plurality of punched holes 8 are arranged at the upper end of the lower die 7, and a plurality of punching holes 8 are respectively matched with a plurality of stamping parts 2, and a guide mechanism is arranged between the movable upper die 1 and the lower die 7.

In the specific embodiment of the utility model, the problem that the flexible circuit board is easy to be adhered to the die and is not easy to be collected and the like in the punching process can be effectively prevented through the arrangement of the anti-adhesion mechanism on the punching die, meanwhile, the whole anti-adhesion mechanism is automatically prevented, the production efficiency is improved, and in the process of downwards punching through the movable upper die 1, the plurality of stamping parts 2 penetrate through the plurality of first through holes 6 on the clamping plate 3 to stamp the flexible circuit board on the lower die 7 by matching with the plurality of punching holes 8, when mould 1 takes a plurality of stamping parts 2 to move back the mould in the activity u, two telescopic links 4 can be because under elastic effect promote cardboard 3 and make the flexible circuit board extrusion downwards after the cardboard 3 will punch through two telescopic links 4 of connecting, effectively prevent that the stamping surface of flexible circuit board and a plurality of stamping parts 2 from forming the bonding, cause the mould difficulty of moving back and cause the damage to the circuit board that bonds.

Specifically please refer to fig. 1 and 2, the guiding mechanism includes a plurality of upper connecting blocks 11, a first guiding rod 12, a lower connecting block 13 and a second guiding rod 14, the plurality of upper connecting blocks 11 and the lower connecting block 13 are respectively fixed at the front and rear parts of the left and right ends of the movable upper die 1 and the lower die 7, the plurality of second guiding rods 14 are respectively fixed in the plurality of lower connecting blocks 13, the plurality of first guiding rods 12 are respectively fixed at the lower ends of the plurality of upper connecting blocks 11, and the plurality of upper connecting blocks 11 are respectively movably inserted into the plurality of second guiding rods 14.

In this embodiment: the setting of guiding mechanism can make the punching press position of a plurality of stamping parts 2 under the mould 1 more accurate on the activity when the mould 1 is gone up in the activity and is done the punching press downwards, prevents the skew of punching press position, improves the efficiency and the yield of processing, goes up the activity through four first guide bars 12 and pegs graft about four second guide bars 14 and goes on spacingly to mould 1 and lower mould 7 on the activity.

Specifically, please refer to fig. 2 and 3, a backing plate 15 is fixed at the lower end of the clamping plate 3, a plurality of second through holes 16 are formed in the backing plate 15, and the plurality of second through holes 16 are respectively matched with the plurality of first through holes 6.

In this embodiment: the setting of backing plate 15 can prevent that cardboard 3 from causing the damage to the surface of flexible circuit board in stamping process, reduces the strength of contact, and the first perforation 6 of the first perforation of the setting cooperation of a plurality of second 16 can let a plurality of stamping parts 2 processes wherein carry out the punching press operation.

Specifically, as shown in fig. 1 and fig. 3, a discharging chute 9 is fixed at the lower end of the lower die 7, a discharging chute 10 is opened at the front end of the discharging chute 9, and the discharging chute 10 is communicated with the plurality of punched holes 8.

In this embodiment: the waste material after the punching can be automatically removed through a plurality of punched holes 8 in the discharge chute 10 by the arrangement of the discharge chute 9 and the discharge chute 10, the waste material is not needed to be cleared by extra time and labor cost, and the punching efficiency is improved.

Specifically, the lower ends of the plurality of stamping parts 2 are all set to be smooth mirror surfaces.

In this embodiment: all establish the lower extreme of a plurality of stamping workpiece 2 into glossy mirror surface can effectively reduce the roughness of a plurality of stamping workpiece 2, prevent die-cut back, a plurality of stamping workpiece 2 cause the circuit line fracture easily.

Specifically, as shown in fig. 2, the discharging chute 9 is provided with a downward-inclined arc.

In this embodiment: the discharging slide 9 is provided with a downward inclined radian, so that waste materials in the plurality of punched holes 8 can be automatically discharged through the inclined radian and self centering force through the discharging groove 10.

The utility model discloses a theory of operation and use flow: when the movable upper die 1 punches downwards, a plurality of stamping parts 2 penetrate through a plurality of first through holes 6 on a clamping plate 3 to stamp a flexible circuit board on a lower die 7 in a matching manner with a plurality of punched holes 8, after stamping is completed, when the movable upper die 1 drives the plurality of stamping parts 2 to retreat upwards, u, two telescopic rods 4 can push the clamping plate 3 under the action of elasticity and enable the clamping plate 3 to extrude the stamped flexible circuit board downwards through the two connected telescopic rods 4, the flexible circuit board is effectively prevented from being bonded with the stamping surfaces of the plurality of stamping parts 2, the difficulty in mold retreat is caused and the bonded circuit board is damaged, the arrangement of a guide mechanism can enable the stamping positions of the plurality of stamping parts 2 below the movable upper die 1 to be more accurate when the movable upper die 1 punches downwards, the stamping position deviation is prevented, the processing efficiency and the yield are improved, the movable upper die 1 and the lower die 7 are limited by the up-down movable insertion of four first guide rods 12 on four second guide rods 14, the setting of the backing plate 15 can prevent the surface of the flexible circuit board from being damaged by the clamping plate 3 in the punching process, the contact force is reduced, the setting of the second through holes 16 is matched with the first through holes 6, the punching operation can be carried out in the processes of the punching parts 2, the discharging slide 9 and the discharging groove 10 can automatically remove the punched waste materials through the discharging groove 10 by the punching parts 8, the waste materials are not needed to be cleared by extra time and labor cost, the punching efficiency is improved, the roughness of the punching parts 2 can be effectively reduced by setting the lower ends of the punching parts 2 to be smooth mirror surfaces, the circuit lines are easily broken by the punching parts 2 after punching is prevented, the discharging slide 9 is provided with the downward-inclined radian, the waste materials can be automatically removed through the inclined radian and the self-neutral force by the discharging groove 10 in the punching parts 8, and the anti-adhesion mechanism on the punching die can be effectively prevented in the punching process, the flexible circuit board is easy to adhere to the die, the problems such as collection and the like are not easy to occur, meanwhile, the whole anti-adhesion mechanism is automatically prevented, and the production efficiency is improved.

Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described in the foregoing embodiments, or equivalents may be substituted for elements thereof. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. The utility model provides an antiseized even flexible circuit board stamping die which characterized in that: comprises a movable upper die (1), wherein the lower end of the movable upper die (1) is provided with a plurality of stamping parts (2), an anti-adhesion mechanism is arranged below the movable upper die (1), the anti-adhesion mechanism comprises a clamping plate (3), telescopic rods (4), reset springs (5) and first through holes (6), the number of the telescopic rods (4) and the number of the reset springs (5) are two, the number of the first through holes (6) are multiple, the clamping plate (3) is fixed at the lower end of the movable upper die (1) through the two telescopic rods (4), the two reset springs (5) are respectively fixed between the movable upper die (1) and the clamping plate (3), the two reset springs (5) are respectively sleeved on the surfaces of the two telescopic rods (4), the first through holes (6) are all arranged at the upper end of the clamping plate (3), a lower die (7) is arranged below the clamping plate (3), a plurality of punching holes (8) are formed in the upper end of the lower die (7), the punching holes (8) are respectively matched with the punching parts (2), and a guide mechanism is arranged between the movable upper die (1) and the lower die (7).

2. The anti-adhesion flexible circuit board stamping die according to claim 1, wherein: guiding mechanism includes connecting block (11), first guide bar (12), lower connecting block (13) and second guide bar (14) on a plurality of, and is a plurality of go up connecting block (11) and lower connecting block (13) and be fixed in the activity respectively go up mould (1) and lower mould (7) about both ends two parts, it is a plurality of in second guide bar (14) are fixed in a plurality of lower connecting block (13) respectively, it is a plurality of first guide bar (12) are fixed in the lower extreme of a plurality of last connecting block (11) respectively, and a plurality of connecting block (11) of going up are the activity respectively and are pegged graft in a plurality of second guide bar (14) in.

3. The anti-adhesion flexible circuit board stamping die according to claim 2, wherein: the lower extreme of cardboard (3) is fixed with backing plate (15), seted up a plurality of second and perforate (16) on backing plate (15), and a plurality of second perforate (16) respectively with a plurality of first perforation (6) phase-match.

4. The anti-adhesion flexible circuit board stamping die according to claim 3, wherein: the lower extreme of lower mould (7) is fixed with ejection of compact slide (9), blown down tank (10) have been seted up to the front end of ejection of compact slide (9), and blown down tank (10) and a plurality of (8) intercommunication that punch a hole.

5. The anti-adhesion flexible circuit board stamping die according to claim 4, wherein: the lower ends of the stamping parts (2) are all set to be smooth mirror surfaces.

6. The anti-adhesion flexible circuit board stamping die according to claim 5, wherein: the discharging slide way (9) is provided with a downward-inclined radian.