CN213702358U - Pressure welding device for memory processing - Google Patents
Pressure welding device for memory processing Download PDFInfo
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- CN213702358U CN213702358U CN202022343140.2U CN202022343140U CN213702358U CN 213702358 U CN213702358 U CN 213702358U CN 202022343140 U CN202022343140 U CN 202022343140U CN 213702358 U CN213702358 U CN 213702358U
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Abstract
The utility model discloses a pressure welding device for memory processing, including support frame and the mount of setting at the support frame top, the inside cavity that is provided with of support frame, the inside one side of cavity is provided with the drive shaft, drive shaft top and bottom all through the bearing with the cavity inner wall is connected, the drive shaft intermediate position is provided with drive gear, drive gear runs through the cavity setting on one side at the support frame outer wall. The utility model discloses when using, only need can accomplish the adjustment to memory bonding position through stirring drive gear, and then reduced the step that the staff needs to the change of memory bonding position greatly to improve staff's work efficiency, further buffering subassembly through setting up can alleviate the welding part to memory pressure, improved the protection effect of device to the bonding in-process of memory, and then make the result of use of device better.
Description
Technical Field
The utility model relates to a relevant technical field of memory processing equipment specifically is a pressure welding device for memory processing.
Background
The memory is used as a storage device mainly applied to computers and intelligent devices, wherein the memory of the computer can be divided into an internal memory and an external memory, the internal memory is frequently used by the computer during program execution and is directly accessible during an instruction cycle, the external memory requires the computer to read information from an external storage device such as a magnetic tape or a magnetic disk, and welding work in the memory processing process mostly needs a welding device to complete.
The defects of the prior art are as follows: traditional pressure welding device can not rotate the memory of fixed completion because the defect of structure itself changes the pressure welding position, and then leads to the device to need the manual work constantly to dismantle fixed completion to the memory in the pressure welding in-process to the memory, not only leads to the device to become complicated to the weldment work of memory, has also influenced staff's work efficiency.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a pressure welding device for memory processing has solved traditional pressure welding device and can not rotate the memory of fixed completion because the defect of structure itself changes the pressure welding position, and then leads to the device to need the manual work constantly to dismantle the fixed completion to the memory in the pressure welding process to the memory, not only leads to the device to become complicated to the weldment work of memory, has also influenced staff's work efficiency's problem.
In order to achieve the above object, the utility model provides a following technical scheme: a pressure welding device for memory processing comprises a support frame and a fixing frame arranged at the top of the support frame, wherein a cavity is arranged in the support frame, a driving shaft is arranged on one side in the cavity, the top and the bottom of the driving shaft are connected with the inner wall of the cavity through bearings, a driving gear is arranged at the middle position of the driving shaft, one side of the driving gear penetrates through the cavity and is arranged on the outer wall of the support frame, a placing platform is arranged at the middle position of the top of the support frame, first air cylinders are arranged on two sides of the top of the placing platform, a buffer assembly is arranged at the middle position of the top of the placing platform, a rotating shaft is arranged at the bottom of the placing platform, a bearing is arranged at the bottom of the rotating shaft and penetrates through the cavity, the rotating shaft is connected with the inner wall of the, a second air cylinder is arranged on one side of the top of the fixing frame, a welding mechanism is arranged on one side of the second air cylinder, and a welding head is arranged at the bottom of the fixing frame.
Preferably, the bottom of the output shaft of the second cylinder is fixedly connected with a fixed transverse plate, and the bottom of the fixed transverse plate is fixedly connected with the top of the welding head.
Preferably, the welding head is connected with the welding mechanism in a matching mode, and the welding head is arranged at the top of the placing platform.
Preferably, the first cylinder output shaft is fixedly connected with a clamping plate, the clamping plate is arranged at the top of the placing platform, and the clamping plate is in contact with the outer wall of the top of the placing platform.
Preferably, the buffering subassembly comprises dashpot, buffer board, limiting plate and buffer spring, the dashpot is seted up at place the platform top intermediate position, the opening has been seted up at the dashpot top, just the buffer board sets up at dashpot top outer wall, the limiting plate sets up inside the dashpot, the buffer board bottom is provided with the connecting piece, the buffer board pass through the connecting piece with limiting plate top fixed connection, just buffer spring set up in the limiting plate bottom with between the inner wall of dashpot bottom.
Preferably, the buffer springs are provided with multiple groups, and the multiple groups of buffer springs are uniformly arranged between the bottom of the limiting plate and the inside of the bottom of the buffer groove.
The utility model provides a pressure welding device for memory processing possesses following beneficial effect:
(1) the utility model discloses a set up drive gear, the drive shaft, the apparatus further comprises a rotating shaft, driven gear and place the platform, when the pressure welding in-process need change the pressure welding position to the memory rotation, only need through stirring drive gear, make drive gear can drive driven gear and rotate, and then make the pivot can drive the memory at place the platform top and rotate under driven gear's drive effect, thereby realize the change to memory pressure welding position, and then reduced the step that the staff needs to the change of memory pressure welding position greatly, thereby staff's work efficiency has been improved.
(2) The utility model discloses a set up the buffering subassembly, when using, the limiting plate that can drive the buffer board bottom in step when the welding part that drives the soldered connection bottom through the second cylinder contacts with the memory moves down, and then can cause compression effect to buffer spring, thereby can alleviate welding part to memory pressure under buffer spring's effect, and then avoid the memory to appear the condition of damaging at the pressure welding in-process, thereby the protection effect of device to the pressure welding in-process of memory has been improved, and then make the result of use of device better.
Drawings
Fig. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is a schematic diagram of the internal structure of the cavity of the present invention;
FIG. 3 is a schematic structural view of the cushion assembly of the present invention;
fig. 4 is a schematic view of the driven gear structure of the present invention.
In the figure: 1. a support frame; 2. a fixed mount; 3. a cavity; 4. a drive shaft; 5. a drive gear; 6. placing a platform; 7. a first cylinder; 8. a rotating shaft; 9. a driven gear; 10. a second cylinder; 11. a welding mechanism; 12. welding a head; 13. a clamping plate; 14. a buffer tank; 15. a buffer plate; 16. a limiting plate; 17. A buffer spring.
Detailed Description
The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention.
Example 1:
as shown in fig. 1-2 and fig. 4, the present invention provides a technical solution: a pressure welding device for memory processing comprises a support frame 1 and a fixing frame 2 arranged at the top of the support frame 1, wherein a cavity 3 is arranged in the support frame 1, a driving shaft 4 is arranged at one side in the cavity 3, the top and the bottom of the driving shaft 4 are connected with the inner wall of the cavity 3 through bearings, a driving gear 5 is arranged at the middle position of the driving shaft 4, one side of the driving gear 5 penetrates through the cavity 3 and is arranged on the outer wall of the support frame 1, a placing platform 6 is arranged at the middle position of the top of the support frame 1, first air cylinders 7 are arranged at two sides of the top of the placing platform 6, a buffer component is arranged at the middle position of the top of the placing platform 6, a rotating shaft 8 is arranged at the bottom of the placing platform 6, a bearing is arranged at the bottom of the rotating shaft, the upper position of the bottom of the rotating shaft 8 is provided with a driven gear 9, the driven gear 9 is meshed with the driving gear 5, one side of the top of the fixing frame 2 is provided with a second cylinder 10, one side of the second cylinder 10 is provided with a welding mechanism 11, and the bottom of the fixing frame 2 is provided with a welding head 12.
Further, the bottom of the output shaft of the second cylinder 10 is fixedly connected with a fixed transverse plate, the bottom of the fixed transverse plate is fixedly connected with the top of the welding head 12, and the second cylinder 10 is connected with the welding head 12, so that the user can adjust the welding head 12 up and down more conveniently through the second cylinder 10.
Further, the welding head 12 is connected with the welding mechanism 11 in a matching manner, and the welding head 12 is arranged on the top of the placing platform 6.
Further, an output shaft of the first cylinder 7 is fixedly connected with a clamping plate 13, the clamping plate is arranged at the top of the placing platform 6, the clamping plate 13 is in contact with the outer wall of the top of the placing platform 6, and when the device is used, a user can open the first cylinder 7 to enable the first cylinder 7 to drive the clamping plate 13 to fix a memory to be processed through the output shaft, so that the device is convenient for the user to fix the memory.
Example 2:
as shown in fig. 1 and 3, the difference from embodiment 1 is: buffer unit comprises buffer tank 14, buffer board 15, limiting plate 16 and buffer spring 17, buffer tank 14 is seted up at 6 top intermediate positions of place the platform, the opening has been seted up at the 14 tops of buffer tank, just buffer board 15 sets up at 14 top outer walls of buffer tank, limiting plate 16 sets up inside buffer tank 14, 15 bottoms of buffer board are provided with the connecting piece, buffer board 15 pass through the connecting piece with 16 top fixed connection of limiting plate, just buffer spring 17 set up in the limiting plate 16 bottom with between the 14 bottom inner walls of buffer tank.
Furthermore, buffer spring 17 is provided with the multiunit, and the multiunit buffer spring 17 is even to be set up limiting plate 16 bottom with between 14 bottoms of dashpot are inside, through setting up multiunit buffer spring 17, and then strengthened the buffering effect of device to the protection effect of device to the memory has been improved.
The working principle is as follows: when the device is used, a user can place a memory to be processed at the middle position of the top of the placing platform 6, then the first cylinder 7 is opened, so that the first cylinder 7 can drive the clamping plate 13 to fix the memory to be processed through the output shaft, after the fixing is completed, a part to be pressure-welded is fixed with the welding head 12, then the user can open the second cylinder 10, so that the pressure-welded part can be pressure-welded with the memory under the action of the welding mechanism 11 and the second cylinder 10, and when the pressure-welded position of the memory needs to be changed in the pressure-welding process, the driving gear 5 only needs to be shifted, so that the driving gear 5 can drive the driven gear 9 to rotate, and further the rotating shaft 8 can drive the memory at the top of the placing platform 6 to rotate under the driving action of the driven gear 9, thereby realizing the change of the bonding position of the accumulator, and then completing the bonding work by opening the second cylinder 10 and the bonding mechanism 11.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. The utility model provides a pressure welding device for memory processing, includes support frame (1) and sets up mount (2) at support frame (1) top, its characterized in that: the inner part of the support frame (1) is provided with a cavity (3), one side of the inner part of the cavity (3) is provided with a drive shaft (4), the top and the bottom of the drive shaft (4) are connected with the inner wall of the cavity (3) through bearings, the middle position of the drive shaft (4) is provided with a drive gear (5), one side of the drive gear (5) penetrates through the cavity (3) and is arranged on the outer wall of the support frame (1), the middle position of the top of the support frame (1) is provided with a placing platform (6), two sides of the top of the placing platform (6) are provided with first cylinders (7), the middle position of the top of the placing platform (6) is provided with a buffer component, the bottom of the placing platform (6) is provided with a rotating shaft (8), the bottom of the rotating shaft (8) penetrates through the cavity (3) and is, the automatic welding device is characterized in that a driven gear (9) is arranged on the upper portion of the bottom of the rotating shaft (8), the driven gear (9) is meshed with the driving gear (5), a second cylinder (10) is arranged on one side of the top of the fixing frame (2), a welding mechanism (11) is arranged on one side of the second cylinder (10), and a welding head (12) is arranged at the bottom of the fixing frame (2).
2. A bonding device for memory machining according to claim 1, characterized in that: the bottom of the output shaft of the second cylinder (10) is fixedly connected with a fixed transverse plate, and the bottom of the fixed transverse plate is fixedly connected with the top of the welding head (12).
3. A bonding device for memory machining according to claim 1, characterized in that: the welding head (12) is connected with the welding mechanism (11) in a matching mode, and the welding head (12) is arranged at the top of the placing platform (6).
4. A bonding device for memory machining according to claim 1, characterized in that: the output shaft of the first cylinder (7) is fixedly connected with a clamping plate (13), the clamping plate is arranged at the top of the placing platform (6), and the clamping plate (13) is in contact with the outer wall of the top of the placing platform (6).
5. A bonding device for memory machining according to claim 1, characterized in that: buffer unit comprises buffer tank (14), buffer board (15), limiting plate (16) and buffer spring (17), set up at place the platform (6) top intermediate position buffer tank (14), the opening has been seted up at buffer tank (14) top, just buffer board (15) set up at buffer tank (14) top outer wall, limiting plate (16) set up inside buffer tank (14), buffer board (15) bottom is provided with the connecting piece, buffer board (15) through the connecting piece with limiting plate (16) top fixed connection, just buffer spring (17) set up in limiting plate (16) bottom with between buffer tank (14) bottom inner wall.
6. A bonding device for memory machining according to claim 5, characterized in that: buffer spring (17) are provided with the multiunit, multiunit buffer spring (17) even setting is in limiting plate (16) bottom with between buffer groove (14) bottom is inside.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022343140.2U CN213702358U (en) | 2020-10-20 | 2020-10-20 | Pressure welding device for memory processing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022343140.2U CN213702358U (en) | 2020-10-20 | 2020-10-20 | Pressure welding device for memory processing |
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| Publication Number | Publication Date |
|---|---|
| CN213702358U true CN213702358U (en) | 2021-07-16 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022343140.2U Active CN213702358U (en) | 2020-10-20 | 2020-10-20 | Pressure welding device for memory processing |
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| CN (1) | CN213702358U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117548891A (en) * | 2024-01-12 | 2024-02-13 | 四川省宜宾威力化工有限责任公司 | Based on electron detonator processing welding set |
-
2020
- 2020-10-20 CN CN202022343140.2U patent/CN213702358U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117548891A (en) * | 2024-01-12 | 2024-02-13 | 四川省宜宾威力化工有限责任公司 | Based on electron detonator processing welding set |
| CN117548891B (en) * | 2024-01-12 | 2024-03-22 | 四川省宜宾威力化工有限责任公司 | Based on electron detonator processing welding set |
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