CN213694724U - Driving IC chip of display screen and electronic equipment - Google Patents
Driving IC chip of display screen and electronic equipment Download PDFInfo
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- CN213694724U CN213694724U CN202022378995.9U CN202022378995U CN213694724U CN 213694724 U CN213694724 U CN 213694724U CN 202022378995 U CN202022378995 U CN 202022378995U CN 213694724 U CN213694724 U CN 213694724U
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Abstract
The application discloses drive IC chip and electronic equipment of display screen belongs to the integrated circuit field. Wherein, the drive IC chip is provided with the filtering module, and the filtering module includes: the first resistor is arranged on a power line of the drive IC chip or a ground line of the drive IC chip; and the cathode of the first integrated diode is connected with a power supply line, and the anode of the first integrated diode is connected with a grounding line. The driver IC chip provided by the embodiment of the application can solve the problem that the efficiency of filtering interference noise generated by a clock module of the driver IC chip is low due to the mode that the filter circuit is arranged on the FPC connected with the driver IC chip.
Description
Technical Field
The application belongs to the field of integrated circuits, and particularly relates to a driving IC chip of a display screen and electronic equipment.
Background
At present, electronic devices with display screens are widely used, such as mobile phones, tablet computers and the like. And the display screen of the electronic equipment is driven by the driving IC chip.
As shown in fig. 1, the driver IC chip includes a clock module (shown as a push-pull circuit in the clock module), and the clock module usually generates a large amount of interference noise. The interference noise generated by the clock module is transmitted to a Flexible Circuit board (FPC) through a power line and a ground line of the driver IC chip, and then is radiatively coupled to the antenna through the FPC. When interference noise radiation is coupled to the antenna, the antenna will be subject to electromagnetic interference, which seriously affects the performance of the electronic device.
Currently, in order to reduce interference noise radiated and coupled to an antenna, a filter circuit is generally provided on an FPC as shown in fig. 1. However, due to the structural space limitation, the filter circuit disposed on the FPC is far from the driver IC chip. This results in interference noise on the traces between the driver IC chip to the filter circuit not being filtered out and still being radiation-coupled to the antenna. As shown in fig. 2, especially the bending region of the FPC is free from reference, the radiation coupling efficiency is higher. That is, the conventional method of providing a filter circuit on the FPC has low filter efficiency.
Although other conventional IC chips are provided with a ceramic filter capacitor to filter out interference noise, the IC chips are not suitable for a driving IC chip of a display panel. This is because the driver IC chip of the display panel is packaged with glass, and the height is limited, and the ceramic filter capacitor cannot be disposed in the driver IC chip of the display panel.
Disclosure of Invention
The embodiment of the application aims to provide a driver IC chip of a display screen, which can solve the problem of low filtering efficiency of interference noise generated by a clock module of the driver IC chip in a mode of arranging a filter circuit on an FPC (flexible printed circuit) connected with the driver IC chip.
In order to solve the technical problem, the present application is implemented as follows:
in a first aspect, an embodiment of the present application provides a driver IC chip of a display screen, the driver IC chip is provided with a filtering module, the filtering module includes:
the first resistor is arranged on a power line of the driving IC chip or a ground line of the driving IC chip;
a first integrated diode having a cathode connected to the power line and an anode connected to the ground line.
In a second aspect, an embodiment of the present application provides an electronic device, including a display screen, where the display screen is driven by the driving IC chip as described in the first aspect.
In the embodiment of the present application, a filter circuit is disposed in the driver IC chip, and the filter circuit includes a first integrated diode. The junction capacitance of the first integrated diode is large, and the unit capacitance occupies a small area, so that the first integrated diode can be integrated in a driving IC chip. The cathode of the first integrated diode is connected to a power supply line and the anode of the first integrated diode is connected to a ground line, so that a reverse voltage is applied to the first integrated diode and the first integrated diode constitutes a capacitive device. Therefore, the first integrated diode can reflect and filter noise generated by the clock module in the driving IC chip. The filter circuit also includes a first resistor. The first resistor is easy to integrate, occupies a small area, and can be integrated in a driving IC chip. The first resistor is arranged on the power supply line or the grounding line, so that the first resistor can convert interference noise on the power supply line or the grounding line into heat dissipation. Therefore, the multi-stage filter circuit formed by the first resistor and the first integrated diode can efficiently filter the interference noise generated by the clock module. Meanwhile, the filtering module is arranged inside the drive IC chip, so that interference noise on the FPC wiring connected with the drive IC chip is filtered. In this way, the efficiency of filtering the interference noise is further improved.
Drawings
FIG. 1 is a schematic diagram of a connection structure between a driver IC chip and an FPC in the conventional art;
FIG. 2 is a schematic diagram of a conventional electronic device including a display screen;
fig. 3 is a schematic view of a connection structure between a driver IC chip and an FPC according to an embodiment of the present application;
fig. 4 is a first schematic structural diagram of a filtering module according to an embodiment of the present application;
fig. 5 is a schematic structural diagram of a filtering module according to an embodiment of the present application;
fig. 6 is a schematic structural diagram three of a filtering module provided in this application according to an embodiment of the present application;
fig. 7 is a schematic structural diagram of a filtering module according to an embodiment of the present application;
fig. 8 is a top view of a filtering module according to an embodiment of the present disclosure.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some, but not all, embodiments of the present application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
The terms first, second and the like in the description and in the claims of the present application are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It will be appreciated that the data so used may be interchanged under appropriate circumstances such that embodiments of the application may be practiced in sequences other than those illustrated or described herein, and that the terms "first," "second," and the like are generally used herein in a generic sense and do not limit the number of terms, e.g., the first term can be one or more than one. In addition, "and/or" in the specification and claims means at least one of connected objects, a character "/" generally means that a preceding and succeeding related objects are in an "or" relationship.
The driving IC chip of the display screen provided in the embodiment of the present application is described in detail below with reference to the accompanying drawings through specific embodiments and application scenarios thereof.
The first embodiment is as follows:
the embodiment of the present application provides a driving IC chip of a display screen, and as shown in fig. 3, the driving IC chip is provided with a filtering module 30. As shown in fig. 4, the filtering module 30 includes: a first resistor 31 and a first integrated diode 32.
The first resistor 31 is disposed on the power line 12 of the driver chip or on the ground line 11 of the driver IC chip. The cathode of the first integrated diode 32 is connected to the power supply line 12, and the anode of the first integrated diode 32 is connected to the ground line 11.
In the embodiment of the present application, the power line 12 of the driver IC chip refers to a trace between a power supply terminal inside the driver IC chip and a power supply pin of the driver IC. The ground line 11 of the driver IC chip refers to a trace between a ground terminal inside the driver IC chip and a ground pin of the driver IC.
In the embodiment of the present application, the first integrated diode 32 has the characteristics of easy integration and large junction capacitance. Typically, the unit capacitance of the first integrated diode 32 is pf/um2A rank.
In the embodiment of the present application, the first resistor 31 has the characteristics of easy integration, small occupied area, and easy control of the resistance value. In one example, the first resistor 31 is a polysilicon resistor. For example, the resistance of the polysilicon resistor can be set between 5-10 ohm.
In the embodiment of the present application, the position relationship between the first resistor 31 and the first integrated diode 32 in the filtering module 30 may be various.
Specifically, the first positional relationship may be: as shown in fig. 4, the first resistor 31 is provided on the power supply line 12; the anode of the first integrated diode 32 is connected to the ground line 11, the cathode of the first integrated diode 32 is connected to the power line 12, and the first integrated diode 32 is disposed away from the power pin of the driver IC chip.
The second positional relationship may be: the first resistor 31 is provided on the power supply line 12; the anode of the first integrated diode 32 is connected to the ground line 11, the cathode of the first integrated diode 32 is connected to the power line 12, and the first integrated diode 32 is disposed near the power pin of the driver IC chip.
The third positional relationship may be: the first resistor 31 is provided on the ground line 11; the anode of the first integrated diode 32 is connected to the ground line 11, the cathode of the first integrated diode 32 is connected to the power line 12, and the first integrated diode 32 is disposed away from the power pin of the driver IC chip.
The fourth positional relationship may be: the first resistor 31 is provided on the ground line 11; the anode of the first integrated diode 32 is connected to the ground line 11, the cathode of the first integrated diode 32 is connected to the power line 12, and the first integrated diode 32 is disposed near the power pin of the driver IC chip.
In the embodiment of the present application, a filter circuit is disposed in the driver IC chip, and the filter circuit includes a first integrated diode. The junction capacitance of the first integrated diode is large, and the unit capacitance occupies a small area, so that the first integrated diode can be integrated in a driving IC chip. The cathode of the first integrated diode is connected to a power supply line and the anode of the first integrated diode is connected to a ground line, so that a reverse voltage is applied to the first integrated diode and the first integrated diode constitutes a capacitive device. Therefore, the first integrated diode can reflect and filter noise generated by the clock module in the driving IC chip. The filter circuit also includes a first resistor. The first resistor is easy to integrate, occupies a small area, and can be integrated in a driving IC chip. The first resistor is arranged on the power supply line or the grounding line, so that the first resistor can convert interference noise on the power supply line or the grounding line into heat dissipation. Therefore, the multi-stage filter circuit formed by the first resistor and the first integrated diode can efficiently filter the interference noise generated by the clock module. Meanwhile, the filtering module is arranged inside the drive IC chip, so that interference noise on the FPC wiring connected with the drive IC chip is filtered. In this way, the efficiency of filtering the interference noise is further improved.
Example two:
on the basis of the first embodiment, the filter module 30 included in the driving IC chip provided in the embodiment of the present application further includes a second resistor 33. The second resistor 33 and the first resistor 33 are provided separately on the power supply line and the ground line.
In the embodiment of the present application, the second resistor 33 has the characteristics of easy integration, small occupied area and easy control of the resistance value. In one example, the second resistor 33 is a polysilicon resistor. For example, the resistance of the polysilicon resistor can be set between 5-10 ohm.
In the present embodiment, in the case where the first resistor 31 is provided on the power supply line 12 of the driver IC chip, the second resistor 33 is provided on the ground line 11 of the driver IC chip. In the case where the first resistor 31 is provided on the ground line 11 of the driver IC chip, the second resistor 33 is provided on the power supply line 12 of the driver IC chip.
Based on the embodiment of the present application, the first resistor 31 and the second resistor 33 may be disposed on the same side of the first integrated diode 32. Of course, as also shown in fig. 5, the first resistor 31 and the second resistor 33 may be arranged on different sides of the first integrated diode 32.
In this embodiment, the filtering module further includes a second resistor on the basis of including the first resistor and the first integrated diode. The second resistor is easy to integrate, occupies small area and can be integrated in a driving IC chip. The first resistor and the second resistor are respectively arranged on the power supply line and the grounding line. Thus, the interference noise on the power line and the grounding line can be converted into heat dissipation at the same time. This is based on the first embodiment, and can further perform efficient filtering on the interference noise generated by the clock module.
Example three:
on the basis of the above embodiments, as shown in fig. 6, the filter module 30 in the driver IC chip provided in the embodiment of the present application further includes a second integrated diode 34. The cathode of the second integrated diode 34 is connected to the power line 12, the anode of the second integrated diode 34 is connected to the ground line 11, the second integrated diode 34 is connected to the first end of the first resistor 31, and the first integrated diode 32 is connected to the second end of the first resistor 31.
In the embodiment of the present application, the second integrated diode 34 and the first integrated diode 32 are disposed at both sides of the first resistor 31. The second integrated diode 34 is easy to integrate and has a large junction capacitance. Typically, the unit capacitance of the second integrated diode 34 is pf/um2A rank.
In the embodiment of the application, on the basis that the filter module of the driving IC chip comprises the first resistor and the first integrated diode, the second integrated diode is further included. The junction capacitance of the second integrated diode is large, and the unit capacitance occupies a small area, so that the second integrated diode can be integrated in a driving IC chip. The cathode of the second integrated diode is connected to the power supply line and the anode of the second integrated diode is connected to the ground line, so that a reverse voltage is applied to the second integrated diode and the second integrated diode constitutes a capacitive device. Therefore, the second integrated diode can filter out the interference noise in one step. Meanwhile, the first integrated diode and the second integrated diode have a condition of generating resonance, which results in poor filtering effect of interference noise in some frequency bands. In the embodiment, the first resistor is arranged between the first integrated diode and the second integrated diode, so that the first resistor converts the interference noise into heat to be dissipated, and the problem of poor filtering effect caused by resonance can be avoided.
In one embodiment, as shown in fig. 6, the junction area of the first integrated diode 32 is different than the junction area of the second integrated diode 34.
In the embodiment of the present application, the junction area of the first integrated diode is different from the junction area of the second integrated diode, so that the first integrated diode and the second integrated diode can respectively perform reflection filtering on interference noise in different frequency bands. In this way, the effect of filtering out interference noise can be enhanced.
In one embodiment, of the first and second integrated diodes 32 and 34, the junction area of the integrated diode far from the power supply pin of the driver IC chip to which the power supply line is connected is small, and the junction area of the integrated diode near the power supply pin is large.
In the embodiment of the application, the junction area of the integrated diode is small, and the frequency corresponding to the frequency band of the filtered interference noise is high. And for high-frequency interference noise, the filtering efficiency is higher when the integrated diode is closer to the interference noise source. Therefore, the junction area of the integrated diode arranged far away from the power supply pin of the drive IC chip is small, and the junction area of the integrated diode close to the power supply pin is large, so that the filtering efficiency of interference noise can be improved.
Example four:
on the basis of the third embodiment, as shown in fig. 7, the filter module 30 in the driver IC chip provided in the embodiment of the present application further includes a third resistor 35.
In the case where the first resistor 31 is provided on the power supply line 12, the third resistor 35 is provided on the ground line 11, and the third resistor 35 is connected between the anode of the first integrated diode 32 and the anode of the second integrated diode 34.
In the case where the first resistor 31 is provided on the ground line 11, the third resistor 35 is provided on the power supply line 12, and the third resistor 35 is connected between the cathode of the first integrated diode 32 and the cathode of the second integrated diode 34.
In the embodiment of the present application, the third resistor 35 has the characteristics of easy integration, small occupied area, and easy control of the resistance value. In one example, the third resistor 35 is a polysilicon resistor. For example, the resistance of the polysilicon resistor can be set between 5-10 ohm.
In the embodiment of the application, the filter module of the driver IC chip further includes a third resistor on the basis of including the first resistor, the first integrated diode and the second integrated diode. The third resistor is easy to integrate and occupies small area, so that the third resistor can be integrated in a driving IC chip. The first resistor, the third resistor, the first integrated diode and the second integrated diode form a square shape. In this way, both the first integrated diode and the second integrated diode may reflectively filter the interference noise. And the first resistor and the second resistor can simultaneously convert interference noise on the power supply line and the grounding line, interference noise reaching the first resistor and the second resistor due to reflection of the first integrated diode or the second integrated diode, and heat dissipation. This greatly improves the filtering efficiency of the interference noise. Meanwhile, the first integrated diode and the second integrated diode have a condition of generating resonance, which results in poor filtering effect of interference noise in some frequency bands. In the embodiment, the first resistor and the third resistor are arranged between the first integrated diode and the second integrated diode, so that the first resistor and the third resistor convert interference noise into heat for dissipation, and the problem of poor filtering effect caused by resonance can be avoided.
In one embodiment, the junction area of the first integrated diode 32 is different than the junction area of the second integrated diode 34.
In the embodiment of the present application, the junction area of the first integrated diode is different from the junction area of the second integrated diode, so that the first integrated diode and the second integrated diode can respectively perform reflection filtering on interference noise in different frequency bands. In this way, the effect of filtering out interference noise can be enhanced.
In one embodiment, of the first and second integrated diodes 32 and 34, the junction area of the integrated diode far from the power supply pin of the driver IC chip to which the power supply line is connected is small, and the junction area of the integrated diode near the power supply pin is large.
In the embodiment of the application, the junction area of the integrated diode is small, and the frequency corresponding to the frequency band of the filtered interference noise is high. And for high-frequency interference noise, the filtering efficiency is higher when the integrated diode is closer to the interference noise source. Therefore, the junction area of the integrated diode arranged far away from the power supply pin of the drive IC chip is small, and the junction area of the integrated diode close to the power supply pin is large, so that the filtering efficiency of interference noise can be improved.
Example five:
on the basis of any of the above embodiments, the driver IC chip further includes a metal shielding case, and the filter module 30 is disposed in the metal shielding case, and the metal shielding case is connected to the ground line.
In the embodiment of the present application, the metal shielding case is usually made of copper.
In the embodiment of the application, the filtering module is arranged in the metal shielding shell, so that interference noise generated by the filtering module can be avoided, and radiation coupling to the antenna is realized.
It should be noted that, due to the design problem of the driving IC chip, the metal shielding case is embodied in the form of: and metal shielding layers are arranged at the upper position and the lower position of the filtering module. The two metal shielding layers are perforated at the periphery and connected through holes by using a connecting medium. The connecting medium may be made of copper. Based on this, in one example, a top view of the filtering module 30 may be as shown in fig. 8. Fig. 8 illustrates an example in which the filter module includes a first resistor 31, a third resistor 35, a first integrated diode 32, and a second integrated diode 34.
Example six:
the embodiment of the application provides electronic equipment. The electronic device comprises a display screen, and the display screen is driven by the driving IC chip provided by any one of the embodiments.
In this embodiment, the electronic device may be a mobile phone, a tablet computer, a vehicle-mounted electronic device, a wearable device, or the like.
In one embodiment, the display screen may be an active matrix organic light emitting diode display screen, i.e., an AMOLED. Alternatively, the display screen can also be a thin film transistor liquid crystal display screen, namely a TFT liquid crystal display screen.
Of course, the display screen may be other similar ICs using a glass packaging process.
While the present embodiments have been described with reference to the accompanying drawings, it is to be understood that the invention is not limited to the precise embodiments described above, which are meant to be illustrative and not restrictive, and that various changes may be made therein by those skilled in the art without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (10)
1. The utility model provides a drive IC chip of display screen which characterized in that, drive IC chip is provided with filtering module, filtering module includes:
the first resistor is arranged on a power line of the driving IC chip or a ground line of the driving IC chip;
a first integrated diode having a cathode connected to the power line and an anode connected to the ground line.
2. The driver IC chip of claim 1, wherein the filter module further comprises:
and the second resistor and the first resistor are respectively arranged on the power line and the grounding line.
3. The driver IC chip of claim 1, wherein the filter module further comprises:
the cathode of the second integrated diode is connected with the power line, the anode of the second integrated diode is connected with the grounding line, the second integrated diode is connected with the first end of the first resistor, and the first integrated diode is connected with the second end of the first resistor.
4. The driver IC chip of claim 3, wherein the filter module further comprises a third resistor,
the third resistor is disposed on the ground line in a case where the first resistor is disposed on the power supply line, and the third resistor is connected between an anode of the first integrated diode and an anode of the second integrated diode;
in a case where the first resistor is provided on the ground line, the third resistor is provided on the power supply line, and the third resistor is connected between a cathode of the first integrated diode and a cathode of the second integrated diode.
5. The driver IC chip of claim 3 or 4, wherein a junction area of the first integrated diode is different from a junction area of the second integrated diode.
6. The driver IC chip according to claim 5, wherein, of the first and second integrated diodes, a junction area of the integrated diode distant from a power supply pin of the driver IC chip to which the power supply line is connected is small, and a junction area of the integrated diode close to the power supply pin is large.
7. The driver IC chip of claim 4, wherein at least one of the first resistor and the third resistor is a polysilicon resistor.
8. The driver IC chip according to claim 1, further comprising a metal shield case, wherein the filter module is disposed in the metal shield case, and the metal shield case is connected to the ground line.
9. An electronic device characterized by comprising a display panel driven by the driver IC chip according to any one of claims 1 to 8.
10. The electronic device of claim 9, wherein the display is an active matrix organic light emitting diode display or the display is a thin film transistor liquid crystal display.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022378995.9U CN213694724U (en) | 2020-10-22 | 2020-10-22 | Driving IC chip of display screen and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022378995.9U CN213694724U (en) | 2020-10-22 | 2020-10-22 | Driving IC chip of display screen and electronic equipment |
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| Publication Number | Publication Date |
|---|---|
| CN213694724U true CN213694724U (en) | 2021-07-13 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022378995.9U Active CN213694724U (en) | 2020-10-22 | 2020-10-22 | Driving IC chip of display screen and electronic equipment |
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| CN (1) | CN213694724U (en) |
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- 2020-10-22 CN CN202022378995.9U patent/CN213694724U/en active Active
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