CN213677482U - Automation equipment for semiconductor packaging - Google Patents
Automation equipment for semiconductor packaging Download PDFInfo
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- CN213677482U CN213677482U CN202022755509.0U CN202022755509U CN213677482U CN 213677482 U CN213677482 U CN 213677482U CN 202022755509 U CN202022755509 U CN 202022755509U CN 213677482 U CN213677482 U CN 213677482U
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 28
- 238000004806 packaging method and process Methods 0.000 title claims description 14
- 238000010030 laminating Methods 0.000 claims abstract description 7
- 238000007789 sealing Methods 0.000 claims description 20
- 239000000428 dust Substances 0.000 claims description 11
- 238000001179 sorption measurement Methods 0.000 claims description 5
- 238000003466 welding Methods 0.000 claims description 3
- 239000002390 adhesive tape Substances 0.000 claims 1
- 238000003825 pressing Methods 0.000 description 4
- 238000009434 installation Methods 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000000605 extraction Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000010248 power generation Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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Abstract
The utility model discloses an automation equipment for semiconductor package, including box and positioning mechanism, the inboard laminating of box has joint strip, and the inboard of box has all seted up the standing groove, positioning mechanism all installs the lateral wall at the standing groove, vacuum mechanism is installed to the inboard below of box, and the lateral wall of box all welds there is adjustment mechanism, the outside top of box is connected with heat-seal mechanism, and heat-seal mechanism's outside rear installs control panel, control panel's outside the place ahead is installed the display screen, and installs control button below the outside of display screen. This automation equipment for semiconductor package through setting up a plurality of standing grooves, can encapsulate a plurality of products simultaneously to the work efficiency of the device has been improved, the usability of the device has also been improved simultaneously.
Description
Technical Field
The utility model relates to a semiconductor correlation technique field specifically is an automation equipment for semiconductor package.
Background
The semiconductor is applied to the fields of integrated circuits, consumer electronics, communication systems, photovoltaic power generation, illumination, high-power conversion and the like, for example, a diode is a device manufactured by adopting the semiconductor, so that the semiconductor needs to be packaged in the production process of the semiconductor, and therefore, an automatic device for packaging the semiconductor is needed.
However, the currently used automation equipment for semiconductor packaging does not have a dustproof function and has poor working efficiency, so that when the device is used, dust and small objects such as the inner side of the vacuum pump are easy to generate due to the fact that the device does not have the dustproof function, and the vacuum pump is broken or damaged.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide an automation equipment for semiconductor package to solve the automation equipment for semiconductor package of the present use that proposes in the above-mentioned background art, do not possess dustproof function and work efficiency not good, make us when using the device, because of do not possess dustproof function, lead to dust and little object to carry out like the inboard of vacuum pump easily, lead to the problem that the vacuum pump breaks down or damages.
In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides an automation equipment for semiconductor package, includes box and positioning mechanism, the inboard laminating of box has joint strip, and the inboard of box has all seted up the standing groove, positioning mechanism all installs the lateral wall at the standing groove, vacuum mechanism is installed to the inboard below of box, and the lateral wall of box all welds there is adjustment mechanism, the outside top of box is connected with heat-seal mechanism, and heat-seal mechanism's outside rear installs control panel, the display screen is installed in control panel's outside the place ahead, and installs control button in the outside below of display screen.
Preferably, the inner side of the box body is tightly attached to the outer side of the sealing rubber strip, and the width of the inner side of the box body is the same as the width of the outer side of the sealing rubber strip.
Preferably, the placing grooves are distributed on the inner side of the box body at equal intervals, and the shape and the size of the placing grooves are the same.
Preferably, positioning mechanism includes fixed sleeve, connecting axle, movable sleeve, clamp plate and adsorption magnet, fixed sleeve has all been welded to positioning mechanism's inside wall, and fixed sleeve's inboard installs the connecting axle, the outside of connecting axle is connected with movable sleeve, and movable sleeve's lateral wall welding has the clamp plate, the lower surface laminating of clamp plate has adsorption magnet.
Preferably, the vacuum mechanism includes vacuum pump, connecting pipe and dust screen, the vacuum pump is all installed to the inboard of vacuum mechanism, and the one end riveting of vacuum pump has the connecting pipe, the dust screen is installed on the inboard top of connecting pipe.
Preferably, adjustment mechanism includes electric telescopic handle, connecting block, pivot, sliding block and spout, adjustment mechanism's outside top threaded connection has electric telescopic handle, and electric telescopic handle's outside top installs the connecting block, and the connecting block is connected with the pivot simultaneously, the outside one end of pivot is connected with the sliding block, the lateral wall at heat-seal mechanism is all seted up to the spout.
Preferably, the heat sealing mechanism comprises a mounting frame, a connecting groove, a mounting block and a heat sealing strip, the mounting frame is welded on the heat sealing mechanism, the connecting groove is formed in the inner side wall of the mounting frame, the mounting block is connected to the inner side of the connecting groove, and one end of the outer side of the mounting block is connected with the heat sealing strip.
Compared with the prior art, the beneficial effects of the utility model are that:
1. according to the automatic equipment for packaging the semiconductor, a plurality of products can be packaged at the same time by arranging the plurality of placing grooves, so that the working efficiency of the device is improved, and the usability of the device is improved;
2. according to the automatic equipment for packaging the semiconductor, through the vacuum mechanism, air inside the box body can be pumped to a vacuum state through the vacuum pump for heat sealing, so that the heat sealing can be realized while the vacuum state is maintained, dust is prevented from entering the vacuum pump while the vacuum state is pumped, and the usability of the device is improved;
3. this automation equipment for semiconductor package through positioning mechanism, can fix the product of placing at the standing groove inboard, avoided when the vacuum, thereby the product takes place the skew and leads to the heat-seal position not right, need carry out secondary vacuum heat-seal, has improved the device's usability.
Drawings
FIG. 1 is a schematic front view of the present invention;
FIG. 2 is a schematic diagram of a control panel structure of the present invention;
FIG. 3 is a schematic view of the vacuum mechanism of the present invention;
fig. 4 is a schematic structural diagram of the positioning mechanism of the present invention.
In the figure: 1. a box body; 2. sealing rubber strips; 3. a placement groove; 4. a positioning mechanism; 401. fixing the sleeve; 402. a connecting shaft; 403. an active cannula; 404. pressing a plate; 405. adsorbing a magnet; 5. a vacuum mechanism; 501. a vacuum pump; 502. a connecting pipe; 503. a dust screen; 6. an adjustment mechanism; 601. an electric telescopic rod; 602. connecting blocks; 603. a rotating shaft; 604. a slider; 605. a chute; 7. a heat sealing mechanism; 701. a mounting frame; 702. connecting grooves; 703. mounting blocks; 704. heat sealing the strips; 8. a control panel; 9. a display screen; 10. and a control button.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-4, the present invention provides a technical solution: the utility model provides an automation equipment for semiconductor package, including box 1 and positioning mechanism 4, the inboard laminating of box 1 has joint strip 2, and standing groove 3 has all been seted up to the inboard of box 1, positioning mechanism 4 all installs the lateral wall at standing groove 3, vacuum mechanism 5 is installed to the inboard below of box 1, and the lateral wall of box 1 all welds has adjustment mechanism 6, the outside top of box 1 is connected with heat-seal mechanism 7, and control panel 8 is installed at the outside rear of heat-seal mechanism 7, display screen 9 is installed in control panel 8's outside the place ahead, and control button 10 is installed to the outside below of display screen 9.
Further, the inboard of box 1 closely laminates with joint strip 2's the outside, and the inboard width of box 1 is the same with joint strip 2's outside width, through setting up joint strip 2 at the box 1 inboard, can avoid appearing the condition emergence of gas leakage to the in-process of heat-seal, leads to unable normal vacuum.
Further, the placing grooves 3 are distributed at equal intervals on the inner side of the box body 1, the placing grooves 3 are identical in shape and size, and a plurality of products can be packaged simultaneously by arranging the placing grooves 3, so that the working efficiency of the device is improved, and the usability of the device is improved.
Further, positioning mechanism 4 includes fixed sleeve 401, connecting axle 402, movable sleeve 403, clamp plate 404 and absorption magnet 405, fixed sleeve 401 has all been welded to positioning mechanism 4's inside wall, and fixed sleeve 401's inboard connecting axle 402 of installing, the outside of connecting axle 402 is connected with movable sleeve 403, and movable sleeve 403's outside wall welding has clamp plate 404, clamp plate 404's lower surface laminating has absorption magnet 405, through positioning mechanism 4, can fix the product of placing in standing groove 3 inboard, avoided when the vacuum, thereby the product takes place the skew and leads to the heat-seal position not right, need carry out secondary vacuum heat-seal, the usability of the device has been improved.
Further, vacuum mechanism 5 includes vacuum pump 501, connecting pipe 502 and dust screen 503, vacuum pump 501 is all installed to the inboard of vacuum mechanism 5, and one end riveting of vacuum pump 501 has connecting pipe 502, dust screen 503 is installed on the inboard top of connecting pipe 502, through vacuum mechanism 5, can extract the air of box 1 inboard to the vacuum state through vacuum pump 501 and carry out the heat-seal, realized also can carrying out the heat-seal in the vacuum, avoided the dust to get into the inside of vacuum pump 501 in the vacuum of extraction, thereby the usability of the device has been improved.
Further, adjustment mechanism 6 includes electric telescopic handle 601, connecting block 602, pivot 603, sliding block 604 and spout 605, there is electric telescopic handle 601 outside top threaded connection of adjustment mechanism 6, and connecting block 602 is installed on electric telescopic handle 601's outside top, connecting block 602 is connected with pivot 603 simultaneously, the outside one end of pivot 603 is connected with sliding block 604, spout 605 is all seted up at the lateral wall of heat-seal mechanism 7, electric telescopic handle 601 through 6 outside tops of adjustment mechanism drives connecting block 602, pivot 603, sliding block 604 and heat-seal mechanism 7 carry out the closure with box 1, thereby realize automatic heat-seal.
Further, heat-sealing mechanism 7 includes mounting bracket 701, spread groove 702, installation piece 703 and heat-seal strip 704, and mounting bracket 701 has all been welded to heat-sealing mechanism 7, and spread groove 702 has all been seted up to the inside wall of mounting bracket 701, and spread groove 702's inboard is connected with installation piece 703, and the outside one end of installation piece 703 is connected with heat-seal strip 704, through setting up a plurality of heat-seal strips 704, can carry out the heat-seal to a plurality of products simultaneously, also be convenient for simultaneously install and dismantle heat-seal strip 704.
The working principle is as follows: for the automatic equipment for packaging the semiconductor, firstly, the device is moved to a known position, then a product to be heat-sealed is placed in the inner side of the placing groove 3, then the pressing plate 404 is rotated to the inner side of the placing groove 3 through the fixing sleeve 401, the connecting shaft 402 and the movable sleeve 403 on the inner side of the positioning mechanism 4, then the pressing plate 404 is adsorbed on the inner side of the placing groove 3 through the adsorption magnet 405 on the lower surface of the pressing plate 404, then an external power supply is switched on, the switch of the electric telescopic rod 601 is turned on, at the moment, the electric telescopic rod 601 starts to operate, the connecting block 602, the rotating shaft 603, the sliding block 604 and the heat-sealing mechanism 7 are driven to be closed with the box body 1 through the electric telescopic rod 601, finally, the switch of the vacuum pump 501 starts to operate, then the vacuum pump 501 performs air extraction on the product in the box body 1, the automatic equipment for packaging the semiconductor is used, wherein the model of the electric telescopic rod 601 is XYDHA24-800, and the model of the vacuum pump 501 is FY-1H.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (7)
1. The utility model provides an automation equipment for semiconductor package, includes box (1) and positioning mechanism (4), its characterized in that: the utility model discloses a box, including box (1), locating mechanism (4), vacuum mechanism (5), control panel (8), display screen (9) are installed in the outside place ahead of control panel (8), and control button (10) are installed to the outside below of display screen (9), and the inboard laminating of box (1) has sealed adhesive tape (2), and standing groove (3) have all been seted up to the inboard of box (1), the lateral wall in standing groove (3) is all installed in locating mechanism (4), vacuum mechanism (5) are installed to the inboard below of box (1), and the lateral wall of box (1) all welds adjustment mechanism (6), the outside top of box (1) is connected with heat-seal mechanism (7), and installs control panel (8) in the outside rear of heat-seal mechanism (.
2. The automated apparatus for semiconductor packaging according to claim 1, wherein: the inner side of the box body (1) is tightly attached to the outer side of the sealing rubber strip (2), and the width of the inner side of the box body (1) is the same as that of the outer side of the sealing rubber strip (2).
3. The automated apparatus for semiconductor packaging according to claim 1, wherein: the placing grooves (3) are distributed on the inner side of the box body (1) at equal intervals, and the shape and the size of the placing grooves (3) are the same.
4. The automated apparatus for semiconductor packaging according to claim 1, wherein: positioning mechanism (4) are including fixed sleeve (401), connecting axle (402), movable sleeve (403), clamp plate (404) and adsorption magnet (405), fixed sleeve (401) have all been welded to the inside wall of positioning mechanism (4), and the inboard of fixed sleeve (401) installs connecting axle (402), the outside of connecting axle (402) is connected with movable sleeve (403), and the lateral wall welding of movable sleeve (403) has clamp plate (404), the lower surface laminating of clamp plate (404) has adsorption magnet (405).
5. The automated apparatus for semiconductor packaging according to claim 1, wherein: vacuum mechanism (5) include vacuum pump (501), connecting pipe (502) and dust screen (503), vacuum pump (501) are all installed to the inboard of vacuum mechanism (5), and the one end riveting of vacuum pump (501) has connecting pipe (502), dust screen (503) are installed on the inboard top of connecting pipe (502).
6. The automated apparatus for semiconductor packaging according to claim 1, wherein: adjustment mechanism (6) include electric telescopic handle (601), connecting block (602), pivot (603), sliding block (604) and spout (605), the outside top threaded connection of adjustment mechanism (6) has electric telescopic handle (601), and the outside top of electric telescopic handle (601) installs connecting block (602), and connecting block (602) are connected with pivot (603) simultaneously, the outside one end of pivot (603) is connected with sliding block (604), spout (605) are all seted up at the lateral wall of heat-seal mechanism (7).
7. The automated apparatus for semiconductor packaging according to claim 1, wherein: the heat sealing mechanism (7) comprises a mounting frame (701), connecting grooves (702), mounting blocks (703) and heat sealing strips (704), the mounting frame (701) is welded on the heat sealing mechanism (7), the connecting grooves (702) are formed in the inner side wall of the mounting frame (701), the mounting blocks (703) are connected to the inner sides of the connecting grooves (702), and the heat sealing strips (704) are connected to one end of the outer side of the mounting blocks (703).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022755509.0U CN213677482U (en) | 2020-11-25 | 2020-11-25 | Automation equipment for semiconductor packaging |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022755509.0U CN213677482U (en) | 2020-11-25 | 2020-11-25 | Automation equipment for semiconductor packaging |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213677482U true CN213677482U (en) | 2021-07-13 |
Family
ID=76735668
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022755509.0U Active CN213677482U (en) | 2020-11-25 | 2020-11-25 | Automation equipment for semiconductor packaging |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213677482U (en) |
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2020
- 2020-11-25 CN CN202022755509.0U patent/CN213677482U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address |
Address after: 3rd Floor, Building 2, 1377 Jiangyue Road, Minhang District, Shanghai, 201303 Patentee after: Shanghai Sulong Information Technology Co.,Ltd. Country or region after: China Address before: 201303 building C, No.888, Huanhu West 2nd Road, Nanhui new town, Pudong New Area, Shanghai Patentee before: Shanghai Sulong Semiconductor Technology Co.,Ltd. Country or region before: China |
|
| CP03 | Change of name, title or address |