CN213664074U - Temperature control structure for luggage - Google Patents

Temperature control structure for luggage Download PDF

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Publication number
CN213664074U
CN213664074U CN202021201838.4U CN202021201838U CN213664074U CN 213664074 U CN213664074 U CN 213664074U CN 202021201838 U CN202021201838 U CN 202021201838U CN 213664074 U CN213664074 U CN 213664074U
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CN
China
Prior art keywords
heat
layer
heat dissipation
fabric layer
temperature control
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Expired - Fee Related
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CN202021201838.4U
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Chinese (zh)
Inventor
林诗琴
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Guangzhou Qinhong Leather Co ltd
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Guangzhou Qinhong Leather Co ltd
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Priority to CN202021201838.4U priority Critical patent/CN213664074U/en
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Expired - Fee Related legal-status Critical Current
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Abstract

The utility model discloses a temperature control structure for luggage, which comprises a fixed main body and a plurality of semiconductor refrigeration sheets positioned on the fixed main body; the fixing main body is provided with a heat-conducting reflecting layer, a heat-insulating filling layer and a fabric layer, the heat-insulating filling layer is positioned between the heat-conducting reflecting layer and the fabric layer, and the semiconductor refrigerating sheet is embedded on the heat-conducting reflecting layer and the heat-insulating filling layer; the semiconductor refrigeration piece is provided with a heat dissipation part and a heat conduction part, the heat dissipation part is positioned at the bottom of the semiconductor refrigeration piece, the heat dissipation part is continuously attached to the fabric layer in an expanding manner through the heat conduction part, and the heat conduction part and the fabric layer are overlapped to form a continuous flexible large-area heat dissipation surface. The utility model discloses a control by temperature change structural design scientific and reasonable for case and bag has following advantage: the heat dissipation is expanded to the whole surface material layer, the heat dissipation area is greatly increased, and the refrigerating and heating effects are better. The semiconductor refrigerating sheet can refrigerate and heat in multiple directions, thereby avoiding blind areas and only refrigerating and heating locally. Simple structure, convenient use and is suitable for suitcases of various different types.

Description

Temperature control structure for luggage
Technical Field
The utility model relates to a case and bag accessory technical field, concretely relates to conveniently carry, can keep warm and keep cold and use wide temperature control structure for case and bag.
Background
With the improvement of the quality of life, the luggage becomes a necessary tool for going out, and the functional requirements of the luggage by market feedback are higher and higher, especially for infants or white-collar people going out. For example, white collars with meals to companies often suffer from excessive temperature and food deterioration. Mother needs to store milk or milk in a cold storage mode or heat treatment mode when going out, but the mother is not carried with tools and needs a large refrigerator and the like, which is troublesome to carry.
The backpack with a cooling device disclosed in the prior art application publication No. CN 107455909A comprises a backpack body 10 and a cooling device 20. The cooling device 20 comprises a semiconductor refrigerating sheet 21, a heat dissipation assembly 22, a liquid return pipe 23, a liquid tank 24 and a circuit board 25; the circuit board 25 is externally connected with a power supply and is electrically connected with the heat dissipation assembly 22 and the semiconductor refrigeration sheet 21; the semiconductor refrigerating sheet 21 is arranged on one side of the liquid tank 24 to cool the liquid in the liquid tank 24; the heat dissipation assembly 22 is arranged on one side of the semiconductor refrigeration 21 to dissipate heat of the semiconductor refrigeration; the liquid return pipe 23 is formed by communicating a plurality of bent U-shaped units; the back of the backpack body 10 is provided with an interlayer 12, and a plurality of bent U-shaped units of the liquid return pipe 23 are flatly laid in the interlayer 12. After the cooled liquid enters the liquid return pipe 23 in the backpack interlayer 12, the temperature of the backpack interlayer 12 is reduced. However, the backpack is heavy, occupies a large space and is inconvenient to carry.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a temperature control structure for case and bag that conveniently carries, can keep warm and keep cold and use extensively.
In order to overcome the defects in the prior art, the utility model adopts the following technical scheme:
a temperature control structure for a luggage comprises a fixed main body and a plurality of semiconductor refrigeration pieces positioned on the fixed main body; the fixing main body is provided with a heat-conducting reflecting layer, a heat-insulating filling layer and a fabric layer, the heat-insulating filling layer is positioned between the heat-conducting reflecting layer and the fabric layer, and the semiconductor refrigerating sheet is embedded on the heat-conducting reflecting layer and the heat-insulating filling layer; the semiconductor refrigeration piece is provided with a heat dissipation part and a heat conduction piece, the heat dissipation part is positioned at the bottom of the semiconductor refrigeration piece, the heat dissipation part is continuously expanded and attached to the fabric layer through the heat conduction piece, and the heat conduction piece and the fabric layer are overlapped to form an integral continuous flexible large-area heat dissipation surface.
Furthermore, the heat conducting piece is a metal wire or a graphene heat dissipation wire, and the metal wire or the graphene heat dissipation wire is attached to the fabric layer.
Further, the fabric layer is one of nylon cloth, canvas, leather/artificial leather, polycarbonate, PVC and polyurethane.
Furthermore, the semiconductor refrigeration sheet is wrapped by waterproof insulating plastic, only the heat conducting piece is exposed, and the heat conducting piece extends to other parts of the fabric layer.
Further, the heat-conducting reflecting layer, the heat-insulating filling layer and the fabric layer are sewn together through a sewing machine.
Furthermore, the semiconductor refrigeration pieces are distributed on the fixing main body in an array mode, and the total area of the whole material layer is the area covered by the heat conducting piece.
Further, the heat insulation filling layer is one or more of foam plastic, superfine glass wool, high silicon-oxygen cotton and aerogel felt.
Furthermore, the case is shaped into a box body or a box body by a temperature control structure, and an opening is arranged through a zipper.
The utility model discloses a control by temperature change structural design scientific and reasonable for case and bag has following advantage:
1. the heat dissipation is expanded to the whole surface material layer, the heat dissipation area is greatly increased, and the refrigerating and heating effects are better.
2. The semiconductor refrigerating sheet can refrigerate and heat in multiple directions, thereby avoiding blind areas and only refrigerating and heating locally.
3. Simple structure, convenient use and is suitable for suitcases of various different types.
Drawings
In order to illustrate the embodiments of the present invention or the technical solutions in the prior art more clearly, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained without inventive exercise according to the drawings:
fig. 1 is a schematic view of an embodiment of a temperature control structure for a luggage of the present invention;
FIG. 2 is a schematic plan view of a temperature control structure for a luggage;
FIG. 3 is a schematic circuit control diagram of a temperature control structure for a luggage;
FIG. 4 is a schematic view of an application scenario 1 of a temperature control structure for a luggage;
FIG. 5 is a schematic view of an application scenario 2 of a temperature control structure for a luggage;
FIG. 6 is a schematic view of an application scenario 3 of a temperature control structure for a luggage;
in the drawings: 1-a stationary body; 2-semiconductor refrigerating sheet; 11-a thermally conductive reflective layer; 12-a thermally insulating fill layer; 13-a fabric layer; 21-a heat sink; 22-heat conducting member.
Detailed Description
The present invention will be described in detail with reference to the drawings and specific embodiments, and the exemplary embodiments and descriptions of the present invention are used to explain the present invention, but not to limit the present invention.
As shown in fig. 1 to 3, a temperature control structure for a luggage includes a fixing main body 1, and a plurality of semiconductor chilling plates 2 located on the fixing main body 1, wherein the area of the fixing main body 1 is much larger than the total area of the semiconductor chilling plates 2, so as to provide conditions for the heat dissipation of the semiconductor chilling plates 2; fixed main part 1 is equipped with heat conduction reflection stratum 11, thermal-insulated filling layer 12 and precoat 13, and in-service use heat conduction reflection stratum 11 is the aluminium foil, and thermal-insulated filling layer 12 is located between heat conduction reflection stratum 11 and the precoat 13, and semiconductor refrigeration piece 2 inlays on heat conduction reflection stratum 11 and thermal-insulated filling layer 12. Specifically speaking, the semiconductor refrigeration piece 2 is connected with a control assembly, and the control assembly comprises a controller, a battery, a relay, a temperature sensor, a USB input socket and a charging circuit. The controller links to each other with battery, relay, temperature sensor respectively, and semiconductor refrigeration piece 2 links to each other with relay, temperature sensor respectively, and charging circuit links to each other with battery, USB input socket respectively, and temperature sensor sets up on semiconductor refrigeration piece 2, and controller, battery, relay, charging circuit are for setting up an integrated circuit board, are located by USB input socket. The plurality of semiconductor refrigerating pieces 2 are distributed on the fixing main body 1 in an array mode. When refrigeration is needed, the battery controls the semiconductor refrigeration piece 2 to refrigerate through the controller, the temperature sensor detects the refrigeration temperature and feeds the refrigeration temperature back to the controller, and when the electric quantity of the battery is insufficient, the battery can be connected with an external power supply through the USB input socket to charge the battery; when needs heating, the controller control semiconductor refrigeration piece 2 heats, and temperature sensor detects the refrigeration temperature and feeds back to the controller, and when the battery electric quantity was not enough, accessible USB input socket connects external power source and charges for the battery.
Specifically, the semiconductor refrigeration piece 2 is provided with a heat dissipation part 21 and a heat conduction part 22, the heat dissipation part 21 is located at the bottom of the semiconductor refrigeration piece 2 and is bonded to the semiconductor refrigeration piece 2 through heat dissipation silicone grease, and the heat conduction part 22 is welded to the heat dissipation part 21. The semiconductor refrigerating sheet 2 is wrapped by waterproof insulating plastic, namely the semiconductor refrigerating sheet 2 and the heat radiating part 21 are soaked in waterproof insulating plastic solution and taken out, only the heat conducting piece 22 is exposed, and the heat conducting piece 22 extends to other parts of the fabric layer 13
Preferably, the heat conducting member 22 is a metal wire or a graphene heat dissipating wire, and the metal wire or the graphene heat dissipating wire is attached to the fabric layer 13. Let the metal wire or graphite alkene radiator wire spread at whole precoat 13 like this, increased the heat radiating area of semiconductor refrigeration piece 2 greatly, make semiconductor refrigeration piece 2 can last the refrigeration. The fabric layer 13 is one of nylon cloth, canvas, leather/artificial leather, polycarbonate, PVC and polyurethane. In actual use, the oxford fabric in canvas is generally used as the fabric layer 13, because the oxford fabric has certain pores on the surface to facilitate heat exchange.
Specifically, the heat conductive reflection layer 11, the heat insulating filler layer 12 and the fabric layer 13 are sewn together by sewing. The plurality of semiconductor refrigeration pieces 2 are distributed on the fixing main body 1 in an array mode, and the total area of the whole material layer 13 is the area covered by the heat conducting piece 22. The heat insulation filling layer 12 is one or more of foam plastic, superfine glass wool, high silicon-oxygen wool and aerogel felt, and the aerogel felt is generally used in the heat insulation filling layer 12 in practice, so that the operability is high, the filling is convenient, and peculiar smell is not generated. The case is shaped into a box body or box body shape by a temperature control structure, and an opening is arranged through a zipper. It is worth mentioning that the temperature control structure for the luggage has certain flexibility and can be suitable for sewing by a sewing machine or hot-press shaping.
Application scenario 1
As shown in FIG. 4, when the thermal insulation packing material is applied to a lunch box/lunch box, the main body of the lunch box/lunch box is directly sewn by a temperature control structure for a case, and the inside of the thermal insulation packing material is food with larger load bearing, so that the thermal insulation packing layer 12 is filled with rigid foam plastics, and the fabric layer 13 can be made of polycarbonate, PVC, polyurethane and the like. It can be known from fig. 4 that the side pocket is disposed outside the fabric layer 13 to facilitate storage of the charger baby and quick connection with the USB input socket. On the back of the figure are several buttons with different functions, which are located in front of the controller of the semiconductor chilling plate 2.
Application scenario 2
As shown in fig. 5, when the cooling device is applied to a backpack/mommy bag/outdoor sports bag, a large space is required inside the backpack/mommy bag/outdoor sports bag when not holding articles, so that the semiconductor cooling plate 2 can conveniently cool or heat. In some backpack embodiments it may be that the heat conductive reflective layer 11 of the semiconductor chilling plate 2 faces the back of the user. It is worth mentioning that the side pocket or the front pocket is not disposed to prevent the heat dissipation of the semiconductor cooling sheet 2 where the side pocket or the front pocket is provided on the backpack/mommy bag/outdoor sports bag, but the heat-conducting member 22 is still extended to these positions to increase the heat dissipation area.
Application scenario 3
As shown in fig. 6, the bottle bag is applied to a bottle bag/mother and infant product bag, and the bottle bag adopts the semiconductor refrigeration sheet 2 with a very small model, so that the limitation caused by the arc arrangement of the temperature control structure for the bag is avoided, and the heat dissipation area is reasonably proportioned. Generally, the bag type adopts that the USB input socket is externally arranged and is led out from the controller by a wire. In some embodiments, a hook and loop fastener is also provided on the fabric layer 13 to attach the bag directly to the inside of the backpack.
The above description is only a preferred embodiment of the present invention, and should not be taken as limiting the invention, and any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims (6)

1. The utility model provides a temperature control structure for case and bag which characterized in that: comprises a fixed main body (1) and a plurality of semiconductor refrigeration sheets (2) positioned on the fixed main body (1); the fixing body (1) is provided with a heat-conducting reflecting layer (11), a heat-insulating filling layer (12) and a fabric layer (13), the heat-insulating filling layer (12) is positioned between the heat-conducting reflecting layer (11) and the fabric layer (13), and the semiconductor refrigerating sheet (2) is embedded on the heat-conducting reflecting layer (11) and the heat-insulating filling layer (12); the semiconductor refrigeration piece (2) is provided with a heat dissipation part (21) and a heat conduction part (22), the heat dissipation part (21) is located at the bottom of the semiconductor refrigeration piece (2), the heat dissipation part (21) is continuously attached to the fabric layer (13) in an expanding mode through the heat conduction part (22), and the heat conduction part (22) and the fabric layer (13) are overlapped to form a whole continuous flexible large-area heat dissipation surface.
2. A temperature control structure for a luggage according to claim 1, wherein:
the heat conducting piece (22) is a metal wire or a graphene heat dissipation wire, and the metal wire or the graphene heat dissipation wire is attached to the fabric layer (13).
3. A temperature control structure for a luggage according to claim 2, wherein:
the fabric layer (13) is one of nylon cloth, canvas, leather/artificial leather, polycarbonate, PVC and polyurethane.
4. A temperature control structure for a luggage according to claim 3, wherein:
the heat-conducting reflecting layer (11), the heat-insulating filling layer (12) and the fabric layer (13) are sewn together through a sewing machine.
5. A temperature control structure for a luggage according to claim 1, wherein:
the semiconductor refrigeration pieces (2) are distributed on the fixed main body (1) in an array mode, and the total area of the whole fabric layer (13) is the area covered by the heat conducting piece (22).
6. A temperature control structure for a luggage according to claim 1, wherein:
the case is shaped into a box body or box body shape by a temperature control structure, and an opening is arranged through a zipper.
CN202021201838.4U 2020-06-27 2020-06-27 Temperature control structure for luggage Expired - Fee Related CN213664074U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202021201838.4U CN213664074U (en) 2020-06-27 2020-06-27 Temperature control structure for luggage

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202021201838.4U CN213664074U (en) 2020-06-27 2020-06-27 Temperature control structure for luggage

Publications (1)

Publication Number Publication Date
CN213664074U true CN213664074U (en) 2021-07-13

Family

ID=76724514

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202021201838.4U Expired - Fee Related CN213664074U (en) 2020-06-27 2020-06-27 Temperature control structure for luggage

Country Status (1)

Country Link
CN (1) CN213664074U (en)

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CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20210713

CF01 Termination of patent right due to non-payment of annual fee