CN213661421U - Modular air-cooled power module - Google Patents
Modular air-cooled power module Download PDFInfo
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- CN213661421U CN213661421U CN202021524671.5U CN202021524671U CN213661421U CN 213661421 U CN213661421 U CN 213661421U CN 202021524671 U CN202021524671 U CN 202021524671U CN 213661421 U CN213661421 U CN 213661421U
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- laminated busbar
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Abstract
The utility model discloses embodiment provides a modular forced air cooling power module belongs to high-power electronic device technical field. The air-cooled power module includes: the air-cooled power module comprises at least one power component connected in parallel, and the power component comprises: an air-cooled module; the temperature equalizing plate is arranged on the air cooling module; the power module is arranged on the temperature-uniforming plate; the current sensor is arranged on the temperature-uniforming plate and is connected with the power module; one end of the laminated busbar is connected with the power module; the driving board is arranged on one end of the laminated busbar and is connected with the power module; the heat dissipation fan is arranged at the rear end of the air cooling module; and the bus capacitor is arranged above the air cooling module, positioned at the rear end of the power module and connected with the laminated busbar. The air-cooled power module can overcome the technical defect that the heat dissipation module in the prior art needs to be designed independently aiming at electronic devices.
Description
Technical Field
The utility model relates to a high-power electronic device technical field specifically relates to a modular forced air cooling power module.
Background
In the air-cooled power module of the present high-power electronic device, the devices usually include a bus capacitor, a busbar, a power module, a PCB driving board, a current sensor, an air-cooled radiator, and the like. The traditional high-power module scheme can design different devices aiming at different power grades, such as designing bus capacitors with different sizes, radiator radiators with different sizes, different PCB driving boards and the like, and therefore the defects of long development period, high cost, poor compatibility, difficulty in material management and the like of the high-power electronic device are caused.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a modular air-cooled power module, this air-cooled power module can overcome the technical defect that heat dissipation module need design alone to the electron device among the prior art.
In order to achieve the above object, the present invention provides a modular air-cooled power module, which includes at least one parallel power module, the power module includes:
an air-cooled module;
the temperature equalizing plate is arranged on the air cooling module;
the power module is arranged on the temperature-uniforming plate;
the current sensor is arranged on the temperature-uniforming plate and is connected with the power module;
one end of the laminated busbar is connected with the power module;
the driving board is arranged on one end of the laminated busbar and is connected with the power module;
the heat dissipation fan is arranged at the rear end of the air cooling module; and
and the bus capacitor is arranged above the air cooling module and positioned at the rear end of the power module and is connected with the laminated busbar.
Optionally, the air-cooled power module further comprises a nylon bracket, and the current sensor is fixed on the air-cooled module through the nylon bracket.
Optionally, the air-cooled power module further includes an isolation pillar and a mica sheet, the mica sheet is disposed between the laminated busbar and the driver board, and the isolation pillar is disposed between the laminated busbar and the mica sheet and between the mica sheet and the driver board.
Optionally, the bus capacitor is perpendicular to the power module, the laminated busbar is L-shaped, one end of the L-shape is connected to the power module, and the other end of the L-shape is connected to the bus capacitor.
Optionally, the air-cooled power module further comprises:
the metal plate supporting piece is arranged at the bottom of the bus capacitor and used for fixing the bus capacitor;
the sheet metal support is connected with the shell;
and the protective casing is arranged on the periphery of the air cooling module and connected with the casing.
Optionally, the chassis further includes a fan grid, and the fan grid is disposed at the rear end of the cooling fan and corresponds to the cooling fan one to one.
Optionally, the bus capacitor includes:
a substrate;
a positive polarity terminal disposed on the substrate;
the negative terminals are arranged on the substrate, the number of one of the positive terminals and the negative terminals is twice that of the other terminal, and the positive terminals and the negative terminals are uniformly distributed on two sides of the other terminal.
Alternatively, the other one is connected to each other, and the positive polarity terminal or the negative polarity terminal located on both sides of the other one are respectively connected to each other.
Through the technical scheme, the utility model provides a pair of modular forced air cooling power module is through piling up the modularization with devices such as forced air cooling module, power module, bus-bar capacitance, and the forced air cooling power module that adopts to constitute by a plurality of power components replaces traditional independent design's power module. When the design requirements of different power levels are met, the corresponding design requirements can be met by increasing or reducing the number of power components, the design cost is reduced, and the design period is shortened.
Other features and advantages of embodiments of the present invention will be described in detail in the detailed description which follows.
Drawings
The accompanying drawings, which are included to provide a further understanding of the embodiments of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the embodiments of the invention, but do not constitute a limitation of the embodiments of the invention. In the drawings:
fig. 1 is a schematic diagram of a modular air-cooled power module according to an embodiment of the present invention;
fig. 2a is one of three-dimensional schematic diagrams of a modular air-cooled power module according to an embodiment of the present invention;
fig. 2b is a second three-dimensional schematic diagram of a modular air-cooled power module according to an embodiment of the present invention;
fig. 3 is an exploded view of a modular air-cooled power module according to an embodiment of the present invention;
fig. 4 is a schematic structural diagram of a bus capacitor according to an embodiment of the present invention; and
fig. 5 is a schematic structural diagram of a bus capacitor according to an embodiment of the present invention.
Detailed Description
The following describes in detail embodiments of the present invention with reference to the accompanying drawings. It is to be understood that the description herein is merely for purposes of illustration and explanation and is not intended to limit the embodiments of the present invention.
In the embodiments of the present invention, unless otherwise specified, the use of directional terms such as "upper, lower, top, and bottom" is generally used with respect to the orientation shown in the drawings or the positional relationship between the components in the vertical, or gravitational direction.
In addition, if there is a description in the embodiments of the present invention referring to "first", "second", etc., the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, the technical solutions in the embodiments can be combined with each other, but it must be based on the realization of those skilled in the art, and when the technical solutions are contradictory or can not be realized, the combination of the technical solutions should not be considered to exist, and is not within the protection scope of the present invention.
The utility model provides a pair of modular forced air cooling power module, this forced air cooling power module can include at least one parallelly connected power component, as shown in fig. 1. Fig. 2a and 2b show an exploded view of a power module according to an embodiment of the present invention. Fig. 2a is one of three-dimensional schematic diagrams of a power module product according to an embodiment of the present invention, and fig. 2b is a second three-dimensional schematic diagram of a power module product according to an embodiment of the present invention.
Fig. 3 is an exploded view of a modular air-cooled power module according to an embodiment of the present invention. In fig. 3, the air-cooled power module may include an air-cooled module 01, a temperature equalizing plate 02, a power module 03, a current sensor 04, a laminated busbar 05, a driving plate 06, a heat dissipation fan 07, and a busbar capacitor 08.
In fig. 1, an air-cooling module 01 may be disposed at the bottom of the power assembly. The temperature equalizing plate 02 is disposed on the air cooling module 01, and the power module 03 can be disposed on the temperature equalizing plate 02. The temperature equalization plate 02 can be used for realizing heat conduction, and avoiding the situation of local overheating in the working process of the power component. The current sensor 04 may be disposed on the temperature-uniforming plate 02, and connected to the power module 03, for acquiring the current of the power module 03 in real time. The type of current sensor may be a variety of types known to those skilled in the art. In a preferred example of the present invention, the current sensor 04 may preferably be a LEM current sensor. One end of the laminated busbar 05 can be connected with the power module 03, and the driving board 06 can be arranged on one end of the laminated busbar 05 and connected with (a wiring terminal of) the power module 03. The heat dissipation fan 07 may be disposed at a rear end of the air-cooling module 01. The bus capacitor 08 may be disposed above the air cooling module 01 and at the rear end of the power module 03, and connected to the laminated busbar 05.
In an embodiment of the present invention, as shown in fig. 1, in order to ensure the stability of the connection between the current sensor 04 and the power module 03, the air-cooled power module may further include a nylon bracket 09. The current sensor 04 may be fixed to the air cooling module 01 by the nylon bracket 09.
During the operation of the power module 03, a large amount of heat is generated, although the heat is conducted to the bottom air cooling module 01 by the temperature equalization plate 02. However, since the driving board 06 is close to the power module 03, and the driving board 06 is generally a metal material, thermal conductivity is good. The heat of the power module 03 is thus very easily absorbed by the driving board 06, affecting the electrical conductivity of the driving board 06 and, even more, possibly other electronic components in the vicinity of the driving board 06, thus causing local overheating of the device. Therefore, in an embodiment of the present invention, the air-cooled power module may further include the separation columns 10, 11 and the mica sheet 12. The mica sheet 12 may be disposed between the laminated busbar 05 and the driving board 06. The isolation pillars 10 may be disposed between the laminated busbar 05 and the mica sheet 12. The spacer posts 11 may be disposed between the mica sheet 12 and the drive plate 06.
In an embodiment of the present invention, the bus capacitor 08 may be disposed perpendicular to the power module 03 in consideration of the design volume of the air-cooled power module. Accordingly, in order to adapt to the position relationship between the two, the laminated busbar 05 may be L-shaped. One end of the L-shape may be connected to the power module 03 and the other end of the L-shape may be connected to the bus capacitor 08.
In an embodiment of the present invention, for the convenience of installation, the air-cooled power module may further include a sheet metal support 13, a housing 14, and a protection housing 15. The sheet metal support 13 may be disposed at the bottom of the bus capacitor 08, and is used to fix the bus capacitor 08. The housing 14 may be connected to the sheet metal support 13 for cooperating to secure the bus capacitor 08. The protective casing 15 may be disposed at the periphery of the air-cooling module 01, and connected to the casing 14. In addition, to facilitate the installation of the air duct, the rear end of the housing 14 may be provided with a fan grill 16. The fan grids may be disposed at the rear end of the heat dissipation fan 07, and correspond to the heat dissipation fan 07 one to one.
Fig. 4 is a schematic diagram of one configuration of the bus capacitor 08. In fig. 4, the bus capacitor 08 may include a substrate 08a, a positive polarity terminal 08b, and a negative polarity terminal 08 c. Both the positive terminal 08b and the negative terminal 08c may be provided on the substrate 08 a. One of the positive polarity terminal 08b and the negative polarity terminal 08c may be twice as many as the other, and the one may be evenly distributed on both sides of the other. In fig. 4, since the conventional single polarity terminal is split into a plurality of polarity terminals, the single capacitor is also equivalent to a plurality of capacitors connected in parallel, which makes the parasitic inductance greatly reduced (by 50%) relative to the single capacitor when the switching device (power module 03) generates voltage overshoot momentarily after the dc bus (laminated busbar 05) is connected. Therefore, the structure as shown in fig. 4 can reduce the parasitic inductance between the capacitor of the dc bus and the switching device greatly.
Further, the inventors have found, when designing the structure shown in fig. 4, that if the positive terminal 08b and the negative terminal 08c in the structure shown in fig. 4 are correspondingly connected, the parasitic inductance can be further reduced. Therefore, the inventors have devised a structure that is the bus capacitor 08 as shown in fig. 5. In fig. 5, the other one, half the number of which is one, is connected to each other, and the positive polarity terminal 08b or the negative polarity terminal 08c positioned on both sides of the other one are connected to each other, respectively.
Through the technical scheme, the utility model provides a pair of modular forced air cooling power module is through piling up the modularization with devices such as forced air cooling module, power module, bus-bar capacitance, and the forced air cooling power module that adopts to constitute by a plurality of power components replaces traditional independent design's power module. When the design requirements of different power levels are met, the corresponding design requirements can be met by increasing or reducing the number of power components, the design cost is reduced, and the design period is shortened.
The above describes in detail optional embodiments of the present invention with reference to the accompanying drawings, however, the embodiments of the present invention are not limited to the details of the above embodiments, and the technical concept of the embodiments of the present invention can be within the scope of the present invention, and can be modified in a variety of ways, and these simple modifications all belong to the protection scope of the embodiments of the present invention.
It should be noted that the various features described in the above embodiments may be combined in any suitable manner without departing from the scope of the invention. In order to avoid unnecessary repetition, the embodiments of the present invention do not separately describe various possible combinations.
In addition, various different embodiments of the present invention can be combined arbitrarily, and the embodiments of the present invention should be considered as disclosed in the embodiments of the present invention as long as the embodiments do not depart from the spirit of the embodiments of the present invention.
Claims (8)
1. A modular air-cooled power module, comprising at least one parallel power module, the power module comprising:
an air-cooled module;
the temperature equalizing plate is arranged on the air cooling module;
the power module is arranged on the temperature-uniforming plate;
the current sensor is arranged on the temperature-uniforming plate and is connected with the power module;
one end of the laminated busbar is connected with the power module;
the driving board is arranged on one end of the laminated busbar and is connected with the power module;
the heat dissipation fan is arranged at the rear end of the air cooling module; and
and the bus capacitor is arranged above the air cooling module and positioned at the rear end of the power module and is connected with the laminated busbar.
2. The air-cooled power module of claim 1, further comprising a nylon bracket, wherein the current sensor is fixed to the air-cooled module by the nylon bracket.
3. The air-cooled power module of claim 1, further comprising an isolation post and a mica sheet, wherein the mica sheet is disposed between the laminated busbar and the drive board, and the isolation post is disposed between the laminated busbar and the mica sheet and between the mica sheet and the drive board.
4. The air-cooled power module as claimed in claim 1, wherein the bus capacitor is perpendicular to the power module, the laminated busbar is L-shaped, one end of the L-shape is connected to the power module, and the other end of the L-shape is connected to the bus capacitor.
5. The air-cooled power module of claim 4, further comprising:
the metal plate supporting piece is arranged at the bottom of the bus capacitor and used for fixing the bus capacitor;
the sheet metal support is connected with the shell;
and the protective casing is arranged on the periphery of the air cooling module and connected with the casing.
6. The air-cooled power module as recited in claim 5, wherein the housing further comprises a fan grid, the fan grid is disposed at a rear end of the heat dissipation fan and corresponds to the heat dissipation fan.
7. The air-cooled power module of claim 1, wherein the bus capacitor comprises:
a substrate;
a positive polarity terminal disposed on the substrate;
the negative terminals are arranged on the substrate, the number of one of the positive terminals and the negative terminals is twice that of the other terminal, and the positive terminals and the negative terminals are uniformly distributed on two sides of the other terminal.
8. The air-cooled power module according to claim 7, wherein the other is connected to each other, and the positive polarity terminal or the negative polarity terminal on both sides of the other are connected to each other, respectively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021524671.5U CN213661421U (en) | 2020-07-28 | 2020-07-28 | Modular air-cooled power module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021524671.5U CN213661421U (en) | 2020-07-28 | 2020-07-28 | Modular air-cooled power module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213661421U true CN213661421U (en) | 2021-07-09 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021524671.5U Active CN213661421U (en) | 2020-07-28 | 2020-07-28 | Modular air-cooled power module |
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| Country | Link |
|---|---|
| CN (1) | CN213661421U (en) |
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2020
- 2020-07-28 CN CN202021524671.5U patent/CN213661421U/en active Active
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| CP02 | Change in the address of a patent holder |
Address after: 201114 Room 101, building 23, No. 588, Xinjun Ring Road, Minhang District, Shanghai Patentee after: Zhizhan Technology (Shanghai) Co.,Ltd. Address before: Room 207.208, East District, building 1, 68 xiupu Road, Pudong New Area, Shanghai, 201315 Patentee before: Zhizhan Technology (Shanghai) Co.,Ltd. |
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| CP02 | Change in the address of a patent holder |