CN213648187U

CN213648187U - Cutting device for crystal processing

Info

Publication number: CN213648187U
Application number: CN202021690130.XU
Authority: CN
Inventors: 张超; 李鹏; 陈龙; 徐殿翔
Original assignee: Shandong Tianyue Advanced Technology Co Ltd
Current assignee: Shandong Tianyue Advanced Technology Co Ltd
Priority date: 2020-08-13
Filing date: 2020-08-13
Publication date: 2021-07-09
Anticipated expiration: 2030-08-13

Abstract

The utility model provides a cutting device for crystal processing, cutting device includes: the platform is used for placing a crystal to be processed, a through groove extending from one side to the middle is formed in the platform, and the crystal is placed right above the through groove; the positioning unit comprises a pressing plate and a lifting device, and the lifting device is connected with the pressing plate; the cutting unit comprises a saw blade, a motor and a moving device, the saw blade is connected with a rotating shaft of the motor, the motor is connected with the moving device, and the saw blade is controlled to penetrate through the through groove and move along the length direction of the through groove so as to cut the crystal in a rotating mode. The lifting device is controlled to drive the pressing plate to move by arranging the positioning unit and the cutting unit so as to position and fix the crystal; the saw blade is controlled to move rotationally to cut the crystal. The device provided by the application is convenient to operate for processing the crystal, improves the working efficiency, and plays a role in protecting the human body and the crystal in the processing process.

Description

Cutting device for crystal processing

Technical Field

The utility model relates to a cutting device for crystal processing belongs to the technical field of crystal cutting.

Background

The silicon carbide crystal has excellent semiconductor physical properties such as high thermal conductivity, high breakdown voltage, extremely high carrier mobility, high chemical stability and the like, can be manufactured into high-frequency and high-power electronic devices and optoelectronic devices which work under the conditions of high temperature and strong radiation, has great application value in the fields of national defense, high technology, industrial production, power supply and power transformation, and is regarded as a third-generation wide-bandgap semiconductor material with great development prospect.

The silicon carbide crystal is applied to a wafer which needs to be processed into a certain size by a device, and the basic process comprises the steps of crystal growth, ingot cutting and detection, grinding, polishing and the like. According to the existing blank opening operation process, a user holds the crystal with both hands by manpower and pushes forward the crystal to the rotating equipment with the cutter until the crystal is cracked, then transfers the crystal for 180 degrees, then holds the crystal and pushes forward until the crystal is in butt joint with the last step of cutting, the operation is completed, potential safety hazards exist, and the work is not convenient.

SUMMERY OF THE UTILITY MODEL

In order to solve the problem, the utility model provides a cutting device for crystal processing through setting up platform, positioning unit and cutting unit, has realized the mechanical automated processing of crystal.

The technical scheme adopted by the application is as follows:

the application provides a cutting device for crystal processing, cutting device includes:

the platform is used for placing a crystal to be processed, a through groove extending from one side to the middle is formed in the platform, and the crystal is placed right above the through groove;

the positioning unit comprises a pressing plate and a lifting device, the lifting device is connected with the pressing plate, and the pressing plate is positioned above two sides of the through groove so as to position the crystal;

the cutting unit comprises a saw blade, a motor and a moving device, the saw blade is connected with a rotating shaft of the motor, the motor is connected with the moving device, and the saw blade is controlled to penetrate through the through groove and move along the length direction of the through groove so as to cut the crystal in a rotating mode.

Preferably, the width of the through groove is not less than the thickness of the saw blade, and the length of the through groove is not less than the diameter of the crystal.

Preferably, the height of the crystal placed on the platform is greater than the height of the bottom end of the blade edge and less than the height of the top end of the blade edge.

Preferably, the lifting device comprises a cylinder, a telescopic rod and a cylinder support frame, the cylinder is fixed on the cylinder support frame, the output end of the cylinder is connected with the telescopic rod, and one end of the telescopic rod is fixedly connected with the pressing plate.

Preferably, the number of the pressing plates is two, and the two pressing plates are symmetrically arranged above two sides of the through groove;

the air cylinder comprises a first air cylinder and a second air cylinder, and the telescopic rod comprises a first telescopic rod and a second telescopic rod;

the output end of the first air cylinder is connected with a first telescopic rod, and one end of the first telescopic rod is fixedly connected with one of the pressing plates;

the output end of the second cylinder is connected with a second telescopic rod, and one end of the second telescopic rod is fixedly connected with the other pressing plate.

Preferably, a pipeline connected with the liquid container is arranged above the through groove, and a valve is arranged on the pipeline.

Preferably, the moving device comprises a motor supporting plate and a moving plate, the motor supporting plate is connected with the platform through an upright post, the motor is fixed on the moving plate, a guide rail is arranged on the motor supporting plate, and a sliding block matched with the guide rail to slide is arranged at the bottom end of the moving plate.

Preferably, the moving device further comprises a third cylinder and a third telescopic rod, an output end of the third cylinder is connected with the third telescopic rod, and one end of the third telescopic rod is fixedly connected with the moving plate.

Preferably, the pressure plate and the platform are both made of a high-purity graphite material or a high-purity organic material, and/or the saw blade is a diamond saw blade.

Preferably, a limiting groove is arranged on the platform, and the diameter of the limiting groove is not smaller than that of the crystal; the through groove is communicated with the limiting groove and transversely penetrates through the bottom end of the limiting groove.

The utility model has the advantages that:

(1) the utility model relates to a cutting device for crystal processing, which controls a lifting device in a positioning unit to drive a pressing plate to move by arranging the positioning unit and a cutting unit so as to position and fix a crystal; the control motor drives the saw blade to rotate and move so as to cut the crystal. The device provided by the application is convenient to operate for processing the crystal, improves the working efficiency, and plays a role in protecting the human body and the crystal in the processing process.

(2) The utility model relates to a cutting device for crystal processing, through inciting somebody to action the clamp plate symmetry sets up the both sides top that leads to the groove for the packing force evenly distributed of clamp plate is in on the crystal, the clamp plate has offset the effort of saw bit to the crystal to the packing force of crystal, has effectively guaranteed that the saw bit can not take place to remove when the crystal rotary cutting to the crystal.

(3) The utility model relates to a cutting device for crystal processing, through setting up the pipeline of connecting liquid container, liquid is used for cooling for the saw bit in the pipeline, avoids saw bit and crystal to generate heat and deformation damage man-hour, has effectively improved crystal processingquality and efficiency.

(4) The utility model relates to a cutting device for crystal processing through setting up spacing recess, the crystal is placed in spacing recess, causes the great removal on a large scale of crystal to the too big effort of crystal when avoiding the saw bit cutting, has improved crystal processing's efficiency.

Drawings

The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this application, illustrate embodiment(s) of the application and together with the description serve to explain the application and not to limit the application. In the drawings:

FIG. 1 is a schematic structural view of a cutting device for crystal processing according to the present invention;

FIG. 2 is a left side view of the cutting device for machining a crystal according to the present invention;

FIG. 3 is a front view of a cutting device for machining a crystal according to the present invention;

wherein, 1, a platform; 101. a through groove; 2. pressing a plate; 3. a saw blade; 4. a motor; 5. a cylinder support frame; 6. a first cylinder; 7. a first telescopic rod; 8. a second cylinder; 9. a second telescopic rod; 10. a water tank; 11. a pipeline; 12. a valve; 13. a water receiving tank; 14. a motor support plate; 1401. a guide rail; 15. moving the plate; 1501. a slider; 16. a column; 17. a third cylinder; 18. and a third telescopic rod.

Detailed Description

The present application will be described in detail with reference to examples, but the present application is not limited to these examples.

In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application, however, the present application may be practiced in other ways than those described herein, and therefore the scope of the present application is not limited by the specific embodiments disclosed below.

In addition, in the description of the present application, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the referred devices or elements must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present application.

The embodiments in the present specification are described in a progressive manner, and the same and similar parts among the embodiments are referred to each other, and each embodiment focuses on the differences from the other embodiments.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise.

In this application, unless expressly stated or limited otherwise, the terms "mounted," "connected," "coupled," and the like are to be construed broadly and include, for example, fixed or removable connections or integral parts; the connection can be mechanical connection, electrical connection or communication; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.

In this application, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through intervening media. In the description herein, reference to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the application. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

Referring to fig. 1-3, the present embodiment provides a cutting device for crystal processing, the cutting device includes a platform 1, a positioning unit and a cutting unit, the platform is used for placing a crystal to be processed, the platform is provided with a through groove 101 extending from one side to the middle, the crystal is placed right above the through groove 101; the positioning unit comprises a pressing plate 2 and a lifting device, the lifting device is connected with the pressing plate 2, and the pressing plate 2 is positioned above two sides of the through groove 101 to position the crystal; the cutting unit comprises a saw blade 3, a motor 4 and a moving device, the saw blade 3 is connected with a rotating shaft of the motor 4, the motor 4 is connected with the moving device, and the saw blade 3 is controlled to penetrate through the through groove 101 and move along the length direction of the through groove 101 so as to cut crystals in a rotating mode.

The device replaces manual operation to process the crystal, firstly, the crystal is placed on the platform 1, and then the lifting device is controlled to drive the pressing plate 2 to move downwards until the pressing plate 2 compresses the crystal; the control motor 4 drives the saw blade 3 to rotate, and meanwhile, the moving device is controlled to push the motor 4 to cut the crystal, and the processing is finished. The device provided by the application is convenient to operate for processing the crystal, improves the working efficiency, and plays a role in protecting the human body and the crystal in the processing process.

As a preferred embodiment of the present application, the saw blade 3 is a general term for a thin circular cutter for cutting solid materials. The saw blade 3 is arranged perpendicular to the crystal such that the saw blade 3 rotates to cut the crystal.

As a preferred embodiment of the present application, the width of the through groove 101 is not less than the thickness of the saw blade 3, so that the saw blade 3 penetrates through the through groove 101 and the wobbling of the saw blade 3 is avoided; the length of the through slot 101 is not less than the diameter of the crystal to ensure that the saw blade 3 moves along the length of the through slot 101 to cut through the crystal.

As a preferred embodiment of the present application, the crystal is placed on the platform at a height greater than the bottom of the edge of the saw blade 3 and less than the top of the edge of the saw blade 3, so that the edge of the edge portion of the saw blade 3 cuts the crystal when the saw blade 3 rotates.

As a preferred embodiment of this application, elevating gear includes cylinder, telescopic link and cylinder support frame 5, and the cylinder is fixed on cylinder support frame 5, and the output and the telescopic link of cylinder are connected, the one end and the clamp plate 2 fixed connection of telescopic link. The lifting device of the present application is not limited to the above-described structure, and may be other lifting devices of the platen 2 that can be realized, for example, a lifting device including a screw, a nut, and the like. Specifically, cylinder drives the flexible removal of telescopic link among the preferred elevating gear of this application to control clamp plate 2's lift when clamp plate 2 downstream compresses tightly the crystal, realizes fixed the location of crystal, accomplishes the back to crystal cutting processing, and control clamp plate 2 upward movement takes off the crystal, and processing is accomplished, then carries out subsequent processing operation. This application elevating gear's simple structure realizes the lift of clamp plate through the cylinder, makes clamp plate vertical displacement obtain changing convenient operation.

As a preferred embodiment of the present application, the number of the pressing plates 2 is two, and the pressing plates are symmetrically arranged above two sides of the through groove 101, the cylinders include a first cylinder 6 and a second cylinder 8, and the telescopic rods include a first telescopic rod 7 and a second telescopic rod 9; the output end of the first air cylinder 6 is connected with a first telescopic rod 7, and one end of the first telescopic rod 7 is fixedly connected with one of the pressing plates 2; the output end of the second cylinder 8 is connected with a second telescopic rod 9, and one end of the second telescopic rod 9 is fixedly connected with the other pressing plate 2. Preferably, the pressing plate 2 is in the shape of a semicircle, the diameter of the semicircle is smaller than that of the crystal, and the pressing plate 2 moves downwards to press the two sides of the crystal. And the pressing plates 2 are symmetrically arranged above two sides of the through groove 101, so that the pressing force of the pressing plates 2 is uniformly distributed on the crystal, the pressing force of the pressing plates 2 on the crystal counteracts the acting force of the saw blade 3 on the crystal, and the crystal is effectively prevented from moving when the saw blade 3 is used for rotatably cutting the crystal.

In a preferred embodiment of the present application, a pipeline 11 connected to the liquid container is disposed above the through groove 101, and a valve 12 is disposed on the pipeline 11. Preferably, the liquid container is arranged on the cylinder support frame 5, the liquid container is a water tank 10, and cold water is contained in the water tank 10. The liquid container can also contain liquid solutions such as cutting liquid, cooling liquid and the like so as to facilitate the crystal cutting of the saw blade 3. The valve on the pipeline 11 is used for controlling the dropping speed of the cold water, and preferably, a water receiving groove 13 is arranged below the saw blade 3 and used for collecting sewage after the saw blade is cleaned. When saw bit 3 cuts the crystal, can release the heat, continuously cool down for the saw bit through pipeline 11 rivers, avoid saw bit 3 and crystal to generate heat and deformation damage when adding man-hour, effectively improved machining efficiency.

As a preferred embodiment of the application, the moving device comprises a motor supporting plate 14 and a moving plate 15, wherein the motor supporting plate 14 is connected with the platform 1 through an upright post 16, a guide rail 1401 is arranged on the motor supporting plate 14, a slide block 1501 matched with the guide rail 1401 to slide is arranged at the bottom end of the moving plate 15, and the moving plate 15 is fixedly connected with a motor 4. Preferably, the number of the upright columns 16 is four, one end of each upright column 16 is fixed at the bottom end of the platform 1, the motor supporting plate 14 is fixed on the upright column 1 close to the other end, and the sliding block 1501 slides on the guide rail 1401 to drive the motor 4 and the saw blade 3 to move, so that the saw blade 3 rotates to cut through the crystal.

As a preferred embodiment of the present application, the moving device further includes a third cylinder 17 and a third telescopic rod 18, an output end of the third cylinder 17 is connected to the third telescopic rod 18, and one end of the third telescopic rod 18 is fixedly connected to the moving plate 15. Preferably, the third cylinder 17 is fixed on a cylinder connecting plate, and the cylinder connecting plate is fixed on the outer side of the upright post. The third cylinder 17 drives the third telescopic rod 18 to move in a telescopic mode, so that the moving plate 15, the motor 4 and the saw blade 3 are driven to move. The moving device of the present application is not limited to the above-described structure, and may be other horizontal moving devices capable of implementing the motor 4, for example, a moving device including a lead screw, a nut, and the like.

As a preferred embodiment of the present application, a water receiving tank 13 is detachably provided on the moving plate 15 to facilitate collection of sewage for cleaning the saw blade 3.

As a preferred embodiment of the present application, the platen 2 and the stage 1 are both made of a high-purity graphite material or a high-purity organic material. The high-purity graphite material or the high-purity organic material refers to a material with the purity of graphite or organic matters being more than 99.999 percent, so that the material contacted with the crystal cannot pollute the crystal. The saw blade 3 is a diamond saw blade, the sharpness of the diamond saw blade is good, the abrasion resistance is high, and rapid cutting of crystals with high hardness can be realized.

As a preferred embodiment of the present application, the platform 1 is provided with a limiting groove, and the diameter of the limiting groove is not smaller than that of the crystal, so that the crystal can be placed in the limiting groove; preferably, the depth of the limiting groove is not more than the thickness of the crystal. The through groove is communicated with the limiting groove and transversely penetrates through the bottom end of the limiting groove, so that the saw blade 3 enters the through groove to rotatably cut crystals located in the limiting groove. The contact force of the side wall of the limiting groove and the crystal can counteract the acting force of part of the saw blade 3 on the crystal, and the phenomenon that the crystal moves in a large range due to the overlarge acting force when the saw blade 3 is cut is avoided.

As a preferred embodiment of the application, the cutting device further comprises a controller, the controller is respectively connected with the first air cylinder 6, the second air cylinder 8, the third air cylinder 17 and the motor 4, and the controller is used for respectively controlling the first air cylinder 6, the second air cylinder 8, the third air cylinder 17 and the motor to be started and stopped, so that the automatic processing of crystal processing is realized.

The device of this application is when using, at first puts the crystal in the logical groove 101 top of platform 1, then starts first cylinder 6 and 8 downstream of second cylinder, until compressing tightly the crystal, the operation of start button motor drives the rotation of saw bit 3, third cylinder 17 impels motor 4 forward until cutting the crystal, processing is accomplished, motor 4 stall, third cylinder 17 drives motor 4 playback, first cylinder 6 and 8 playback of second cylinder, it accomplishes to take off the crystal operation.

The above are merely examples of the present application, and the scope of the present application is not limited by these specific examples, but is defined by the claims of the present application. Various modifications and changes may occur to those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the technical idea and principle of the present application should be included in the protection scope of the present application.

Claims

1. A cutting device for crystal processing, characterized in that the cutting device comprises:

2. The cutting device for crystal processing according to claim 1, wherein the width of the through groove is not less than the thickness of the saw blade, and the length of the through groove is not less than the diameter of the crystal.

3. The cutting device for crystal processing according to claim 1, wherein the height of the crystal placed on the platform is greater than the height of the bottom end of the blade edge and less than the height of the top end of the blade edge.

4. The cutting device for crystal processing according to claim 1, wherein the lifting device comprises a cylinder, an expansion link and a cylinder support frame, the cylinder is fixed on the cylinder support frame, the output end of the cylinder is connected with the expansion link, and one end of the expansion link is fixedly connected with the pressing plate.

5. The cutting device for crystal processing according to claim 4, wherein the number of the pressing plates is two, and the two pressing plates are symmetrically arranged above two sides of the through groove;

6. The cutting device for crystal processing according to claim 1, wherein a pipeline for connecting the liquid container is provided above the through groove, and a valve is provided on the pipeline.

7. The cutting device for crystal processing according to claim 1, wherein the moving device comprises a motor support plate and a moving plate, the motor support plate is connected with the platform through a column, the motor is fixed on the moving plate, a guide rail is arranged on the motor support plate, and a sliding block which is matched with the guide rail and slides is arranged at the bottom end of the moving plate.

8. The cutting device for crystal processing according to claim 7, wherein the moving device further comprises a third cylinder and a third telescopic rod, an output end of the third cylinder is connected with the third telescopic rod, and one end of the third telescopic rod is fixedly connected with the moving plate.

9. The cutting apparatus for crystal processing according to claim 1, wherein the pressing plate and the platform are made of a high-purity graphite material or a high-purity organic material, and/or

The saw blade is a diamond saw blade.

10. The cutting device for crystal processing according to claim 1, wherein a limit groove is provided on the platform, and the diameter of the limit groove is not less than the diameter of the crystal;

the through groove is communicated with the limiting groove and transversely penetrates through the bottom end of the limiting groove.