CN213635940U

CN213635940U - Wafer adsorption device

Info

Publication number: CN213635940U
Application number: CN202022577622.4U
Authority: CN
Inventors: 许志雄
Original assignee: Xinmi Xiamen Semiconductor Equipment Co ltd
Current assignee: Xinmi Xiamen Semiconductor Equipment Co ltd
Priority date: 2020-11-10
Filing date: 2020-11-10
Publication date: 2021-07-06
Anticipated expiration: 2030-11-10

Abstract

The utility model relates to a wafer adsorption device, which comprises a sucker, a sealing ring, a fixing ring and a ring groove, wherein the fixing ring is fixed on the sucker, an installation cavity is arranged inside the sealing ring, the installation cavity is matched with the fixing ring, the ring groove is arranged below the sealing ring, a sealing cover is fixed in the sucker, the lower part of the sealing cover is connected with the fixing ring, an extrusion groove is fixed above the sealing cover, a bolt is arranged on the sucker, a positioning groove is arranged on the sealing cover, the positioning groove is arranged at the periphery of the extrusion groove, a positioner is fixed in the positioning groove, the bolt penetrates through the sucker, the wafer adsorption device has simple structure and convenient use, the sucker only needs to adsorb a wafer, the air in the sucker is evacuated by utilizing the bolt, a vacuum space is formed between the sucker and the wafer, and the wafer is firmly adsorbed, the device can also detect whether the adsorption is tight and where the non-tight position is when the adsorption is performed.

Description

Wafer adsorption device

Technical Field

The utility model relates to a semiconductor equipment technical field specifically is a wafer adsorption equipment.

Background

As is well known, the existing wafer suction apparatus is an auxiliary apparatus for a semiconductor device, and is widely used in the field of semiconductor device technology.

For example, the patent publication "CN 109817560A" is named as: the patent of "a prevent the wafer adsorption equipment of heat conduction", the patent discloses "the utility model belongs to the semiconductor manufacture field, specifically speaking is a prevent the wafer adsorption equipment of heat conduction, the upper surface of the wafer bearing platform is equipped with inner seal ring and outer seal ring respectively, form the annular vacuum chamber between the inner and outer seal ring, the inside of the inner seal ring is the ordinary pressure chamber; a wafer bearing boss is arranged in the vacuum cavity, and a vacuum hole is formed in the wafer bearing table in the vacuum cavity; the wafer bearing platform in the normal pressure cavity is respectively provided with a demonstration hole and a normal pressure cavity exhaust hole; an annular boss is arranged in an inner hole of the sucker neck at the lower part of the sheet bearing table, the motor shaft is inserted from the inner hole of the sucker neck and is only connected with the annular boss, a motor shaft hollow hole is formed in the motor shaft, one end of the vacuum hole is communicated with the vacuum cavity, and the other end of the vacuum hole is communicated with the motor shaft hollow hole; the wafer is placed on the wafer bearing platform and is supported by the wafer bearing boss, the inner sealing ring and the outer sealing ring, one end of the atmospheric pressure cavity exhaust hole is communicated with the atmospheric pressure cavity, and the other end of the atmospheric pressure cavity exhaust hole is communicated with the atmosphere at the lower part of the wafer bearing platform. The utility model discloses can effectively avoid the wafer temperature variation who is brought by the high-speed rotation of motor ".

The existing wafer adsorption device for preventing heat conduction is characterized in that an annular vacuum cavity is formed between an inner sealing ring and an outer sealing ring by vacuum transmitted from each vacuum hole to achieve the purpose of adsorbing a wafer, a plurality of supporting sheet bosses are arranged between the inner sealing ring and the outer sealing ring to prevent the wafer from deforming due to the pressure difference between the vacuum cavity and the outside, when the wafer is contacted with each supporting sheet boss, the inner sealing ring and the outer sealing ring, a normal pressure cavity is formed inside the inner sealing ring and is not provided with the supporting sheet bosses, the normal pressure cavity is isolated from the contact between the supporting sheet table and the wafer, so that a heat conduction channel is cut off, the upper pressure and the lower pressure of the normal pressure cavity are equal, the wafer cannot deform, and an exhaust hole of the normal pressure cavity plays a role of preventing the wafer from drifting or sticking caused by partial sealing of the normal pressure cavity when the wafer is placed or taken away, and the existing wafer adsorption device for preventing heat conduction is found in use, it can't know whether the wafer is closely absorbed, and the air in the sucker can't be fully exhausted when exhausting, resulting in higher limitation of its use.

SUMMERY OF THE UTILITY MODEL

Technical problem to be solved

Aiming at the defects of the prior art, the utility model designs two schemes to realize stable adsorption to the wafer, the first scheme adopts simple mechanical motion to fix the sealing ring on the fixing ring below the sucker through the mounting cavity, the sucker is utilized to adsorb the wafer, after partial air is discharged by pressing, the bolt is screwed to the lower part by utilizing the handle, the cylinder is arranged below the bolt to extrude the extrusion groove on the sealing cover in the sucker, the sealing cover is pressed downwards to discharge the air in the sucker, the device enables the sucker to play an adsorption role to the wafer through the simple mechanical motion, the annular flange is fixed under the auxiliary sealing cover, the annular flange can cause secondary adsorption to the wafer after contacting the wafer, the second scheme adopts electric element adsorption, the vacuum pump arranged on the device can further evacuate the air on the sucker, the device is prevented from being in the moving process because of vibration or other use problems, make the air in the sucking disc fill to some extent, lead to the wafer to drop from the sucking disc, be provided with connecting pipe and protecting wire net in vacuum pump and sucking disc junction simultaneously, be equipped with the protection pad in the protecting wire net, make the device guarantee the security to the wafer when guaranteeing the absorption dynamics when using, the device makes the device guarantee through some electrical components when using to the location accuracy of wafer, provides a simple structure, and economical and practical has protection system's wafer adsorption equipment to the wafer.

(II) technical scheme

In order to achieve the above object, the utility model provides a following technical scheme: wafer adsorption equipment, including sucking disc, sealing washer, solid fixed ring and ring channel, be fixed with solid fixed ring on the sucking disc, the inside installation cavity that is provided with of sealing washer, the installation cavity with gu fixed ring phase-match, the sealing washer below is provided with the ring channel, the sucking disc internal fixation has the sealed cowling, the sealed cowling below with gu fixed ring connects, the sealed cowling top is fixed with the extrusion groove, be provided with the bolt on the sucking disc, be provided with the constant head tank on the sealed cowling, the constant head tank sets up extrusion groove week side, the constant head tank internal fixation has the locator, the bolt runs through the sucking disc.

In order to make the ring channel have great adsorption affinity to the wafer in order to make things convenient for, the utility model discloses the improvement has, the little below in ring channel top is trapezoidal greatly.

In order to conveniently utilize the bolt to go up and down to empty the air in the sucking disc, the utility model discloses the improvement has, the bolt other end is fixed with the handle.

In order to facilitate the grip to be clamped, the utility model discloses the improvement has, the handle week side is regular polygon.

For the convenience extrudees the extrusion groove, the utility model discloses the improvement has, the bolt below sets up to the cylinder, the cylinder with bolted connection, the cylinder with the extrusion groove phase-match.

In order to further make the sucking disc adsorb the wafer conveniently, the utility model discloses the improvement has, be provided with annular flange in the sealed cowling.

In order to facilitate the stable adsorption, the utility model discloses the improvement has, cyclic annular flange sets up to the multiunit.

In order to know the device to the adsorption affinity size of wafer, the utility model discloses the improvement has, set up in the sealing washer and be fixed with pressure sensor.

Whether the device adsorbs wafer sucking disc edge suction is even for the convenience of understanding, the utility model discloses the improvement has, pressure sensor sets up to the multiunit, pressure sensor even arranges in the sealing washer, pressure sensor sets up the installation cavity with between the ring channel.

For the convenience of reminding the user that the device adsorbs not inseparably, the utility model discloses the improvement has, the attention device includes pilot lamp and bee calling organ, the pilot lamp sets up bee calling organ week side.

In order to prevent the vacuum pump from damaging the device during adsorption, the utility model discloses the improvement has, it has the protection pad to fill in the protection network.

(III) advantageous effects

Compared with the prior art, the utility model provides a wafer adsorption equipment possesses following beneficial effect:

the wafer adsorption device is simple in structure and convenient to produce and manufacture, a sealing ring is fixed on a fixing ring below a sucker through a mounting cavity, the sucker is used for adsorbing a wafer, after partial air is discharged through mechanical pressing, a bolt is screwed to the lower part through a handle and moves downwards through the bolt, a positioning groove is formed below the bolt, damage caused when a sealing cover is extruded is prevented, the device is more accurately positioned when in use through limitation of the positioning groove, a cylinder is arranged below the bolt and extrudes an extrusion groove on the sealing cover in the sucker, the air in the sucker is discharged through downward pressing of the sealing cover, an annular flange is fixed below the sealing cover, the annular flange can perform secondary adsorption on the wafer after contacting the wafer, the wafer can be better adsorbed through a positioner and a pressure sensor, the sucker can firmly adsorb the wafer through a vacuum pump, the pressure sensor transmits information to a controller, show that position on the display screen does not adsorb firmly, the alarm reports to the police simultaneously, it can be further with the air evacuation on the sucking disc to be provided with the vacuum pump on the device, the effect of vacuum pump makes the device carry out the cubic to the wafer and adsorbs, prevent the device is at the removal in-process, because vibrations or other use problems, make the air in the sucking disc fill to some extent, lead to the wafer to drop from the sucking disc, be provided with connecting pipe and guard net in vacuum pump and sucking disc junction simultaneously, be equipped with sealed the pad in the guard net, guarantee the security to the wafer when making the device when using to guaranteeing the absorption dynamics.

Drawings

FIG. 1 is a schematic structural view of the present invention;

FIG. 2 is a schematic view of a portion of the enlarged structure of FIG. 1;

FIG. 3 is a schematic view of a portion of the enlarged structure of FIG. 1 at B according to the present invention;

fig. 4 is a bottom view of the structure of the present invention;

fig. 5 is a top view of the present invention.

In the figure: 1. a suction cup; 2. a seal ring; 3. a fixing ring; 4. an annular groove; 5. a mounting cavity; 6. a sealing cover; 7. extruding a groove; 8. a bolt; 9. positioning a groove; 10. a positioner; 11. a handle; 12. an annular flange; 13. a pressure sensor; 14. a cylinder; 15. a controller; 16. a display screen; 17. an alarm; 18. an indicator light; 19. a buzzer; 20. a vacuum pump; 21. a connecting pipe; 22. a protection net; 23. and (6) a protective pad.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Please refer to fig. 1-5, a wafer adsorbing device, which comprises a sucker 1, a sealing ring 2, a fixing ring 3 and a ring groove 4, wherein the fixing ring 3 is fixed on the sucker 1, a mounting cavity 5 is arranged inside the sealing ring 2, the mounting cavity 5 is matched with the fixing ring 3, the ring groove 4 is arranged below the sealing ring 2, a sealing cover 6 is fixed in the sucker 1, the lower part of the sealing cover 6 is connected with the fixing ring 3, a squeezing groove 7 is fixed above the sealing cover 6, a bolt 8 is arranged on the sucker 1, a positioning groove 9 is arranged on the sealing cover 6, the positioning groove 9 is arranged on the periphery of the squeezing groove 7, a positioner 10 is fixed in the positioning groove 9, and the bolt 8 penetrates through the sucker 1.

The upper part of the annular groove 4 is smaller, and the lower part of the annular groove 4 is larger in trapezoid shape, so that the annular groove 4 can have larger adsorption force on the wafer conveniently.

And a handle 11 is fixed at the other end of the bolt 8, so that the air in the suction cup 1 can be emptied by lifting the bolt 8 conveniently.

The periphery of the handle 11 is a regular polygon, so that the handle 11 is clamped conveniently.

The lower part of the bolt 8 is provided with a cylinder 14, the cylinder 14 is connected with the bolt 8, and the cylinder 14 is matched with the extrusion groove 7 so as to extrude the extrusion groove 7 conveniently.

An annular flange 12 is arranged in the sealing cover 6, so that the sucker 1 can further adsorb the wafer conveniently.

The annular flanges 12 are arranged in multiple groups, so that the adsorption is stable.

And a pressure sensor 13 is fixedly arranged in the sealing ring 2, so that the adsorption force of the device on the wafer can be known.

Pressure sensor 13 sets up to the multiunit, pressure sensor 13 is even arranges in sealing washer 2, pressure sensor 13 sets up installation cavity 5 with between the ring channel 4, whether the edge suction of device absorption wafer sucking disc 1 is even for the convenience of understanding.

The alarm 17 comprises an indicator light 18 and a buzzer 19, wherein the indicator light 18 is arranged on the periphery of the buzzer 19, so that the device is not tightly adsorbed for reminding a user.

The protective net 22 is filled with a protective pad 23 to prevent the vacuum pump 20 from damaging the device during suction.

In summary, in the wafer adsorbing device, when in use, the seal ring 2 is fixed on the fixing ring 3 below the sucker 1 through the mounting cavity 5, the sucker 1 adsorbs a wafer, after partial air is discharged by pressing, the bolt 8 is screwed to the lower part through the handle 11, the column 14 is arranged below the bolt 8 to press the extrusion groove 7 on the sealing cover 6 in the sucker 1, the sealing cover 6 presses down to discharge the air in the sucker 1, the device enables the sucker 1 to adsorb the wafer through simple mechanical movement, the annular flange 12 is fixed below the sealing cover 6, the annular flange 12 can cause secondary adsorption to the wafer after contacting the wafer, the wafer can be better adsorbed through the positioner 10 and the pressure sensor 13, the sucker 1 can firmly adsorb the wafer through the vacuum pump 20, the pressure sensor 13 transmits information to the controller 15, and the display screen 16 shows that a position is not firmly adsorbed, meanwhile, the alarm 17 gives an alarm, the vacuum pump 20 arranged on the device can further evacuate the air on the sucker 1, so that the device is prevented from being damaged in the moving process, the air in the chuck 1 is filled due to vibration or other use problems, causing the wafer to fall off the chuck 1, meanwhile, a connecting pipe 21 and a protective net 22 are arranged at the joint of the vacuum pump 20 and the suction cup 1, the protective pad 23 is arranged in the protective net 22, so that the device can ensure the adsorption force and the safety of the wafer when in use, the device can ensure the accurate positioning of the wafer when in use through some electric elements, through the cooperation of the pressure sensor 13 and the display screen 16 on the controller 15, the wafer is better and more intelligently adsorbed, meanwhile, the position of the wafer which is not fixed can be conveniently known, the device is matched with the vacuum pump 20, the wafer can be conveniently and further adsorbed, and triple adsorption can be carried out on the wafer by adopting the device.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. Wafer adsorption equipment, including sucking disc (1), sealing washer (2), solid fixed ring (3) and ring channel (4), its characterized in that: the novel vacuum cleaner is characterized in that a fixing ring (3) is fixed on the sucker (1), a mounting cavity (5) is arranged inside the sealing ring (2), the mounting cavity (5) is matched with the fixing ring (3), an annular groove (4) is arranged below the sealing ring (2), a sealing cover (6) is fixed in the sucker (1), the sealing cover (6) is connected with the fixing ring (3) below, a squeezing groove (7) is fixed above the sealing cover (6), a bolt (8) is arranged on the sucker (1), a positioning groove (9) is arranged on the sealing cover (6), the positioning groove (9) is arranged on the periphery side of the squeezing groove (7), a positioner (10) is fixed in the positioning groove (9), the bolt (8) penetrates through the sucker (1), a controller (15) is arranged on one side of the sucker (1), a display screen (16) is fixed on one side of the controller (15), display screen (16) opposite side is fixed with attention device (17), display screen (16) with attention device (17) are connected, the opposite side is provided with vacuum pump (20) on sucking disc (1), vacuum pump (20) through connecting pipe (21) with sucking disc (1) are connected, connecting pipe (21) with sucking disc (1) junction is fixed with protection network (22), vacuum pump (20) with controller (15) are connected.

2. The wafer adsorption device of claim 1, wherein: the upper part of the annular groove (4) is smaller, and the lower part of the annular groove is larger and trapezoidal.

3. The wafer adsorption device of claim 1, wherein: and a handle (11) is fixed at the other end of the bolt (8).

4. The wafer adsorption device of claim 3, wherein: the periphery of the handle (11) is in a regular polygon shape.

5. The wafer adsorption device of claim 1, wherein: the lower part of the bolt (8) is provided with a cylinder (14), the cylinder (14) is connected with the bolt (8), and the cylinder (14) is matched with the extrusion groove (7).

6. The wafer adsorption device of claim 1, wherein: an annular flange (12) is arranged in the sealing cover (6).

7. The wafer adsorption device of claim 6, wherein: the annular flanges (12) are arranged in groups.

8. The wafer adsorption device of claim 1, wherein: and a pressure sensor (13) is fixedly arranged in the sealing ring (2).

9. The wafer adsorption device of claim 8, wherein: the pressure sensors (13) are arranged into a plurality of groups, the pressure sensors (13) are uniformly arranged in the sealing ring (2), and the pressure sensors (13) are arranged between the mounting cavity (5) and the annular groove (4).

10. The wafer adsorption device of claim 1, wherein: the alarm (17) comprises an indicator light (18) and a buzzer (19), and the indicator light (18) is arranged on the periphery side of the buzzer (19); and the protection net (22) is filled with a protection pad (23).