CN213634416U

CN213634416U - Integrated power module with good heat dissipation

Info

Publication number: CN213634416U
Application number: CN202023194479.7U
Authority: CN
Inventors: 黄静; 陈晓斌
Original assignee: Shenzhen Guowei Power Technology Co ltd
Current assignee: Shenzhen Guowei Power Technology Co ltd
Priority date: 2020-12-25
Filing date: 2020-12-25
Publication date: 2021-07-06
Anticipated expiration: 2030-12-25

Abstract

The utility model provides a good power module of integration heat dissipation relates to power module technical field, including circuit board and fixing device, the top of circuit board is provided with the body, and the good power module of body for integration heat dissipation, fixing device are located the upper surface setting of circuit board. The utility model discloses, when fixed body, place the body in the mounting bracket, immediately to the direction pulling pull block of keeping away from fixed frame, pull block passes through bolt extrusion spring, the deformation of spring atress produces elasticity, the surface that rotates fixed frame and mounting bracket offsets, loosen the pull block afterwards, the spring loses the constraint and drives the bolt and reset, the welding is passed through when the installation to most power module on the market at present, fix on the circuit board, when the body damages when needing the maintenance, be difficult to dismantle, can't maintain the body, the above-mentioned problem has been avoided and the ease for use of equipment has been improved in the application of this device.

Description

Integrated power module with good heat dissipation

Technical Field

The utility model relates to a power module technical field especially relates to a power module that integration heat dissipation is good.

Background

The power supply module is a power supply device which can be directly attached to a printed circuit board and is characterized by supplying power to an application specific integrated circuit, a digital signal processor, a microprocessor, a memory, a field programmable gate array and other digital or analog loads.

Most power modules on the market are fixed on a circuit board through welding when being installed, and when the body is damaged and needs to be maintained, the power modules are difficult to detach, the body cannot be maintained, and improvement is needed.

SUMMERY OF THE UTILITY MODEL

The utility model aims at solving the defects existing in the prior art and providing an integrated power module with good heat dissipation.

In order to achieve the above purpose, the utility model adopts the following technical scheme: a power module with integrated heat dissipation function comprises a circuit board and a fixing device, wherein a body is arranged above the circuit board, the body is the power module with integrated heat dissipation function, the fixing device is arranged on the upper surface of the circuit board and comprises a mounting frame, the mounting frame is fixedly connected with the upper surface of the circuit board, the body is arranged in the mounting frame, the upper surface of the mounting frame is fixedly connected with two symmetrically arranged mounting blocks, the inner wall of each mounting block is rotatably connected with a fixing frame, the surface of the fixing frame is fixedly connected with two lugs arranged in a mirror image mode, the inner walls of the lugs are slidably connected with a bolt, one end, close to the circuit board, of the bolt penetrates through the fixing frame and is inserted into the body to abut against the inner wall of the fixing frame, one end, far away from the fixing frame, of the bolt is fixedly connected with, one end of the spring, which is far away from the fixed frame, is fixedly connected with the inner wall of the convex block.

Preferably, one side fixedly connected with stopper that the installation piece was kept away from to fixed frame, the spout has been seted up to the upper surface of mounting bracket, and the inner wall sliding connection of spout has the slider, the one end that the mounting bracket was kept away from to the slider inserts in the stopper and offsets rather than the inner wall.

Preferably, the fixing frame is matched with the body, and the lower surface of the fixing frame is abutted to the surface of the body.

Preferably, the upper surface of the circuit board is provided with a heat dissipation device, and the heat dissipation device is matched with the body.

Preferably, the heat dissipation device includes a moving groove, the moving groove is located on the upper surface of the circuit board, a moving block is connected to the inner wall of the moving groove in a sliding manner, a micro fan is fixedly connected to one end, far away from the circuit board, of the moving block, and a rotating blade is connected to the inner wall of the micro fan in a rotating manner.

Preferably, the two sides of the moving block are fixedly connected with mounting plates, the inner wall of each mounting plate is in threaded connection with a bolt, and one end, far away from the micro fan, of each bolt abuts against the circuit board.

Compared with the prior art, the utility model has the advantages and positive effects that,

1. the utility model discloses in, through setting up fixing device, when fixed body, place the body in the mounting bracket, draw the piece to the direction pulling of keeping away from fixed frame immediately, draw the piece to pass through bolt extrusion spring, spring atress deformation produces elasticity, the surface of rotating fixed frame and mounting bracket offsets, loosen the piece of drawing afterwards, the spring loses the constraint and drives the bolt and resets, the bolt resets and runs through fixed frame and offsets with the body, slide the slider in the spout immediately, the one end of keeping away from the mounting bracket with the slider is inserted and is accomplished the fixing to the body in the stopper, most power module passes through the welding when the installation on the market at present, fix on the circuit board, when the body damages needs the maintenance, be difficult to dismantle, can't maintain the body, the above-mentioned problem has been avoided in the application of this device and the ease for.

2. The utility model discloses in, through setting up heat abstractor, when dispelling the heat to the body, it makes its restriction of loosening the movable block to twist the bolt, promote the movable block to the direction that is close to the body immediately, remove miniature fan to suitable position, reverse twisting the movable rod, when the threaded rod offsets with the surface of circuit board, fix the movable block through the mounting panel, open miniature fan immediately, the fan dispels the heat to the body, at present most power module on the market is at the during operation, the inner part is in the state of high load function, long-time high load function easily leads to power module to generate heat, thereby the condition that the power burns out appears, the above-mentioned problem has been avoided in the application of this device and the stability of equipment has been improved.

Drawings

Fig. 1 is a schematic perspective view of a power module with integrated heat dissipation of the present invention;

fig. 2 is an exploded view of a fixing device in an integrated power module with good heat dissipation;

fig. 3 is a schematic structural diagram of a position a in fig. 2 in the power module with integrated heat dissipation;

fig. 4 is a schematic structural diagram of a portion B in fig. 2 of the power module with integrated heat dissipation according to the present invention;

fig. 5 is a schematic structural view of the heat dissipation device in the power module with integrated heat dissipation function.

Illustration of the drawings: 1. a circuit board; 2. a body; 3. a fixing device; 31. a mounting frame; 32. mounting blocks; 33. a fixing frame; 34. a bump; 35. a bolt; 36. a spring; 37. pulling the block; 38. a limiting block; 39. a slider; 4. a heat sink; 41. a moving groove; 42. a moving block; 43. a micro fan; 44. rotating the blades; 45. mounting a plate; 46. and (4) bolts.

Detailed Description

In order to make the above objects, features and advantages of the present invention more clearly understood, the present invention will be further described with reference to the accompanying drawings and examples. It should be noted that the embodiments and features of the embodiments of the present application may be combined with each other without conflict.

In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention, however, the present invention may be practiced in other ways than those specifically described herein, and therefore the present invention is not limited to the limitations of the specific embodiments of the present disclosure.

Embodiment 1, as shown in fig. 1-5, the utility model provides a good power module of integration heat dissipation, including circuit board 1 and fixing device 3, the top of circuit board 1 is provided with body 2, and body 2 is the good power module of integration heat dissipation, and fixing device 3 is located the upper surface setting of circuit board 1.

The specific arrangement and function of the fixing means 3 and the heat dissipating means 4 will be described in detail below.

As shown in fig. 1 and 4, the fixing device 3 includes a mounting frame 31, the mounting frame 31 is fixedly connected to the upper surface of the circuit board 1, the body 2 is located in the mounting frame 31, two symmetrically arranged mounting blocks 32 are fixedly connected to the upper surface of the mounting frame 31, a fixing frame 33 is rotatably connected to the inner wall of the mounting blocks 32, two projections 34 arranged in a mirror image manner are fixedly connected to the surface of the fixing frame 33, a bolt 35 is slidably connected to the inner wall of the projection 34, one end of the bolt 35 close to the circuit board 1 penetrates through the fixing frame 33 and is inserted into the body 2 to abut against the inner wall thereof, one end of the bolt 35 far from the fixing frame 33 is fixedly connected to a pull block 37, a spring 36 is fixedly connected to the surface of the bolt 35, one end of the spring 36 far from the fixing frame 33 is fixedly connected to the inner wall of the projection 34, one side, and the inner wall sliding connection of spout has slider 39, and the slider 39 is kept away from the one end of mounting bracket 31 and is inserted in stopper 38 and rather than the inner wall and offset, and fixed frame 33 and body 2 looks adaptation, and the lower surface of fixed frame 33 and the surface of body 2 offset.

The whole fixing device 3 achieves the effect that when the body 2 is fixed, the body 2 is placed in the mounting frame 31, the pulling block 37 is pulled in the direction far away from the fixing frame 33, the pulling block 37 extrudes the spring 36 through the bolt 35, the spring 36 is deformed under the stress to generate elasticity, the fixing frame 33 is rotated to be abutted against the surface of the mounting frame 31, then the pulling block 37 is loosened, the spring 36 loses the constraint to drive the bolt 35 to reset, the bolt 35 resets to penetrate through the fixing frame 33 and be abutted against the body 2, the sliding block 39 slides in the sliding groove, one end of the sliding block 39 far away from the mounting frame 31 is inserted into the limiting block 38 to complete the fixing of the body 2, most power supply modules in the market are fixed on the circuit board 1 through welding during the, when the body 2 damages and needs to be maintained, the disassembly is difficult, the body 2 can not be maintained, the application of the device avoids the problems and improves the usability of the equipment.

As shown in fig. 1 and 5, a heat dissipation device 4 is disposed on an upper surface of the circuit board 1, the heat dissipation device 4 is adapted to the body 2, the heat dissipation device 4 includes a moving groove 41, the moving groove 41 is disposed on the upper surface of the circuit board 1, a moving block 42 is slidably connected to an inner wall of the moving groove 41, a micro fan 43 is fixedly connected to one end of the moving block 42 away from the circuit board 1, a rotating blade 44 is rotatably connected to an inner wall of the micro fan 43, mounting plates 45 are fixedly connected to two sides of the moving block 42, a bolt 46 is connected to an inner wall of the mounting plates 45 through a thread, and one end of the bolt 46 away from the.

The whole heat dissipation device 4 achieves the effect that when the body 2 is cooled, the bolt 46 is screwed to loosen the limit of the movable block 42, the movable block 42 is pushed towards the direction close to the body 2, the micro fan 43 is moved to a proper position, the threaded rod is screwed reversely, when the threaded rod abuts against the surface of the circuit board 1, the movable block 42 is fixed through the mounting plate 45, the micro fan 43 is opened immediately, the fan cools the body 2, most of power modules on the market at present are in a high-load operation state, the power modules are easy to generate heat due to long-time high-load operation, and therefore the power source is burnt.

In embodiment 2, unlike embodiment 1, as shown in fig. 5, mounting plates 45 are fixedly connected to both sides of the moving block 42, bolts 46 are screwed to the inner walls of the mounting plates 45, and one ends of the bolts 46, which are away from the micro fans 43, are abutted against the circuit board 1.

The integral working principle is that when the body 2 is fixed, the body 2 is placed in the mounting frame 31, the pull block 37 is pulled in the direction far away from the fixed frame 33, the pull block 37 extrudes the spring 36 through the bolt 35, the spring 36 is stressed and deformed to generate elasticity, the fixed frame 33 is rotated to abut against the surface of the mounting frame 31, then the pull block 37 is loosened, the spring 36 loses constraint to drive the bolt 35 to reset, the bolt 35 resets to penetrate through the fixed frame 33 and abut against the body 2, the slide block 39 slides in the sliding groove, one end of the slide block 39 far away from the mounting frame 31 is inserted into the limiting block 38 to complete the fixation of the body 2, most power modules on the market are fixed on the circuit board 1 through welding during installation, when the body 2 is damaged and needs maintenance, the disassembly is difficult, the body 2 cannot be maintained, the application of the device avoids the problems and improves the usability of the device, when the body 2 is cooled, the bolt 46 is screwed to loosen the limit of the moving block 42, the moving block 42 is pushed to the direction close to the body 2, the micro fan 43 is moved to a proper position, the threaded rod is screwed reversely, when the threaded rod abuts against the surface of the circuit board 1, the moving block 42 is fixed through the mounting plate 45, the micro fan 43 is turned on immediately, the fan cools the body 2, most of power modules in the market at present are in a high-load operation state, the power modules are prone to heating due to long-time high-load operation, and therefore the power supply is burnt.

The above description is only a preferred embodiment of the present invention, and is not intended to limit the present invention in other forms, and any person skilled in the art may use the above-mentioned technical contents to change or modify the equivalent embodiment into equivalent changes and apply to other fields, but any simple modification, equivalent change and modification made to the above embodiments according to the technical matters of the present invention will still fall within the protection scope of the technical solution of the present invention.

Claims

1. The utility model provides a good power module of integration heat dissipation, includes circuit board (1) and fixing device (3), its characterized in that: a body (2) is arranged above the circuit board (1), the body (2) is an integrated power module with good heat dissipation, and the fixing device (3) is arranged on the upper surface of the circuit board (1);

the fixing device (3) comprises a mounting rack (31), the mounting rack (31) is fixedly connected with the upper surface of the circuit board (1), the body (2) is positioned in the mounting rack (31), the upper surface of the mounting rack (31) is fixedly connected with two symmetrically arranged mounting blocks (32), the inner wall of the mounting block (32) is rotatably connected with a fixed frame (33), the surface of the fixed frame (33) is fixedly connected with two convex blocks (34) which are arranged in a mirror image manner, the inner wall of the convex block (34) is connected with a bolt (35) in a sliding way, one end of the bolt (35) close to the circuit board (1) penetrates through the fixing frame (33) and is inserted into the body (2) to be propped against the inner wall of the body, one end of the bolt (35) far away from the fixed frame (33) is fixedly connected with a pull block (37), the fixed surface of bolt (35) is connected with spring (36), the one end that fixed frame (33) was kept away from in spring (36) is connected with the inner wall fixed connection of lug (34).

2. The power module with good integrated heat dissipation of claim 1, wherein: one side fixedly connected with stopper (38) of installation piece (32) is kept away from to fixed frame (33), the spout has been seted up to the upper surface of mounting bracket (31), and the inner wall sliding connection of spout has slider (39), the one end that mounting bracket (31) were kept away from in slider (39) inserts stopper (38) and offsets rather than the inner wall.

3. The power module with good integrated heat dissipation of claim 1, wherein: the fixed frame (33) is matched with the body (2), and the lower surface of the fixed frame (33) is abutted to the surface of the body (2).

4. The power module with good integrated heat dissipation of claim 1, wherein: the upper surface of the circuit board (1) is provided with a heat dissipation device (4), and the heat dissipation device (4) is matched with the body (2).

5. The power module with good integrated heat dissipation of claim 4, wherein: the heat dissipation device (4) comprises a moving groove (41), the moving groove (41) is located on the upper surface of the circuit board (1), a moving block (42) is connected to the inner wall of the moving groove (41) in a sliding mode, a micro fan (43) is fixedly connected to one end, far away from the circuit board (1), of the moving block (42), and a rotating blade (44) is connected to the inner wall of the micro fan (43) in a rotating mode.

6. The power module with good integrated heat dissipation of claim 5, wherein: the two sides of the moving block (42) are fixedly connected with mounting plates (45), the inner wall of each mounting plate (45) is in threaded connection with a bolt (46), and one end, far away from the micro fan (43), of each bolt (46) abuts against the circuit board (1).