CN213616018U - Mirror surface grinding machine of semiconductor thimble - Google Patents
Mirror surface grinding machine of semiconductor thimble Download PDFInfo
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- CN213616018U CN213616018U CN202022543245.2U CN202022543245U CN213616018U CN 213616018 U CN213616018 U CN 213616018U CN 202022543245 U CN202022543245 U CN 202022543245U CN 213616018 U CN213616018 U CN 213616018U
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Abstract
The utility model relates to the technical field of grinding machines, in particular to a mirror surface grinding machine for a semiconductor thimble, which can effectively filter and purify dust generated in the grinding process, reduce the harm to people and improve the use safety; including first link, the workstation, the pneumatic cylinder, first abrasive disc, the second abrasive disc, handle case and two sets of solution pumps, the bottom left side of first link is provided with first link, the bottom of first link is connected with the top left side of workstation, the top right side of workstation is provided with the third link, the top of third link is connected with the bottom right side of first link, be provided with control panel on the third link, the pneumatic cylinder is installed on first link, the bottom of pneumatic cylinder is provided with the motor, the bottom output of motor is provided with the mounting bracket, first abrasive disc is installed on the mounting bracket, the bottom of second abrasive disc is connected with the top of workstation, be provided with the fixed slot on the second abrasive disc.
Description
Technical Field
The utility model relates to a grind the technical field of machine, especially relate to a mirror surface of semiconductor thimble grinds machine.
Background
A mirror surface grinder for a semiconductor thimble is a grinding auxiliary device for a semiconductor thimble, which is widely used in the field of grinders; the existing mirror surface grinding machine for the semiconductor ejector pin is found to generate certain dust in the grinding process of materials, and the dust causes great damage to the health of surrounding workers and is poor in use safety.
SUMMERY OF THE UTILITY MODEL
In order to solve the technical problem, the utility model provides a can carry out effective filtration to the dust that produces in the grinding course of working, reduce its harm that causes the people, improve the mirror surface grinding machine of semiconductor thimble of safety in utilization.
The utility model relates to a mirror surface grinding machine for semiconductor thimbles, which comprises a first connecting frame, a workbench, a hydraulic cylinder, a first grinding disc, a second grinding disc, a processing box and two groups of solution pumps, wherein the left side of the bottom end of the first connecting frame is provided with a second connecting frame, the bottom end of the second connecting frame is connected with the left side of the top end of the workbench, the right side of the top end of the workbench is provided with a third connecting frame, the top end of the third connecting frame is connected with the right side of the bottom end of the first connecting frame, the third connecting frame is provided with a control panel, the hydraulic cylinder is arranged on the first connecting frame, the bottom end of the hydraulic cylinder is provided with a motor, the bottom output end of the motor is provided with a mounting frame, the first grinding disc is arranged on the mounting frame, the bottom end of the second grinding disc is connected with the top end of the workbench, the second grinding disc is provided with a fixing groove, and the left front, the bottom of four groups of supports all is connected with the top of first link, the inside of handling the case is provided with the working chamber, the top left side intercommunication of working chamber is provided with the inlet tube, the bottom of two sets of solution pumps all is connected with the top of first link, and two sets of solution pumps all are located the front side of handling the case, the output of two sets of solution pumps all communicates and is provided with first air duct, the output of two sets of first air ducts passes respectively and handles both ends about the case and all stretch into to the working chamber of handling the case, the bottom input of two sets of solution pumps all communicates and is provided with the second air duct, the equal top-down of bottom input of two sets of second air ducts passes first link, the bottom input of two sets of second air ducts all communicates and is provided with the gas guide tank, the bottom input of two sets of gas guide.
The utility model discloses a mirror surface of semiconductor thimble grinds machine still includes two sets of first mounts, two sets of second mounts, two sets of third mounts and two sets of fourth mounts, and two sets of first air ducts are connected with the top of the interior outer wall of handling the case and first link through two sets of first mounts, two sets of second mounts and two sets of third mounts respectively, and two sets of air ducts are connected with third link and pneumatic cylinder through two sets of fourth mounts respectively.
The utility model discloses a mirror surface of semiconductor thimble grinds machine still includes the pipe cap, and the pipe cap suit is provided with the multiunit air vent in the top input outside of inlet tube on the pipe cap.
The utility model discloses a mirror surface of semiconductor thimble grinds machine still includes the multiunit telescopic link, and the top of multiunit telescopic link all is connected with the bottom of mounting bracket.
The utility model discloses a mirror surface of semiconductor thimble grinds machine all is provided with the spring on the multiunit telescopic link.
The utility model discloses a mirror surface of semiconductor thimble grinds machine, the inside of workstation is provided with the cavity, and the front end of cavity is provided with the opening, is provided with the chamber door in the opening, and the front end of chamber door is provided with two sets of handles.
The utility model discloses a mirror surface of semiconductor thimble grinds machine, the left front side, left rear side, right front side and the right rear side of workstation bottom all are provided with the gyro wheel.
Compared with the prior art, the beneficial effects of the utility model are that: firstly, filter liquid is poured into a working cavity of a processing box through a water inlet pipe, then materials are placed in a fixing groove of a second grinding disc for fixing, then a motor is started, the motor drives the first grinding disc to rotate, then a hydraulic cylinder is started, the hydraulic cylinder drives the rotating first grinding disc to descend for grinding the materials, then two groups of solution pumps are started, the two groups of solution pumps suck dust generated in the grinding process into two groups of air guide tanks through a plurality of groups of air inlet pipes, then dust gas in the two groups of air guide tanks is sucked into the filter liquid in the working cavity of the processing box through two groups of second air guide pipes and two groups of first air guide pipes, then dust particles are adsorbed and filtered through the filter liquid, and finally the filtered clean gas is discharged through the water inlet pipe, so that the dust generated in the grinding process can be effectively filtered and purified, and the harm to people is reduced, the use safety is improved.
Drawings
Fig. 1 is a schematic structural diagram of the present invention;
FIG. 2 is an enlarged schematic view of the connection of the cap with the inlet tube;
FIG. 3 is an enlarged schematic view of the connection between the telescopic rod and the spring;
in the drawings, the reference numbers: 1. a first connecting frame; 2. a second link frame; 3. a work table; 4. a third connecting frame; 5. a hydraulic cylinder; 6. a motor; 7. a first abrasive disk; 8. a second abrasive disk; 9. A treatment tank; 10. a support; 11. a water inlet pipe; 12. a solution pump; 13. a first air duct; 14. A second air duct; 15. a gas guide tank; 16. an air inlet pipe; 17. a first fixing frame; 18. a second fixing frame; 19. a third fixing frame; 20. a fourth fixing frame; 21. a pipe cap; 22. a telescopic rod; 23. a spring; 24. a box door; 25. a handle; 26. and a roller.
Detailed Description
The following detailed description of the embodiments of the present invention is provided with reference to the accompanying drawings and examples. The following examples are intended to illustrate the invention, but are not intended to limit the scope of the invention.
As shown in figures 1 to 3, the mirror surface grinding machine for semiconductor thimbles of the utility model comprises a first connecting frame 1, a workbench 3, a hydraulic cylinder 5, a first grinding disc 7, a second grinding disc 8, a processing box 9 and two groups of solution pumps 12, wherein the left side of the bottom end of the first connecting frame 1 is provided with a second connecting frame 2, the bottom end of the second connecting frame 2 is connected with the left side of the top end of the workbench 3, the right side of the top end of the workbench 3 is provided with a third connecting frame 4, the top end of the third connecting frame 4 is connected with the right side of the bottom end of the first connecting frame 1, the third connecting frame 4 is provided with a control panel, the hydraulic cylinder 5 is arranged on the first connecting frame 1, the bottom end of the hydraulic cylinder 5 is provided with a motor 6, the bottom output end of the motor 6 is provided with a mounting frame, the first grinding disc 7 is arranged on the mounting frame, the bottom end of the second grinding disc 8 is connected with the top end, the left front side, the left rear side, the right front side and the right rear side of the bottom end of the treatment box 9 are all provided with a bracket 10, the bottom ends of four groups of brackets 10 are all connected with the top end of a first connecting frame 1, the inside of the treatment box 9 is provided with a working cavity, the left side of the top end of the working cavity is communicated with a water inlet pipe 11, the bottom ends of two groups of solution pumps 12 are all connected with the top end of the first connecting frame 1, the two groups of solution pumps 12 are all positioned at the front side of the treatment box 9, the output ends of the two groups of solution pumps 12 are all communicated with a first air duct 13, the output ends of the two groups of first air ducts 13 respectively penetrate through the left end and the right end of the treatment box 9 and respectively extend into the working cavity of the treatment box 9, the bottom input ends of the two groups of solution pumps 12 are all communicated with a second air duct 14, the bottom input ends of the two groups of second, the bottom input ends of the two groups of air guide tanks 15 are respectively communicated with a plurality of groups of air inlet pipes 16; firstly, filter liquid is poured into a working cavity of a processing box through a water inlet pipe, then materials are placed in a fixing groove of a second grinding disc for fixing, then a motor is started, the motor drives the first grinding disc to rotate, then a hydraulic cylinder is started, the hydraulic cylinder drives the rotating first grinding disc to descend for grinding the materials, then two groups of solution pumps are started, the two groups of solution pumps suck dust generated in the grinding process into two groups of air guide tanks through a plurality of groups of air inlet pipes, then dust gas in the two groups of air guide tanks is sucked into the filter liquid in the working cavity of the processing box through two groups of second air guide pipes and two groups of first air guide pipes, then dust particles are adsorbed and filtered through the filter liquid, and finally the filtered clean gas is discharged through the water inlet pipe, so that the dust generated in the grinding process can be effectively filtered and purified, and the harm to people is reduced, the use safety is improved.
The utility model discloses a mirror surface grinding machine of semiconductor thimble, still include two sets of first mounts 17, two sets of second mounts 18, two sets of third mounts 19 and two sets of fourth mounts 20, two sets of first air ducts 13 are connected with the interior outer wall of processing box 9 and the top of first link 1 through two sets of first mounts 17, two sets of second mounts 18 and two sets of third mounts 19 respectively, two sets of air guide tanks 15 are connected with third link 4 and pneumatic cylinder 5 through two sets of fourth mounts 20 respectively; through setting up two sets of first mounts of installation, two sets of second mounts, two sets of third mounts and two sets of fourth mounts, effectively strengthen the fixed and support to two sets of first air ducts and two sets of air guide tanks, improve stability in use.
The utility model discloses a mirror surface grinding machine of a semiconductor thimble, which also comprises a pipe cap 21, wherein the pipe cap 21 is sleeved outside the input end at the top of the water inlet pipe 11, and a plurality of groups of vent holes are arranged on the pipe cap 21; through setting up the pipe cap, effectively prevent that outside foreign matter from the work intracavity of inlet tube into the processing case, improve stability in use.
The utility model discloses a mirror surface grinding machine for semiconductor thimbles, which also comprises a plurality of groups of telescopic rods 22, wherein the top ends of the groups of telescopic rods 22 are all connected with the bottom of the mounting rack; through setting up the multiunit telescopic link, can play the guard action to the second abrasive disc at first abrasive disc decline in-process, improve stability in use.
In the mirror surface grinding machine for the semiconductor thimble, the plurality of groups of telescopic rods 22 are all provided with springs 23; through setting up the multiunit spring, effectively strengthen the elasticity and the toughness of multiunit telescopic link, improve the stability in use.
The utility model discloses a mirror surface grinding machine of a semiconductor thimble, the inside of the working table 3 is provided with a cavity, the front end of the cavity is provided with an opening, a box door 24 is arranged in the opening, and the front end of the box door 24 is provided with two groups of handles 25; the material of accomplishing processing can be accomodate through the cavity of workstation and place to through setting up the chamber door, reduce external dust and get into in to the cavity of workstation, improve the practicality.
The utility model discloses a mirror surface grinding machine for a semiconductor thimble, wherein the left front side, the left rear side, the right front side and the right rear side of the bottom end of a workbench 3 are all provided with rollers 26; through setting up four groups of gyro wheels, be convenient for remove whole suitable position, improve the convenience of use.
The utility model relates to a mirror surface grinding machine for semiconductor thimbles, when in work, filtrate is poured into a working cavity of a processing box through a water inlet pipe, then materials are placed in a fixed groove of a second grinding disc for fixing, then starting the motor, the motor drives the first grinding disc to rotate, then starting the hydraulic cylinder, the hydraulic cylinder drives the rotating first grinding disc to descend, grinding the materials, starting two groups of solution pumps, sucking dust generated in the grinding process into two groups of gas guide tanks through a plurality of groups of gas inlet pipes, sucking dust gas in the two groups of gas guide tanks into the filtrate in the working cavity of the treatment box through two groups of second gas guide pipes and two groups of first gas guide pipes, then the dust particles are adsorbed and filtered by the filter liquid, and finally the filtered clean gas is discharged through a plurality of groups of vent holes of the pipe cap.
The mounting mode, the connection mode or the setting mode of the mirror surface grinding machine for the semiconductor thimble of the utility model are common mechanical modes, and the mirror surface grinding machine can be implemented as long as the beneficial effects can be achieved; the utility model discloses a pneumatic cylinder, motor and solution pump of mirror surface grinding machine of semiconductor thimble are purchase on the market, and this industry technical staff only need according to its subsidiary service instruction install and operate can.
The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, a plurality of modifications and variations can be made without departing from the technical principle of the present invention, and these modifications and variations should also be regarded as the protection scope of the present invention.
Claims (7)
1. A mirror surface grinding machine for a semiconductor thimble is characterized by comprising a first connecting frame (1), a workbench (3), a hydraulic cylinder (5), a first grinding disc (7), a second grinding disc (8), a processing box (9) and two groups of solution pumps (12), wherein the left side of the bottom end of the first connecting frame (1) is provided with a second connecting frame (2), the bottom end of the second connecting frame (2) is connected with the left side of the top end of the workbench (3), the right side of the top end of the workbench (3) is provided with a third connecting frame (4), the top end of the third connecting frame (4) is connected with the right side of the bottom end of the first connecting frame (1), the third connecting frame (4) is provided with a control panel, the hydraulic cylinder (5) is arranged on the first connecting frame (1), the bottom end of the hydraulic cylinder (5) is provided with a motor (6), the output end of the bottom of the motor (6) is provided with a mounting frame, the first grinding disc (7) is arranged, the bottom end of a second grinding disc (8) is connected with the top end of a workbench (3), fixing grooves are arranged on the second grinding disc (8), supports (10) are respectively arranged on the left front side, the left rear side, the right front side and the right rear side of the bottom end of a treatment box (9), the bottom ends of four groups of supports (10) are respectively connected with the top end of a first connecting frame (1), a working cavity is arranged inside the treatment box (9), a water inlet pipe (11) is communicated with the left side of the top end of the working cavity, the bottom ends of two groups of solution pumps (12) are respectively connected with the top end of the first connecting frame (1), the two groups of solution pumps (12) are respectively positioned on the front side of the treatment box (9), the output ends of the two groups of solution pumps (12) are respectively communicated with a first air duct (13), the output ends of the two groups of first air ducts (13) respectively penetrate through the left end and the right end of the treatment box (9) and respectively, the bottom input ends of the two groups of solution pumps (12) are communicated with each other and provided with second air guide pipes (14), the bottom input ends of the two groups of second air guide pipes (14) penetrate through the first connecting frame (1) from top to bottom, the bottom input ends of the two groups of second air guide pipes (14) are communicated with each other and provided with air guide tanks (15), and the bottom input ends of the two groups of air guide tanks (15) are communicated with each other and provided with a plurality of groups of air inlet pipes (16).
2. The mirror grinding machine for semiconductor ejector pins according to claim 1, further comprising two sets of first fixing frames (17), two sets of second fixing frames (18), two sets of third fixing frames (19), and two sets of fourth fixing frames (20), wherein the two sets of first air ducts (13) are respectively connected to the inner and outer walls of the processing box (9) and the top end of the first connecting frame (1) through the two sets of first fixing frames (17), the two sets of second fixing frames (18), and the two sets of third fixing frames (19), and the two sets of air ducts (15) are respectively connected to the third connecting frame (4) and the hydraulic cylinder (5) through the two sets of fourth fixing frames (20).
3. The mirror finishing machine for semiconductor ejector pins according to claim 2, further comprising a cap (21), wherein the cap (21) is fitted over the outside of the top input end of the water inlet pipe (11), and a plurality of sets of ventilation holes are formed in the cap (21).
4. The mirror finishing machine for semiconductor ejector pins according to claim 3, further comprising a plurality of sets of telescopic rods (22), wherein the top ends of the plurality of sets of telescopic rods (22) are connected to the bottom of the mounting frame.
5. The mirror finishing machine for semiconductor ejector pins according to claim 4, wherein the plurality of groups of telescopic rods (22) are provided with springs (23).
6. A mirror finishing machine for semiconductor ejector pins according to claim 5, characterized in that the work table (3) is provided with a chamber therein, the chamber is provided at a front end thereof with an opening, a box door (24) is provided in the opening, and two sets of handles (25) are provided at a front end of the box door (24).
7. The mirror finishing machine for semiconductor ejector pins according to claim 6, wherein rollers (26) are provided on each of the front left side, rear left side, front right side and rear right side of the bottom end of the table (3).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022543245.2U CN213616018U (en) | 2020-11-05 | 2020-11-05 | Mirror surface grinding machine of semiconductor thimble |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022543245.2U CN213616018U (en) | 2020-11-05 | 2020-11-05 | Mirror surface grinding machine of semiconductor thimble |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213616018U true CN213616018U (en) | 2021-07-06 |
Family
ID=76630368
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022543245.2U Active CN213616018U (en) | 2020-11-05 | 2020-11-05 | Mirror surface grinding machine of semiconductor thimble |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213616018U (en) |
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2020
- 2020-11-05 CN CN202022543245.2U patent/CN213616018U/en active Active
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