CN213588679U - Wound therapeutic instrument - Google Patents
Wound therapeutic instrument Download PDFInfo
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- CN213588679U CN213588679U CN202021821158.2U CN202021821158U CN213588679U CN 213588679 U CN213588679 U CN 213588679U CN 202021821158 U CN202021821158 U CN 202021821158U CN 213588679 U CN213588679 U CN 213588679U
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- power supply
- radiator
- water
- water tank
- reversing switch
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Abstract
A wound therapeutic apparatus is composed of power supply system, semiconductor refrigerating unit, connecting tube, water bag and band. The power supply system consists of a lead, a temperature controller, a reversing switch, a power supply bag and a power supply bundling belt. The semiconductor refrigerating device component comprises a semiconductor refrigerating device, a radiator A, a radiator B, a water tank and other parts. The reversing switch changes the current direction of the semiconductor refrigerating device component, so that the semiconductor refrigerating component is in a refrigerating or heating working state. The refrigeration temperature is three levels of 2 ℃, 3 ℃ and 5 ℃. During heating: three temperature ranges of 32 ℃, 36 ℃ and 40 ℃. The radiator B cools or heats water in the water tank and the water bag. The water cooled or heated by these cools or heats the wound. The present invention has: safety, economy, convenient use, small maintenance workload and the like. The method is suitable for all levels of medical units, stadiums, building construction sites and other places which are easy to be wounded.
Description
Technical Field
The utility model belongs to a physical therapy instrument for surgery, in particular to a wound therapy instrument.
Background
Various trauma phenomena often occur in the production, the life and various indoor and outdoor activities of people. The existing method for treating the wound is to firstly carry out cold compress for 12-24 hours and then carry out hot compress for 12-24 hours. Currently, the cold compress method is to use various natural ice and chemical ice bags for cold compress. The hot compress method adopts various electric heating devices for irradiation. The cold compress method by natural ice or chemical ice bag has good therapeutic effect. But needs to be replaced frequently, which is troublesome, especially at night, and sometimes wets the clothes and quilts. The irradiation effect of various electric heating devices is good, but the scalding phenomenon appears from time to time. At present, no wound therapeutic apparatus which can meet the requirements of cold and hot compress treatment of the wounded, has convenient use and moderate price and avoids the occurrence of freezing and scalding is found in the market.
Disclosure of Invention
In order to solve the problem, the utility model provides a wound treatment instrument which can avoid the occurrence of freezing and scalding and can timely relieve the pain of the wound.
A wound therapeutic apparatus is composed of power supply system, semiconductor refrigerating unit, connecting tube, water bag and binding band.
The power supply system consists of a lead, a temperature controller, a reversing switch, a power supply bag and a power supply bundling belt.
The power supply is arranged in the power supply bag; when the reversing switch is positioned at a refrigerating position, the temperature controller controls the 3-gear temperature to be that: 2 ℃, 3 ℃ and 5 ℃; when the reversing switch is positioned at a heating position, the temperature controller controls the 3-gear temperature to be that: 32 ℃, 36 ℃ and 40 ℃.
The power supply is a battery pack or a charger consisting of 3 batteries 18650, the power supply voltage is 5V, and the power is 5W.
Semiconductor refrigeration device subassembly: the refrigerating device comprises a semiconductor refrigerating device, a radiator A, a radiator B, a water tank, a gasket, a screw 1, a screw 2 and a gasket.
The semiconductor refrigerating device is provided with an upper working plane and a lower working plane; when the reversing switch is positioned at a refrigerating position, the upper plane is used for releasing heat, and the lower plane is used for absorbing heat, namely refrigerating.
When the reversing switch is positioned at the heating position, the upper plane absorbs heat and the lower plane generates heat.
The radiator A and the radiator B are made of graphene composite plastic or aluminum alloy; when the radiator A and the radiator B are made of aluminum alloy, the surfaces of the radiating fins are coated with graphene radiating paint.
The water tank consists of a water tank body made of transparent heat-resistant plastics, a screw hole, a support leg and a water outlet nozzle.
The connecting pipe is composed of a nut, a stop valve and a connecting pipe.
The water bag consists of a water bag body made of heat-resistant soft rubber and a hollow stud.
The two ends of the ribbon are provided with the thread gluing which are arranged on the upper and lower planes of the two ends of the ribbon.
Daily keeping: and (4) closing the stop valve to inject purified water accounting for 85% of the total volume of the water tank, the connecting pipe and the water bag into the water tank.
When in use: the center of the water bag of the invention is arranged above the wound of the wounded and is tied by a bandage.
And placing the water tank and the semiconductor refrigeration device assembly above the water bag and the binding belt.
Switching on the power supply, arranging a reversing switch at a refrigerating position, and controlling the temperature at 3 gears of the temperature controller: selecting one temperature from 2 deg.C, 3 deg.C and 5 deg.C. At this time, the semiconductor refrigeration device starts to work, the lower plane of the semiconductor refrigeration device refrigerates, and the upper plane of the semiconductor refrigeration device generates heat. The cold quantity of lower plane cools off the pure water in water tank, connecting pipe and the water bag. After the purified water in the water tank, the connecting pipe and the water bag is cooled down, the water bag cools the wound part of the wound, namely cold therapy. The cold therapy can be as follows: 1. relieving local congestion and bleeding is beneficial to blood coagulation and controlling bleeding. 2. Relieving pain. 3. Controlling the spread of inflammation.
When the cold therapy reaches 24 hours, the reversing switch is arranged at the heating position, and the anode and the cathode of the semiconductor refrigerating device are exchanged. Controlling the temperature from the 3 th gear of the temperature controller: namely, 1-stage temperature selected from 32 ℃, 36 ℃ and 40 ℃. According to the Pair effect, the lower plane of the semiconductor refrigeration device heats and the upper plane cools. The heat of the lower plane heats the purified water in the water tank, the connecting pipe 3 and the water bag 4. The water tank, the connecting pipe and the purified water in the water bag are heated, the temperature is raised, and the water bag is used for heating the wound part of the wound, namely the thermal therapy. The heat treatment can be: 1. promoting resolution and localization of inflammation. 2. Relieving pain. 3. Relieve deep tissue congestion.
The utility model is characterized in that: 1. the voltage of the power supply is safe voltage 5V; 2. the temperature is controlled, and the skin can not be frozen and scalded during refrigeration and heating. 3. The structure is simple, the semiconductor refrigeration device is a standardized product, the radiator A and the radiator B are formed by extrusion, and automation is easy to realize. 4. The utility model discloses use voltage 5V, electric current 5A, power little, when heating semiconductor refrigeration device can also absorb the heat from the environment through the radiator. 5. The use is convenient: when in use, only the following components are needed: the center of the water bag of the utility model is arranged above the wound of the wounded and is tied by the ribbon, and the water tank semiconductor refrigeration device component is arranged above the water bag and the ribbon. 6. The utility model discloses do not have the motion spare part, semiconductor refrigeration device is the ripe product so the maintenance work volume is little again.
Drawings
Fig. 1 is a schematic structural view of the wound therapy apparatus of the present invention.
Fig. 2 is a left side view of fig. 1.
Fig. 3 is a view B-B of fig. 2.
Fig. 4 is a schematic structural diagram of the power supply system of the component 1.
Fig. 5 is a view a-a of fig. 2.
Fig. 6 is a view from C-C of fig. 5.
Fig. 7 is a schematic view of the structure of member 22.
Fig. 8 is a top view of fig. 7.
Fig. 9 is a schematic view of the structure of the member 23.
Fig. 10 is a top view of fig. 9.
Figure 11 is a schematic view of the structure of member 24.
Fig. 12 is a top view of fig. 11.
Fig. 13 is a schematic structural view of the piece 3.
Figure 14 is a top view of the member 4.
In FIGS. 1 to 14:
1-power supply system. 2-semiconductor refrigeration system. 3-connecting pipe. 4-a water bag. And 5-binding the belt. 11-conductive line. 12-temperature controller. 13-a reversing switch. 14-power supply. 15-power pack. 16-power wrap tie.
21-semiconductor refrigeration device.
22-radiator a. 221 fins. 222-radiator bottom plate. 223-radiator floor plane. 224-screw holes.
23-radiator B. 231-fins. 232-radiator bottom plate. 233-radiator floor plane. 234-screw hole. 235-screw hole.
3-connecting pipe. 31 nut. 32-stop valve. 33-connecting tube.
4-a water bag. 41-water bag. 42-hollow nut.
Detailed Description
In order to solve the problem, the utility model provides a wound therapy apparatus which avoids the occurrence of freezing and scalding.
A wound therapeutic apparatus is composed of a power supply system 1, a semiconductor refrigerating device component 2, a connecting pipe 3, a water bag 4 and a binding belt 5.
The power supply system 1 is composed of a lead 11, a temperature controller 12, a reversing switch 13, a power supply 14, a power supply pack 15 and a power supply bundling belt 16.
The reversing switch 13 changes the current direction of the semiconductor refrigerating device component 2 to make the semiconductor refrigerating component in a refrigerating or heating working state
When the reversing switch 13 is in the cooling position, the thermostat 12 can control the 3-gear temperature: 2 ℃, 3 ℃ and 5 ℃.
When the reversing switch 13 is in the heating position, the thermostat 12 can control the 3-gear temperature: 32 ℃, 36 ℃ and 40 ℃.
The power supply 14 is a battery pack composed of 3 batteries 18650, or a charger, and has a power supply voltage of 5V and a power of 5W.
The power source 14 is disposed in a power pack 15, and the power pack 15 has a power strap 16.
The wire 11 connects the power supply 14, the temperature controller 12, the reversing switch 13 and the semiconductor refrigeration device component 2 in series.
The semiconductor refrigeration device assembly 2 is composed of a semiconductor refrigeration device 21, a radiator a22, a radiator B23, a water tank 24, a gasket 25, a screw 26, a screw 27, and a gasket 28.
The semiconductor refrigeration device 21 has two working planes, an upper plane 211 and a lower plane 212.
When the semiconductor cooling device 21 is in a cooling state, the lower plane 212 cools, and the upper plane 211 generates heat. When the semiconductor cooling device 21 is in a heating state. The lower plane 212 generates heat and the upper plane 211 generates cooling.
The heat sink a22 is made of graphene composite plastic or aluminum alloy, and is composed of heat dissipation fins 221, a bottom plate 222, and screw holes 224. 223 is a lower plane of the base plate 222. When the heat sink a22 is made of an aluminum alloy, the surface of the heat dissipation fin 221 must be coated with a graphene heat dissipation coating.
The heat sink B23 is made of an aluminum alloy, and is composed of heat radiating fins 231, a heat sink bottom plate 232, and screw holes 234, 235. 233 is a lower plane of the radiator bottom plate 232.
The water tank 24 is composed of a water tank body 241 made of transparent heat-resistant plastic, a screw hole 242, a leg 243, and a water outlet 244. The volume of the water tank body 241 is smaller than that of the water bag 41. The amount of water injected into the water tank 241 is 80% of the volume of the water tank 241.
The connection pipe 3 is composed of a nut 31, a stop valve 32, and a connection pipe 33.
The water bag 4 is composed of a water bag 41 made of heat-resistant soft rubber and a hollow stud, and the water bag 41 and the hollow stud are connected in a sealing mode.
The two ends of the ribbon seal 5 are provided with thread gluing which are arranged on the upper and lower planes of the two ends of the ribbon 5.
Daily keeping:
the power supply 14 is separate from the conductor 11. The cut-off valve 32 is closed and purified water of 85% of the total volume of the water tank 24, the connection tube 3 and the water bag 4 is filled into the water tank 24.
Working principle and using method
The water bag 4 of the present invention is centered over the wound site of the injured person and tightened with a bandage 5.
The water tank semiconductor refrigeration device assembly 2 is placed over the water bag 4 and the strap 5.
The power is switched on, the reversing switch 13 is arranged at the refrigerating position, and the temperature is controlled from the 3-gear position of the temperature controller 12: selecting one temperature from 2 deg.C, 3 deg.C and 5 deg.C. At this time, the semiconductor cooling device 21 starts to operate, the lower plane 212 of the semiconductor cooling device 21 cools, and the upper plane 211 generates heat. The cold of the lower plane 212 cools the pure water in the water tank 24, the connecting tube 3 and the water bag 4. After the temperature of the purified water in the water tank 24, the connecting pipe 3 and the water bag 4 is reduced, the water bag 4 is used for cooling the wound part of the wound, namely cold therapy. At the same time, the upper plane 211 of the semiconductor refrigeration device 21 generates heat, and the heat of the semiconductor refrigeration device 21 is conducted to the environment through the natural convection heat exchange and the heat radiation with the ambient air through the radiator bottom plate 232 and the heat radiation fins 231. The cold therapy of the wound is realized by the circulation.
When the cold therapy reaches 24 hours, the reversing switch 13 is placed at the heating position, and the anode and the cathode of the semiconductor refrigerating device are exchanged. One temperature is selected from the 3 control temperatures of the thermostat 12, i.e., 32 c, 36 c and 40 c. At this time, the lower plane 212 of the semiconductor cooling device 21 heats and the upper plane 211 cools, according to the parr effect. The heat of the lower plane 212 heats the purified water in the water tank 24, the connection tube 3, and the water bag 4. The water tank 24, the connecting pipe 3 and the purified water in the water bag 4 are heated, and then the temperature is raised, and the water bag 4 is used for heating the wound part of the wound, namely the thermal therapy. Meanwhile, the upper plane 211 of the semiconductor refrigeration device 21 refrigerates, and the cold energy is conducted to the environment through natural convection heat exchange with the ambient air through the radiator bottom plate 232 and the radiating fins 231. The heat treatment to the wound is realized by the circulation.
Claims (5)
1. A wound treatment apparatus, comprising: the device consists of a power supply system, a semiconductor refrigeration device component, a connecting pipe, a water bag and a binding belt; a power supply system: consists of a lead, a temperature controller, a reversing switch, a power supply bag and a power supply bundling belt; when the reversing switch is positioned at a refrigerating position, the temperature controller controls the 3-gear temperature to be that: 2 ℃, 3 ℃ and 5 ℃; when the reversing switch is positioned at a hot and cold position, the temperature controller controls the 3-gear temperature to be that: 32 ℃, 36 ℃ and 40 ℃; semiconductor refrigeration device subassembly: the refrigerating device comprises a semiconductor refrigerating device, a radiator A, a radiator B, a water tank, a gasket, a screw 1, a screw 2 and a gasket.
2. The wound treatment apparatus of claim 1, wherein: the radiator A and the radiator B are made of graphene composite plastic or aluminum alloy.
3. The wound treatment apparatus of claim 1, wherein: the power supply is a 3-section 18650 battery pack or a charger, the power supply voltage is 5V, and the power is 5W.
4. The wound treatment apparatus of claim 1, wherein: the water bag is made of heat-resistant soft rubber.
5. The wound treatment apparatus of claim 1, wherein: the water tank is made of transparent heat-resistant plastic.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021821158.2U CN213588679U (en) | 2020-08-28 | 2020-08-28 | Wound therapeutic instrument |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021821158.2U CN213588679U (en) | 2020-08-28 | 2020-08-28 | Wound therapeutic instrument |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213588679U true CN213588679U (en) | 2021-07-02 |
Family
ID=76585527
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021821158.2U Active CN213588679U (en) | 2020-08-28 | 2020-08-28 | Wound therapeutic instrument |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213588679U (en) |
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2020
- 2020-08-28 CN CN202021821158.2U patent/CN213588679U/en active Active
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