CN213583714U

CN213583714U - Silicon wafer acid etching machine for silicon wafer production

Info

Publication number: CN213583714U
Application number: CN202022819289.3U
Authority: CN
Inventors: 吳凱; 李漢生; 蔡雪良
Original assignee: Kunshan Zhongchen Silicon Crystal Co ltd
Current assignee: Kunshan Zhongchen Silicon Crystal Co ltd; Kunshan Sino Silicon Technology Co Ltd
Priority date: 2020-11-30
Filing date: 2020-11-30
Publication date: 2021-06-29
Anticipated expiration: 2030-11-30

Abstract

The utility model belongs to the technical field of silicon wafer production, especially a silicon wafer acid etching machine for silicon wafer production, to the problem that existing technology can't realize automatic acid etching treatment to silicon wafer, and collecting is troublesome after acid etching is finished, the following scheme is proposed, which comprises an acid etching machine main body, a hollow fixing plate is fixedly arranged in the acid etching machine main body, the top of the fixing plate is connected with an acid etching box in a sliding way, the bottom of the acid etching box is connected with an L-shaped plate in a sliding way, the bottom of the fixing plate is provided with a heating device and a filter chamber, one side of the L-shaped plate runs through the inner wall of the acid etching box and extends into the acid etching machine main body, the other side of the L-shaped plate runs through the fixing plate and extends into the filter chamber, the utility model is convenient to use, and realizes the effects of supplementing materials and acid etching liquid and heating acid etching in the acid etching box through the, the silicon wafer after acid etching is separated from the acid etching solution and collected by reversing the output shaft of the motor.

Description

Silicon wafer acid etching machine for silicon wafer production

Technical Field

The utility model relates to a silicon wafer production technical field especially relates to a silicon wafer acid etching machine for silicon wafer production.

Background

The silicon wafer acid etching machine for silicon wafer production is an important component for silicon wafer production, has the characteristic of automatically carrying out acid etching treatment on the silicon wafer and simultaneously automatically collecting, and is a very effective production means.

In the prior art, the silicon wafer acid etching machine for silicon wafer production cannot automatically carry out acid etching treatment on the silicon wafer, and is troublesome to collect after the acid etching is finished, so that the silicon wafer acid etching machine for silicon wafer production is provided for solving the problems.

SUMMERY OF THE UTILITY MODEL

The utility model aims at solving the problem that the silicon wafer can not be automatically etched by acid in the prior art, and collecting the defect of being troublesome after the acid etching is finished, and the silicon wafer etching machine for silicon wafer production is provided.

In order to achieve the above purpose, the utility model adopts the following technical scheme:

a silicon wafer acid etching machine for silicon wafer production comprises an acid etching main body, wherein a fixing plate with a hollow inner part is fixedly arranged in the acid etching main body, the top of the fixing plate is slidably connected with an acid etching box, the bottom of the acid etching box is slidably connected with an L-shaped plate, the bottom of the fixing plate is provided with a heating device and a filtering chamber, one side of the L-shaped plate penetrates through the inner wall of the acid etching box and extends into the acid etching main body, the other side of the L-shaped plate penetrates through the fixing plate and extends into the filtering chamber, a filtering plate is fixedly arranged in the filtering chamber, the bottom of the filtering chamber is rotatably connected with a rotating rod, one end of the rotating rod extends out of the acid etching main body, one end of the rotating rod, which is positioned outside the acid etching main body, is rotatably connected with a connecting rod, the bottom of the filtering chamber is rotatably connected with a rotating door, one side of, an inner rod is connected in the return pipe in a sliding mode, one end of the return pipe extends into the acid etching box, one end of the inner rod is fixedly connected with the inner wall of one side of the acid etching box, a supporting table is fixedly mounted on one side of the acid etching main body, a motor is fixedly mounted on the top of the supporting table, a gear is fixedly connected with one end of an output shaft of the motor, a first sliding plate is connected to one side of the inner wall of the top of the acid etching main body in a sliding mode, a second sliding plate is connected to the other side of the inner wall of the top of the acid etching main body in a sliding mode, one side, far away from the first sliding plate and the second sliding plate, of the first sliding plate and the second sliding plate extends out of the acid etching main body, the inner side, close to each other, of the first sliding plate and.

Preferably, the bottom of the first sliding plate is provided with a rack, and the rack is meshed with the gear, so that the effect of conveniently driving the sliding plate to slide is achieved.

Preferably, the inner wall of one side of the return pipe is fixedly connected with a spring, and one end of the spring is fixedly connected with one end of the inner rod, so that the effect of pushing the inner rod to drive the acid etching box to move continuously is achieved.

Preferably, the top of the L-shaped plate and the bottom of the first sliding plate are both fixedly provided with a limiting plate, so that the effect of limiting the movement of the L-shaped plate and the acid etching box is achieved.

Preferably, the inner walls of the two sides of the acid etching main body are respectively provided with a forward rotation switch and a reverse rotation switch, and the forward rotation switch and the reverse rotation switch are both electrically connected with the motor, so that the effect of driving the motor output shaft to rotate forward and reversely is achieved.

The utility model discloses in, a silicon wafer pickling machine has compensatied the not enough of prior art for silicon wafer production, and its beneficial effect is: when the motor is electrified and the output shaft rotates, the effects of supplementing materials and acid etching liquid and heating acid etching in the acid etching box are realized through the matching of the gear, the first sliding plate, the threaded column, the second sliding plate, the acid etching box, the L-shaped plate, the return pipe and the inner rod, and the effects of separating and collecting the acid etched silicon wafer and the acid etching liquid are realized through the matching of the reversing switch, the first sliding plate, the threaded column, the second sliding plate, the acid etching box, the L-shaped plate, the rotating rod, the connecting rod filter screen and the rotating door.

The utility model discloses convenient to use realizes corroding the incasement supplementary material and acid through motor output shaft corotation and loses the liquid and heat the effect that the acid loses, realizes making the silicon wafer after the acid loses and the effect that the acid loses the liquid and separate and collect through motor output shaft reversal.

Drawings

FIG. 1 is a front sectional view of a silicon wafer etching machine for silicon wafer production according to the present invention;

FIG. 2 is a top view of a silicon wafer etching machine for silicon wafer production according to the present invention;

FIG. 3 is a side view of a silicon wafer etching machine for silicon wafer production according to the present invention.

In the figure: 1 acid etching and acid etching main body, 2 acid etching box, 3 heating device, 4 filtering chamber, 5 fixing plate, 6 filtering plate, 7 rotating rod, 8 connecting rod, 9 rotating door, 10 return pipe, 11 inner rod, 12 supporting platform, 13 motor, 14 gear, 15 first sliding plate, 16 second sliding plate, 17 material box, 18 acid etching liquid box, 19 screw column, 20L type plate and 21 collecting box.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.

Referring to fig. 1-3, a silicon wafer acid etching machine for silicon wafer production comprises an acid etching main body 1, a fixing plate 5 with a hollow inner part is fixedly arranged in the acid etching main body 1, the top of the fixing plate 5 is slidably connected with an acid etching box 2, the bottom of the acid etching box 2 is slidably connected with an L-shaped plate 20, the bottom of the fixing plate 5 is provided with a heating device 3 and a filter chamber 4, one side of the L-shaped plate 20 penetrates through the inner wall of the acid etching box 2 and extends into the acid etching main body 1, the other side of the L-shaped plate 20 penetrates through the fixing plate 5 and extends into the filter chamber 4, a filter plate 6 is fixedly arranged in the filter chamber 4, the bottom of the filter chamber 4 is rotatably connected with a rotating rod 7, one end of the rotating rod 7 extends out of the acid etching main body 1, one end of the rotating rod 7 outside the acid etching main body 1 is, one side of a rotating door 9 is rotatably connected with one side of a connecting rod 8, one side inner wall of an acid etching main body 1 is fixedly connected with a return pipe 10, an inner rod 11 is connected in the return pipe 10 in a sliding manner, one end of the return pipe 10 extends into an acid etching box 2, one end of the inner rod 11 is fixedly connected with one side inner wall of the acid etching box 2, one side of the acid etching main body 1 is fixedly provided with a supporting table 12, the top of the supporting table 12 is fixedly provided with a motor 13, one end of an output shaft of the motor 13 is fixedly connected with a gear 14, one side of the top inner wall of the acid etching main body 1 is slidably connected with a first sliding plate 15, the other side of the top inner wall of the acid etching main body 1 is slidably connected with a second sliding plate 16, the sides of the first sliding plate 15 and the second sliding plate 16, which are far away from each other, extend out of the acid, the bottom of the acid etching main body 1 is fixedly provided with a collecting box 21, and the top of the acid etching main body 1 is fixedly connected with a material box 17 and an acid etching liquid box 18.

The utility model discloses in, the bottom of a sliding plate 15 is equipped with the rack, and the rack meshes with gear 14 mutually, plays the effect that conveniently drives the sliding plate and carry out the gliding.

The utility model discloses in, one side inner wall fixedly connected with spring of return pipe 10, and the one end of spring and the one end fixed connection of interior pole 11 play the effect that the pole drove the acid etching case and continue to remove in promoting.

The utility model discloses in, the top of L template 20 and the equal fixed mounting in bottom of sliding plate 15 have a limiting plate, play the effect of restricting the removal of L template and acid etching case.

The utility model discloses in, corotation switch and reversal switch are installed respectively to the both sides inner wall of acid etching main part 1, and corotation switch and reversal switch all with motor 13 electric connection, play the effect that drives motor output shaft corotation and reversal.

In the utility model, in actual operation, when motor 13 is powered on, the output shaft of motor 13 is driven to rotate, gear 14 rotates along with the output shaft of motor 13, at the moment, gear 14 drives sliding plate 15 to slide, when sliding plate 15 slides, sliding plate 15 drives threaded post 19 to rotate, when threaded post 19 rotates, threaded post 19 drives sliding plate 16 to move outwards, sliding plate 15 drives acid etching box 2 to move, at the moment, along with the movement of sliding plate 15 and sliding plate 16, the effect of supplementing material and acid etching liquid in acid etching box 2 is realized, simultaneously along with the continuous movement of sliding plate 15, gear 14 and rack are disengaged, at the moment, inner rod gear 14 idles, and simultaneously, 11 continues to drive acid etching box 2 to move through the elasticity of spring, realize fully carrying out the effect that heats the acid etching, contact with the reversal switch along with acid etching case 2 continues to remove this moment, sliding plate 15 this moment drives acid etching case 2 and carries out the return, carries out the return along with acid etching case 2 this moment, and the one end of L template 20 contacts with dwang 7 simultaneously, drives dwang 7 and rotates, and when dwang 7 rotated, dwang 7 drove rotation door 9 and rotates the effect that realizes that material and acid etching liquid separate and collect through filter 6.

The above, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, the concept of which is equivalent to replace or change, should be covered within the protection scope of the present invention.

Claims

1. A silicon wafer acid etching machine for silicon wafer production comprises an acid etching main body (1) and is characterized in that an inner hollow fixing plate (5) is fixedly installed in the acid etching main body (1), the top of the fixing plate (5) is slidably connected with an acid etching box (2), the bottom of the acid etching box (2) is slidably connected with an L-shaped plate (20), a heating device (3) and a filtering chamber (4) are arranged at the bottom of the fixing plate (5), one side of the L-shaped plate (20) penetrates through the inner wall of the acid etching box (2) and extends into the acid etching main body (1), the other side of the L-shaped plate (20) penetrates through the fixing plate (5) and extends into the filtering chamber (4), a filtering plate (6) is fixedly installed in the filtering chamber (4), the bottom of the filtering chamber (4) is rotatably connected with a rotating rod (7), and one end of the rotating rod (7) extends out of the acid etching main body (, the acid etching device is characterized in that one end of the rotating rod (7) which is positioned outside the acid etching main body (1) is rotatably connected with a connecting rod (8), one side of the bottom of the filtering chamber (4) which is positioned outside the acid etching main body (1) is rotatably connected with a rotating door (9), one side of the rotating door (9) is rotatably connected with one side of the connecting rod (8), one side inner wall of the acid etching main body (1) is fixedly connected with a return pipe (10), an inner rod (11) is slidably connected in the return pipe (10), one end of the return pipe (10) extends into the acid etching box (2), one end of the inner rod (11) is fixedly connected with one side inner wall of the acid etching box (2), one side of the acid etching main body (1) is fixedly provided with a supporting table (12), the top of the supporting table (12) is fixedly provided with a motor (13), one end of an output shaft of the motor (13) is fixedly connected with a gear (, the other side of the inner wall of the top of the acid etching main body (1) is connected with a second sliding plate (16) in a sliding mode, one side, far away from each other, of the first sliding plate (15) and the second sliding plate (16) extends to the outside of the acid etching main body (1), one side, close to each other, of the first sliding plate (15) and the second sliding plate (16) is internally and respectively connected with the same threaded column (19) in a threaded mode, a collecting box (21) is fixedly installed at the bottom of the acid etching main body (1), and a material box (17) and an acid etching liquid box (18) are fixedly connected to the top of the acid etching main.

2. The silicon wafer etching machine for silicon wafer production according to claim 1, wherein the first sliding plate (15) is provided with a rack at the bottom, and the rack is engaged with the gear (14).

3. The silicon wafer etching machine for silicon wafer production according to claim 1, wherein a spring is fixedly connected to one side inner wall of the return pipe (10), and one end of the spring is fixedly connected to one end of the inner rod (11).

4. The silicon wafer etching machine for silicon wafer production according to claim 1, wherein the top of the L-shaped plate (20) and the bottom of the first sliding plate (15) are both fixedly provided with a limiting plate.

5. The silicon wafer etching machine for silicon wafer production according to claim 1, wherein the inner walls of both sides of the etching main body (1) are respectively provided with a forward switch and a reverse switch, and the forward switch and the reverse switch are electrically connected with the motor (13).