CN213546305U

CN213546305U - Low-power consumption semiconductor element

Info

Publication number: CN213546305U
Application number: CN202120048109.8U
Authority: CN
Inventors: 陈怡�
Original assignee: Individual
Current assignee: Individual
Priority date: 2021-01-08
Filing date: 2021-01-08
Publication date: 2021-06-25
Anticipated expiration: 2031-01-08

Abstract

The utility model discloses a low-power consumption semiconductor element, concretely relates to semiconductor element field, including box body and chip, the chip is established inside the box body, the fixed a plurality of pins that are equipped with of chip lateral wall, a plurality of pins are at chip lateral wall surface evenly distributed, a plurality of jacks have been seted up on box body lateral wall surface, the pin runs through the jack and extends to the jack outside, box body top activity is equipped with the apron, a plurality of draw-in grooves have been seted up on box body top surface, be equipped with the fixture block in the draw-in groove. The utility model discloses an all be provided with connecting rod and protection film at box body and apron lateral surface, connect pin and external device after, the protection film on apron and the box body can form the protection in the top and the bottom of pin, compares with prior art, and the protection film can avoid the pin to receive the collision of external object and take place to damage, and connecting rod on the box body can overturn to the box body bottom, makes the box body keep away from the desktop, improves the radiating effect of heat dissipation box body bottom.

Description

Low-power consumption semiconductor element

Technical Field

The utility model relates to a semiconductor element field, concretely relates to low-power consumption semiconductor element.

Background

The semiconductor device refers to an object with electric conductivity between a conductor and an insulator at normal temperature, and the electric conductivity of the object can be controlled and ranges from the insulator to the conductor, so the semiconductor device is widely applied to the technical field of electronic equipment. Because the semiconductor device can only realize the unilateral heat dissipation, the heat dissipation effect of the semiconductor device is poor, so that the working performance and the efficiency of the semiconductor device can be influenced, and the service life of the semiconductor device is seriously influenced because a chip can be burnt even if the temperature is too high.

Chinese patent publication No. CN209298100U discloses a semiconductor device in which a protruding portion of a heat-conducting heat sink is attached to a chip by passing through a through hole of a rubber base, a part of heat of the chip can be transferred to the heat-conducting heat sink and diffused through the protruding portion, a part of heat of the chip can be transferred to a substrate and diffused, the semiconductor device can diffuse heat of the chip at both sides of the rubber base, and the heat dissipation effect of the semiconductor device is good; through setting up a plurality of pins and respectively with the chip electrical property continuous, partial heat of chip can transmit to each pin and spread, also can realize the intercommunication with a plurality of external devices, and then improve semiconductor element's work availability factor.

The prior art has the following defects: when the pins on the semiconductor element are electrically connected with other devices, the outer sides of the pins are not protected, and external objects are easy to break after collision, so that the use is influenced.

SUMMERY OF THE UTILITY MODEL

For this reason, the utility model provides a low-power consumption semiconductor element, through all being provided with connecting rod and protection film at box body and apron lateral surface, connect pin and external device after well, the protection film on apron and the box body can form the protection in the top and the bottom of pin, compare with prior art, the collision that the pin can avoid external object to receive the protection film takes place to damage, and the connecting rod on the box body can overturn the box body bottom, makes the box body keep away from the desktop, improves the radiating effect of heat dissipation box body bottom.

In order to achieve the above object, the present invention provides the following technical solutions: a low-power consumption semiconductor element comprises a box body and a chip, wherein the chip is arranged in the box body, the outer side wall of the chip is fixedly provided with a plurality of pins which are uniformly distributed on the surface of the outer side wall of the chip, the surface of the outer side wall of the box body is provided with a plurality of jacks, the pins penetrate through the jacks and extend to the outside of the jacks, a cover plate is movably arranged at the top of the box body, a plurality of clamping grooves are arranged on the surface of the top of the box body, clamping blocks are arranged in the clamping grooves, the clamping groove cross section is set to be T-shaped, the clamping block is fixedly arranged at the bottom of the cover plate, a plurality of groups of mounting assemblies are fixedly arranged on the outer side wall of the box body and the outer side wall of the cover plate, each group of mounting assemblies comprises two connecting rods, the two connecting rods are symmetrically arranged on the outer side wall of the box body and the outer side wall of the cover plate, one side of each connecting rod is hinged to the box body and the outer side wall of the cover plate, and a.

Furthermore, all fixedly on a plurality of connecting rods be equipped with the inserted block, the slot has all been seted up on box body lateral wall surface and apron lateral wall surface.

Further, the protective film is made of a heat-conducting silica gel material.

Further, heat-conducting plates are embedded in the box body and the cover plate.

Furthermore, a rubber pad is fixedly arranged on the outer wall of the clamping block, and anti-skid lines are processed on the surface of the outer wall of the rubber pad.

Furthermore, a handle is fixedly arranged at the center of the top of the cover plate.

Further, a plurality of connecting rods are respectively close to box body one side and apron one side and all fixedly are equipped with the damping hinge, a plurality of damping hinge one end and box body lateral wall, apron lateral wall fixed connection.

Compared with the prior art, the utility model discloses following beneficial effect has:

the utility model discloses an all be provided with connecting rod and protection film at box body and apron lateral surface, connect pin and external device after, the protection film on apron and the box body can form the protection in the top and the bottom of pin, compares with prior art, and the protection film can avoid the pin to receive the collision of external object and take place to damage, and connecting rod on the box body can overturn to the box body bottom, makes the box body keep away from the desktop, improves the radiating effect of heat dissipation box body bottom.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below. It should be apparent that the drawings in the following description are merely exemplary, and that other embodiments can be derived from the drawings provided by those of ordinary skill in the art without inventive effort.

The structure, ratio, size and the like shown in the present specification are only used for matching with the content disclosed in the specification, so as to be known and read by people familiar with the technology, and are not used for limiting the limit conditions which can be implemented by the present invention, so that the present invention has no technical essential significance, and any structure modification, ratio relationship change or size adjustment should still fall within the scope which can be covered by the technical content disclosed by the present invention without affecting the efficacy and the achievable purpose of the present invention.

Fig. 1 is a front sectional view of the overall structure provided by the present invention;

fig. 2 is a top view of the overall structure provided by the present invention;

FIG. 3 is a side view of the overall structure provided by the present invention;

FIG. 4 is an enlarged view of the portion A of FIG. 1 according to the present invention;

in the figure: the damping hinge comprises a box body 1, a chip 2, pins 3, jacks 4, a cover plate 5, a clamping groove 6, a clamping block 7, a connecting rod 8, a protective film 9, an inserting block 10, an inserting groove 11, a heat conducting plate 12, a rubber pad 13, a handle 14 and a damping hinge 15.

Detailed Description

The present invention is described in terms of specific embodiments, and other advantages and benefits of the present invention will become apparent to those skilled in the art from the following disclosure. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to the attached drawings 1-4 of the specification, the low-power-consumption semiconductor element of the embodiment comprises a box body 1 and a chip 2, wherein the chip 2 is arranged inside the box body 1, a plurality of pins 3 are fixedly arranged on the outer side wall of the chip 2, the plurality of pins 3 are uniformly distributed on the surface of the outer side wall of the chip 2, a plurality of jacks 4 are formed in the surface of the outer side wall of the box body 1, the pins 3 penetrate through the jacks 4 and extend to the outsides of the jacks 4, a cover plate 5 is movably arranged at the top of the box body 1, a plurality of clamping grooves 6 are formed in the surface of the top of the box body 1, clamping blocks 7 are arranged in the clamping grooves 6, the cross sections of the clamping grooves 6 are T-shaped, the clamping blocks 7 are fixedly arranged at the bottom of the cover plate 5, a plurality of groups of mounting assemblies are fixedly, On the 5 lateral walls of apron, 8 one sides of a plurality of connecting rods are articulated with

box body

1 and 5 lateral walls of apron respectively, and fixed protection film 9 that is equipped with between two connecting rods 8.

Further, all fixed being equipped with inserted block 10 on a plurality of connecting rods 8, slot 11 has all been seted up on 1 lateral wall surface of box body and 5 lateral wall surfaces of apron, and when opening connecting rod 8, fixture block 7 and draw-in groove 6 can carry out spacing fixed to connecting rod 8, avoid connecting rod 8 to influence operating personnel's operation.

Further, the protective film 9 is made of a heat-conducting silica gel material, and the protective film 9 made of the heat-conducting silica gel material has good elasticity and heat conductivity.

Further, heat-conducting plates 12 are embedded in the box body 1 and the cover plate 5, so that the heat dissipation speed of the chip 2 is increased, the temperature of the chip 2 is prevented from being too high, and the power consumption is increased.

Further, a rubber pad 13 is fixedly arranged on the outer wall of the clamping block 7, anti-skid lines are processed on the surface of the outer wall of the rubber pad 13, friction force between the clamping block 7 and the clamping groove 6 is increased, and the cover plate 5 and the box body 1 are connected more firmly.

Furthermore, a handle 14 is fixedly arranged at the center of the top of the cover plate 5, so that an operator can conveniently open the cover plate 5.

Further, a plurality of connecting rods 8 are close to 1 one side of box body and 5 one sides of apron respectively and all fixedly are equipped with damping hinge 15, and a plurality of damping hinge 15 one ends and 1 lateral wall of box body, 5 lateral wall fixed connection of apron make smooth-going more during upset connecting rod 8.

The utility model discloses the theory of operation:

referring to the attached drawings 1-4 of the specification, when in use, a chip 2 is firstly placed into a box body 1, then pins 3 on the chip 2 penetrate through jacks 4 on the box body 1 and extend to the outside of the box body 1, then a cover plate 5 is covered on the box body 1, a clamping block 7 at the bottom of the cover plate 5 is inserted into the jacks 4 in the box body 1, a rubber pad 13 is arranged on the outer wall of the clamping block 7 by arranging the clamping groove 6 into a T shape, when the clamping block 7 is inserted into the clamping groove 6, the rubber pad 13 is tightly attached to the clamping groove 6, anti-skid lines are processed on the surface of the rubber pad 13, the friction force between the clamping block 7 and the clamping groove 6 is greatly increased, the connection between the cover plate 5 and the box body 1 is firmer, the cover plate 5 is prevented from falling off the box body 1 to influence the protection of the chip 2, the cover plate 5 can be opened from the box body 1 only by pulling a handle 14 when, open connecting rod 8 and protection film 9 upset on apron 5 and the 1 lateral wall of box body earlier, after connecting, again with connecting rod 8 and protection film 9 upset on the apron 5 to pin 3, top at pin 3 forms the protection, avoid external object to collide pin 3, influence the use, connecting rod 8 in the 1 outside of box body can overturn 1 bottom of box body, make box body 1 keep a distance with the desktop, can increase the flow of 1 bottom air of box body, be convenient for dispel the heat, through all be provided with heat-conducting plate 12 in box body 1 and apron 5 inside, can greatly increased chip 2's radiating effect, avoid chip 2 high temperature, increase the consumption, setting through inserted block 10 and slot 11, when connecting rod 8 is opened in the upset, fixture block 7 and draw-in groove 6 can carry on spacing fixed to connecting rod 8, avoid connecting rod 8 to influence operating personnel's operation.

Although the invention has been described in detail with respect to the general description and the specific embodiments, it will be apparent to those skilled in the art that modifications and improvements can be made based on the invention. Therefore, such modifications and improvements are intended to be within the scope of the invention as claimed.

Claims

1. A low-power consumption semiconductor element, includes box body (1) and chip (2), chip (2) are established inside box body (1), its characterized in that: the outer side wall of the chip (2) is fixedly provided with a plurality of pins (3), the plurality of pins (3) are uniformly distributed on the outer side wall surface of the chip (2), the outer side wall surface of the box body (1) is provided with a plurality of jacks (4), the pins (3) penetrate through the jacks (4) and extend to the outside of the jacks (4), the top of the box body (1) is movably provided with a cover plate (5), the top surface of the box body (1) is provided with a plurality of clamping grooves (6), clamping blocks (7) are arranged in the clamping grooves (6), the cross sections of the clamping grooves (6) are arranged in a T shape, the clamping blocks (7) are fixedly arranged at the bottom of the cover plate (5), the outer side wall of the box body (1) and the outer side wall of the cover plate (5) are fixedly provided with a plurality of groups of mounting assemblies, each group of mounting assemblies comprises two connecting, one side of each connecting rod (8) is hinged with the box body (1) and the outer side wall of the cover plate (5), and a protective film (9) is fixedly arranged between the two connecting rods (8).

2. A low power consumption semiconductor element according to claim 1, characterized in that: all fixed being equipped with inserted block (10) on a plurality of connecting rods (8), slot (11) have all been seted up on box body (1) lateral wall surface and apron (5) lateral wall surface.

3. A low power consumption semiconductor element according to claim 1, characterized in that: the protective film (9) is made of a heat-conducting silica gel material.

4. A low power consumption semiconductor element according to claim 1, characterized in that: heat-conducting plates (12) are embedded in the box body (1) and the cover plate (5).

5. A low power consumption semiconductor element according to claim 1, characterized in that: the anti-skid fixture is characterized in that a rubber pad (13) is fixedly arranged on the outer wall of the fixture block (7), and anti-skid lines are processed on the surface of the outer wall of the rubber pad (13).

6. A low power consumption semiconductor element according to claim 1, characterized in that: a handle (14) is fixedly arranged at the center of the top of the cover plate (5).

7. A low power consumption semiconductor element according to claim 1, characterized in that: a plurality of connecting rods (8) are respectively close to one side of the box body (1) and one side of the cover plate (5) and are fixedly provided with damping hinges (15), and one ends of the damping hinges (15) are fixedly connected with the outer side wall of the box body (1) and the outer side wall of the cover plate (5).