CN213522348U - Thin bone conduction speaker, bone conduction listening device, and thin air conduction speaker - Google Patents
Thin bone conduction speaker, bone conduction listening device, and thin air conduction speaker Download PDFInfo
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- CN213522348U CN213522348U CN202021854303.7U CN202021854303U CN213522348U CN 213522348 U CN213522348 U CN 213522348U CN 202021854303 U CN202021854303 U CN 202021854303U CN 213522348 U CN213522348 U CN 213522348U
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- elastic wave
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Abstract
The utility model belongs to the technical field of the speaker, especially, relate to a slim bone conduction speaker, bone conduction listening device and slim gas conduction speaker. The thin bone conduction speaker comprises a first magnetic circuit unit, a first voice coil, a bone conduction vibration plate, a first support, a first elastic wave and a first positioning ring. A first magnetic gap is formed in the first magnetic circuit unit; the first voice coil extends into the first magnetic gap; the bone conduction vibration plate is connected to the upper part of the first voice coil; the first support is sleeved on the outer side of the first magnetic circuit unit, and a first accommodating groove is formed between the first magnetic circuit unit and the first support; the periphery of the first elastic wave is fixedly connected with a first bracket; the first positioning ring is connected with the periphery of the bone conduction vibration plate and extends downwards into the first accommodating groove; the inner periphery of the first elastic wave is fixedly connected with the first positioning ring. This slim bone conduction speaker supplies first bullet ripples to connect through increasing first retainer ring to make the mounting height of first bullet ripples reduce.
Description
Technical Field
The utility model belongs to the technical field of the speaker, especially, relate to a slim bone conduction speaker, bone conduction listening device and slim gas conduction speaker.
Background
Referring to fig. 1, an air conduction speaker 200 includes a housing 210, a U-iron 220, a magnet 230, a voice coil 240, a damper 250, a diaphragm 260, and a bracket 270, wherein the U-iron 220 is accommodated in the housing 210, the magnet 230 is disposed in the middle of the U-iron 220, a magnetic gap 280 is formed between the magnet 230 and the U-iron 220, and the voice coil 240 extends into the magnetic gap 280. The inner periphery of the damper 250 is connected to the voice coil 240, the outer periphery is connected to the inner wall of the housing 210, the damper 250 traverses above the U-shaped iron 220, the installation height of the damper 250 is limited by the U-shaped iron 220, the mounting height of the damper 250 is high, the bottom end of the diaphragm 260 is fixedly connected to the voice coil 240, the upper end of the diaphragm is protruded upwards, and the periphery of the diaphragm 260 needs a bracket 270 fixed on the housing 210 to further increase the height. In summary, the conventional air conduction speaker has a relatively large thickness due to the structural design, and thus cannot meet the requirement of thin-type devices. Bone conduction speakers also have the above-mentioned drawbacks.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a slim bone conduction speaker, bone conduction listening device and slim gas conduction speaker, it is thicker with gas conduction speaker thickness to aim at solving the bone conduction speaker among the prior art, can't satisfy the technical problem of slim equipment demand.
In order to achieve the above object, an embodiment of the present invention provides a thin bone conduction speaker, including:
a first magnetic circuit unit having a first magnetic gap formed therein;
the first voice coil extends into the first magnetic gap;
a bone conduction vibration plate connected to an upper portion of the first voice coil;
the first bracket is sleeved outside the first magnetic circuit unit, and a first accommodating groove is formed between the first magnetic circuit unit and the first bracket;
the periphery of the first elastic wave is fixedly connected with the first support; and
the first positioning ring is connected with the periphery of the bone conduction vibration plate and extends downwards into the first accommodating groove; the inner periphery of the first elastic wave is fixedly connected with the first positioning ring.
Optionally, a first conductive member is disposed in the first support, and a first pad is further disposed on the surface of the first conductive member; the first elastic wave is a first conductive elastic wave, the first voice coil is connected with the first conductive piece through the first conductive elastic wave, and the first conductive piece is connected with the first bonding pad.
Optionally, the number of the first elastic waves is preferably one or two.
Optionally, the two first elastic waves are a first upper elastic wave and a first lower elastic wave respectively, and the first upper elastic wave is located above the first lower elastic wave;
the first upper elastic wave and the first lower elastic wave are both connected with the first positioning ring;
or, the first upper elastic wave is connected with the first positioning ring, and the first lower elastic wave is connected with the first magnetic circuit unit.
Optionally, a plurality of first air vents are arranged on the first positioning ring.
The embodiment of the utility model provides an above-mentioned one or more technical scheme in the slim bone conduction speaker have one of following technological effect at least: according to the thin bone conduction loudspeaker, the first positioning ring is additionally arranged to be connected with the first elastic wave, the outer periphery of the first elastic wave is fixedly connected with the first support, the inner periphery of the first elastic wave is fixedly connected with the first positioning ring, so that the installation height of the first elastic wave is reduced, the bone conduction vibration plate is connected with the first positioning ring, and the first positioning ring is fixed on the first support through the first elastic wave, so that the mechanism is further simplified; therefore, the thin bone conduction speaker has the advantages of compact structure and thinner thickness.
In order to achieve the above object, an embodiment of the present invention provides a bone conduction listening device having the thin bone conduction speaker.
The embodiment of the utility model provides an among the bone conduction listening device above-mentioned one or more technical scheme have one of following technological effect at least: the bone conduction listening device has the advantages of small volume and thin thickness.
In order to achieve the above object, an embodiment of the present invention provides a thin air conduction speaker, including:
a second magnetic circuit unit having a second magnetic gap formed therein;
the second voice coil extends into the second magnetic gap;
the connecting piece is arranged above the second magnetic circuit unit, and the second voice coil is connected with the connecting piece;
the bottom of the vibrating diaphragm is connected with the connecting piece;
the second bracket is sleeved outside the second magnetic circuit unit, and a second accommodating groove is formed between the second magnetic circuit unit and the second bracket; the suspension edge of the diaphragm is connected with the second bracket;
the periphery of the second elastic wave is fixedly connected with the second support; and
the second positioning ring is connected with the periphery of the connecting piece and extends downwards into the second accommodating groove; the inner periphery of the second elastic wave is fixedly connected with the second positioning ring.
Optionally, a second conductive member is arranged in the second bracket, and a second pad is further arranged on the surface of the second conductive member; the second elastic wave is a second conductive elastic wave, the second voice coil is connected with the second conductive piece through the second conductive elastic wave, and the second conductive piece is connected with the second bonding pad;
optionally, a third bonding pad is disposed on the surface of the second support, and the third bonding pad is connected to the second voice coil through a flexible third conductive member.
Optionally, the number of the second elastic waves is preferably one or two.
Optionally, the two second elastic waves are a second upper elastic wave and a second lower elastic wave respectively, and the second upper elastic wave is located above the second lower elastic wave;
the second upper elastic wave and the second lower elastic wave are both connected with the second positioning ring;
or, the second upper elastic wave is connected with the second positioning ring, and the second lower elastic wave is connected with the second magnetic circuit unit.
Optionally, a plurality of second air vents are arranged on the second positioning ring.
The embodiment of the utility model provides an above-mentioned one or more technical scheme in the slim gas conduction speaker have one of following technological effect at least: according to the thin air conduction loudspeaker, the second positioning ring is additionally arranged to be connected with the second elastic wave, the outer periphery of the second elastic wave is fixedly connected with the second support, the inner periphery of the second elastic wave is fixedly connected with the second positioning ring, so that the mounting height of the second elastic wave is reduced, the vibrating diaphragm is connected with the second positioning ring, and the second positioning ring is fixed on the second support through the second elastic wave, so that the structure is further simplified; therefore, the thin air conduction loudspeaker has the advantages of compact structure and thinner thickness.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for the embodiments or the prior art descriptions will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without inventive labor.
Fig. 1 is a schematic structural diagram of a prior art air conduction speaker.
Fig. 2 is a schematic structural diagram of a thin bone conduction speaker according to embodiment 1 of the present invention.
Fig. 3 is a schematic structural diagram of a thin bone conduction speaker according to embodiment 2 of the present invention.
Fig. 4 is a schematic structural diagram of a thin bone conduction speaker according to embodiment 3 of the present invention.
Fig. 5 is a schematic structural diagram of a thin bone conduction speaker according to embodiment 4 of the present invention.
Fig. 6 is a schematic structural diagram of a thin bone conduction speaker according to embodiment 5 of the present invention.
Fig. 7 is a schematic structural diagram of a thin air conduction speaker according to embodiment 7 of the present invention.
Fig. 8 is a schematic structural diagram of a thin air conduction speaker according to embodiment 8 of the present invention.
Fig. 9 is a schematic structural diagram of a thin air conduction speaker according to embodiment 9 of the present invention.
Fig. 10 is a schematic structural diagram of a thin air conduction speaker according to embodiment 10 of the present invention.
Fig. 11 is a schematic structural diagram of a thin air conduction speaker according to embodiment 11 of the present invention.
Fig. 12 is a schematic structural diagram of a thin air conduction speaker according to embodiment 12 of the present invention.
Fig. 13 is a schematic structural diagram of a thin air conduction speaker according to embodiment 13 of the present invention.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below by referring to the drawings are exemplary and intended to explain the embodiments of the present invention and are not to be construed as limiting the present invention.
Example 1
As shown in fig. 2, the thin bone conduction speaker 100a of the present embodiment includes a first magnetic circuit unit 110a, a first voice coil 120, a bone conduction diaphragm 130, a first support 140, a first elastic wave 150a, and a first positioning ring 160. The first magnetic circuit unit 110a has a first magnetic gap 111 formed therein. The first voice coil 120 extends into the first magnetic gap 111. The bone conduction vibration plate 130 is connected to an upper portion of the first voice coil 120. The first bracket 140 is sleeved outside the first magnetic circuit unit 110a, and a first receiving groove 170 is formed between the first magnetic circuit unit 110a and the first bracket 140. The first elastic band 150a is fixedly connected to the first bracket 140 at its outer circumference. The first positioning ring 160 is connected to the periphery of the bone conduction vibration plate 130 and extends downward into the first receiving groove 170. The inner circumference of the first damper 150a is fixedly coupled to the first retainer ring 160.
In the thin bone conduction speaker 100a, the first positioning ring 160 is additionally provided to connect the first damper 150a, the outer circumference of the first damper 150a is fixedly connected to the first bracket 140, and the inner circumference of the first damper 150a is fixedly connected to the first positioning ring 160, so that the installation height of the first damper 150a is reduced, and the bone conduction vibration plate 130 can be fixed to the first bracket 140 through the first damper 150a, thereby further simplifying the mechanism. Therefore, the thin bone conduction speaker 100a has advantages of compact structure and thinner thickness.
The first support 140 has a first conductive member 141 disposed therein, and a first bonding pad 142 disposed on a surface thereof. The first damper 150a is a first conductive damper, the first voice coil 120 is connected to the first conductive member 141 through the first conductive damper, and the first conductive member 141 is connected to the first bonding pad 142. Compare in traditional speaker through the mode of electric wire for the voice coil power supply, the power supply mode of this embodiment is more concealed, and the wiring is more convenient, and the fault rate is lower.
The first magnetic circuit unit 110a includes a first U-iron 112 and a first magnet 113. The first magnet 113 is disposed in the middle of the first U-iron 112. The first U-bar 112 also has the function of replacing the housing, further simplifying the structure.
Example 2
The present embodiment is different from embodiment 1 in that: as shown in fig. 3, the first magnetic circuit unit 110b of the thin bone conduction speaker 100b of the present embodiment includes a first T-iron 114, a second magnet 115 and a second washer 116, the first T-iron 114 has a first central pillar 1141, the second magnet 115 is annular, the annular second magnet 115 is disposed on the first T-iron 114, and the first central pillar 1141 passes through a middle portion of the second magnet 115. The second washer 116 is disposed on the top surface of the second magnet 115, and the second washer 116 has a magnetic conductive function. The first T-bar 114 also has the function of replacing the housing, further simplifying the structure.
The rest of this embodiment is the same as embodiment 1, and the features not explained in this embodiment are explained by embodiment 1, which is not described again here.
Example 3
The present embodiment is different from embodiment 1 in that: as shown in fig. 4, the thin bone conduction speaker 100c according to the present embodiment has two first elastic waves. The two first elastic waves are a first upper elastic wave 151 and a first lower elastic wave 152, respectively, and the first upper elastic wave 151 is located above the first lower elastic wave 152. The first upper damper 151 and the first lower damper 152 are connected to the first positioning ring 160. The first positioning ring 160 is provided with a plurality of first air guide holes 161. The first air guide holes 161 circulate the air flow to enhance the bass sound.
The rest of this embodiment is the same as embodiment 1, and the features not explained in this embodiment are explained by embodiment 1, which is not described again here.
Example 4
The present embodiment is different from embodiment 3 in that: as shown in fig. 5, the first upper damper 151 of the thin bone conduction speaker 100d according to the present embodiment is connected to the first positioning ring 160, and the first lower damper 152 is connected to the first magnetic circuit unit 110 a. The thin bone conduction speaker 100d is a magnetic circuit unit movable type speaker, and has an effect of enhancing a low frequency.
The rest of this embodiment is the same as embodiment 3, and the features that are not explained in this embodiment are explained by embodiment 3, which is not described again here.
Example 5
The present embodiment is different from embodiment 2 in that: as shown in fig. 6, the thin bone conduction speaker 100e according to the present embodiment has two first elastic waves. The two first elastic waves are a first upper elastic wave 151 and a first lower elastic wave 152, respectively, and the first upper elastic wave 151 is located above the first lower elastic wave 152. The first upper damper 151 is connected to the first positioning ring 160, and the first lower damper 152 is connected to the first magnetic circuit unit 110 b. The thin bone conduction speaker 100e is a magnetic circuit unit movable type speaker, and has an effect of enhancing a low frequency.
The rest of this embodiment is the same as embodiment 3, and the features that are not explained in this embodiment are explained by embodiment 3, which is not described again here.
Example 6
The bone conduction listening device provided in this embodiment has the thin bone conduction speaker provided in embodiment 1. The bone conduction listening device can be small in size and thin in thickness.
Example 7
As shown in fig. 7, the thin air conduction speaker 300a of the present embodiment includes a second magnetic circuit unit 310a, a second voice coil 320, a connecting member, a diaphragm 330, a second support 340, a second elastic wave 350, and a second positioning ring 360. A second magnetic gap 311 is formed in the second magnetic circuit unit 310 a. The second voice coil 320 extends into the second magnetic gap 311. The connection member is disposed above the second magnetic circuit unit 310a, and the second voice coil 320 is connected to the connection member. The bottom of the diaphragm 330 is connected to the connecting member. The second bracket 340 is sleeved outside the second magnetic circuit unit 310a, and a second receiving groove 370 is formed between the second magnetic circuit unit 310a and the second bracket 340. And the suspension edge of the diaphragm is connected with the second bracket. The periphery of the second elastic wave 350 is fixedly connected with the second bracket 340. The second positioning ring 360 is connected to the periphery of the connecting member and extends downward into the second receiving groove 370. The inner periphery of the second damper 350 is fixedly connected to the second positioning ring 360. A plurality of second air vents 361 are disposed on the second positioning ring 360.
In the thin air conduction speaker 300a, a second positioning ring 360 is added to connect the second damper 350, the outer periphery of the second damper 350 is fixedly connected to the second bracket 340, and the inner periphery of the second damper 350 is fixedly connected to the second positioning ring 360, so that the installation height of the second damper 350 is reduced, and the diaphragm 330 can be fixed to the second bracket 340 through the second damper 350 and the suspension edge 331 thereof, thereby further simplifying the mechanism; the thin air conduction speaker 300a has advantages of compact structure and thinner thickness.
A second conductive member 341 is disposed in the second bracket 340, and a second pad 342 is disposed on the surface of the second conductive member. The second elastic wave 350 is a second conductive elastic wave, the second voice coil 320 is connected to the second conductive member 341 through the second conductive elastic wave, and the second conductive member 341 is connected to the second pad 342.
The second magnetic circuit unit 310a includes a second U-iron 312 and a third magnet 313. The third magnet 313 is disposed in the middle of the second U-shaped iron 312.
Example 8
This embodiment is different from embodiment 7 in that: as shown in fig. 8, a third bonding pad 343 is disposed on a surface of the second frame 340 of the thin air conduction speaker 300b according to this embodiment, and the third bonding pad 343 is connected to the second voice coil 320 through a flexible third conductive member 3431. The arrangement has the advantage of facilitating the lead.
The rest of this embodiment is the same as embodiment 7, and the features not explained in this embodiment are explained by embodiment 7, which is not described again here.
Example 9
This embodiment is different from embodiment 7 in that: as shown in fig. 9, the first magnetic circuit unit 310b of the thin air conduction speaker 300c of this embodiment includes a second T-iron 314, a first washer 316 and a fourth magnet 315, where the second T-iron 314 has a second central pillar 3141, the fourth magnet 315 is annular, the annular fourth magnet 315 is disposed on the second T-iron 314, and the second central pillar 3141 passes through a middle portion of the fourth magnet 315. The first washer 316 is disposed on the top surface of the fourth magnet 315.
The rest of this embodiment is the same as embodiment 7, and the features not explained in this embodiment are explained by embodiment 7, which is not described again here.
Example 10
This embodiment is different from embodiment 7 in that: as shown in fig. 10, the number of the second elastic waves of the thin air conduction speaker 300d provided in the present embodiment is two. The two second elastic waves are a second upper elastic wave 351 and a second lower elastic wave 352 respectively, and the second upper elastic wave 351 is located above the second lower elastic wave 352. The second upper damper 351 and the second lower damper 352 are both connected to the second positioning ring 360.
The rest of this embodiment is the same as embodiment 7, and the features not explained in this embodiment are explained by embodiment 7, which is not described again here.
Example 11
The present embodiment is different from embodiment 10 in that: as shown in fig. 11, the second upper damper 351 of the thin air conduction speaker 300e of the present embodiment is connected to the second positioning ring 360, and the second lower damper 352 is connected to the second magnetic circuit unit 310 a.
The rest of this embodiment is the same as embodiment 10, and the features not explained in this embodiment are explained by embodiment 10, which is not described again here.
Example 12
This embodiment is different from embodiment 11 in that: as shown in fig. 12, the two second upper elastic waves 351, 351' of the thin air conduction speaker 300f provided by the present embodiment are connected to the second positioning ring 360, and the second lower elastic wave 352 is connected to the second magnetic circuit unit 310 a.
The rest of this embodiment is the same as embodiment 11, and the features that are not explained in this embodiment are all explained by embodiment 11, which is not described again here.
Example 13
This example differs from example 9 in that: as shown in fig. 13, the number of the second elastic waves of the thin air conduction speaker 300g provided in the present embodiment is two. The two second elastic waves are a second upper elastic wave 351 and a second lower elastic wave 352, respectively, the second upper elastic wave 351 is connected with the second positioning ring 360, and the second lower elastic wave 352 is connected with the second magnetic circuit unit 310 b.
The rest of this embodiment is the same as embodiment 9, and the features not explained in this embodiment are explained by embodiment 9, which is not described again here.
The above description is only exemplary of the present invention and should not be taken as limiting the scope of the present invention, as any modifications, equivalents, improvements and the like made within the spirit and principles of the present invention are intended to be included within the scope of the present invention.
Claims (11)
1. A thin bone conduction speaker comprising:
a first magnetic circuit unit having a first magnetic gap formed therein;
the first voice coil extends into the first magnetic gap;
a bone conduction vibration plate connected to an upper portion of the first voice coil;
it is characterized by also comprising:
the first bracket is sleeved outside the first magnetic circuit unit, and a first accommodating groove is formed between the first magnetic circuit unit and the first bracket;
the periphery of the first elastic wave is fixedly connected with the first support; and
the first positioning ring is connected with the periphery of the bone conduction vibration plate and extends downwards into the first accommodating groove; the inner periphery of the first elastic wave is fixedly connected with the first positioning ring.
2. The thin bone conduction speaker as claimed in claim 1, wherein the first frame has a first conductive member disposed therein, and a first bonding pad disposed thereon; the first elastic wave is a first conductive elastic wave, the first voice coil is connected with the first conductive piece through the first conductive elastic wave, and the first conductive piece is connected with the first bonding pad.
3. The thin bone conduction speaker as claimed in claim 1 or 2, wherein the number of the first elastic waves is one or two.
4. The thin bone conduction speaker as claimed in claim 3, wherein the two first elastic waves are a first upper elastic wave and a first lower elastic wave, respectively, and the first upper elastic wave is located above the first lower elastic wave;
the first upper elastic wave and the first lower elastic wave are both connected with the first positioning ring;
or, the first upper elastic wave is connected with the first positioning ring, and the first lower elastic wave is connected with the first magnetic circuit unit.
5. The thin bone conduction speaker as claimed in claim 1 or 2, wherein the first positioning ring is provided with a plurality of first air holes.
6. A bone conduction listening device comprising the thin bone conduction speaker according to any one of claims 1 to 5.
7. A thin air conduction speaker comprising:
a second magnetic circuit unit having a second magnetic gap formed therein;
the second voice coil extends into the second magnetic gap;
it is characterized by also comprising:
the connecting piece is arranged above the second magnetic circuit unit, and the second voice coil is connected with the connecting piece;
the bottom of the vibrating diaphragm is connected with the connecting piece;
the second bracket is sleeved outside the second magnetic circuit unit, and a second accommodating groove is formed between the second magnetic circuit unit and the second bracket; the suspension edge of the diaphragm is connected with the second bracket;
the periphery of the second elastic wave is fixedly connected with the second support; and
the second positioning ring is connected with the periphery of the connecting piece and extends downwards into the second accommodating groove; the inner periphery of the second elastic wave is fixedly connected with the second positioning ring.
8. The thin air conduction speaker as claimed in claim 7, wherein a second conductive member is disposed in the second frame, and a second bonding pad is disposed on the surface of the second frame; the second elastic wave is a second conductive elastic wave, the second voice coil is connected with the second conductive piece through the second conductive elastic wave, and the second conductive piece is connected with the second bonding pad;
or a third bonding pad is arranged on the surface of the second support and is connected with the second voice coil through a flexible third conductive piece.
9. The thin air conduction speaker as claimed in claim 7 or 8, wherein the number of the second elastic waves is one or two.
10. The thin air conduction speaker as claimed in claim 7 or 8, wherein the two second elastic waves are a second upper elastic wave and a second lower elastic wave, respectively, and the second upper elastic wave is located above the second lower elastic wave;
the second upper elastic wave and the second lower elastic wave are both connected with the second positioning ring;
or, the second upper elastic wave is connected with the second positioning ring, and the second lower elastic wave is connected with the second magnetic circuit unit.
11. The thin air conduction speaker as claimed in claim 7 or 8, wherein a plurality of second air holes are formed on the second positioning ring.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021854303.7U CN213522348U (en) | 2020-08-29 | 2020-08-29 | Thin bone conduction speaker, bone conduction listening device, and thin air conduction speaker |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021854303.7U CN213522348U (en) | 2020-08-29 | 2020-08-29 | Thin bone conduction speaker, bone conduction listening device, and thin air conduction speaker |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113271526A (en) * | 2021-07-21 | 2021-08-17 | 共达电声股份有限公司 | Loudspeaker |
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2020
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113271526A (en) * | 2021-07-21 | 2021-08-17 | 共达电声股份有限公司 | Loudspeaker |
| CN113271526B (en) * | 2021-07-21 | 2021-11-26 | 共达电声股份有限公司 | Loudspeaker |
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