CN213503617U - Electronic component package - Google Patents

Abstract

The utility model provides an electronic component packing relates to electronic component packaging structure technical field, and for solving the packaging structure packing capacity that exists among the prior art and carry out the packing to electronic component less, during the batch packing, the integrated level is lower, leads to packing the lower problem design of handling efficiency. The utility model provides an electronic component package, include: outer packing box, inner packing box, and electronic component bear holding in the palm. The electronic element bearing support is laid in the inner packing box and used for bearing and fixing the electronic element, and a plurality of layers of the inner packing box are stacked in the outer packing box.

Description

Electronic component package

Technical Field

The utility model belongs to the technical field of electronic component packaging structure technique and specifically relates to an electronic component packing is related to.

Background

Electronic components (which are the basic elements of electronic circuits, usually individually packaged and having two or more leads or metal contacts) are interconnected to form a functional electronic circuit, such as amplifiers, radio receivers, oscillators, etc., and are typically soldered to a printed circuit board.

Electronic components belong to precision components, and when the electronic components are produced and processed, the electronic components are generally strictly protected to avoid damage or lap short circuit. At the same time, strict protection of the electronic components is also required when the electronic components are packaged.

The packaging structure for packaging electronic components in the prior art has small packaging capacity, and the integration level is low during batch packaging, so that the packaging and carrying efficiency is low.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide an electronic component packing to there is the packaging structure packing capacity who packs electronic component less among the solution prior art, during packing in batches, the integrated level is lower, leads to the lower problem of packing handling efficiency.

The utility model provides an electronic component package, include: outer packing box, inner packing box, and electronic component bear holding in the palm.

The electronic element bearing support is laid in the inner packing box and used for bearing and fixing electronic elements, and a plurality of layers of the inner packing box are stacked in the outer packing box.

Further, the inner packing box comprises an upper shell and a lower shell, and the upper shell can be buckled with the lower shell;

the lower shell is provided with a containing cavity, and the electronic element bearing support is laid in the containing cavity.

Further, the inner packing box is the cuboid structure, the length of inner packing box is 353mm, and wide is 353mm, and the height is 17 mm.

Further, the electronic component bearing support is a first foam pad, and pins of the electronic component can be inserted into the first foam pad.

Further, the first foam pad is 345mm long, 345mm wide and 8mm high; and 24 rows of the electronic components are transversely arranged on the first foam pad, and 23 rows of the electronic components are vertically arranged on the first foam pad.

Further, the outer packing box is of a cuboid structure, the length of the outer packing box is 360mm, the width of the outer packing box is 360mm, and the height of the outer packing box is 220 mm.

Further, ten of the inner packs are stacked in a single outer packing box.

Further, the outer packing box is provided with an upper cover group, a box body and a lower cover group, and the upper cover group and the lower cover group are connected to the box body in an openable and closable manner; the upper cover group and the lower cover group can be sealed through adhesive tapes.

Further, the electronic component package further comprises a second foam pad and a first paperboard;

the second foam pad and the first paper board are sequentially arranged at the bottom position in the outer packaging box from bottom to top, and a plurality of groups of inner packaging boxes are arranged above the first paper board.

Further, the electronic component package further comprises a third foam pad and a second paperboard;

the cotton pad of third bubble with the second cardboard from top to bottom set gradually in the outer packing box, just the second cardboard set up in inner packing box top.

The utility model provides an electronic component packing's beneficial effect is:

the utility model provides an electronic component package, include: outer packing box, inner packing box, and electronic component bear holding in the palm. The electronic element bearing support is laid in the inner packing box and used for bearing and fixing the electronic element, and a plurality of layers of the inner packing box are stacked in the outer packing box.

By utilizing the structure, the electronic element is arranged on the electronic element bearing support, the electronic element bearing support can bear and fix a plurality of electronic elements, and the electronic element bearing support bearing the electronic elements is placed in the inner packing box. A plurality of inner packing boxes are loaded in sequence according to the mode, and the inner packing boxes are placed into the outer packing box in sequence, so that the inner packing boxes are stacked in the outer packing box in sequence.

In the structure, the electronic element bearing support is used for bearing and fixing the electronic element, so that the electronic element can be stably fixed on the electronic element bearing support, and the problems of collision, damage and the like of the electronic element in the packaging and transporting process are avoided. The inner packing box is used for packing electronic component once, bears the weight of with electronic component and holds in the palm and electronic component all packs in the inner packing box, carries out once packing protection to electronic component. A plurality of inner packing boxes are packaged by the outer packing box, secondary packing of the electronic elements is achieved, and secondary packing protection is conducted on the electronic elements. By utilizing the structure, firstly, the electronic element is subjected to secondary packaging protection, so that the electronic element is prevented from being collided and damaged in the transportation process; it is two, a plurality of inner packing box put things in good order and outer packing box in, make outer packing box to electronic component splendid attire greatly increased, make the integrated nature of electronic component packing higher, utilize outer packing box splendid attire still less ground electronic component, consequently, during the batch production packing, the packing handling capacity of the external packing box of staff has been reduced, packaging efficiency has been promoted, it is less to have the packaging structure packing capacity who carries out the packing to electronic component to have avoided among the prior art, during the batch packing, the integrated level is lower, lead to the lower problem of packing handling efficiency.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the embodiments or the technical solutions in the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.

Fig. 1 is a schematic structural diagram of an inner packing box of an electronic component package according to an embodiment of the present invention;

fig. 2 is a schematic structural diagram of an outer packaging box of an electronic component package according to an embodiment of the present invention;

fig. 3 is a schematic structural diagram of an electronic component package according to an embodiment of the present invention.

Icon: 100-inner packing box; 110-a lower shell; 111-a containment chamber; 120-upper shell; 130-a first foam pad; 200-outer packing case; 210-an upper cover group; 220-lower cover group; 230-a box body; 300-third foam cotton pad; 400-a second paperboard; 500-a first paperboard; 600-second foam pad.

Detailed Description

The technical solution of the present invention will be described clearly and completely with reference to the following embodiments, and it should be understood that the described embodiments are some, but not all embodiments of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

It should be noted that in the description of the present invention, the terms "first", "second", "third" and "fourth" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance. Unless expressly stated or limited otherwise, the terms "connected" and "attached" are to be construed broadly, e.g., as meaning a fixed connection, a removable connection, or an integral connection; can be directly connected or connected through an intermediate medium; either mechanically or electrically. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

The present invention will be described in further detail below with reference to specific embodiments and with reference to the attached drawings.

The specific structure is shown in fig. 1-3.

The embodiment provides an electronic component package, including: an outer package 200, an inner package 100, and an electronic component carrier. The electronic component bearing support is laid on the inner packing box 100 and used for bearing and fixing electronic components, and a plurality of layers of the inner packing box 100 are stacked in the outer packing box 200.

With the above structure, the electronic component is disposed on the electronic component carrier, the electronic component carrier can carry and fix a plurality of electronic components, and the electronic component carrier carrying the electronic component is placed in the inner package box 100. The plurality of inner packs 100 are sequentially loaded in the above-described manner, and the plurality of inner packs 100 are sequentially placed in the outer packing box 200, so that the plurality of inner packs 100 are sequentially stacked in the outer packing box 200.

In the structure, the electronic element bearing support is used for bearing and fixing the electronic element, so that the electronic element can be stably fixed on the electronic element bearing support, and the problems of collision, damage and the like of the electronic element in the packaging and transporting process are avoided. The inner packing box 100 is used for packing the electronic elements once, and the electronic element bearing support and the electronic elements are all packed in the inner packing box 100 to protect the electronic elements once. The outer packing box 200 packs the plurality of inner packing boxes 100, thereby realizing secondary packing of the electronic components and performing secondary packing protection on the electronic components. By utilizing the structure, firstly, the electronic element is subjected to secondary packaging protection, so that the electronic element is prevented from being collided and damaged in the transportation process; secondly, a plurality of inner packing box 100 are put things in good order and outer packing box in, make outer packing box to electronic component splendid attire greatly increased, make the integrated nature of electronic component packing higher, utilize outer packing box 200 splendid attire still less ground electronic component, therefore, during the batch production packing, the packing volume of staff to outer packing box 200 has been reduced, packaging efficiency has been promoted, it is less to have the packaging structure packing capacity who carries out the packing to electronic component to have avoided among the prior art, during the batch packing, the integrated level is lower, lead to the lower problem of packing handling efficiency.

In an optional technical solution of this embodiment, the inner pack 100 includes an upper case 120 and a lower case 110, and the upper case 120 can be fastened to the lower case 110.

The lower shell 110 has a receiving cavity 111, and the electronic component bearing tray is laid in the receiving cavity 111.

Preferably, the structure that the upper case 120 and the lower case 110 are fastened is adopted, so that the inner packing box 100 can be quickly and conveniently fastened or opened, and the inner packing box 100 can be conveniently packed. Meanwhile, the structure that the upper case 120 and the lower case 110 are fastened has good airtightness, and the structure can protect the electronic components in the accommodating cavity 111.

In the optional technical scheme of this embodiment, inner packing box 100 is the cuboid structure, and inner packing box 100's length is 353mm, and wide is 353mm, and the height is 17 mm.

Preferably, the inner packing box 100 is a rectangular parallelepiped structure, wherein the upper case 120 is also a rectangular parallelepiped structure, the lower surface of the upper case 120 has a first opening, the lower case 110 is a rectangular parallelepiped structure, the upper surface of the lower case 110 has a second opening, the second opening is communicated with the accommodating cavity 111 of the lower case 110, and the electronic component bearing tray loaded with the electronic component is placed in the accommodating cavity 111 through the second opening. After the electronic component bearing support is placed in the accommodating cavity 111, the upper shell 120 is buckled to the lower shell 110 from top to bottom, and the lower shell 110 can be buckled by the upper shell 120 through the first opening.

Preferably, after the upper case 120 is fastened to the lower case 110, the overall length of the inner pack 100 is 353mm, the width thereof is 353mm, and the height thereof is 17 mm.

In an alternative embodiment of this embodiment, the electronic component carrier is a first foam pad 130, and the pins of the electronic component can be inserted into the first foam pad 130.

Preferably, the electronic component bearing support is a first foam pad 130, the foam material has certain elasticity, and when the pins of the electronic component are inserted into the first foam pad 130, the pins can be elastically extruded by the first foam pad 130 through the elasticity of the first foam pad 130, so that the pins of the electronic component are prevented from being separated from the first foam pad 130, and the electronic component can be fixed on the first foam pad 130.

Utilize first bubble cotton pad 130 to fix electronic component, the electronic component of being convenient for is pegged graft and is loaded, simultaneously, when needs uninstallation electronic component, can directly take out electronic component, the uninstallation of being convenient for.

In addition, first bubble cotton pad 130 material is softer, has good absorption and strikes and buffer performance, and in the transportation, when electronic component package received external impact, first bubble cotton pad 130 can absorb the impact, and electronic component avoids appearing the collision and collides with the damage problem under the protection of first bubble cotton pad 130.

In an optional technical scheme of this embodiment, the first foam pad 130 has a length of 345mm, a width of 345mm, and a height of 8 mm; and 24 rows of the electronic components are arranged in the transverse direction of the first foam pad 130, and 23 rows of the electronic components are arranged in the vertical direction of the first foam pad 130.

Preferably, the length, width and height of the first foam pad 130 are slightly less than those of the inner packing box 100, so that the first foam pad 130 can be smoothly loaded into the receiving cavity 111 of the inner packing box 100.

Preferably, the first foam pad 130 having a length of 345mm, a width of 345mm and a height of 8mm can carry 24 × 23 ═ 552 electronic components.

The size of the first foam pad 130 is preferably, but not limited to, the size as long as the first foam pad 130 can be loaded into the inner package 100. In addition, the number of the electronic components carried by the first foam pad 130 is a preferred number, but is not limited to the above number, and can be increased or decreased according to different working conditions and sizes of different electronic components.

In the optional technical solution of this embodiment, the outer packing box 200 is a rectangular parallelepiped structure, and the length of the outer packing box 200 is 360mm, the width is 360mm, and the height is 220 mm.

Preferably, the outer packing box 200 has a size, length and width slightly larger than those of the inner packing box 100, so that the inner packing box 100 can be smoothly loaded into the outer packing box 200, and it should be noted that after the inner packing box 100 is loaded into the outer packing box 200, the inner wall of the outer packing box 200 abuts against the outer wall of the inner packing box 100 to limit the movement of the inner packing box 100 and ensure the stability of the electronic components inside the inner packing box 100. The height of the outer package 200 is much greater than the height of the inner package 100, which facilitates the ability of the outer package 200 to accommodate multiple layers of the inner package 100 to increase the number of electronic components contained in the electronic component package.

The size of the outer packing box 200 is a preferred size, but is not limited to the above size, and the requirement for packaging electronic components can be satisfied as long as the outer packing box 200 can smoothly contain the multi-layered inner packing box 100 and can restrict the movement of the inner packing box 100.

In an alternative embodiment of this embodiment, ten inner packaging boxes 100 are stacked in a single outer packaging box 200.

Preferably, ten inner packs 100 are stacked in sequence in the outer package 200, a single inner pack 100 holds 552 electronic components, and ten inner packs 100 hold 5520 electronic components in total, i.e., a single outer pack can hold 5520 electronic components.

The outer packing box 200 preferably contains ten inner packs 100, but is not limited to the ten inner packs 100.

In an optional technical solution of this embodiment, the outer package box 200 has an upper cover set 210, a box body 230 and a lower cover set 220, and both the upper cover set 210 and the lower cover set 220 are openably connected to the box body 230; both the upper cover set 210 and the lower cover set 220 can be sealed by an adhesive tape.

Preferably, the case 230 has a rectangular parallelepiped structure having a top opening and a bottom opening, the upper cover set 210 is openably and closably connected to the top opening, and the lower cover set 220 is openably and closably connected to the bottom opening. The upper cover group 210 comprises two groups of rocking covers, the two groups of rocking covers are respectively connected with two groups of opposite sides of the top opening, and after the two groups of rocking covers are buckled, the two groups of rocking covers are sealed and fixed by using an adhesive tape. The lower cover group 220 comprises two groups of rocking covers, the two groups of rocking covers are respectively connected with two groups of opposite sides of the bottom opening, and after the two groups of rocking covers are buckled, the lower cover group is sealed and fixed by using an adhesive tape.

In an alternative solution of this embodiment, the electronic component package further includes a second foam pad 600 and a first paper board 500.

The second foam pad 600 and the first paper board 500 are sequentially disposed at the bottom position in the outer packing box 200 from bottom to top, and the plurality of sets of inner packing boxes 100 are disposed above the first paper board 500.

Preferably, the second foam pad 600 is disposed at the bottom inside the outer packing box 200 and is abutted to the lower cover set 220 after the fastening is completed, the first paper board 500 is disposed above the second foam pad 600, and the plurality of inner packing boxes 100 are disposed above the first paper board 500.

Preferably, the second foam pad 600 is made of a soft material and is used for buffering and absorbing impact, and when the outer packaging box 200 is subjected to external impact in the transportation process, the second foam pad 600 can absorb the impact, so that the inner packaging box 100 is prevented from being impacted to generate collision and damage the electronic element.

Preferably, first cardboard 500 sets up in inner packing box 100 below, can play the effect of bearing inner packing box 100, guarantees that inner packing box 100 can stably bear inside outer packing box 200. In addition, the first paper board 500 can also play a certain role in absorbing moisture and dehumidifying, so that the influence of moisture and humidity on electronic components is avoided.

Preferably, the first paper board 500 is a corrugated paper board, which has high structural strength and can bear the weight of the inner packing box 100.

In an alternative embodiment of this embodiment, the electronic component package further includes a third foam pad 300 and a second paper board 400.

The third foam pad 300 and the second paper board 400 are sequentially disposed in the outer packing box 200 from top to bottom, and the second paper board 400 is disposed at the top of the inner packing box 100.

Preferably, the third foam pad 300 is disposed at the top inside the outer packing box 200, after the cover set 210 is fastened, the cover set 210 abuts against the third foam pad 300, the second paper board 400 is disposed below the third foam pad 300, and the plurality of inner packing boxes 100 are disposed below the second paper board 400.

Preferably, the third foam pad 300 is made of a soft material and is used for buffering and absorbing impact, and when the outer packing box 200 is subjected to external impact in the transportation process, the third foam pad 300 can absorb the impact and prevent the inner packing box 100 from being impacted to cause collision and damage to the electronic component.

Preferably, the second paperboard 400 is disposed above the inner packing box 100, and can limit the inner packing box 100, and stabilize the inner packing box 100, and ensure that the inner packing box 100 can be stably supported between the first paperboard 500 and the second paperboard 400 inside the outer packing box 200. In addition, the second paper board 400 can absorb moisture and remove humidity to prevent moisture and humidity from affecting electronic components.

Preferably, the second paper board 400 is a corrugated paper board, which has high structural strength and can bear the weight of the inner packing box 100.

The multiunit inner packing box 100 sets up between the higher first cardboard 500 of structural strength and second cardboard 400, avoids multiunit inner packing box 100 directly to load between the cotton pad 600 of the soft second bubble of material and the cotton pad 300 of third bubble, prevents that inner packing box 100 from appearing rocking unstable problem.

Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; such modifications and substitutions do not depart from the spirit and scope of the embodiments of the present invention.

Claims (10)

1. An electronic component package, comprising: an outer packing box (200), an inner packing box (100) and an electronic component bearing support;

the electronic element bearing support is laid on the inner packing box (100), the electronic element bearing support is used for bearing and fixing electronic elements, and a plurality of layers of the inner packing box (100) are stacked in the outer packing box (200).

2. The electronic component package of claim 1, wherein the inner package (100) comprises an upper case (120) and a lower case (110), the upper case (120) being snapably coupled to the lower case (110);

the lower shell (110) is provided with a containing cavity (111), and the electronic element bearing support is laid in the containing cavity (111).

3. The electronic component package according to claim 2, wherein the inner package box (100) has a rectangular parallelepiped structure, and the length of the inner package box (100) is 353mm, the width of the inner package box is 353mm, and the height of the inner package box is 17 mm.

4. An electronic component package according to claim 3, wherein the electronic component carrier is a first blister pad (130), the pins of the electronic component being insertable into the first blister pad (130).

5. The electronic component package of claim 4, wherein the first foam pad (130) has a length of 345mm, a width of 345mm, and a height of 8 mm; and 24 rows of the electronic components are transversely arranged on the first foam pad (130), and 23 rows of the electronic components are vertically arranged on the first foam pad (130).

6. The electronic component package of claim 3, wherein the outer package (200) is a rectangular parallelepiped structure, the outer package (200) having a length of 360mm, a width of 360mm and a height of 220 mm.

7. The electronic component package of claim 6, wherein ten of the inner packages (100) are stacked within a single outer package (200).

8. The electronic component package of claim 1, wherein the outer package (200) has an upper lid pack (210), a case (230), and a lower lid pack (220), the upper lid pack (210) and the lower lid pack (220) each being openably connected to the case (230); the upper cover group (210) and the lower cover group (220) can be sealed by an adhesive tape.

9. The electronic component package according to any one of claims 1-8, further comprising a second blister pad (600) and a first paperboard (500);

the second foam pad (600) and the first paper board (500) are sequentially arranged at the bottom position in the outer packing box (200) from bottom to top, and a plurality of groups of inner packing boxes (100) are arranged above the first paper board (500).

10. The electronic component package according to any one of claims 1-8, further comprising a third blister pad (300) and a second paperboard (400);

the third foam pad (300) and the second paper board (400) are sequentially arranged in the outer packing box (200) from top to bottom, and the second paper board (400) is arranged at the top of the inner packing box (100).

Images