CN213495895U - Wafer punch forming equipment for industrial manufacturing - Google Patents
Wafer punch forming equipment for industrial manufacturing Download PDFInfo
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- CN213495895U CN213495895U CN202022341570.0U CN202022341570U CN213495895U CN 213495895 U CN213495895 U CN 213495895U CN 202022341570 U CN202022341570 U CN 202022341570U CN 213495895 U CN213495895 U CN 213495895U
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 13
- 238000004080 punching Methods 0.000 claims abstract description 40
- 239000000463 material Substances 0.000 claims description 24
- 238000003825 pressing Methods 0.000 claims description 8
- 229910001220 stainless steel Inorganic materials 0.000 claims description 2
- 239000010935 stainless steel Substances 0.000 claims description 2
- 238000000465 moulding Methods 0.000 claims 4
- 235000012431 wafers Nutrition 0.000 abstract description 15
- 230000000694 effects Effects 0.000 abstract description 2
- 238000000034 method Methods 0.000 abstract description 2
- 238000005520 cutting process Methods 0.000 abstract 1
- 229910000831 Steel Inorganic materials 0.000 description 2
- 230000001808 coupling Effects 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 229910000976 Electrical steel Inorganic materials 0.000 description 1
- 230000000875 corresponding Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000009776 industrial production Methods 0.000 description 1
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Chemical group [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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Abstract
The utility model relates to a stamping forming technique especially relates to a disk stamping forming equipment for industrial manufacturing. The wafer punch forming equipment for industrial manufacturing is high in efficiency, and wafers after punch forming are not prone to adhesion. The stamping device comprises a bottom plate, a stamping table, support frames and the like, wherein the stamping table is arranged on one side of the top of the bottom plate, and the support frames are arranged on two sides of the top of the bottom plate. Through the cylinder function, drive the elevator downstream, the spring part is compressed, simultaneously, connect the flitch to move right and no longer block the punching press head, the elevator drives punching press head downstream and carries out stamping forming to panel, after punching press work was accomplished, the cylinder upward movement drives and connects the flitch to reset, drives the ejector pad under the effect of spring part and releases the disk, the disk falls into immediately and connects on the flitch, prevent that the disk adhesion is on the punching press head after the cutting, and make things convenient for the workman to collect the disk.
Description
Technical Field
The utility model relates to a stamping forming technique especially relates to a disk stamping forming equipment for industrial manufacturing.
Background
The press forming is a processing and forming method for obtaining a workpiece (stamping part) with a required shape and size by applying an external force to a plate, a strip, a pipe, a section bar and the like by a press machine and a die to cause plastic deformation or separation.
In the world, 60-70% of steel products are plates, and most of the steel products are finished products manufactured by stamping. The body, chassis, oil tank, radiator sheet, boiler steam drum, shell of container, iron core silicon steel sheet of motor and electric appliance are all made by punching. Therefore, the punch forming technology is widely applied to industrial production.
When the circular sheet is subjected to punch forming on the plate, the plate is placed under a punching device, a worker presses the device to perform punch forming on the plate, then the circular sheet is taken out, and the punch forming is performed.
SUMMERY OF THE UTILITY MODEL
In order to overcome the defects that the punch forming efficiency of the wafer is low and the wafer is easy to adhere to equipment, the technical problems to be solved are as follows: the wafer punch forming equipment for industrial manufacturing is high in efficiency, and wafers after punch forming are not prone to adhesion.
The technical implementation scheme of the utility model is: the utility model provides a disk stamping forming equipment for industrial manufacturing, is including bottom plate, punching press platform and support frame, and bottom plate top one side is equipped with the punching press platform, and bottom plate top both sides all are equipped with the support frame, still including punching press mechanism and receiving mechanism, are equipped with punching press mechanism between the support frame top, are connected with receiving mechanism between punching press mechanism and the bottom plate.
As further preferred scheme, the punching press mechanism is including the mounting panel, the depression bar, a supporting plate, the cylinder, the elevator, a slide rail, the punching press head, the spring part, briquetting and ejector pad down, be connected with the mounting panel between the support frame upper portion, mounting panel lower part both sides all are equipped with the depression bar, the mounting panel top is equipped with the backup pad, backup pad one side is equipped with the cylinder, the cylinder bottom is connected with the elevator, the mounting panel both sides all are equipped with the slide rail, the elevator cooperatees with the slide rail, the elevator bottom is equipped with the punching press head, elevator lower part inner wall both sides all are connected with the spring part, be connected with the ejector pad between the spring part end, ejector pad and the first slidingtype cooperation of punching press, ejector pad top both.
As further preferred scheme, receiving mechanism is including first connecting block, first push rod, first connecting axle, connect the flitch, the second push rod, the second connecting block, second connecting axle and pin, elevator bottom both sides all are equipped with first connecting block, equal rotary type is connected with first push rod on the first connecting block, be connected with first connecting axle between the first push rod, the equal rotary type in first connecting axle both sides is connected with the second push rod, the second connecting axle of both sides passes through the second connecting block and connects at the bottom plate top, the second push rod is terminal to be connected with second connecting axle rotary type, be connected with the flitch between the first push rod bottom, be equipped with the pin between the support frame lower part, connect flitch bottom and pin contact.
As a further preferable scheme, the stamping device further comprises a lifting stop rod, and the lifting stop rod is arranged on one side of the lower portion of the supporting frame close to the stamping platform.
Preferably, the punch is made of stainless steel.
Compared with the prior art, the utility model has the advantages of as follows: the lifting block is driven to move downwards through the operation of the air cylinder, the spring part is compressed, meanwhile, the material receiving plate moves rightwards, the stamping head is not blocked any more, the lifting block drives the stamping head to move downwards to stamp the plate, after the stamping work is finished, the air cylinder moves upwards to drive the material receiving plate to reset, the material pushing block is driven to push out the wafer under the action of the spring part, the wafer immediately falls into the material receiving plate, the cut wafer is prevented from being adhered to the stamping head, and a worker can conveniently collect the wafer; the residual plates after the plate is punched and formed are easily adhered to the punching head, and the lifting stop rod can prevent the residual plates from moving upwards under the driving of the punching head.
Drawings
Fig. 1 is a schematic perspective view of the main body of the present invention.
Fig. 2 is the perspective structure schematic diagram of the punching mechanism of the present invention.
Fig. 3 is a schematic view of the cross-sectional three-dimensional structure of the stamping head of the present invention.
Fig. 4 is a schematic view of the three-dimensional structure of the receiving mechanism of the present invention.
Wherein: 1: bottom plate, 10: stamping table, 2: support frame, 3: punching mechanism, 30: mounting plate, 31: pressure lever, 32: support plate, 33: cylinder, 34: lifting block, 35: slide rail, 36: punch head, 37: spring member, 38: briquetting, 39: pusher block, 310: chute, 4: receiving mechanism, 40: first connection block, 41: first push rod, 42: first connecting shaft, 43: material receiving plate, 44: second push rod, 45: second connecting block, 46: second connecting shaft, 47: stop lever, 5: and (5) stopping lifting of the rod.
Detailed Description
The following further describes the technical solution with reference to specific embodiments, and it should be noted that: the words upper, lower, left, right, and the like used herein to indicate orientation are merely for the location of the illustrated structure in the corresponding figures. The serial numbers of the parts are themselves numbered herein, for example: first, second, etc. are used solely to distinguish one from another as to objects described herein, and do not have any sequential or technical meaning. The application states that: the connection and coupling, unless otherwise indicated, include both direct and indirect connections (couplings).
Example 1
The utility model provides a disk stamping forming equipment for industrial manufacturing, as shown in figure 1, including bottom plate 1, punching press platform 10, support frame 2, punching press mechanism 3 and receiving mechanism 4, 1 top left side of bottom plate is equipped with punching press platform 10, and the side all is equipped with support frame 2 around 1 top of bottom plate, is equipped with punching press mechanism 3 between the support frame 2, is connected with receiving mechanism 4 between punching press mechanism 3 and the bottom plate 1.
When needing to carry out stamping forming to panel, at first, the workman places panel on punching press platform 10, starts punching press mechanism 3 afterwards and carries out stamping forming to panel, and the disk after the punching press drops to receiving mechanism 4 under punching press mechanism 3's effect on, the workman collect the disk after the punching press can on receiving mechanism 4, if carry out punching press work once more, repeat above operation.
Example 2
On the basis of embodiment 1, as shown in fig. 2 and 3, the stamping mechanism 3 includes a mounting plate 30, a pressure rod 31, a support plate 32, an air cylinder 33, a lifting block 34, a slide rail 35, a stamping head 36, a spring member 37, a lower pressing block 38 and a pushing block 39, the mounting plate 30 is connected between the upper portions of the support frames 2, the pressure rod 31 is arranged at both left sides of the mounting plate 30, the support plate 32 is arranged at the top of the mounting plate 30, the air cylinder 33 is arranged at the left side of the support plate 32, the lifting block 34 is connected at the bottom of the air cylinder 33, the slide rail 35 is arranged at both front and back of the left portion of the mounting plate 30, the lifting block 34 is matched with the slide rail 35, the stamping head 36 is arranged at the bottom of the lifting block 34, the two spring members 37 are connected on the lower inner wall of the lifting block 34, the pushing block 39 is connected with the, the lower pressing block 38 is matched with the pressing rod 31 through the sliding groove 310.
After the plate is placed, a worker moves the telescopic rod of the control cylinder 33 downwards, the cylinder 33 drives the lifting block 34 to slide downwards in the sliding rail 35, the lifting block 34 moves downwards to drive the punching head 36 and the material pushing block 39 to move downwards, so that the punching head 36 moves downwards to punch and form the plate, at the moment, the plate pushes the material pushing block 39 to move upwards, the spring piece 37 is compressed, after the punch and form is completed, the telescopic rod of the control cylinder 33 moves upwards to control the punching head 36 not to be in contact with the plate, the material pushing block 39 is driven to move downwards to push the wafer out of the punching head 36 under the action of the spring piece 37, when the lower pressing block 38 moves upwards to be in contact with the pressing rod 31, the punching head 36 stops moving upwards, and a worker can collect the punched and formed wafer.
As shown in fig. 4, the material receiving mechanism 4 includes a first connecting block 40, a first push rod 41, a first connecting shaft 42, a material receiving plate 43, a second push rod 44, a second connecting block 45, a second connecting shaft 46 and a stop lever 47, the first connecting block 40 is disposed on both sides of the bottom of the lifting block 34, the first push rod 41 is rotatably connected to the first connecting block 40, the first connecting shaft 42 is connected between the first push rods 41, the second push rod 44 is rotatably connected to the front and rear ends of the first connecting shaft 42, two second connecting blocks 45 are disposed on the front and rear sides of the top of the bottom plate 1, the second connecting shaft 46 is connected between the two second connecting blocks 45, the end of the second push rod 44 is rotatably connected to the first connecting shaft 42, the material receiving plate 43 is disposed between the bottoms of the first push rods 41, the stop lever 47 is connected between the lower portions of the support frames 2, and the bottom of the material receiving plate.
The lifting block 34 moves downwards to drive the first push rod 41 to swing rightwards through the first connecting block 40, the first push rod 41 drives the second push rod 44 to swing rightwards, the material receiving plate 43 moves rightwards along with the first push rod 41, the stamping head 36 is not blocked any more, the stamping head 36 moves downwards to punch and form plates, after stamping is completed, the lifting block 34 moves upwards to drive the first push rod 41 to move upwards, the material receiving plate 43 is driven to move leftwards through the second push rod 44, at the moment, the wafer drops onto the material receiving plate 43, and a worker collects the wafer on the right side of the material receiving plate 43.
As shown in fig. 1, the lifting device further comprises a lifting stop rod 5, and the lifting stop rod 5 is arranged on the left side of the lower part of the support frame 2.
After the punching head 36 performs punch forming on the plate, the plate may be adhered to the bottom of the punching head 36, and the lifting stop rod 5 can block the rest part of the plate.
The above description is only for the specific embodiments of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art can easily think of the changes or substitutions within the technical scope of the present invention, and all should be covered within the protection scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (5)
1. The utility model provides a disk stamping forming equipment for industrial manufacturing, including bottom plate (1), punching press platform (10) and support frame (2), bottom plate (1) top one side is equipped with punching press platform (10), and bottom plate (1) top both sides all are equipped with support frame (2), its characterized in that: the automatic feeding device is characterized by further comprising a stamping mechanism (3) and a material receiving mechanism (4), wherein the stamping mechanism (3) is arranged between the tops of the supporting frames (2), and the material receiving mechanism (4) is connected between the stamping mechanism (3) and the bottom plate (1).
2. The wafer press molding apparatus for industrial manufacturing according to claim 1, wherein: the stamping mechanism (3) comprises a mounting plate (30), pressure rods (31), a support plate (32), an air cylinder (33), lifting blocks (34), slide rails (35), a stamping head (36), spring parts (37), a lower pressure block (38) and a pushing block (39), the mounting plate (30) is connected between the upper portions of the support frames (2), the pressure rods (31) are arranged on two sides of the lower portion of the mounting plate (30), the support plate (32) is arranged on the top of the mounting plate (30), the air cylinder (33) is arranged on one side of the support plate (32), the lifting blocks (34) are connected to the bottom of the air cylinder (33), the slide rails (35) are arranged on two sides of the mounting plate (30), the lifting blocks (34) are matched with the slide rails (35), the stamping head (36) is arranged on the bottom of the lifting block (34), the spring parts (37) are connected to, the material pushing block (39) is matched with the punching head (36) in a sliding mode, the two sides of the top of the material pushing block (39) are both connected with the lower pressing block (38), the two sides of the lower portion of the lifting block (34) are both provided with sliding grooves (310), and the lower pressing block (38) penetrates through the sliding grooves (310) to be matched with the pressing rod (31).
3. The wafer press molding apparatus for industrial manufacturing according to claim 2, wherein: the material receiving mechanism (4) comprises a first connecting block (40), a first push rod (41), a first connecting shaft (42), a material receiving plate (43), a second push rod (44), a second connecting block (45), a second connecting shaft (46) and a stop lever (47), wherein the first connecting block (40) is arranged on each of two sides of the bottom of the lifting block (34), the first push rod (41) is rotatably connected to the first connecting block (40), the first connecting shaft (42) is connected between the first push rods (41), the second push rods (44) are rotatably connected to each of two sides of the first connecting shaft (42), the second connecting shafts (46) on two sides are connected to the top of the base plate (1) through the second connecting blocks (45), the tail ends of the second push rods (44) are rotatably connected with the second connecting shafts (46), the material receiving plate (43) is connected between the bottoms of the first push rods (41), the stop lever (47) is arranged between the lower portions of the support frames (2, the bottom of the material receiving plate (43) is contacted with the stop lever (47).
4. The wafer press molding apparatus for industrial manufacturing according to claim 3, wherein: the stamping device is characterized by further comprising a lifting stop rod (5), wherein the lifting stop rod (5) is arranged on one side of the lower portion of the support frame (2) close to the stamping platform (10).
5. The wafer press molding apparatus for industrial manufacturing according to claim 2, wherein: the punch head (36) is made of stainless steel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022341570.0U CN213495895U (en) | 2020-10-20 | 2020-10-20 | Wafer punch forming equipment for industrial manufacturing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022341570.0U CN213495895U (en) | 2020-10-20 | 2020-10-20 | Wafer punch forming equipment for industrial manufacturing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213495895U true CN213495895U (en) | 2021-06-22 |
Family
ID=76400467
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022341570.0U Active CN213495895U (en) | 2020-10-20 | 2020-10-20 | Wafer punch forming equipment for industrial manufacturing |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213495895U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114260352A (en) * | 2022-03-02 | 2022-04-01 | 江苏海德曼新材料股份有限公司 | Aluminium veneer stamping forming processing equipment |
-
2020
- 2020-10-20 CN CN202022341570.0U patent/CN213495895U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114260352A (en) * | 2022-03-02 | 2022-04-01 | 江苏海德曼新材料股份有限公司 | Aluminium veneer stamping forming processing equipment |
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