CN213495359U

CN213495359U - Semiconductor wafer boat sediment cleaning device

Info

Publication number: CN213495359U
Application number: CN202021022129.XU
Authority: CN
Inventors: 王璐瑶
Original assignee: Guangzhou Ruigao Electronic Technology Co ltd
Current assignee: Guangzhou Ruigao Electronic Technology Co ltd
Priority date: 2020-06-06
Filing date: 2020-06-06
Publication date: 2021-06-22
Anticipated expiration: 2030-06-06

Abstract

The utility model discloses a semiconductor crystal boat deposit cleaning device, including casing and crystal boat, crystal boat fixed mounting is in the inside of casing, the upper end fixedly connected with cleaning device of casing, the bottom fixedly connected with under casing of crystal boat, and under casing) the bottom fixed connection in the inside bottom of casing. This semiconductor crystal boat deposit cleaning device, through setting up cleaning device isotructure, when carrying out deposit clearance to the wafer on the crystal boat, only need to drive the pivot of cleaning device bottom through clicking and rotate the clearance pole to vertical position, the connecting rod on pivot surface drives the clearance pole in the spout simultaneously and removes the intermediate position to the crystal boat, simultaneously through connecting intake pipe and outlet duct to cleaning device inside and with the nozzle department on clearance pole and telescopic link surface be connected, can utilize the nozzle to clear up the wafer on the crystal boat, the effect of the inside deposit of automatic clearance crystal boat has been reached.

Description

Semiconductor wafer boat sediment cleaning device

Technical Field

The utility model belongs to the technical field of the semiconductor and specifically relates to a semiconductor wafer boat deposit cleaning device.

Background

Many processes are performed in a chamber of a semiconductor processing apparatus during a wafer manufacturing process, and by-products are inevitably deposited in the chamber during the wafer processing process. When the by-products are deposited to a certain thickness, the by-products are peeled off and fall onto the wafer placed in the cavity, and the quality of the wafer is affected.

At present, generally, like a manual boat blowing method, by-products deposited and falling on a boat are blown off, when the boat is blown off manually, a cabin door of a cavity needs to be opened, floating objects in air are easily brought into the cavity, the floating objects fall on a wafer to influence the quality of the wafer, the original atmosphere in the cavity is damaged after the cabin door is opened, the same atmosphere is created in the cavity for a long time, manual operation is adopted, and the risk of operation not according to the established rules exists.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a semiconductor wafer boat deposit cleaning device to solve the problem that proposes among the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme:

the utility model provides a semiconductor crystal boat deposit cleaning device, includes casing and crystal boat, crystal boat fixed mounting is in the inside of casing, the upper end fixedly connected with cleaning device of casing, the bottom fixedly connected with under casing of crystal boat, and under casing) the bottom fixed connection in the inside bottom of casing.

In a further embodiment, a motor is fixedly connected to the middle position of the upper end surface of the cleaning device, and a circuit of the motor extends to the inside of the cleaning device.

In a further embodiment, the left side and the right side of the rear end surface of the cleaning device are respectively provided with an air outlet hole and an air inlet hole, and the air inlet holes and the air outlet holes both extend to the inside of the cleaning device.

In a further embodiment, a cleaning rod is installed at the bottom end of the cleaning device, a telescopic column is slidably connected to the front end of the cleaning rod, and a rotating shaft is fixedly connected to the tail end of the cleaning rod.

In a further embodiment, the middle position of the surface of the rotating shaft is fixedly connected with a connecting rod, the left side and the right side of the bottom end of the cleaning device are both provided with transversely arranged sliding grooves, and the connecting rod is slidably connected inside the sliding grooves.

In a further embodiment, a nozzle is fixedly connected to the inner side surfaces of the cleaning rod and the telescopic rod, and the nozzle extends to the inside of the cleaning rod and the telescopic rod.

In a further embodiment, a collecting tank is arranged inside the bottom box, two placing plates are fixedly connected to the middle position of the upper end surface of the bottom box, the boat is fixedly installed above the placing plates, and a box door is movably connected to the front end surface of the bottom box.

Compared with the prior art, the beneficial effects of the utility model are that:

1. this semiconductor crystal boat deposit cleaning device, through setting up cleaning device isotructure, when carrying out deposit clearance to the wafer on the crystal boat, only need to drive the pivot of cleaning device bottom through clicking and rotate the clearance pole to vertical position, the connecting rod on pivot surface drives the clearance pole in the spout simultaneously and removes the intermediate position to the crystal boat, simultaneously through connecting intake pipe and outlet duct to cleaning device inside and with the nozzle department on clearance pole and telescopic link surface be connected, can utilize the nozzle to clear up the wafer on the crystal boat, the effect of the inside deposit of automatic clearance crystal boat has been reached.

2. This semiconductor wafer boat deposit cleaning device through setting up under casing isotructure, after cleaning device blows the deposit of wafer boat upper end, through the under casing that the wafer boat bottom set up for in the deposit fell the collecting vat that sets up in the under casing, collect the deposit through the collecting vat is unified, then take out the deposit through the chamber door, reached the effect of conveniently clearing up the deposit.

Drawings

FIG. 1 is a schematic diagram of the explosion effect structure of the semiconductor boat deposit cleaning apparatus.

FIG. 2 is a schematic diagram of a rear end perspective view of a semiconductor wafer boat deposit cleaning apparatus.

FIG. 3 is a schematic bottom perspective view of the semiconductor wafer boat deposit cleaning apparatus.

FIG. 4 is a schematic side view of a cleaning rod of the semiconductor wafer boat deposit cleaning apparatus.

In the figure: 1. a housing; 2. a wafer boat; 3. a cleaning device; 31. a motor; 32. an air inlet; 33. an air outlet; 34. cleaning the rod; 341. a telescopic column; 342. a rotating shaft; 343. a connecting rod; 344. a nozzle; 35. a chute; 4. a bottom box; 41. collecting tank; 42. placing the plate; 43. and (4) a box door.

Detailed Description

In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are used merely for convenience of description and for simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention. Furthermore, the terms "first", "second", etc. are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first," "second," etc. may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless otherwise specified.

In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art through specific situations.

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Example 1

Referring to fig. 1-3, in the embodiment of the present invention, a semiconductor wafer boat deposit cleaning apparatus comprises a housing 1 and a wafer boat 2, the wafer boat 2 is fixedly installed inside the housing 1, a cleaning device 3 is fixedly connected to the upper end of the housing 1, a bottom box 4 is fixedly connected to the bottom end of the wafer boat 2, the bottom end of the bottom box 4 is fixedly connected to the bottom end of the housing 1, a motor 31 is fixedly connected to the middle position of the upper surface of the cleaning device 3, a circuit of the motor 31 extends to the inside of the cleaning device 3, air outlet holes 33 and air inlet holes 32 are respectively formed on the left and right sides of the rear end surface of the cleaning device 3, the air inlet holes 32 and the air outlet holes 33 both extend to the inside of the cleaning device 3, a cleaning rod 34 is installed at the bottom end of the cleaning device 3, a telescopic column 341 is slidably connected to the front end of the cleaning rod 34, a rotating shaft 342 is fixedly connected to the end of the cleaning rod 34, a connecting rod 343 is, the left side and the right side of the bottom end of the cleaning device 3 are both provided with a sliding chute 35 which is transversely arranged, the connecting rod 343 is connected inside the sliding chute 35 in a sliding way, the inner side surfaces of the cleaning rod 34 and the telescopic column 341 are both fixedly connected with a nozzle 344, and the nozzle 344 extends to the inside of the cleaning rod 34 and the telescopic column 341, by providing the cleaning device 3 and the like, when cleaning the deposit on the wafer boat 2, the cleaning rod 34 is rotated to the vertical position only by clicking the rotating shaft 342 at the bottom end of the cleaning device 3, meanwhile, the connecting rod 343 on the surface of the rotating shaft 342 drives the cleaning rod 34 to move to the middle position of the boat 2 in the sliding slot 35, while by connecting the inlet and outlet pipes to the interior of the cleaning device 3 and to the cleaning bar 34 and the nozzles 344 on the surface of the telescopic bars, the nozzle 344 can be used to clean the wafers on the boat 2, so as to achieve the effect of automatically cleaning the deposits inside the boat 2.

Example 2

The difference from example 1 is: collecting vat 41 has been seted up to the inside of under casing 4, and two upper end surface intermediate position fixedly connected with of under casing 4

place board

42, 2 fixed mounting of boat is in the top of placing board 42, the front end surface swing joint of under casing 4 has chamber door 43, through setting up under casing 4 isotructure, after the deposit with the boat 2 upper end blows at cleaning device 3, under casing 4 through 2 bottoms of boat set up, make the deposit fall in the collecting vat 41 that sets up in under casing 4, collect the deposit through collecting vat 41 in unison, then take out the deposit through chamber door 43, the effect of conveniently clearing up the deposit has been reached.

The utility model discloses a theory of operation is: when carrying out deposit clearance to the wafer on the boat 2, only need to drive pivot 342 in cleaning device 3 bottom through clicking and rotate clearance pole 34 to vertical position, connecting rod 343 on pivot 342 surface drives clearance pole 34 in spout 35 and moves to the intermediate position of boat 2 simultaneously, simultaneously through connecting intake pipe and outlet duct to cleaning device 3 inside and being connected with clearance pole 34 and the surperficial nozzle 344 of telescopic link, can utilize nozzle 344 to clear up the wafer on the boat 2, blow behind the deposit of boat 2 upper end at cleaning device 3, through the under casing 4 that the boat 2 bottom set up, make the deposit fall in the collecting vat 41 that sets up in under casing 4, collect the deposit through collecting vat 41 in unison, then take out the deposit through chamber door 43.

It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.

Claims

1. The utility model provides a semiconductor wafer boat deposit cleaning device, includes casing (1) and wafer boat (2), wafer boat (2) fixed mounting is in the inside of casing (1), its characterized in that, the upper end fixedly connected with cleaning device (3) of casing (1), the bottom fixedly connected with under casing (4) of wafer boat (2), and the bottom fixed connection of under casing (4) is in the inside bottom of casing (1).

2. The semiconductor boat deposit cleaning device according to claim 1, wherein a motor (31) is fixedly connected to the middle position of the upper end surface of the cleaning device (3), and a circuit of the motor (31) extends to the inside of the cleaning device (3).

3. The semiconductor wafer boat deposit cleaning device according to claim 2, wherein the left side and the right side of the rear end surface of the cleaning device (3) are respectively provided with an air outlet hole (33) and an air inlet hole (32), and the air inlet hole (32) and the air outlet hole (33) both extend to the inside of the cleaning device (3).

4. The semiconductor wafer boat sediment cleaning device as claimed in claim 3, wherein a cleaning rod (34) is mounted at the bottom end of the cleaning device (3), a telescopic column (341) is slidably connected to the front end of the cleaning rod (34), and a rotating shaft (342) is fixedly connected to the tail end of the cleaning rod (34).

5. The semiconductor wafer boat deposit cleaning device according to claim 4, wherein a connecting rod (343) is fixedly connected to a middle position of the surface of the rotating shaft (342), the left side and the right side of the bottom end of the cleaning device (3) are respectively provided with a transversely arranged sliding groove (35), and the connecting rod (343) is slidably connected inside the sliding groove (35).

6. The semiconductor boat deposit cleaning apparatus according to claim 4, wherein nozzles (344) are fixedly connected to the inner side surfaces of the cleaning rod (34) and the telescopic column (341), and the nozzles (344) extend into the cleaning rod (34) and the telescopic column (341).

7. The semiconductor wafer boat sediment cleaning device as claimed in claim 1, wherein a collection tank (41) is disposed inside the bottom box (4), two placing plates (42) are fixedly connected to the middle position of the upper end surface of the bottom box (4), the wafer boat (2) is fixedly installed above the placing plates (42), and a box door (43) is movably connected to the front end surface of the bottom box (4).