CN213482379U - LED chip testing device - Google Patents

LED chip testing device Download PDF

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Publication number
CN213482379U
CN213482379U CN202021794356.4U CN202021794356U CN213482379U CN 213482379 U CN213482379 U CN 213482379U CN 202021794356 U CN202021794356 U CN 202021794356U CN 213482379 U CN213482379 U CN 213482379U
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China
Prior art keywords
fixedly connected
electric telescopic
telescopic handle
pressure head
led chip
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CN202021794356.4U
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Chinese (zh)
Inventor
杨良春
赵永峰
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Anhui Xinnuoda Microelectronics Co ltd
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Anhui Xinnuoda Microelectronics Co ltd
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Abstract

The utility model belongs to the technical field of test equipment, in particular to a LED chip testing device, which comprises a test board, a positioning plate and an electric telescopic rod, wherein the top of the test board is fixedly connected with two symmetrically distributed supporting plates, one end of the two supporting plates, which is far away from the test board, is fixedly connected with a mounting plate, the top of the test board is fixedly connected with three symmetrically distributed pressure sensors, and the pressure sensors are in signal connection with an external PLC controller; put into the dead slot on the locating plate to the chip that needs the test in, then control electric telescopic handle descends to drive first pressure head, second pressure head, third pressure head and extrude the chip, then contrast, thereby observe the chip at the different damage degree that takes place of lifting surface under the same kind of pressure, but also can change the same pressure head, then observe under the condition that lifting surface and pressure are the same, the position of easy damage on the chip body, the people of being convenient for observe and the record.

Description

LED chip testing device
Technical Field
The utility model belongs to the technical field of test equipment, concretely relates to LED chip testing arrangement.
Background
The LED chip is a solid semiconductor device, the heart of the LED is a semiconductor wafer, one end of the wafer is attached to a support, the other end of the wafer is a cathode, the other end of the wafer is connected with an anode of a power supply, the whole wafer is packaged by epoxy resin, and the LED chip is usually subjected to various tests before being delivered from a factory.
When the existing LED chips are tested, operators cannot compare the test results of the LED chips, and people cannot observe the test results and record data conveniently.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a LED chip testing arrangement to solve the problem that proposes among the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme: a LED chip testing device comprises a testing table, a positioning plate and an electric telescopic rod, wherein the top of the testing table is fixedly connected with two symmetrically distributed supporting plates, one end of each of the two supporting plates, which is far away from the testing table, is fixedly connected with a mounting plate, the top of the testing table is fixedly connected with three symmetrically distributed pressure sensors, the pressure sensors are in signal connection with an external PLC (programmable logic controller), the number of the positioning plates is three, the positioning plates are detachably connected with the testing table, empty grooves are formed in the positioning plates, the pressure sensors are clamped and connected with the positioning plates in the empty grooves, the number of the electric telescopic rods is three, the electric telescopic rods are in signal connection with the external PLC, the electric telescopic rods are detachably connected with the mounting plates, one end of each electric telescopic rod, which is far away from, the connecting ring connected with one of the electric telescopic rods is fixedly connected with a first pressure head, the connecting ring connected with one of the electric telescopic rods is fixedly connected with a second pressure head, and the connecting ring connected with one of the electric telescopic rods is fixedly connected with a third pressure head.
Preferably, four corners of the bottom of the test board are fixedly connected with supporting legs, and one ends of the supporting legs, far away from the test board, are fixedly connected with rubber pads.
Preferably, the outer wall of the positioning plate is fixedly connected with a connecting plate, the connecting plate is provided with a connecting bolt, and the connecting plate is fixedly connected with the test board through the connecting bolt in a threaded manner.
Preferably, the electric telescopic handle is close to the one end fixedly connected with fixed plate of mounting panel, be equipped with fixing bolt on the fixed plate, the fixed plate passes through fixing bolt with the mounting panel spiro union is fixed.
Preferably, the first ram, the second ram, and the third ram are different sizes.
Preferably, one end of the electric telescopic rod, which is far away from the mounting plate, is fixedly connected with a connecting threaded rod, and the electric telescopic rod is fixedly connected with the connecting ring through the connecting threaded rod.
Preferably, the first pressure head, the second pressure head and the third pressure head are all made of stainless steel.
Compared with the prior art, the beneficial effects of the utility model are that:
1. when using this device, put into the dead slot on the locating plate to the chip that needs the test in, then control electric telescopic handle descends, thereby drive first pressure head, second pressure head, third pressure head and extrude the chip, then contrast, thereby observe the chip at the different damage degree that takes place of lifting surface under the same kind of pressure, and can also change the same pressure head, then observe under the condition that lifting surface and pressure are the same, the position of easy damage on the chip body, the people of being convenient for observe and the record.
Drawings
The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention, and together with the description serve to explain the invention and not to limit the invention. In the drawings:
fig. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic structural view of the test board and the electric telescopic rod of the present invention;
fig. 3 is a schematic structural view of the electric telescopic rod and the connecting ring according to the present invention;
fig. 4 is a schematic structural view of the middle positioning plate of the present invention.
In the figure: 1. a test bench; 11. supporting legs; 111. a rubber pad; 12. a support plate; 13. mounting a plate; 14. a pressure sensor; 2. positioning a plate; 21. a connecting plate; 211. a connecting bolt; 22. an empty groove; 3. an electric telescopic rod; 31. a fixing plate; 311. fixing the bolt; 32. a connecting ring; 33. a first ram; 34. a second ram; 35. a third ram; 36. connecting the threaded rod.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-4, the present invention provides the following technical solutions: a LED chip testing device comprises a testing platform 1, a positioning plate 2 and electric telescopic rods 3, wherein the top of the testing platform 1 is fixedly connected with two symmetrically distributed supporting plates 12, one ends of the two supporting plates 12, which are far away from the testing platform 1, are fixedly connected with a mounting plate 13, the top of the testing platform 1 is fixedly connected with three symmetrically distributed pressure sensors 14, the pressure sensors 14 are in signal connection with an external PLC controller, the number of the positioning plates 2 is three, the positioning plates 2 are detachably connected with the testing platform 1, empty grooves 22 are formed in the positioning plates 2, the pressure sensors 14 are clamped and connected with the positioning plates 2 in the empty grooves 22, the number of the electric telescopic rods 3 is three, the electric telescopic rods 3 are in signal connection with the external PLC controller, the electric telescopic rods 3 are detachably connected with the mounting plate 13, one ends of the electric telescopic rods 3, which are far away from the mounting plate 13, are, a second pressure head 34 is fixedly connected to the connecting ring 32 connected to one of the electric telescopic rods 3, and a third pressure head 35 is fixedly connected to the connecting ring 32 connected to one of the electric telescopic rods 3.
In this embodiment: the top of the test bench 1 is fixedly connected with two symmetrically distributed support plates 12, one end of each of the two support plates 12, which is far away from the test bench 1, is fixedly connected with a mounting plate 13, the top of the test bench 1 is fixedly connected with three symmetrically distributed pressure sensors 14, the pressure sensors 14 are in signal connection with an external PLC (programmable logic controller), the pressure sensors 14 can sense the pressure applied to the LED chip in the test process and transmit the pressure to the external PLC, the number of the positioning plates 2 is three, the positioning plates 2 are detachably connected with the test bench 1, the positioning plates 2 are provided with empty grooves 22, the pressure sensors 14 are connected with the positioning plates 2 in the empty grooves 22 in a clamping manner, the number of the electric telescopic rods 3 is three, the electric telescopic rods 3 are in signal connection with the external PLC, the electric telescopic rods 3 are detachably connected with the mounting plates 13, and one end of, when the device is used, firstly, the positioning plate 2 is connected with the test bench 1, then the LED chip to be tested is placed in the empty groove 22 on the positioning plate 2, then the electric telescopic rod 3 is controlled to descend, so that the first pressure head 33, the second pressure head 34 and the third pressure head 35 are driven to extrude the LED chip, then comparison is carried out, the damage degree of the LED chip caused by different stress areas under the same pressure is observed, the same pressure head can be replaced, and then the easily damaged part on the LED chip body is observed under the condition that the stress area and the pressure are the same, convenient for people to observe and record.
Specifically, four corners of the bottom of the test board 1 are fixedly connected with supporting legs 11, and one ends, far away from the test board 1, of the supporting legs 11 are fixedly connected with rubber pads 111; can play the effect of a support through supporting leg 11 to testboard 1, can avoid supporting leg 11 and ground contact through rubber pad 111, play the effect of a protection to supporting leg 11.
Specifically, the outer wall of the positioning plate 2 is fixedly connected with a connecting plate 21, the connecting plate 21 is provided with a connecting bolt 211, and the connecting plate 21 is fixed with the test board 1 in a threaded manner through the connecting bolt 211; during installation, the connecting bolt 211 penetrates through the connecting plate 21 and is screwed into the test bench 1, and during disassembly, the connecting bolt 211 is screwed out, so that the positioning plate 2 and the test bench 1 can be installed and disassembled.
Specifically, one end of the electric telescopic rod 3 close to the mounting plate 13 is fixedly connected with a fixing plate 31, a fixing bolt 311 is arranged on the fixing plate 31, and the fixing plate 31 is fixed with the mounting plate 13 through the fixing bolt 311 in a threaded manner; during installation, the fixing bolt 311 penetrates through the fixing plate 31 and is screwed into the mounting plate 13, and during disassembly, the fixing bolt 311 is screwed out, so that the electric telescopic rod 3 and the mounting plate 13 can be installed and disassembled.
Specifically, the first ram 33, the second ram 34, and the third ram 35 have different sizes; with different sized indenters, one can easily compare after testing.
Specifically, one end of the electric telescopic rod 3, which is far away from the mounting plate 13, is fixedly connected with a connecting threaded rod 36, and the electric telescopic rod 3 is fixedly connected with the connecting ring 32 through the connecting threaded rod 36 in a threaded manner; when the electric telescopic rod 3 is assembled and disassembled, the connecting threaded rod 36 is screwed into the connecting ring 32, and when the electric telescopic rod is disassembled, the connecting threaded rod 36 is screwed out, so that the electric telescopic rod 3 and the connecting ring 32 are assembled and disassembled.
Specifically, the first indenter 33, the second indenter 34, and the third indenter 35 are made of stainless steel; the stainless steel has good corrosion resistance and oxidation resistance, and can prolong the service life of the first pressure head 33, the second pressure head 34 and the third pressure head 35.
The utility model discloses a theory of operation and use flow: when using this device, at first be connected locating plate 2 and testboard 1, put into dead slot 22 on the locating plate 2 to the LED chip that needs the test again, then control electric telescopic handle 3 descends, thereby drive first pressure head 33, second pressure head 34, third pressure head 35 extrudees the LED chip, pressure sensor 14 can sense the pressure that receives at this time, then on passing back the PLC controller, ensure that the pressure that three LED chip received is the same, then contrast, thereby observe the LED chip area of stress difference and the damage degree that takes place under same kind of pressure, and can also change the same pressure head, then observe under the condition that area of stress and pressure are the same, easy damaged position on the LED chip body, be convenient for people observe and take notes.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described in the foregoing embodiments, or equivalents may be substituted for elements thereof. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims (7)

1. The utility model provides a LED chip testing arrangement, includes testboard (1), locating plate (2) and electric telescopic handle (3), its characterized in that: the top of the test board (1) is fixedly connected with two symmetrically distributed support plates (12), one ends, far away from the test board (1), of the two support plates (12) are fixedly connected with a mounting plate (13), the top of the test board (1) is fixedly connected with three symmetrically distributed pressure sensors (14), and the pressure sensors (14) are in signal connection with an external PLC (programmable logic controller);
the number of the positioning plates (2) is three, the positioning plates (2) are detachably connected with the test board (1), empty grooves (22) are formed in the positioning plates (2), and the pressure sensors (14) are clamped and connected with the positioning plates (2) in the empty grooves (22);
the quantity of electric telescopic handle (3) is three, electric telescopic handle (3) and outside PLC controller signal connection, electric telescopic handle (3) with the connection can be dismantled in mounting panel (13), electric telescopic handle (3) are kept away from the one end of mounting panel (13) can be dismantled and be connected with go-between (32), one of them electric telescopic handle (3) are connected go up the first pressure head (33) of fixedly connected with on go-between (32), one of them electric telescopic handle (3) are connected fixedly connected with second pressure head (34) on go-between (32), one of them electric telescopic handle (3) are connected fixedly connected with third pressure head (35) on go-between (32).
2. The LED chip testing apparatus according to claim 1, wherein: the test bench is characterized in that supporting legs (11) are fixedly connected to four corners of the bottom of the test bench (1), and one end of each supporting leg (11) far away from the test bench (1) is fixedly connected with a rubber pad (111).
3. The LED chip testing apparatus according to claim 1, wherein: locating plate (2) outer wall fixedly connected with connecting plate (21), be equipped with connecting bolt (211) on connecting plate (21), connecting plate (21) pass through connecting bolt (211) with testboard (1) spiro union is fixed.
4. The LED chip testing apparatus according to claim 1, wherein: electric telescopic handle (3) are close to one end fixedly connected with fixed plate (31) of mounting panel (13), be equipped with fixing bolt (311) on fixed plate (31), fixed plate (31) pass through fixing bolt (311) with mounting panel (13) spiro union is fixed.
5. The LED chip testing apparatus according to claim 1, wherein: the first press head (33), the second press head (34) and the third press head (35) have different sizes.
6. The LED chip testing apparatus according to claim 1, wherein: keep away from electric telescopic handle (3) the one end fixedly connected with connecting screw rod (36) of mounting panel (13), electric telescopic handle (3) pass through connecting screw rod (36) with go-between (32) spiro union is fixed.
7. The LED chip testing apparatus according to claim 1, wherein: the first pressure head (33), the second pressure head (34) and the third pressure head (35) are all made of stainless steel.
CN202021794356.4U 2020-08-25 2020-08-25 LED chip testing device Active CN213482379U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202021794356.4U CN213482379U (en) 2020-08-25 2020-08-25 LED chip testing device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202021794356.4U CN213482379U (en) 2020-08-25 2020-08-25 LED chip testing device

Publications (1)

Publication Number Publication Date
CN213482379U true CN213482379U (en) 2021-06-18

Family

ID=76415482

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202021794356.4U Active CN213482379U (en) 2020-08-25 2020-08-25 LED chip testing device

Country Status (1)

Country Link
CN (1) CN213482379U (en)

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