CN213478595U

CN213478595U - Air compressor

Info

Publication number: CN213478595U
Application number: CN202021963795.3U
Authority: CN
Inventors: 邹斌宏; 林圣玉; 其他发明人请求不公开姓名
Original assignee: Zhejiang Jiacheng Machinery Co ltd
Current assignee: Zhejiang Jiacheng Machinery Co ltd
Priority date: 2020-09-10
Filing date: 2020-09-10
Publication date: 2021-06-18
Anticipated expiration: 2030-09-10

Abstract

The utility model discloses an air compressor, the utility model relates to an air compressor technical field, air compressor includes: the heat insulation plate is vertically fixed on the left side of the middle inside the shell, the compression cavity and the heat exchange cavity are arranged inside the shell and are respectively positioned on the right side and the left side of the heat insulation plate, three heat dissipation holes which are vertically and equidistantly distributed are formed in the middle of the left surface of the heat insulation plate, heat dissipation nets are embedded in the three heat dissipation holes, semiconductor refrigeration sheets are installed on the upper side and the lower side of the left surface of the heat insulation plate, and one ends, far away from the two semiconductor refrigeration sheets, of the three heat dissipation holes are connected with a lead; a base is fixed at the bottom of the shell; the left side of the shell is provided with a through hole communicated with the heat exchange cavity, and the left side of the shell is provided with a corrugated pipe; the beneficial effects of the utility model reside in that: carry out supplementary cooling through the semiconductor refrigeration piece to introduce outside cold air and carry out the heat transfer in the compressor, discharge hot-air simultaneously, be favorable to realizing the cooling of directly dispelling the heat, avoid the steam gathering in the compression intracavity.

Description

Air compressor

Technical Field

The utility model belongs to the technical field of air compressor technique and specifically relates to an air compressor is related to.

Background

The air compressor is a device used for compressing gas, the air compressor is similar to a water pump in structure, most of the air compressors are of reciprocating pistons, rotating blades or rotating screws, heat generated in a compression cavity of an existing compressor is not easy to directly discharge when the existing compressor operates, and the heat is gathered in the compression cavity, so that the temperature of the whole compressor is high, and the service life of the compressor is influenced.

SUMMERY OF THE UTILITY MODEL

The utility model aims at the problem that above-mentioned exists with not enough, provide one kind and assist the cooling through the semiconductor refrigeration piece to introduce the compressor with outside cold air and carry out the heat transfer, discharge hot-air simultaneously, be favorable to realizing the cooling of directly dispelling the heat, avoid the air compressor of steam gathering in the compression intracavity.

In order to achieve the purpose, the adopted technical scheme is as follows:

an air compressor, comprising:

the heat insulation plate is vertically fixed on the left side of the middle inside the shell, a compression cavity and a heat exchange cavity are arranged inside the shell, the compression cavity and the heat exchange cavity are respectively positioned on the right side and the left side of the heat insulation plate, three heat dissipation holes which are vertically and equidistantly distributed are formed in the middle of the left surface of the heat insulation plate, heat dissipation nets are embedded in the three heat dissipation holes, semiconductor refrigeration sheets are installed on the upper side and the lower side of the left surface of the heat insulation plate, and one ends, far away from the two semiconductor refrigeration sheets, of the heat insulation plate are connected with a lead;

a base is fixed at the bottom of the shell;

open the shell left side have with the communicating opening in heat transfer chamber, just the shell left side is equipped with the bellows, the bellows right-hand member inserts in the opening and communicates with each other with the heat transfer chamber, just the bellows left end is equipped with rather than communicating pressurization box, the inlet port that equidistance was arranged about three rows is opened to pressurization box left surface, and every all imbed in the inlet port and have separated the net, side vertically fixed has branch around the pressurization box lower surface, and two the branch end is all rotated and is connected with the pulley.

Preferably, the wire casing has all been opened by the left side to the lower face on the shell, just the wire casing below the shell extends to the base lower surface.

Preferably, the wires in the two semiconductor chilling plates respectively pass through the two wire grooves and are exposed outside.

Preferably, the left surface of the pressurizing box is welded with two handles which are parallel up and down, and the two handles are respectively positioned between the three rows of air inlets.

Preferably, the base upper surface left side is opened there are two parallel spouts around, and two the pulley end slides in two respectively in the spout, the pressurization box passes through pulley and base horizontal sliding connection, just the pressurization box is located the shell left side.

Preferably, the pressurizing box is communicated with the heat exchange cavity through a corrugated pipe.

By adopting the technical scheme, the beneficial effects are as follows:

the heat generated in the compression cavity enters the heat exchange cavity through the heat dissipation holes in the heat insulation plate, the heat dissipation and dust prevention effects can be achieved through the heat dissipation net in the heat insulation plate, the heat at the cold end can be transferred to the hot end to be cooled by the semiconductor refrigeration piece, so that the heat exchange cavity can be locally cooled, the temperature of the heat insulation plate is prevented from being high due to the heat in the compression cavity, and the effect of auxiliary heat dissipation can be achieved through the semiconductor refrigeration piece;

at the in-process that promotes the pressurization box, outside cold air passes through in the inlet port gets into the pressurization box, and follow the entering bellows, reentrant heat transfer intracavity, like this alright add outside cold air in the heat transfer intracavity and assist the cooling, and the user when will pressurize the box and stimulate to the left side, wind-force is retrieved, the part in the heat transfer intracavity has thermal air will return for the pressurization box through the bellows, the inlet port in the rethread pressurization box is discharged, wherein separate the net and can play simple filterable effect, when avoiding admitting air, outside magazine flows into wherein.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings of the embodiments of the present invention will be briefly described below. The drawings are intended to depict only some embodiments of the invention, and not all embodiments of the invention are limited thereto.

Fig. 1 is a schematic view of the overall front view cross-sectional structure of the present invention;

fig. 2 is a schematic view of a partial structure a of fig. 1 according to the present invention;

fig. 3 is a schematic view of the left side plan structure of the extrusion box and the base of the present invention.

The labels in the figure are: the heat exchanger comprises a shell 1, a base 101, a compression chamber 102, a heat insulation plate 103, heat dissipation holes 104, a heat dissipation net 105, a heat exchange chamber 106, a semiconductor refrigeration sheet 107, a conducting wire 108, a wire groove 109, a through opening 110, a corrugated pipe 111, a pressurizing box 112, an air inlet 113, a separation net 114, a handle 115, a support rod 116, a pulley 117 and a sliding groove 118.

Detailed Description

In order to make the purpose, technical features and technical effects of the technical solution of the present invention clearer, the drawings of the embodiments of the present invention are combined together, and the example solution of the embodiments of the present invention is clearly and completely described.

Referring to fig. 1 to 3, the present application is an air compressor including:

the heat insulation plate comprises a shell 1, wherein a heat insulation plate 103 is vertically fixed on the left side of the middle inside the shell 1, a compression cavity 102 and a heat exchange cavity 106 are arranged inside the shell 1, the compression cavity 102 and the heat exchange cavity 106 are respectively positioned on the right side and the left side of the heat insulation plate 103, three heat dissipation holes 104 which are vertically arranged at equal intervals are formed in the middle of the left side of the heat insulation plate 103, heat dissipation nets 105 are embedded in the three heat dissipation holes 104, semiconductor chilling plates 107 are respectively installed on the upper side and the lower side of the left side of the heat insulation plate 103, and one ends, far away from the;

a base 101 is fixed at the bottom of the shell 1, the upper surface and the lower surface of the shell 1 close to the left side are both provided with wire grooves 109, the wire grooves 109 on the lower surface of the shell 1 extend to the lower surface of the base 101, and wires 108 in the two semiconductor chilling plates 107 respectively penetrate through the two wire grooves 109 and are exposed outside;

specifically, through the semiconductor chilling plates 107 in the heat insulation plate 103, the wires 108 penetrate through the corresponding wire grooves 109 and are uniformly connected with a power supply, in the working process of the whole compressor, heat generated in the compression cavity 102 enters the heat exchange cavity 106 through the heat dissipation holes 104 in the heat insulation plate 103, and the heat dissipation and dust prevention effects can be achieved through the heat dissipation nets 105 in the heat exchange cavity, the semiconductor chilling plates 107 are utilized, wherein one end, close to the compression cavity 102, of each semiconductor chilling plate 107 is a cold end, and one end, close to the heat exchange cavity 106, of each semiconductor chilling plate 107 is a hot end, so that the cold end heat can be moved to the hot end to cool the compression cavity 102, the compression cavity 102 can be locally cooled, the heat in the compression cavity 102 is prevented from being high, and the effect of auxiliary heat dissipation can be achieved through the semiconductor chilling plates 107;

the left side of the shell 1 is provided with a through hole 110 communicated with the heat exchange cavity 106, the left side of the shell 1 is provided with a corrugated pipe 111, the right end of the corrugated pipe 111 is inserted into the through hole 110 and communicated with the heat exchange cavity 106, the left end of the corrugated pipe 111 is provided with a pressurizing box 112 communicated with the corrugated pipe, the left side of the pressurizing box 112 is provided with three rows of air inlet holes 113 which are arranged at equal intervals up and down, a separation net 114 is embedded in each air inlet hole 113, the front side and the back side of the lower surface of the pressurizing box 112 are vertically fixed with supporting rods 116, the tail ends of the two supporting rods 116 are respectively connected with pulleys 117 in a rotating manner, the left side of the pressurizing box 112 is welded with two handles 115 which are parallel up and down, the two handles 115 are respectively positioned between the three rows of air inlet holes 113, the left side of the upper surface of the base 101 is provided with two sliding grooves 118 which are parallel, the pressurizing box 112 is communicated with the heat exchange cavity 106 through a corrugated pipe 111;

further, while the semiconductor chilling plate 107 is refrigerating, a user can also perform auxiliary heat dissipation through the pressurizing box 112, hold the handle 115, push the whole pressurizing box 112 to the right side along the sliding slot 118 through the pulley 117 at the bottom, the corrugated tube 111 is contracted by its own flexibility in the process of pushing the pressurizing box 112, and the user can reciprocate the pressurizing box 112 along the sliding slot 118, in the process of pushing the pressurizing box 112, the external cold air enters the pressurizing box 112 through the air inlet hole 113, and then enters the corrugated tube 111 and then enters the heat exchange cavity 106, so that the external cold air can be added into the heat exchange cavity 106 for auxiliary cooling, and when the user pulls the pressurizing box 112 to the left side, the wind power is recovered, part of the air with heat in the heat exchange cavity 106 will be returned to the pressurizing box 112 through the corrugated tube 111 and then discharged through the air inlet hole 113 in the pressurizing box 112, the separation net 114 can perform a simple filtering function, so that external magazines are prevented from flowing into the separation net during air inlet.

In the present specification, each embodiment is described with emphasis on differences from other embodiments, and the same or similar parts between the embodiments may be referred to each other.

Exemplary embodiments of the present invention have been described in detail with reference to the preferred embodiments, however, it will be understood by those skilled in the art that various modifications and changes may be made to the above specific embodiments without departing from the scope of the present invention, and various combinations of the technical features and structures of the present invention may be implemented without departing from the scope of the present invention, which is defined by the appended claims.

Claims

1. An air compressor, comprising:

the heat insulation plate comprises a shell (1), wherein a heat insulation plate (103) is vertically fixed on the left side of the middle inside the shell (1), a compression cavity (102) and a heat exchange cavity (106) are arranged inside the shell (1), the compression cavity (102) and the heat exchange cavity (106) are respectively positioned on the right side and the left side of the heat insulation plate (103), three heat dissipation holes (104) which are vertically and equidistantly arranged are formed in the middle of the left side of the heat insulation plate (103), heat dissipation nets (105) are embedded into the three heat dissipation holes (104), semiconductor refrigeration sheets (107) are respectively installed on the upper side and the lower side of the left side of the heat insulation plate (103), and one ends, far away from the two semiconductor refrigeration sheets (107) are respectively connected with a;

a base (101) is fixed at the bottom of the shell (1);

shell (1) left side is opened there is communicating opening (110) with heat transfer chamber (106), just shell (1) left side is equipped with bellows (111), bellows (111) right-hand member inserts in opening (110) and communicates with each other with heat transfer chamber (106), just bellows (111) left end is equipped with rather than communicating pressurization box (112), inlet port (113) that equidistance was arranged about three rows are opened to pressurization box (112) left surface, and every all the embedding has at a distance from net (114) in inlet port (113), side vertically fixed has branch (116) around pressurization box (112) lower surface, and two branch (116) end all rotates and is connected with pulley (117).

2. An air compressor as claimed in claim 1, wherein: wire casing (109) have all been opened by the left side to the lower face on shell (1), just wire casing (109) below shell (1) extend to base (101) lower surface.

3. An air compressor as claimed in claim 2, wherein: the wires (108) in the two semiconductor refrigeration sheets (107) respectively pass through the two wire grooves (109) and are exposed outside.

4. An air compressor as claimed in claim 1, wherein: two handles (115) which are parallel up and down are welded on the left surface of the pressurizing box (112), and the two handles (115) are respectively positioned between the three rows of air inlet holes (113).

5. An air compressor as claimed in claim 1, wherein: the left side of the upper surface of the base (101) is provided with two sliding grooves (118) which are parallel to each other in the front and back direction, the tail ends of the pulleys (117) slide into the two sliding grooves (118), the pressurizing box (112) is connected with the base (101) in a left-right sliding mode through the pulleys (117), and the pressurizing box (112) is located on the left side of the shell (1).

6. An air compressor as claimed in claim 1, wherein: the pressurizing box (112) is communicated with the heat exchange cavity (106) through a corrugated pipe (111).