CN213461786U

CN213461786U - Universal chip testing device

Info

Publication number: CN213461786U
Application number: CN202022594538.3U
Authority: CN
Inventors: 索思亮; 陶文伟; 曹扬; 匡晓云; 陈立明; 黄开天
Original assignee: China Southern Power Grid Co Ltd; Research Institute of Southern Power Grid Co Ltd
Current assignee: CSG Electric Power Research Institute; China Southern Power Grid Co Ltd; Research Institute of Southern Power Grid Co Ltd
Priority date: 2020-11-11
Filing date: 2020-11-11
Publication date: 2021-06-15
Anticipated expiration: 2030-11-11

Abstract

The utility model discloses a universal chip testing device, which comprises a needle plate and a testing machine arranged above the needle plate, wherein the needle plate comprises a base plate, more than one testing probe arranged on the lower surface of the base plate and more than one three-dimensional connecting block arranged on the upper surface of the base plate; the universal chip testing device is strong in stability and wide in application range.

Description

Universal chip testing device

Technical Field

The utility model relates to a general type chip testing arrangement.

Background

In order to ensure that the chips can be normally identified and communicated after being mounted, the chips need to be subjected to performance testing by a chip testing machine before leaving the factory. The chip testing machine has a communication protocol consistent with that of the host, and when the chip testing machine is in normal communication with the chip to be tested, the chip can be identified by the host and belongs to a qualified product.

In the chip module testing process, a needle plate is generally used for testing a plurality of chips at the same time, and the existing chip module testing device has poor stability and narrow application range.

SUMMERY OF THE UTILITY MODEL

Not enough to prior art, the utility model aims at providing a stability is strong, the big general type chip testing arrangement of application scope.

The utility model provides a technical scheme that its technical problem adopted is:

the utility model provides a general type chip testing arrangement, including the faller, and install the test machine in the faller top, the faller is including the base plate, and set up in the lower surface of base plate, more than one test probe, and set up in the base plate upper surface, more than one three-dimensional connecting block, the test machine is including the guiding mechanism who holds with three-dimensional connecting block mutually, and set up in the guiding mechanism top, drive the actuating mechanism that guiding mechanism removed, guiding mechanism is including the guide arm, and connect in the flexible arm of guide arm below, and install the centre gripping arm at flexible arm both ends.

Preferably, the three-dimensional connecting blocks are arranged in an inverted trapezoid shape, and gaps are formed among the three-dimensional connecting blocks.

Furthermore, the clamping arm is arranged in a clamping jaw shape matched with the shape of the three-dimensional connecting block.

Furthermore, the connecting end of the telescopic arm and the clamping arm is hollowed out.

Preferably, the hollow part in the telescopic arm is provided with a tension spring.

Preferably, the front end of the clamping arm is embedded in the telescopic arm and is connected with a tension spring at a hollow part inside the telescopic arm.

Preferably, the distance between the two ends of the clamping arm is equal to the distance between the two adjacent three-dimensional connecting blocks.

Preferably, the maximum stretching length of the tension spring is half of the distance between two adjacent three-dimensional connecting blocks.

Preferably, the test probe is composed of more than one group of probe read-write heads, and the probe read-write heads of each group are longitudinally arranged.

The utility model has the advantages that:

through adopting three-dimensional connecting block to meet in the test equipment, the centre gripping of different positions is realized to the guiding mechanism through in the test equipment to cooperation three-dimensional connecting block to the faller of different size and dimension carries out the centre gripping, and it is all more convenient to change and dismantle, and according to the structural feature of chip, improves the structure of faller, makes the commonality of test faller increase, thereby the reasonable manufacturing cost and the replacement cost of saving.

Drawings

Fig. 1 is a schematic view of the overall structure of a universal chip testing device according to the present invention;

fig. 2 is a schematic drawing of the tensile state of the universal core chip testing device of the present invention.

Detailed Description

The present invention will be further described with reference to the accompanying drawings and specific embodiments so that those skilled in the art can better understand the present invention and can implement the present invention, but the embodiments are not to be construed as limiting the present invention.

Examples

Referring to fig. 1-2, a general chip testing device includes a needle plate 1 and a testing machine 2 installed above the needle plate 1, where the needle plate 1 includes a base plate 11, more than one testing probe 12 installed on the lower surface of the base plate 11, and more than one three-dimensional connecting block 13 installed on the upper surface of the base plate 11, the testing machine 2 includes a guiding mechanism 21 clamped with the three-dimensional connecting block 13, and a driving mechanism 22 installed above the guiding mechanism 21 and driving the guiding mechanism 21 to move, and the guiding mechanism 21 includes a guiding arm 211, a telescopic arm 212 connected below the guiding arm 211, and clamping arms 213 installed at two ends of the telescopic arm 212.

Three-dimensional connecting block 13 is the setting of falling trapezoidal and has the clearance between each three-dimensional connecting block 13, centre gripping arm 213 is the clamping jaw form setting with three-dimensional connecting block 13 shape matched with, the link end department of flexible arm 212 and centre gripping arm 213 is the fretwork setting, adopts the mode of centre gripping to carry out the test fixture 2 and is connected between the faller 1.

The inside fretwork department of flexible arm 212 is equipped with extension spring 214, the front end of centre gripping arm 213 buries in flexible arm 212 and is connected with the extension spring 214 of the inside fretwork department of flexible arm 212, interval between centre gripping arm 213 both ends equals with the interval between two adjacent cube connecting blocks 13, the biggest tensile length of extension spring 214 is half of interval between two adjacent cube connecting blocks 13, adopts extension spring 214 to carry out centre gripping, easy dismounting's mode that stretches out and draws back.

The test probe 12 is composed of more than one group of probe read-write heads, each group of probe read-write heads are longitudinally arranged, and each group of probe read-write heads corresponds to a chip to realize testing.

The utility model has the advantages that:

The above embodiments of the present invention are not right the utility model discloses the limited protection scope, the utility model discloses an embodiment is not limited to this, all kinds of basis according to the above-mentioned of the utility model discloses an under the above-mentioned basic technical thought prerequisite of the utility model, right according to ordinary technical knowledge and the conventional means in this field the modification, replacement or the change of other multiple forms that above-mentioned structure made all should fall within the protection scope of the utility model.

Claims

1. The utility model provides a general type chip testing arrangement, is including the faller, and installs the test machine above the faller, its characterized in that: the needle plate comprises a base plate, more than one test probe and more than one three-dimensional connecting block, wherein the more than one test probe is arranged on the lower surface of the base plate, the more than one three-dimensional connecting block is arranged on the upper surface of the base plate, the test machine comprises a guide mechanism and a driving mechanism, the guide mechanism is clamped with the three-dimensional connecting block, the driving mechanism is arranged above the guide mechanism and drives the guide mechanism to move, the guide mechanism comprises a guide arm, a telescopic arm and clamping arms, the telescopic arm is connected below the guide arm, and the clamping arms are arranged at two ends.

2. The universal chip test apparatus according to claim 1, wherein: the three-dimensional connecting blocks are arranged in an inverted trapezoid shape, and gaps are formed among the three-dimensional connecting blocks.

3. The universal chip test apparatus according to claim 2, wherein: the clamping arm is arranged in a clamping jaw shape matched with the shape of the three-dimensional connecting block.

4. A universal chip testing device according to claim 3, wherein: the connecting end of the telescopic arm and the clamping arm is hollowed out.

5. The universal chip test apparatus according to claim 4, wherein: the inside fretwork department of flexible arm is equipped with the extension spring.

6. The universal chip test apparatus according to claim 5, wherein: the front end of the clamping arm is embedded in the telescopic arm and is connected with the tension spring at the hollow part inside the telescopic arm.

7. The universal chip test apparatus according to claim 6, wherein: the distance between the two ends of the clamping arm is equal to the distance between the two adjacent three-dimensional connecting blocks.

8. The universal chip test apparatus according to claim 7, wherein: the maximum stretching length of the tension spring is half of the distance between two adjacent three-dimensional connecting blocks.

9. The universal chip test apparatus according to claim 1, wherein: the test probe is composed of more than one group of probe read-write heads, and the probe read-write heads of each group are longitudinally arranged.