CN213459662U

CN213459662U - Solar silicon wafer surface etching device

Info

Publication number: CN213459662U
Application number: CN202022906899.7U
Authority: CN
Inventors: 张传祥; 刘超
Original assignee: Hefei Changyang New Energy Technology Co ltd
Current assignee: Hefei Changyang New Energy Technology Co ltd
Priority date: 2020-12-07
Filing date: 2020-12-07
Publication date: 2021-06-15
Anticipated expiration: 2030-12-07

Abstract

The utility model discloses a solar energy silicon chip surface etching device, including etching shell body, liquid pipe, infusion hose, the equal fixed connection of lower extreme four corners department of etching shell body is provided with the supporting legs, the inside lower extreme slope fixed connection of etching shell body is provided with etching tilt floor, the lower extreme fixed mounting of etching shell body is provided with the waste liquid exit tube, the upper end of etching shell body is provided with the etching fluid reservoir, the upper end fixed connection of etching shell body is provided with the liquid pump, the input of liquid pump is connected with the etching fluid reservoir through liquid pipe. The utility model discloses a lower extreme of etching shell body sets up etching inclined floor to be provided with the waste liquid exit tube at the lower extreme of etching shell body, in the etching solution after using can flow in etching inclined floor, and flow in waste liquid exit tube department in the etching inclined floor of slope, can carry out centralized processing to the etching waste liquid through the waste liquid exit tube, be convenient for collect the etching waste liquid.

Description

Solar silicon wafer surface etching device

Technical Field

The utility model relates to a solar energy silicon chip technical field specifically is a solar energy silicon chip surface etching device.

Background

The solar cell is divided into a crystal silicon type and an amorphous silicon type, wherein the crystal silicon type cell can be divided into a single crystal cell and a polycrystalline cell, the efficiency of the single crystal silicon is more, the single crystal silicon is different, the silicon wafer is a carrier of the solar cell, and the quality of the silicon wafer directly determines the conversion efficiency of the solar cell, so that the incoming silicon wafer needs to be detected. The process is mainly used for measuring some technical parameters of the silicon wafer on line, the parameters mainly comprise the surface unevenness, minority carrier lifetime, resistivity, P/N type, microcrack and the like of the silicon wafer, and doped silicon at the periphery of the solar cell needs to be etched in production so as to remove PN junctions at the edge of the cell.

The existing solar silicon wafer surface etching device has the following defects: when the conventional solar silicon wafer surface etching device is used for etching, etching liquid cannot be effectively collected, and the etching liquid is accumulated at the bottom of the etching device to interfere the moving and transportation of the solar silicon wafer; in addition, because different solar silicon wafer thickness specifications are different, the current solar silicon wafer surface etching device cannot stably limit the solar silicon wafers with different thicknesses, and the etching precision is easily influenced by the movement of the solar silicon wafers during etching.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a solar energy silicon chip surface etching device to solve the problem that proposes among the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme: a solar silicon wafer surface etching device comprises an etching shell, a liquid pipe and a liquid conveying hose, wherein supporting legs are fixedly connected and arranged at four corners of the lower end of the etching shell, an etching inclined bottom plate is fixedly connected and arranged at the inner lower end of the etching shell in an inclined mode, a waste liquid outlet pipe is fixedly arranged at the lower end of the etching shell, an etching liquid tank is arranged at the upper end of the etching shell, a liquid pump is fixedly connected and arranged at the upper end of the etching shell, the input end of the liquid pump is connected with the etching liquid tank through the liquid pipe, a plurality of hanging rods are fixedly connected and arranged at the inner upper end of the etching shell, a linear motor is fixedly connected and arranged at the lower end of each hanging rod, an etching spray nozzle is fixedly connected and arranged at the moving end of the linear motor, the output end of the liquid pump is connected with the etching, rotate on the side-mounting board and connect and be provided with a plurality of rotary rod, fixed cover is equipped with the removal roller on the rotary rod, the outside fixed mounting of etching the shell body is provided with servo motor, servo motor's output with remove roller fixed connection, the inside upper end fixed connection of etching the shell body is provided with a plurality of spring telescopic link, spring telescopic link's lower extreme fixed connection is provided with the arm lock, the front and back side rotate between the arm lock and connect and be provided with the pivot, fixed cover is equipped with the compressing roller in the pivot, the upper end left side fixed connection of etching the shell body is provided with pan feeding frame mouth.

Preferably, the right side of the upper end of the etching outer shell is fixedly connected with a discharge connecting plate, and the height of the discharge connecting plate is consistent with the height of the moving roller.

Preferably, the outer surface of the moving roller is provided with an anti-skid wear-resistant coating.

Preferably, the moving roller and the pressing roller are arranged at intervals.

Preferably, a control valve is arranged on the waste liquid outlet pipe.

Preferably, the hanger rods are arranged at uniform intervals.

Compared with the prior art, the beneficial effects of the utility model are that:

1. the etching inclined bottom plate is arranged at the lower end of the etching outer shell, the waste liquid outlet pipe is arranged at the lower end of the etching outer shell, used etching liquid can flow into the etching inclined bottom plate and flow into the waste liquid outlet pipe in the inclined etching inclined bottom plate, and the etching waste liquid can be intensively treated through the waste liquid outlet pipe, so that the etching waste liquid can be conveniently collected;

2. the utility model discloses still be provided with spring telescopic link, arm lock, pivot and pinch roller simultaneously, spring telescopic link can drive the pinch roller and carry out the lift removal, and to the solar silicon chip of different thickness, the lift thickness adjustment that the pinch roller can carry out the correspondence can carry out the laminating that stabilizes to the solar silicon chip of different thickness spacing, can prevent that solar silicon chip from taking place not hard up the skew, has simple structure, convenient to use, excellent in use effect's advantage.

Drawings

FIG. 1 is a schematic view of the overall structure of a solar silicon wafer surface etching apparatus of the present invention;

FIG. 2 is a schematic diagram of the internal structure of the left side of the etching housing of the solar silicon wafer surface etching apparatus of the present invention;

fig. 3 is an enlarged view of a portion a of fig. 1.

In the figure: 1. etching the outer shell; 2. etching the inclined bottom plate; 3. supporting legs; 4. feeding a frame opening; 5. a discharging receiving plate; 6. etching solution tank; 7. a liquid pump; 8. a liquid pipe; 9. a side mounting plate; 10. rotating the rod; 11. a waste liquid outlet pipe; 12. a flexible infusion tube; 13. a boom; 14. a linear motor; 15. a rotating shaft; 16. an etching spray nozzle; 17. a servo motor; 18. a moving roller; 19. a spring telescopic rod; 20. a pressure roller;

21. and (4) clamping arms.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-3, the present invention provides a technical solution: a solar silicon wafer surface etching device comprises an etching outer shell 1, a liquid pipe 8 and a liquid conveying hose 12, wherein supporting legs 3 are fixedly connected at four corners of the lower end of the etching outer shell 1, an etching inclined bottom plate 2 is fixedly connected at the inner lower end of the etching outer shell 1 in an inclined mode, a waste liquid outlet pipe 11 is fixedly installed at the lower end of the etching outer shell 1, an etching liquid tank 6 is arranged at the upper end of the etching outer shell 1, a liquid pump 7 is fixedly connected at the upper end of the etching outer shell 1, the input end of the liquid pump 7 is connected with the etching liquid tank 6 through the liquid pipe 8, a plurality of hanging rods 13 are fixedly connected at the inner upper end of the etching outer shell 1, a linear motor 14 is fixedly connected at the lower end of each hanging rod 13, an etching injection nozzle 16 is fixedly connected at the moving end of the linear motor 14, and the output end of the liquid, equal fixed connection in side is provided with side-mounting board 9 around the etching shell body 1, the connection of rotating is provided with a plurality of rotary rod 10 on the side-mounting board 9, fixed cover is equipped with on the rotary rod 10 and removes roller 18, the outside fixed mounting of etching shell body 1 is provided with servo motor 17, servo motor 17's output and removal roller 18 fixed connection, the inside upper end fixed connection of etching shell body 1 is provided with a plurality of spring telescopic link 19, the lower extreme fixed connection of spring telescopic link 19 is provided with arm lock 21, the side around the arm lock 21 between the rotation connection be provided with pivot 15, fixed cover is equipped with compressing roller 20 on the pivot 15, the upper end left side fixed connection of etching shell body 1 is provided with pan feeding frame mouth 4.

Etching shell body 1's upper end right side fixed connection is provided with ejection of compact fishplate bar 5, just the height that ejection of compact fishplate bar 5 set up keeps unanimous with the height of removal roller 18, can ensure ejection of compact fishplate bar 5 and exert ejection of compact butt joint effect smoothly, the surface of removal roller 18 is provided with anti-skidding wear-resistant coating, and the anti-skidding wear-resistant coating that sets up can play anti-skidding wear-resistant coating effect, removal roller 18 and the setting of compression roller 20 interval can make the extrusion transportation atress of removal roller 18 and compression roller 20 even, be provided with the control valve on the waste liquid exit tube 11, the control valve that the accessible set up is controlled waste liquid exit tube 11, the interval that jib 13 set up is even, can make jib 13's.

The working principle is as follows: the utility model discloses a through set up etching inclined floor 2 at the lower extreme of etching shell body 1, and be provided with waste liquid exit tube 11 at the lower extreme of etching shell body 1, etching solution after the use can flow into etching inclined floor 2, and flow into waste liquid exit tube 11 department in etching inclined floor 2 of slope, can concentrate the processing to etching waste liquid through waste liquid exit tube 11, be convenient for collect etching waste liquid, can drive the removal roller 18 through servo motor 17 and rotate, when etching, carry etching solution to etching spray nozzle 16 through infusion hose 12 through liquid pump 7, and etch through etching spray nozzle 16, still be provided with spring telescopic link 19 simultaneously, arm lock 21, pivot 15 and pinch roll 20, spring telescopic link 19 can drive pinch roll 20 and go up and down the removal, to the solar energy silicon chip of different thickness, pinch roll 20 can carry out corresponding lift thickness adjustment, the solar silicon wafer fixing device has the advantages of being simple in structure, convenient to use and good in using effect.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a solar energy silicon chip surface etching device, includes etching shell body (1), liquid pipe (8), infusion hose (12), its characterized in that: the etching device is characterized in that supporting legs (3) are fixedly connected at four corners of the lower end of the etching outer shell (1), an etching inclined bottom plate (2) is fixedly connected at the inner lower end of the etching outer shell (1) in an inclined mode, a waste liquid outlet pipe (11) is fixedly installed at the lower end of the etching outer shell (1), an etching liquid tank (6) is arranged at the upper end of the etching outer shell (1), a liquid pump (7) is fixedly connected at the upper end of the etching outer shell (1), the input end of the liquid pump (7) is connected with the etching liquid tank (6) through a liquid pipe (8), a plurality of hanging rods (13) are fixedly connected at the inner upper end of the etching outer shell (1), a linear motor (14) is fixedly connected at the lower end of each hanging rod (13), and an etching spray nozzle (16) is fixedly, the output end of the liquid pump (7) is connected with an etching spray nozzle (16) through a transfusion hose (12), the front side and the rear side of the etching outer shell (1) are fixedly connected with a side mounting plate (9), the side mounting plate (9) is connected with a plurality of rotary rods (10) in a rotating manner, the rotary rods (10) are fixedly sleeved with a moving roller (18), the outer side of the etching outer shell (1) is fixedly provided with a servo motor (17), the output end of the servo motor (17) is fixedly connected with the moving roller (18), the inner upper end of the etching outer shell (1) is fixedly connected with a plurality of spring telescopic rods (19), the lower end of each spring telescopic rod (19) is fixedly connected with a clamping arm (21), the front side and the rear side of the etching outer shell (1) are connected with a rotating shaft (15) in a rotating manner, and the rotating shaft (15) is, and a feeding frame opening (4) is fixedly connected to the left side of the upper end of the etching outer shell (1).

2. The device for etching the surface of the solar silicon wafer according to claim 1, wherein: the right side of the upper end of the etching outer shell (1) is fixedly connected with a discharging connecting plate (5), and the height of the discharging connecting plate (5) is consistent with the height of the moving roller (18).

3. The device for etching the surface of the solar silicon wafer according to claim 1, wherein: the outer surface of the moving roller (18) is provided with an anti-skid wear-resistant coating.

4. The device for etching the surface of the solar silicon wafer according to claim 1, wherein: the moving roller (18) and the pressing roller (20) are arranged at intervals.

5. The device for etching the surface of the solar silicon wafer according to claim 1, wherein: and a control valve is arranged on the waste liquid outlet pipe (11).

6. The device for etching the surface of the solar silicon wafer according to claim 1, wherein: the hanger rods (13) are arranged at uniform intervals.