CN213457352U - Co-substrate heat dissipation camera module and electronic equipment - Google Patents
Co-substrate heat dissipation camera module and electronic equipment Download PDFInfo
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- CN213457352U CN213457352U CN202021869359.XU CN202021869359U CN213457352U CN 213457352 U CN213457352 U CN 213457352U CN 202021869359 U CN202021869359 U CN 202021869359U CN 213457352 U CN213457352 U CN 213457352U
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Abstract
The utility model provides a be total to base plate heat dissipation module and electronic equipment of making a video recording, include: a first mounting groove is formed in the rear side face of the mounting bracket, and a through hole is formed in the bottom of the first mounting groove to be communicated with the front side face of the mounting bracket; the depth camera module is arranged in the first mounting groove, and an image acquisition end of the depth camera module extends out through the through hole; a second mounting groove is formed in the area, adjacent to the through hole, of the front side face of the mounting support, and the light projector is arranged in the second mounting groove; the back side of the mounting bracket is provided with a boss in the area opposite to the light projector, and the table top of the boss is abutted to the heat dissipation substrate. The utility model discloses the region relative with the light projector on the trailing flank of well installing support is provided with the boss, and the mesa and the heat dissipation base plate looks butt of boss can directly dispel the heat to the heat dissipation base plate on, have bypassed soft arranging wire base plate and supporting substrate with the heat conduction route, can effectively reduce the thermal resistance, improve the radiating efficiency.
Description
Technical Field
The utility model relates to a degree of depth camera specifically relates to a altogether base plate heat dissipation module of making a video recording and electronic equipment.
Background
The tof (time of flight) technique is a 3D imaging technique that emits measurement light from a projector and reflects the measurement light back to a receiver through a target object, thereby obtaining a spatial distance from the object to a sensor from a propagation time of the measurement light in the propagation path. Common ToF techniques include single point scanning projection methods and area light projection methods.
The ToF method of single-point scanning projection uses a single-point projector to project a single beam of collimated light whose projection direction is controlled by a scanning device so that it can be projected onto different target locations. After the collimated light of the single light beam is reflected by the target object, part of the light is received by the single-point light detector, and therefore the depth measurement data of the current projection direction is obtained. The method can concentrate all the optical power on one target point, thereby realizing high signal-to-noise ratio at a single target point and further realizing high-precision depth measurement. Scanning of the entire target object relies on scanning devices such as mechanical motors, MEMS, photo phase control radar, etc. And splicing the depth data points obtained by scanning to obtain the discrete point cloud data required by 3D imaging. This method is advantageous for long-range 3D imaging, but requires the use of complex projection scanning systems, which is costly.
The ToF method of surface light projection projects a surface light beam with a continuous energy distribution. The projected light continuously covers the target object surface. The light detector is a light detector array capable of acquiring the propagation time of the light beam. When the optical signal reflected by the target object is imaged on the optical detector through the optical imaging system, the depth obtained by each detector image point is the depth information of the object image relationship corresponding to the object position. This method can be free of complex scanning systems. However, since the optical power density of the surface light projection is much lower than that of the singular collimated light, the signal-to-noise ratio is greatly reduced compared with the method of single-point scanning projection, so that the method can only be applied to scenes with reduced distance and lower precision.
In the module is made a video recording to TOF, need set up a degree of depth camera and a light projector on a support to realize the integrated minimizing of volume, the light projector can produce a large amount of heats when work, how to throw the heat that produces to light and high-efficiently transmit out, with the steady work of guaranteeing the light projector urgent need to be solved.
SUMMERY OF THE UTILITY MODEL
To the defect among the prior art, the utility model aims at providing a be total to base plate heat dissipation module of making a video recording and electronic equipment.
According to the utility model provides a be total to base plate heat dissipation camera module, including installing support, degree of depth camera module, light projector and heat dissipation base plate;
a first mounting groove is formed in the rear side face of the mounting bracket, and a through hole is formed in the bottom of the first mounting groove so as to be communicated with the front side face of the mounting bracket;
the depth camera module is arranged in the first mounting groove, and an image acquisition end of the depth camera module extends out through the through hole; a second mounting groove is formed in the area, adjacent to the through hole, of the front side face of the mounting support, and the light projector is arranged in the second mounting groove;
a boss is arranged on the rear side surface of the mounting bracket in an area opposite to the light projector, and the table surface of the boss is abutted to the heat dissipation substrate; a flexible flat cable substrate and a supporting substrate are sequentially sleeved between the boss and the radiating substrate.
Preferably, one side of the flexible flat cable substrate, which is located on the boss, extends to the first mounting groove and covers the first mounting groove to be electrically connected with the depth camera module,
the other side of the boss of the flexible flat cable substrate extends to the bottom of the second mounting groove from the front side surface of the mounting bracket so as to be electrically connected with the light projector.
Preferably, an avoidance groove is formed in one side wall surface of the mounting bracket;
the other side of the flexible flat cable substrate, which is located on the boss, is bent and extended through the avoiding groove and then extends to the front side face of the mounting support.
Preferably, the mounting bracket, the boss, the first mounting groove and the second mounting groove are rectangular;
the flexible flat cable substrate is U-shaped.
Preferably, the height of the boss is equal to the sum of the thicknesses of the flex cable substrate and the support substrate.
Preferably, the light projector comprises a laser array, a collimating lens and a beam splitting device arranged on a light path;
the laser array is used for projecting laser of a first order of magnitude to the collimating lens;
the collimating lens is used for collimating a plurality of incident lasers and then emitting collimated beams with a first order of magnitude;
the beam splitting device is used for splitting the incident collimated light beam of the first order of magnitude and then emitting a collimated light beam of a second order of magnitude to a target object;
the second order of magnitude is greater than the first order of magnitude.
Preferably, the light projector comprises an edge-emitting laser and a beam projector disposed on an optical path;
the edge-emitting laser is used for projecting laser to the beam projector;
the beam projector is used for projecting the incident laser into a plurality of discrete collimated beams to a target object.
Preferably, a diffuser is also included; the diffuser is used for diffusing the collimated light beams and enabling the collimated light beams to be subjected to floodlight emergence.
Preferably, the depth camera module comprises an optical imaging lens, a light detector array and a driving circuit; the light detector array comprises a plurality of light detectors distributed in an array;
the optical imaging lens is used for enabling direction vectors of the collimated light beams which penetrate through the optical imaging lens and enter the light detector array to be in one-to-one correspondence with the light detectors;
the light detector is used for receiving the collimated light beam reflected by the target object;
the driving circuit is used for measuring the propagation time of the plurality of collimated light beams and further generating depth data of the surface of the target object.
According to the utility model provides an electronic equipment, include altogether the base plate heat dissipation module of making a video recording.
Compared with the prior art, the utility model discloses following beneficial effect has:
the boss is arranged on the rear side surface of the mounting bracket in the area opposite to the light projector, the table surface of the boss is abutted to the heat dissipation substrate, heat can be directly dissipated to the heat dissipation substrate, the heat conduction path is bypassed by the flexible flat cable substrate and the support substrate, the thermal resistance can be effectively reduced, and the heat dissipation efficiency is improved;
the depth camera module group and the light projector are externally connected through a flexible flat cable substrate in the utility model, so as to realize signal output through a flexible flat cable interface, and realize that the depth camera module and the light projector share a flexible flat cable interface, thereby being capable of more lightly integrating the TOF module;
the utility model discloses on module and the light projector of making a video recording of well degree of depth set up the installing support according to two independent modules, when having avoided the base plate of the module of making a video recording of degree of depth and the base plate integration of light projector together, can influence the reduction problem of the yield of whole TOF module of making a video recording because of SMT (Surface Mounted Technology) pastes the increase of device quantity.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the provided drawings without creative efforts. Other features, objects and advantages of the invention will become more apparent upon reading of the detailed description of non-limiting embodiments with reference to the following drawings:
fig. 1 is a schematic structural view of a common substrate heat dissipation camera module in one direction according to an embodiment of the present invention;
fig. 2 is a schematic structural view of the co-substrate heat dissipation camera module in another direction according to an embodiment of the present invention;
fig. 3 is an exploded schematic view of the co-substrate heat dissipation camera module according to the embodiment of the present invention;
fig. 4 is a schematic structural view of a mounting bracket in one direction according to an embodiment of the present invention;
fig. 5 is a schematic structural view of the mounting bracket in another direction according to the embodiment of the present invention;
fig. 6 is a schematic view of a light projector according to an embodiment of the invention;
FIG. 7 is a schematic view of another embodiment of a light projector according to the present invention;
fig. 8 is the embodiment of the utility model provides an in the embodiment structure schematic diagram of degree of depth camera module.
In the figure:
1 is a depth camera module;
2 is a light projector;
3 is a mounting bracket;
4 is a flexible flat cable substrate;
5 is a supporting substrate;
6 is a flexible flat cable interface;
101 is a photodetector array;
102 is an optical imaging lens;
201 is an edge-emitting laser;
202 is a beam projector;
203 is a laser array;
204 is a collimating lens;
205 is a beam splitting device.
Detailed Description
The present invention will be described in detail with reference to the following embodiments. The following examples will assist those skilled in the art in further understanding the present invention, but are not intended to limit the invention in any way. It should be noted that various changes and modifications can be made by one skilled in the art without departing from the spirit of the invention. These all belong to the protection scope of the present invention.
It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or be indirectly connected to the other element. The connection may be for fixation or for circuit connection.
It is to be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in an orientation or positional relationship indicated in the drawings for convenience in describing the embodiments of the present invention and to simplify the description, and are not intended to indicate or imply that the referenced device or element must have a particular orientation, be constructed in a particular orientation, and be in any way limiting of the present invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the embodiments of the present invention, "a plurality" means two or more unless specifically limited otherwise.
The utility model provides a common substrate heat dissipation camera module, which comprises an installation bracket, a depth camera module, a light projector and a heat dissipation substrate;
a first mounting groove is formed in the rear side face of the mounting bracket, and a through hole is formed in the bottom of the first mounting groove so as to be communicated with the front side face of the mounting bracket;
the depth camera module is arranged in the first mounting groove, and an image acquisition end of the depth camera module extends out through the through hole; a second mounting groove is formed in the area, adjacent to the through hole, of the front side face of the mounting support, and the light projector is arranged in the second mounting groove;
a boss is arranged on the rear side surface of the mounting bracket in an area opposite to the light projector, and the table surface of the boss is abutted to the heat dissipation substrate; a flexible flat cable substrate and a supporting substrate are sequentially sleeved between the boss and the radiating substrate.
The utility model discloses the region relative with the light projector on the trailing flank of well installing support is provided with the boss, and the mesa and the heat dissipation base plate looks butt of boss can directly dispel the heat to the heat dissipation base plate on, have bypassed soft arranging wire base plate and supporting substrate with the heat conduction route, can effectively reduce the thermal resistance, improve the radiating efficiency.
Above is the core thought of the utility model, for making the above-mentioned purpose, characteristic and advantage of the utility model can be more obvious understandable, will combine below in the embodiment of the utility model the drawing, to technical scheme in the embodiment of the utility model is clear, completely describe, obviously, the embodiment that describes is only a partial embodiment of the utility model, rather than whole embodiment. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Fig. 1 is a schematic structural view of a common substrate heat dissipation camera module in one direction in the embodiment of the present invention, and fig. 2 is a schematic structural view of a common substrate heat dissipation camera module in another direction in the embodiment of the present invention, as shown in fig. 1 and fig. 2, the present invention provides a common substrate heat dissipation camera module, which includes a mounting bracket 3, a depth camera module 1, a light projector 2 and a heat dissipation substrate;
a first mounting groove is formed in the rear side face of the mounting bracket 3, and a through hole is formed in the bottom of the first mounting groove so as to be communicated with the front side face of the mounting bracket 3;
the depth camera module 1 is arranged in the first mounting groove, and an image acquisition end of the depth camera module 1 extends out through the through hole; a second mounting groove is formed in the area, adjacent to the through hole, of the front side face of the mounting support 3, and the light projector 2 is arranged in the second mounting groove;
a boss is arranged on the rear side surface of the mounting bracket 3 in the area opposite to the light projector 2, and the table surface of the boss is abutted to the heat dissipation substrate; a flexible flat cable substrate 4 and a supporting substrate 5 are sequentially sleeved between the boss and the radiating substrate.
In the embodiment of the present invention, the height of the boss is equal to the sum of the thicknesses of the flexible flat cable substrate 4 and the supporting substrate 5.
In the embodiment of the present invention, the flexible flat cable substrate 4 is located at one side of the boss and extends to the first mounting groove and covers the first mounting groove to electrically connect with the depth camera module 1,
the flexible flat cable substrate 4 is located at the other side of the boss and extends to the front side surface of the mounting bracket 3 to the bottom of the second mounting groove so as to be electrically connected with the light projector 2.
In the embodiment of the present invention, an evasion groove is formed on one side wall surface of the mounting bracket 3;
the other side of the flexible flat cable substrate 4, which is located on the boss, is bent and extended through the avoiding groove and then extends to the front side surface of the mounting bracket 3.
In the embodiment of the present invention, the flexible flat cable substrate 4 is made of a flexible flat cable, and the supporting substrate 5 is made of a steel plate. And a flexible flat cable interface 6 is arranged on the FPC flexible flat cable.
Fig. 3 is an exploded schematic view of a common-substrate heat-dissipating camera module according to an embodiment of the present invention, as shown in fig. 3, the mounting bracket 3, the boss, the first mounting groove, and the second mounting groove are rectangular;
the flexible flat cable substrate 4 is U-shaped.
Fig. 4 is a schematic structural view of a mounting bracket in one direction in an embodiment of the present invention, and fig. 5 is a schematic structural view of a mounting bracket in another direction in an embodiment of the present invention, as shown in fig. 4 and 5, a first mounting groove is provided on a rear side surface of the mounting bracket 3, and a through hole is provided at a groove bottom of the first mounting groove to communicate with a front side surface of the mounting bracket 3;
a second mounting groove is formed in the area, adjacent to the through hole, of the front side face of the mounting support 3, and the light projector 2 is arranged in the second mounting groove;
a boss is provided on the rear side of the mounting bracket 3 in an area opposite to the light projector 2.
Fig. 6 is a schematic structural diagram of a light projector according to an embodiment of the present invention, and as shown in fig. 6, the light projector 2 includes an edge-emitting laser 201 and a light beam projector 202 disposed on a light path;
the edge-emitting laser 201 is used for projecting laser to the beam projector 202;
the beam projector 202 is configured to project the incident laser light into a plurality of discrete collimated beams of light onto a target object.
In an embodiment of the present invention, the beam splitting projector is configured by processing an optical chip with a micro-nano structure on an inner surface thereof and matching with an optical lens. The beam splitting projector can perform the function of splitting incident light from the edge-emitting laser 201 into any number of collimated beams. The emission direction of the edge-emitting laser 201 and the projection direction of the beam splitting projector may be the same, or may be at 90 degrees or any angle required for the optical system design.
In an embodiment of the present invention, the light beam projector 202 can also employ a diffraction grating.
Fig. 7 is another schematic structural diagram of a light projector according to an embodiment of the present invention, and as shown in fig. 7, the light projector 2 includes a laser array 203, a collimating lens 204 and a beam splitting device 205 disposed on a light path;
the laser array 203 is used for projecting laser of a first order of magnitude to the collimating lens 204;
the collimating lens 204 is configured to collimate the incident multiple laser beams and emit collimated light beams of a first order of magnitude;
the beam splitting device 205 is configured to split the incident collimated light beam of the first order of magnitude and emit a collimated light beam of a second order of magnitude to the target object;
the second order of magnitude is greater than the first order of magnitude.
In an embodiment of the present invention, the Laser array 203 may be formed by a plurality of Vertical Cavity Surface Emitting Lasers (VCSELs) or a plurality of Edge Emitting Lasers (EELs). The multiple laser beams can become highly parallel collimated beams after passing through the collimating lens 204. The beam splitting device 205 may be used to achieve more collimated beams as required by the number of discrete beams in practical applications. The beam splitting device 205 may employ a diffraction grating (DOE), a Spatial Light Modulator (SLM), or the like.
In an embodiment of the present invention, the TOF camera module with small volume provided by the present invention further comprises a diffuser; the diffuser is used for diffusing the collimated light beams and enabling the collimated light beams to be subjected to floodlight emergence.
Fig. 8 is a schematic structural diagram of an embodiment of the depth camera module of the present invention, and as shown in fig. 8, the depth camera module 1 includes an optical imaging lens 102, a photodetector array 101, and a driving circuit; the light detector array 101 comprises a plurality of light detectors distributed in an array;
the optical imaging lens 102 is configured to enable a direction vector of the collimated light beam entering the light detector array 101 through the optical imaging lens 102 to have a one-to-one correspondence with the light detectors;
the light detector is used for receiving the collimated light beam reflected by the target object;
the driving circuit is used for measuring the propagation time of the plurality of collimated light beams and further generating depth data of the surface of the target object.
In order to filter background noise, a narrow band filter is usually installed in the optical imaging lens 102, so that the photodetector array 101 can only pass incident collimated light beams with preset wavelength. The preset wavelength can be the wavelength of the incident collimated light beam, and can also be between 50 nanometers smaller than the incident collimated light beam and 50 nanometers larger than the incident collimated light beam. The photodetector array 101 may be arranged periodically or aperiodically. Each photodetector, in cooperation with an auxiliary circuit, may enable measurement of the time of flight of the collimated beam. The photodetector array 101 may be a combination of multiple single-point photodetectors or a sensor chip integrating multiple photodetectors, as required by the number of discrete collimated light beams. To further optimize the sensitivity of the light detectors, the illumination spot of one discrete collimated light beam on the target object 3 may correspond to one or more light detectors. When a plurality of light detectors correspond to the same irradiation light spot, signals of each detector can be communicated through a circuit, so that the light detectors with larger detection areas can be combined.
The embodiment of the utility model provides an in the electronic equipment provided, include altogether the base plate heat dissipation module of making a video recording. The electronic device can be a mobile phone, a tablet computer, a digital camera, a payment platform and the like.
In the embodiment of the utility model, the boss is arranged on the back side surface of the mounting bracket in the area opposite to the light projector, the table surface of the boss is abutted with the heat dissipation substrate, the heat can be directly dissipated to the heat dissipation substrate, the heat conduction path is bypassed by the flexible flat cable substrate and the supporting substrate, the thermal resistance can be effectively reduced, and the heat dissipation efficiency is improved; the depth camera module group and the light projector are externally connected through a flexible flat cable substrate in the utility model, so as to realize signal output through a flexible flat cable interface, and realize that the depth camera module 1 and the light projector share a flexible flat cable interface, thereby being capable of being a more light and handy integrated TOF module; the utility model discloses on module 1 and the light projector of making a video recording of well degree of depth set up the installing support according to two independent modules, when having avoided the base plate of module 1 and the base plate integration of light projector of making a video recording of degree of depth, can influence the reduction problem of the yield of whole TOF module of making a video recording because of SMT (Surface Mounted Technology) pastes the increase of device quantity.
The embodiments in the present description are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other. The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
The foregoing description of the specific embodiments of the invention has been presented. It is to be understood that the present invention is not limited to the specific embodiments described above, and that various changes and modifications may be made by those skilled in the art within the scope of the appended claims without departing from the spirit of the invention.
Claims (10)
1. A common substrate heat dissipation camera module is characterized by comprising a mounting bracket, a depth camera module, a light projector and a heat dissipation substrate;
a first mounting groove is formed in the rear side face of the mounting bracket, and a through hole is formed in the bottom of the first mounting groove so as to be communicated with the front side face of the mounting bracket;
the depth camera module is arranged in the first mounting groove, and an image acquisition end of the depth camera module extends out through the through hole; a second mounting groove is formed in the area, adjacent to the through hole, of the front side face of the mounting support, and the light projector is arranged in the second mounting groove;
a boss is arranged on the rear side surface of the mounting bracket in an area opposite to the light projector, and the table surface of the boss is abutted to the heat dissipation substrate; a flexible flat cable substrate and a supporting substrate are sequentially sleeved between the boss and the radiating substrate.
2. The co-substrate thermal imaging module of claim 1, wherein the FFC substrate extends to the first mounting groove on a side of the boss and covers the first mounting groove to electrically connect to the depth imaging module,
the other side of the boss of the flexible flat cable substrate extends to the bottom of the second mounting groove from the front side surface of the mounting bracket so as to be electrically connected with the light projector.
3. The co-substrate heat dissipation camera module according to claim 2, wherein an avoidance groove is formed in a side wall surface of the mounting bracket;
the other side of the flexible flat cable substrate, which is located on the boss, is bent and extended through the avoiding groove and then extends to the front side face of the mounting support.
4. The co-substrate thermal imaging module of claim 2, wherein the mounting bracket, the boss, the first mounting groove, and the second mounting groove are rectangular;
the flexible flat cable substrate is U-shaped.
5. The co-substrate thermal imaging module of claim 1, wherein the height of the boss is equal to the sum of the thicknesses of the flex cable substrate and the support substrate.
6. The co-substrate thermal imaging module of claim 1, wherein the light projector comprises a laser array, a collimating lens, and a beam splitter disposed in an optical path;
the laser array is used for projecting laser of a first order of magnitude to the collimating lens;
the collimating lens is used for collimating a plurality of incident lasers and then emitting collimated beams with a first order of magnitude;
the beam splitting device is used for splitting the incident collimated light beam of the first order of magnitude and then emitting a collimated light beam of a second order of magnitude to a target object;
the second order of magnitude is greater than the first order of magnitude.
7. The co-substrate thermal imaging module of claim 1, wherein the light projector comprises an edge-emitting laser and a beam projector disposed on an optical path;
the edge-emitting laser is used for projecting laser to the beam projector;
the beam projector is used for projecting the incident laser into a plurality of discrete collimated beams to a target object.
8. The co-substrate thermal imaging module of claim 6 or 7, further comprising a diffuser; the diffuser is used for diffusing the collimated light beams and enabling the collimated light beams to be subjected to floodlight emergence.
9. The co-substrate thermal imaging module according to claim 6 or 7, wherein the depth imaging module comprises an optical imaging lens, a photodetector array, and a driving circuit; the light detector array comprises a plurality of light detectors distributed in an array;
the optical imaging lens is used for enabling direction vectors of the collimated light beams which penetrate through the optical imaging lens and enter the light detector array to be in one-to-one correspondence with the light detectors;
the light detector is used for receiving the collimated light beam reflected by the target object;
the driving circuit is used for measuring the propagation time of the plurality of collimated light beams and further generating depth data of the surface of the target object.
10. An electronic device comprising the co-substrate thermal imaging module according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021869359.XU CN213457352U (en) | 2020-08-31 | 2020-08-31 | Co-substrate heat dissipation camera module and electronic equipment |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021869359.XU CN213457352U (en) | 2020-08-31 | 2020-08-31 | Co-substrate heat dissipation camera module and electronic equipment |
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| CN213457352U true CN213457352U (en) | 2021-06-15 |
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| CN202021869359.XU Active CN213457352U (en) | 2020-08-31 | 2020-08-31 | Co-substrate heat dissipation camera module and electronic equipment |
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