CN213443898U

CN213443898U - Singlechip packing plant

Info

Publication number: CN213443898U
Application number: CN202022365271.0U
Authority: CN
Inventors: 陆勇俭
Original assignee: Kunshan Qunqi Electronics Co ltd
Current assignee: Kunshan Qunqi Electronics Co ltd
Priority date: 2020-10-22
Filing date: 2020-10-22
Publication date: 2021-06-15
Anticipated expiration: 2030-10-22

Abstract

The utility model discloses a singlechip packing plant relates to singlechip technical field, can't take out the singlechip fast for solving current packing plant, and the singlechip easily receives the extrusion and leads to the problem that the pin distortion damaged. The upper end of packagine machine constructs is provided with the mount pad, the packing base is installed to the upper end of mount pad, the packing base includes fixed limit and cassette, and fixed limit sets up to the integrated into one piece structure with the cassette, the inside of cassette is provided with singlechip standing groove and pin standing groove, and the pin standing groove is located the outside of singlechip standing groove, the centre of protective panel lower extreme is provided with the shock attenuation cushion, and protective panel splices with the shock attenuation cushion and is connected, protective panel's lower extreme is provided with the cardboard, the upper end on fixed limit is provided with the draw-in groove, and draw-in groove and cardboard all are provided with four.

Description

Singlechip packing plant

Technical Field

The utility model relates to a singlechip technical field specifically is singlechip packing plant.

Background

The single chip microcomputer is a typical embedded microcontroller, is composed of an arithmetic unit, a controller, a memory, input and output equipment and the like, and is equivalent to a microcomputer. It is more self-provisioning (no external hardware) and cost-effective than general-purpose microprocessors used in personal computers. Its advantages are small size, small storage capacity, simple interface and low function. Because the development is very rapid, the definition of the old single chip microcomputer can not be met, so the single chip microcomputer is called as a microcontroller with a wider range in many application occasions, the single chip microcomputer is easily polluted and damaged, and after the single chip microcomputer is produced, the single chip microcomputer needs to be packaged in order to conveniently transport and store the single chip microcomputer.

However, the existing packaging device cannot rapidly take out the single-chip microcomputer after packaging the single-chip microcomputer, and the single-chip microcomputer is easily extruded to cause pin distortion and damage, so that the existing requirements are not met, and the single-chip microcomputer packaging device is provided.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a singlechip packing plant to the current packing plant who proposes in solving above-mentioned background art can't take out the singlechip fast, and the singlechip easily receives the extrusion and leads to the problem that the pin distortion damaged.

In order to achieve the above object, the utility model provides a following technical scheme: singlechip packing plant, including packagine machine structure and protective panel, packagine machine constructs's upper end is provided with the mount pad, the packing base is installed to the upper end of mount pad, the packing base includes fixed limit and cassette, and fixed limit sets up to the integrated into one piece structure with the cassette, the inside of cassette is provided with singlechip standing groove and pin standing groove, and the pin standing groove is located the outside of singlechip standing groove, the centre of protective panel lower extreme is provided with the shock attenuation cushion, and protective panel splices with the shock attenuation cushion and is connected.

Preferably, the lower end of the protective panel is provided with four clamping plates, and the upper ends of the fixing edges are provided with four clamping grooves.

Preferably, the middle of the bottom end of the clamping seat is provided with a through groove, and the bottom of the single chip microcomputer placing groove is provided with a movable push plate.

Preferably, the lower extreme on fixed limit is provided with the magnetism strip, and fixed limit and magnetism strip cementing are connected, and magnetism strip and mount pad magnetic adsorption.

Preferably, a force application block is arranged in the middle of the upper end of the protection panel, and the protection panel is fixedly connected with the force application block.

Preferably, the upper end of the packaging mechanism is provided with a packaging cover plate, and the packaging cover plate is in interference fit with the packaging mechanism.

Compared with the prior art, the beneficial effects of the utility model are that:

1. the utility model discloses a be provided with singlechip standing groove and pin standing groove in the inside of cassette, the quantity of pin standing groove is the same with singlechip pin quantity, and during the packing, every pin of singlechip all is located corresponding pin standing groove inside, can protect every pin of singlechip, avoids the singlechip pin to receive the distortion damage after the extrusion.

2. The utility model discloses a cooperation between draw-in groove and the cardboard can arrange protective panel in the upper end of packing base, and the inside of the shock attenuation cushion embedding singlechip standing groove of protective panel lower extreme, with the inside singlechip surface contact of singlechip standing groove, further protects the singlechip, improves the security after the packing.

3. The utility model discloses a magnetic adsorption power between magnetic stripe and the mount pad realizes the quick fixed of the two, and fixed mode is simple, replaces sticky fixed, can take the packing base out from the mount pad is inside fast, and the ascending thrust of activity push pedal level is applyed to the logical groove of rethread cassette bottom, can release the inside singlechip of singlechip standing groove, and it is convenient to get of singlechip to put.

Drawings

Fig. 1 is a schematic structural view of a packaging base of the present invention;

fig. 2 is a three-dimensional view of the protective panel according to the present invention;

fig. 3 is a top three-dimensional perspective view of the protection panel of the present invention;

fig. 4 is a three-dimensional view of the packaging base according to the present invention;

fig. 5 is a connection diagram of the packaging mechanism and the packaging cover plate of the present invention.

In the figure: 1. a packaging mechanism; 2. a mounting seat; 3. a packaging base; 4. a single chip microcomputer placing groove; 5. a pin placing groove; 6. a protective panel; 7. a shock-absorbing cushion; 8. a card slot; 9. clamping a plate; 10. a force application block; 11. fixing the edge; 12. a card holder; 13. a through groove; 14. a movable push plate; 15. a magnetic strip; 16. and (7) packaging a cover plate.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.

Referring to fig. 1-5, the present invention provides an embodiment: singlechip packing plant, including packagine machine structure 1 and protective panel 6, packagine machine structure 1's upper end is provided with mount pad 2, packing base 3 is installed to mount pad 2's upper end, packing base 3 includes fixed limit 11 and cassette 12, and fixed limit 11 sets up to the integrated into one piece structure with cassette 12, the inside of cassette 12 is provided with singlechip standing groove 4 and pin standing groove 5, and pin standing groove 5 is located the outside of singlechip standing groove 4, the centre of protective panel 6 lower extreme is provided with damping cushion 7, and protective panel 6 splices with damping cushion 7 and is connected, singlechip standing groove 4's inside is arranged in to the singlechip main part, corresponding pin standing groove 5 inside is arranged in to each pin of singlechip, can protect every pin of singlechip, avoid the singlechip pin to receive the extrusion back distortion damage.

Further, the lower extreme of protecting panel 6 is provided with cardboard 9, and the upper end of fixed limit 11 is provided with draw-in groove 8, and draw-in groove 8 and cardboard 9 all are provided with four, and it is fixed to place protecting panel 6 in the upper end of packing base 3 through the cooperation between draw-in groove 8 and cardboard 9.

Further, the middle of cassette 12 bottom is provided with logical groove 13, and the bottom of singlechip standing groove 4 is provided with movable push pedal 14, exerts the ascending thrust of a level of movable push pedal 14 through logical groove 13 of cassette 12 bottom, can release the inside singlechip of singlechip standing groove 4, and it is convenient to get of singlechip and put.

Further, the lower extreme on fixed limit 11 is provided with magnetism strip 15, and fixed limit 11 is connected with 15 cementing of magnetism strip, and

magnetism strip

15 and 2 magnetic adsorption of mount pad, has the magnetic adsorption power through magnetism strip 15 and mount pad 2 between, can fix packing base 3 fast with mount pad 2, and fixed mode is simple, replaces sticky fixed, can take packing base 3 from the inside of mount pad 2 out fast.

Furthermore, a force application block 10 is arranged in the middle of the upper end of the protection panel 6, and the protection panel 6 is fixedly connected with the force application block 10, so that force application is convenient, and the protection panel 6 is convenient to assemble and disassemble.

Further, a packaging cover plate 16 is arranged at the upper end of the packaging mechanism 1, and the packaging cover plate 16 is in interference fit with the packaging mechanism 1, so that the connection mode is simple, and the assembly and disassembly are convenient.

The working principle is as follows: when the packaging base 3 is used, the packaging base 3 can be quickly fixed with the mounting base 2 through the magnetic adsorption force between the magnetic strip 15 and the mounting base 2, the fixing mode is simple, the packaging base 3 can be quickly drawn out from the inside of the mounting base 2 instead of being fixed by gluing, after the fixing is finished, a single chip microcomputer to be packaged is arranged in the packaging base 3, the main body of the single chip microcomputer is arranged in the single chip microcomputer placing groove 4, each pin of the single chip microcomputer is arranged in the corresponding pin placing groove 5, each pin of the single chip microcomputer can be protected, the single chip microcomputer is prevented from being twisted and damaged after being extruded, the single chip microcomputer in the single chip microcomputer placing groove 4 can be pushed out by applying a horizontal upward thrust of the movable push plate 14 through the through groove 13 at the bottom of the clamping seat 12, the single chip microcomputer is convenient to take and place, and the protection panel 6 can be arranged at the upper end of the, and the shock attenuation cushion 7 of protection panel 6 lower extreme imbeds the inside of singlechip standing groove 4 to with the inside singlechip surface contact of singlechip standing groove 4, further protect the singlechip, improve the security after the packing, cover packing apron 16 at last and can accomplish the packing.

It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Claims

1. Singlechip packing plant, including packagine machine structure (1) and protective panel (6), its characterized in that: the upper end of packagine machine structure (1) is provided with mount pad (2), packing base (3) are installed to the upper end of mount pad (2), packing base (3) are including fixed limit (11) and cassette (12), and just fixed limit (11) set up to the integrated into one piece structure with cassette (12), the inside of cassette (12) is provided with singlechip standing groove (4) and pin standing groove (5), and pin standing groove (5) are located the outside of singlechip standing groove (4), be provided with damping cushion (7) in the middle of protective panel (6) lower extreme, and protective panel (6) splice with damping cushion (7) and be connected.

2. The single chip microcomputer packaging device according to claim 1, wherein: the lower extreme of protection panel (6) is provided with cardboard (9), the upper end of fixed limit (11) is provided with draw-in groove (8), and draw-in groove (8) and cardboard (9) all are provided with four.

3. The single chip microcomputer packaging device according to claim 1, wherein: the middle of the bottom end of the clamping seat (12) is provided with a through groove (13), and the bottom of the single chip microcomputer placing groove (4) is provided with a movable push plate (14).

4. The single chip microcomputer packaging device according to claim 1, wherein: the lower extreme of fixed limit (11) is provided with magnetism strip (15), and fixed limit (11) and magnetism strip (15) cementing are connected, and magnetism strip (15) and mount pad (2) magnetic adsorption.

5. The single chip microcomputer packaging device according to claim 1, wherein: the middle of the upper end of the protection panel (6) is provided with a force application block (10), and the protection panel (6) is fixedly connected with the force application block (10).

6. The single chip microcomputer packaging device according to claim 1, wherein: the packaging mechanism is characterized in that a packaging cover plate (16) is arranged at the upper end of the packaging mechanism (1), and the packaging cover plate (16) is in interference fit with the packaging mechanism (1).