CN213423263U - Test board card for high-speed signal integrity test - Google Patents
Test board card for high-speed signal integrity test Download PDFInfo
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- CN213423263U CN213423263U CN202022541913.8U CN202022541913U CN213423263U CN 213423263 U CN213423263 U CN 213423263U CN 202022541913 U CN202022541913 U CN 202022541913U CN 213423263 U CN213423263 U CN 213423263U
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- 238000012360 testing method Methods 0.000 title claims abstract description 66
- 238000007789 sealing Methods 0.000 claims abstract description 6
- 230000017525 heat dissipation Effects 0.000 claims description 7
- 238000001514 detection method Methods 0.000 abstract description 3
- 238000010438 heat treatment Methods 0.000 description 5
- 125000003003 spiro group Chemical group 0.000 description 5
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
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Abstract
The utility model provides a test integrated circuit board for high speed signal integrality test belongs to integrated circuit board technical field, and this a test integrated circuit board for high speed signal integrality test includes casing assembly and integrated circuit board subassembly. The shell component comprises a bottom plate, side plates, a top plate, a back plate, an interface board, an operation plate, an image plate and a sealing plate, and the board card component comprises a board card main body, a control plate and a tablet computer. When encountering severe weather such as sleet, the integrated circuit board main part passes through the waterproof interface connection detection circuitry of interface board, when built-in slope panel computer makes things convenient for personnel to observe the signal, reduce the stop of sleet on the display image, the waterproof interface design, it gets into the test integrated circuit board to have reduced outdoor sleet, adopt and shelter from built-in slope design, the direct contact of test component with outside sleet has been reduced, the stop of sleet on test component surface has been reduced, the integrality test of outdoor high speed signal has been made things convenient for, the equipment of outdoor high speed signal integrality test has been protected.
Description
Technical Field
The utility model relates to a integrated circuit board technical field particularly, relates to a test integrated circuit board for high-speed signal integrality test.
Background
Signal integrity refers to the quality of a signal on a transmission path, which may be a common metal wire, an optical device, or other medium. Integrity failures of signals are typically detected and cleared by using a test card.
However, the above scheme still has certain defects, and the inventor finds that when the integrity of the high-speed signal is detected outdoors, severe weather such as rain, snow and the like is often encountered, which brings difficulty to the operation of the test board card.
SUMMERY OF THE UTILITY MODEL
In order to compensate above not enough, the utility model provides a test integrated circuit board for high-speed signal integrality test aims at improving the inconvenient problem of outdoor high-speed signal integrality test.
The utility model discloses a realize like this:
the utility model provides a test integrated circuit board for high-speed signal integrality test includes casing assembly and integrated circuit board subassembly.
The shell component comprises a bottom plate, side plates, a top plate, a back plate, an interface plate, an operation plate, an image plate and a sealing plate, wherein the side walls of the lower end of the side plates are vertically and symmetrically fixed on two sides of the side walls of the bottom plate, two sides of the bottom of the top plate are lapped between the tops of the side plates, the bottom of the back plate is fixed on one side of the top of the bottom plate between the side plates, the bottom of the interface plate is vertically fixed on the top of the bottom plate far away from the back plate, the bottom of the operation plate is obliquely and upwards arranged on the top of the interface plate between the side plates, the bottom of the image plate is obliquely and upwards arranged on one side of the top of the operation plate between the side plates, the bottom of the sealing plate is vertically arranged on the top of the image plate between the, one side of the control panel is arranged on one side of the surface of the operation panel, and one side of the tablet personal computer is arranged on one side of the surface of the image panel.
In an embodiment of the present invention, the bottom plate has a heat dissipation through hole.
In an embodiment of the present invention, a waterproof box is disposed on one side of the side wall of the interface board.
The utility model discloses an in an embodiment, its characterized in that, adjacent waterproof box integrated circuit board main part one end is provided with the mount, mount lateral wall one side is fixed in waterproof box lateral wall one side.
In an embodiment of the present invention, a wiring through hole is formed on one side of the surface of the waterproof box.
The utility model discloses an in an embodiment, its characterized in that, it is adjacent waterproof box integrated circuit board main part one side is provided with hardware interface, hardware interface run through in the wiring through-hole.
In an embodiment of the present invention, a heat dissipation plate is disposed at the bottom of the board main body.
The utility model discloses an in one embodiment, its characterized in that, adjacent the heating panel curb plate lateral wall one side symmetry is provided with the support frame, heating panel bottom both sides overlap in between the support frame lower extreme.
In an embodiment of the present invention, a hook is disposed at the top center of the top plate.
In an embodiment of the present invention, a hanging rack is disposed on one side of the sidewall of the upper end of the back plate away from the interface board.
The utility model has the advantages that: the utility model discloses a test board card for high-speed signal integrality test that obtains through the above-mentioned design, when using, open the backplate and install the board card main part on interface board one side, the control panel is installed on operation panel one side, the panel computer is installed on image board one side, cover the backplate, when meetting the bad weather such as sleet, the waterproof interface connection detection circuitry of interface board is passed through to the board card main part, the roof shelters from outside sleet to enter, built-in slope control panel makes the sleet that operating personnel brought can slide off by oneself when convenient personnel operated, built-in slope panel computer reduces sleet and sleet stay on the display image when convenient personnel observe the signal, adopt waterproof interface design, outdoor sleet entering test board card has been reduced, adopt and shelter from built-in slope design, reduced the direct contact of test subassembly with outside sleet, reduced sleet and sleet stay on the test subassembly surface, the integrity test of outdoor high-speed signals is facilitated, and the equipment for the integrity test of the outdoor high-speed signals is protected.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention, and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
Fig. 1 is a schematic view of a three-dimensional structure of a test board card for high-speed signal integrity test according to an embodiment of the present invention;
fig. 2 is a schematic view of a first-view perspective structure of a housing assembly according to an embodiment of the present invention;
fig. 3 is a schematic view of a second perspective three-dimensional structure of the housing assembly according to an embodiment of the present invention;
fig. 4 is a schematic view of a three-dimensional structure of the board card assembly provided by the embodiment of the present invention.
In the figure: 100-a housing assembly; 110-a base plate; 111-heat dissipating through holes; 120-side plate; 121-a support frame; 130-a top plate; 131-a hook; 140-a back plate; 141-a hanger; 150-an interface board; 151-waterproof box; 1511-wiring via; 160-an operation panel; 170-image plate; 180-sealing plate; 200-a board card assembly; 210-a board card main body; 211-a holder; 212 — hardware interface; 213-heat sink plate; 220-a control panel; 230-tablet computer.
Detailed Description
To make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the drawings of the embodiments of the present invention are combined to clearly and completely describe the technical solutions of the embodiments of the present invention, and obviously, the described embodiments are some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Thus, the following detailed description of the embodiments of the present invention, presented in the accompanying drawings, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and to simplify the description, but do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the present invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically limited otherwise.
In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," and "fixed" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally formed; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.
In the present disclosure, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact between the first and second features, or may comprise contact between the first and second features not directly. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.
Examples
Referring to fig. 1, 2, 3 and 4, the present invention provides a technical solution: a test board for high-speed signal integrity test comprises a shell assembly 100 and a board assembly 200, wherein the board assembly 200 is arranged in the shell assembly 100, the shell assembly 100 is internally designed to reduce direct contact with rain and snow, and the board assembly 200 tests the integrity of high-speed signals.
Referring to fig. 1, 2 and 3, the housing assembly 100 includes a bottom plate 110, side plates 120, a top plate 130, a back plate 140, an interface board 150, an operation plate 160, an image plate 170 and a sealing plate 180, wherein the side walls of the lower ends of the side plates 120 are vertically and symmetrically fixed on the two sides of the side walls of the bottom plate 110, the side plates 120 are screwed with the bottom plate 110, the two sides of the bottom of the top plate 130 are overlapped between the tops of the side plates 120, the top plate 130 is screwed with the side plates 120, the bottom of the back plate 140 is fixed on one side of the top of the bottom plate 110 between the side plates 120, the back plate 140 is screwed with the bottom plate 110, the bottom of the interface board 150 is vertically fixed on the top of the bottom plate 110 far from the back plate 140, the interface board 150 is screwed with the bottom of the bottom plate 110, the bottom of the operation plate 160 is obliquely, put the quick landing of sleet that can make things convenient for operating personnel to bring to one side, image board 170 bottom slope upwards sets up in operating panel 160 top one side between curb plate 120, in this embodiment, bends after image board 170 and operating panel 160 integrated into one piece, and image board 170 sets up in casing subassembly 100, reducible and external sleet's contact, puts the quick landing of sleet that can make things convenient for operating personnel to bring to one side.
Wherein, shrouding 180 bottom is vertical sets up the image board 170 top between curb plate 120, shrouding 180 bends after with image board 170 integrated into one piece, shrouding 180 increases the interval between roof 130 and the image board 170, reduce the visual obstruction, radiating through-hole 111 has been seted up to bottom plate 110 bottom, increase the heat dissipation of test integrated circuit board, roof 130 top center is provided with lifting hook 131, lifting hook 131 and roof 130 spiro union, make things convenient for hanging of outdoor test integrated circuit board, backplate 140 upper end lateral wall one side of keeping away from interface board 150 is provided with stores pylon 141, stores pylon 141 and backplate 140 spiro union, make things convenient for hanging of outdoor test integrated circuit board to lean on.
Referring to fig. 1, 3 and 4, the board card assembly 200 includes a board card main body 210, a control board 220 and a board computer 230, a waterproof box 151 is disposed on one side of a sidewall of an interface board 150, the waterproof box 151 is screwed with the interface board 150, a fixing bracket 211 is disposed at one end of the board card main body 210 adjacent to the waterproof box 151, one side of the side wall of the fixing bracket 211 is fixed on one side of the sidewall of the waterproof box 151, the fixing bracket 211 is respectively screwed with the board card main body 210 and the waterproof box 151, the peripheral side of the board card main body 210 is horizontally disposed between the sidewalls 120 of the adjacent interface boards 150, for testing high-speed signal deviation, a wiring through hole 1511 is disposed on one side of the surface of the waterproof box 151, a hardware interface 212 is disposed on one side of the board card main body 210 adjacent to the waterproof box 151, the hardware interface 212 penetrates through the wiring through hole 1511, rain and rain, the lateral plate 120 lateral wall one side symmetry of adjacent heating panel 213 is provided with support frame 121, heating panel 213 bottom both sides overlap joint between support frame 121 lower extreme, support frame 121 respectively with lateral plate 120 and heating panel 213 spiro union, control panel 220 one side sets up in operation panel 160 surface one side, control panel 220 and operation panel 160 spiro union, control panel 220 makes things convenient for the setting of test card, panel computer 230 one side sets up in image board 170 surface one side, panel computer 230 and image board 170 spiro union, panel computer 230 makes things convenient for the detector to observe the integrality of high-speed signal.
Specifically, the working principle of the test board card for the high-speed signal integrity test is as follows: in use, the back plate 140 is opened to mount the board card main body 210 on the side of the interface board 150, the control board 220 is mounted on the side of the operation board 160, the tablet computer 230 is mounted on the side of the image board 170, the back plate 140 is covered, when encountering severe weather such as sleet, the board card main body 210 is connected with the detection line through the waterproof interface of the interface board 150, the top plate 130 blocks outside sleet from entering, when the built-in inclined control panel 220 is convenient for personnel to operate, the sleet that makes the operating personnel bring can slide by oneself, when the built-in inclined panel computer 230 is convenient for personnel to observe signals, reduce the stop of sleet on the display image, the built-in test board, the exposure of the test board is reduced, the inclined plane design reduces the stop of sleet, the signal test that is applicable to various severe weather, the integrity test of outdoor high-speed signals is facilitated, the equipment for testing the integrity of outdoor high-speed signals is protected.
It should be noted that the specific model specifications of the board card main body 210, the control board 220 and the tablet pc 230 need to be determined by type selection according to the actual specification of the device, and the specific type selection calculation method adopts the prior art, so detailed description is omitted.
The power supply and the principle of the board main body 210, the control board 220 and the tablet computer 230 are clear to those skilled in the art and will not be described in detail herein.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. A test board card for high-speed signal integrity test is characterized by comprising
The shell assembly (100), the shell assembly (100) comprises a bottom plate (110), side plates (120), a top plate (130), a back plate (140), an interface plate (150), an operation plate (160), an image plate (170) and a closing plate (180), the side walls of the lower end of the side plates (120) are vertically and symmetrically fixed on two sides of the side walls of the bottom plate (110), two sides of the bottom of the top plate (130) are lapped between the tops of the side plates (120), the bottom of the back plate (140) is fixed on one side of the top of the bottom plate (110) between the side plates (120), the bottom of the interface plate (150) is vertically fixed on the top of the bottom plate (110) far away from the back plate (140), the bottom of the operation plate (160) is obliquely and upwards arranged on the top of the interface plate (150) between the side plates (120), the bottom of the image plate (170) is obliquely and upwards arranged on one, the bottom of the sealing plate (180) is vertically arranged at the top of the image plate (170) between the side plates (120);
the integrated circuit board assembly (200), the integrated circuit board assembly (200) includes integrated circuit board main part (210), control panel (220) and panel computer (230), integrated circuit board main part (210) week side level set up adjacently interface board (150) between curb plate (120), control panel (220) one side set up in operation panel (160) surface one side, panel computer (230) one side set up in image board (170) surface one side.
2. The test card for high-speed signal integrity test according to claim 1, wherein the bottom of the bottom plate (110) is provided with a heat dissipation through hole (111).
3. The test board card for high-speed signal integrity test according to claim 1, wherein a waterproof box (151) is disposed on one side of the sidewall of the interface board (150).
4. The test board for high-speed signal integrity test according to claim 3, wherein a fixing frame (211) is arranged at one end of the board main body (210) adjacent to the waterproof box (151), and one side of the side wall of the fixing frame (211) is fixed at one side of the side wall of the waterproof box (151).
5. The test board card for high-speed signal integrity test according to claim 3, wherein one side of the surface of the waterproof box (151) is provided with a wiring through hole (1511).
6. The test board for high-speed signal integrity test according to claim 5, wherein a hardware interface (212) is disposed adjacent to one side of the board main body (210) of the waterproof box (151), and the hardware interface (212) penetrates through the wiring through hole (1511).
7. The test board for high-speed signal integrity test according to claim 1, wherein the bottom of the board body (210) is provided with a heat dissipation plate (213).
8. The test board card for high-speed signal integrity test according to claim 7, wherein the side wall of the side plate (120) adjacent to the heat dissipation plate (213) is symmetrically provided with a support frame (121), and two sides of the bottom of the heat dissipation plate (213) are overlapped between the lower ends of the support frames (121).
9. The test board card for high-speed signal integrity test according to claim 1, wherein the top plate (130) is provided with a hook (131) at the top center.
10. The test board card for high-speed signal integrity test according to claim 1, wherein a hanging rack (141) is disposed on a side wall of an upper end of the back plate (140) away from the interface board (150).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022541913.8U CN213423263U (en) | 2020-11-05 | 2020-11-05 | Test board card for high-speed signal integrity test |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022541913.8U CN213423263U (en) | 2020-11-05 | 2020-11-05 | Test board card for high-speed signal integrity test |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213423263U true CN213423263U (en) | 2021-06-11 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022541913.8U Active CN213423263U (en) | 2020-11-05 | 2020-11-05 | Test board card for high-speed signal integrity test |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213423263U (en) |
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- 2020-11-05 CN CN202022541913.8U patent/CN213423263U/en active Active
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: A testing board for high-speed signal integrity testing Granted publication date: 20210611 Pledgee: Agricultural Bank of China Limited Hangzhou Yuhang Branch Pledgor: Hangzhou Jiefu Electronic Technology Co.,Ltd. Registration number: Y2024980004385 |