CN213401141U - Suction nozzle of chip mounter - Google Patents
Suction nozzle of chip mounter Download PDFInfo
- Publication number
- CN213401141U CN213401141U CN202022738440.0U CN202022738440U CN213401141U CN 213401141 U CN213401141 U CN 213401141U CN 202022738440 U CN202022738440 U CN 202022738440U CN 213401141 U CN213401141 U CN 213401141U
- Authority
- CN
- China
- Prior art keywords
- suction
- chip
- hole
- connecting pipe
- nozzle
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000009434 installation Methods 0.000 claims abstract description 13
- 229920001342 Bakelite® Polymers 0.000 claims description 3
- 239000004637 bakelite Substances 0.000 claims description 3
- 238000004891 communication Methods 0.000 claims description 2
- 238000001179 sorption measurement Methods 0.000 abstract description 11
- 230000000694 effects Effects 0.000 abstract description 5
- 239000000428 dust Substances 0.000 abstract description 4
- 238000010521 absorption reaction Methods 0.000 abstract description 3
- 238000007664 blowing Methods 0.000 abstract description 3
- 230000003434 inspiratory effect Effects 0.000 abstract description 3
- 230000002035 prolonged effect Effects 0.000 abstract description 3
- 238000000034 method Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 238000002834 transmittance Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008094 contradictory effect Effects 0.000 description 1
- 230000003670 easy-to-clean Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Images
Landscapes
- Manipulator (AREA)
Abstract
The utility model discloses a chip mounter suction nozzle, including connecting pipe and suction head, the lumen of connecting pipe forms the gas circuit passageway of constant diameter, suction head demountable installation is on the connecting pipe, just the suction hole that is used for adsorbing the chip is offered to the suction head, it runs through to inhale the hole the suction head and with gas circuit passageway straight line intercommunication. This chip mounter suction nozzle's suction head sets up the suction hole that runs through the suction head, carries out evacuation processing to the suction hole, then forms the vacuum adsorption effect to the chip for the chip adsorbs on the suction head, and, suction hole and gas circuit pipeline straight line intercommunication, and the inspiratory air current of follow suction hole can not receive the resistance of connecting pipe, but directly irritates in the gas circuit passageway, improves the rapidity of the effect of vacuum adsorption, has strengthened vacuum adsorption, guarantees the stability to the chip absorption, and the reliability is high. Because the suction hole is communicated with the air channel pipeline in a straight line, the suction hole can be dredged by blowing with strong air flow even if the suction hole is blocked by dust, and the service life of the suction nozzle of the chip mounter is prolonged.
Description
Technical Field
The utility model relates to an electronic equipment technical field, in particular to chip mounter suction nozzle.
Background
The suction nozzle of the chip mounter is a tool commonly used in the MEMS MIC packaging process, and the MEMS chip can be taken down from the wafer and then attached to a specified position on the substrate under the suction action of the suction hole on the suction nozzle of the chip mounter. The suction nozzle of the existing chip mounter is generally provided with an air pipe and a suction head, the air pipe and the suction head are connected in the process, a suction hole of the suction head is in a staggered structure through the suction hole and an air pipe, the size of the air pipe is small, the air flow can be subjected to resistance of the end face of the air pipe in the process of flowing into the air pipe after passing through the suction hole, circulation is not smooth, the time delay of the action of adsorption force is increased, the vacuum adsorption force is weakened, the stability of chip suction is influenced, and the reliability is poor. And moreover, the suction hole of the chip mounter suction nozzle can be blocked by dust after the chip mounter suction nozzle is used for a long time, the chip mounter suction nozzle is not easy to clean, and the service life of the chip mounter suction nozzle is shortened.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a chip mounter suction nozzle aims at solving the poor problem that reaches difficult clearance of chip mounter suction nozzle reliability among the prior art.
In order to achieve the above object, the utility model provides a chip mounter suction nozzle, chip mounter suction nozzle includes connecting pipe and suction head, the lumen of connecting pipe forms the gas circuit passageway of constant diameter, suction head demountable installation is on the connecting pipe, just the suction hole that is used for adsorbing the chip is offered to the suction head, it runs through to inhale the hole the suction head and with gas circuit passageway straight line intercommunication.
Preferably, the suction head comprises an installation block and a suction cup, one end of the installation block is detachably connected with the connecting pipe, the other end of the installation block is provided with the suction cup, and the suction hole penetrates through the suction cup and the installation block.
Preferably, a connection joint is formed at one end of the connection pipe, a mounting hole is formed in the mounting block, and the mounting block is detachably sleeved outside the connection joint through the mounting hole.
Preferably, the shape of the sucking disc is matched with that of the chip, one side of the sucking disc, which is far away from the mounting block, is provided with a plurality of bosses which are arranged at intervals, the bosses protrude from the sucking disc in the direction far away from the sucking disc, each boss is correspondingly provided with one sucking hole, and each sucking hole penetrates through the corresponding boss.
Preferably, each of the bosses is disposed at an edge of the chuck, and an avoidance space for avoiding the diaphragm on the chip is formed among the plurality of bosses.
Preferably, the suction cup covers the air path channel in the way of orthographic projection towards the connecting pipe, so that the suction hole is communicated with the air path channel in a straight line.
Preferably, the shape of the connecting joint is matched with that of the mounting hole, and the connecting joint is adhered in the mounting hole.
Preferably, a limiting convex ring is arranged at a position, close to the connecting joint, on the connecting pipe, the limiting convex ring is sleeved outside the connecting pipe, and one end, deviating from the sucker, of the mounting block is abutted against the limiting convex ring.
Preferably, the suction head is an integrally formed piece.
Preferably, the suction head is made of bakelite.
The technical scheme of the utility model, the suction hole that runs through the suction head is seted up to the suction head of chip mounter suction nozzle, carries out evacuation treatment to the suction hole, then forms the vacuum adsorption effect to the chip for the chip adsorbs on the suction head, and, the utility model discloses a suction hole and gas circuit pipeline straight line intercommunication can not receive the resistance of connecting pipe from the inspiratory air current of suction hole, but directly irritate in the gas circuit passageway, improve the rapidity that vacuum adsorption acts on, have strengthened vacuum adsorption, guarantee the stability to the chip absorption, and the reliability is high. And because the suction hole is communicated with the air channel pipeline in a straight line, the suction hole can be dredged by blowing with strong air flow even under the condition that the suction hole is blocked by dust, and the service life of the suction nozzle of the chip mounter is prolonged. In addition, the suction holes are communicated with the air channel in a straight line, so that the position and the angle of a suction nozzle of the chip mounter can be corrected through the transmittance of the suction holes, the correction mode can be optimized, and the correction precision and the correction efficiency are improved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
Fig. 1 is a schematic perspective view of a suction nozzle of a chip mounter according to an embodiment of the present invention;
fig. 2 is a schematic plan perspective view of a suction nozzle of a chip mounter according to an embodiment of the present invention;
fig. 3 is an exploded perspective view of the suction nozzle of the chip mounter according to an embodiment of the present invention.
The reference numbers illustrate:
| reference numerals | Name (R) | Reference numerals | Name (R) |
| 100 | Suction nozzle of |
21 | |
| 10 | Connecting |
22 | |
| 11 | |
221 | |
| 12 | Connecting |
23 | |
| 13 | Limiting |
231 | |
| 20 | |
232 | Avoidance space |
The objects, features and advantages of the present invention will be further described with reference to the accompanying drawings.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
It should be noted that, if directional indications (such as upper, lower, left, right, front and rear … …) are involved in the embodiment of the present invention, the directional indications are only used to explain the relative position relationship between the components, the motion situation, etc. in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indications are changed accordingly.
In addition, if there is a description relating to "first", "second", etc. in the embodiments of the present invention, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, the technical solutions in the embodiments may be combined with each other, but it must be based on the realization of those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should not be considered to exist, and is not within the protection scope of the present invention.
The utility model provides a chip mounter suction nozzle.
As shown in fig. 1 to 3, the chip mounter nozzle 100 of the present embodiment includes a connecting pipe 10 and a suction head 20, a lumen of the connecting pipe 10 forms an equal-diameter air channel 11, the suction head 20 is detachably mounted on the connecting pipe 10, the suction head 20 is provided with a suction hole 21 for sucking a chip, and the suction hole 21 penetrates through the suction head 20 and is linearly communicated with the air channel 11.
Specifically, the connecting pipe 10 of the chip mounter suction nozzle 100 of the present embodiment is a metal pipe, which may be a stainless steel pipe, and for the smoothness of the air path, the stainless steel pipe of the present embodiment is arranged in an equal diameter manner, and the tube cavity thereof forms an equal diameter air path channel 11, that is, the sizes of all parts of the tube cavity are the same, and the air path channels 11 with the same size are formed. The suction head 20 is detachably mounted on the connection pipe 10, so as to be conveniently disassembled from the connection pipe 10. Suction hole 21 that runs through suction head 20 is seted up to suction head 20, carry out evacuation processing to suction hole 21, then form the vacuum adsorption effect to the chip, make the chip adsorb on suction head 20, and, the suction hole 21 and the air circuit pipeline straight line intercommunication of this embodiment, the inspiratory air current of follow suction hole 21 can not receive the resistance of connecting pipe 10, but directly irritate in the air circuit passageway 11, improve the rapidity that the vacuum adsorption effect is acted on, the vacuum adsorption power has been strengthened, guarantee the stability to the chip absorption, high reliability. Moreover, because the suction hole 21 is linearly communicated with the air path pipeline, even if the suction hole 21 is blocked by dust, the suction hole 21 can be dredged by blowing air with strong air flow, and the service life of the suction nozzle 100 of the chip mounter is prolonged. In addition, because the suction holes 21 are linearly communicated with the air channel 11, the chip mounter can correct the position and the angle of the suction nozzle 100 of the chip mounter through the transmittance of the suction holes 21, so that the correction mode can be optimized, and the correction precision and the correction efficiency are improved.
The suction head 20 of the embodiment comprises a mounting block 22 and a suction cup 23, one end of the mounting block 22 is detachably connected with the connecting pipe 10, the other end of the mounting block 22 is provided with the suction cup 23, and the suction hole 21 penetrates through the suction cup 23 and the mounting block 22. The installation block 22 is arranged to facilitate the installation of the suction head 20 on the connecting pipe 10, the suction cup 23 is mainly used for adsorbing a chip, and the suction hole 21 penetrates through the suction cup 23 and the installation block 22 to realize the communication between the suction hole 21 and the air passage 11 in the connecting pipe 10.
Further, one end of the connecting pipe 10 forms a connecting joint 12, the mounting block 22 forms a mounting hole 221, and the mounting block 22 is detachably sleeved outside the connecting joint 12 through the mounting hole 221. In the process of assembling the suction head 20 and the connecting pipe 10, the connecting joint 12 of the connecting pipe 10 extends into the mounting hole 221 of the mounting block 22, so that the mounting block 22 is sleeved outside the connecting joint 12, and the assembly is simple and convenient. It should be noted that the connection joint 12 of the present embodiment is a part of the connection pipe 10, and is integrated with the connection pipe 10, and there is no need to additionally provide another connection joint 12.
Furthermore, the shape of the suction cup 23 is matched with that of the chip, a plurality of bosses 231 arranged at intervals are arranged on one side of the suction cup 23 away from the mounting block 22, the bosses 231 protrude from the suction cup 23 in a direction away from the suction cup 23, a suction hole 21 is correspondingly formed in each boss 231, and each suction hole 21 penetrates through the corresponding boss 231.
It can be understood that the chip has square chip, circular chip or other special-shaped chip, and in order to guarantee the adsorbed reliability to the chip, the sucking disc 23 in this embodiment chip mounter suction nozzle 100 matches with the shape of chip, for example, when the chip is square chip, sucking disc 23 is square sucking disc 23, when the chip is circular chip, sucking disc 23 is circular sucking disc 23, and the shape of sucking disc 23 can be according to the nimble setting of shape of chip, the utility model discloses do not make the restriction to the concrete structure of sucking disc 23.
In this embodiment, each of the bosses 231 is disposed at an edge of the suction cup 23, and an avoiding space 232 for avoiding the film on the chip is formed between the plurality of bosses 231. As shown in fig. 1, the chip of this embodiment is a square chip, correspondingly, the suction cup 23 is a square suction cup 23, the number of the bosses 231 is four, and the four bosses 231 are respectively disposed at the four corners of the suction cup 23, so that when the chip is adsorbed, the four bosses 231 respectively adsorb the four corners of the chip, thereby avoiding damage to other structures of the chip while the chip is adsorbed. Moreover, each boss 231 protrudes from the suction cup 23 to the original direction of the suction cup 23, an avoiding space 232 can be formed among the four bosses 231, and when the bosses 231 adsorb the chip, the avoiding space 232 can avoid the film on the chip, so that the film is protected from being damaged.
In this embodiment, the orthographic projection of the suction cup 23 to the direction of the connecting pipe 10 covers the air passage 11, so that the suction hole 21 is linearly communicated with the air passage 11. The size of this embodiment sucking disc 23 is less than the size of gas path channel 11, gas path channel 11 can be cylindrical passageway, sucking disc 23 can be square sucking disc 23, circular sucking disc 23 or other special-shaped sucking discs 23, sucking disc 23 is towards the orthographic projection of connecting pipe 10 direction, namely, as shown in fig. 3, the orthographic projection of sucking disc 23 from the right side left direction is covered by gas path channel 11 entirely, thereby make the position of inhaling the hole 21 on sucking disc 23 can not surpass the scope of gas path channel 11, inhale the hole 21 and need not turn round, but with gas path channel 11 straight line connection. It should be noted that, in fig. 3, the gas passage 11 and the suction hole 21 are shown by broken lines, and the remaining broken lines are extended lines of the suction hole 21.
In this embodiment, the shape of the connection terminal 12 matches the shape of the mounting hole 221, and the connection terminal 12 is bonded in the mounting hole 221. To facilitate the assembly of the cleaner head 20 to the connector pipe 10, the shape of the mounting hole 221 is configured to match the shape of the connector sub 12. The connection joint 12 of this embodiment is a part of the connection pipe 10, and can be a circular connection joint 12, and the installation hole 221 can be a circular installation hole 221, and further matches with the shaft hole of the connection joint 12, so as to realize the assembly of the suction head 20 and the connection pipe 10. In addition, the connection joint 12 can be adhered to the mounting hole 221, which is beneficial to improving the assembly stability of the suction head 20 and the connection pipe 10, and further improving the chip suction reliability of the chip mounter suction nozzle 100.
The position that is close to attach fitting 12 on the connecting pipe 10 of this embodiment is provided with spacing bulge loop 13, and outside connecting pipe 10 was located to spacing bulge loop 13 cover, the one end that installation piece 22 deviates from sucking disc 23 and spacing bulge loop 13 butt. As shown in fig. 2 and 3, a position on the connecting pipe 10 near the right end thereof is provided with a limiting convex ring 13, the limiting convex ring 13 is sleeved outside the connecting pipe 10, and during assembly, the left end of the mounting block 22 on the suction head 20 can be abutted against the limiting convex ring 13 to play a limiting role, so that the suction head 20 and the connecting pipe 10 can be conveniently assembled.
The suction head 20 of this embodiment is an integrally formed part. As can be appreciated, the mounting block 22 and the suction cup 23 are integrally formed into the suction head 20, thereby eliminating assembly steps, avoiding assembly gaps and errors, and facilitating manufacturing. Further, the suction nozzle 100 of the chip mounter according to the present embodiment can be used in the MEMS MIC encapsulation process to suck the MEMS chip, and in order to protect the MEMS chip from being crushed, the suction head 20 of the present embodiment is made of bakelite, which has high mechanical strength and low hardness, is easy to process and manufacture, and can not crush the chip when sucking the chip, thereby ensuring the yield of the chip.
The above is only the preferred embodiment of the present invention, not so limiting the patent scope of the present invention, all of which are in the utility model discloses a conceive, utilize the equivalent structure transform that the content of the specification and the attached drawings did, or directly/indirectly use all to include in other relevant technical fields the patent protection scope of the present invention.
Claims (10)
1. The utility model provides a chip mounter suction nozzle, its characterized in that, the chip mounter suction nozzle includes connecting pipe and suction head, the lumen of connecting pipe forms the gas circuit passageway of constant diameter, suction head demountable installation is on the connecting pipe, just the suction hole that is used for adsorbing the chip is offered to the suction head, the suction hole runs through the suction head and with gas circuit passageway straight line intercommunication.
2. The suction nozzle of claim 1, wherein the suction head includes a mounting block and a suction cup, one end of the mounting block is detachably connected to the connection pipe, the suction cup is mounted to the other end of the mounting block, and the suction hole extends through the suction cup and the mounting block.
3. The suction nozzle of claim 2, wherein one end of the connecting tube forms a connector, and the mounting block forms a mounting hole through which the mounting block is removably received over the connector.
4. The suction nozzle of the chip mounter according to claim 3, wherein the suction cup is matched with the chip in shape, a side of the suction cup facing away from the mounting block is provided with a plurality of bosses arranged at intervals, the bosses protrude from the suction cup in a direction away from the suction cup, each boss is correspondingly provided with one suction hole, and each suction hole penetrates through the corresponding boss.
5. The suction nozzle of a chip mounter according to claim 4, wherein each of said bosses is provided at an edge of said suction plate, and an avoidance space for avoiding a diaphragm on said chip is formed between a plurality of said bosses.
6. The suction nozzle of claim 4, wherein an orthographic projection of the suction cup in a direction of the connecting tube covers the air passage channel so that the suction hole is in linear communication with the air passage channel.
7. The mounter nozzle as recited in claim 3, wherein said connection terminals have a shape matching a shape of said mounting holes, said connection terminals being bonded within said mounting holes.
8. The suction nozzle of the chip mounter according to claim 3, wherein a position on said connecting pipe near said connection joint is provided with a limit protruding ring, said limit protruding ring is sleeved outside said connecting pipe, and one end of said mounting block facing away from said suction cup abuts against said limit protruding ring.
9. The mounter nozzle of any one of claims 1 to 8, wherein said suction head is an integrally formed piece.
10. The mounter nozzle according to any one of claims 1 to 8, wherein said suction head is a bakelite part.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022738440.0U CN213401141U (en) | 2020-11-23 | 2020-11-23 | Suction nozzle of chip mounter |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022738440.0U CN213401141U (en) | 2020-11-23 | 2020-11-23 | Suction nozzle of chip mounter |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213401141U true CN213401141U (en) | 2021-06-08 |
Family
ID=76195012
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022738440.0U Expired - Fee Related CN213401141U (en) | 2020-11-23 | 2020-11-23 | Suction nozzle of chip mounter |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213401141U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114375153A (en) * | 2021-12-30 | 2022-04-19 | 北京无线电计量测试研究所 | Chip mounting suction nozzle for crystal oscillator and chip mounting equipment |
| CN117042437A (en) * | 2023-08-29 | 2023-11-10 | 翼龙半导体设备(无锡)有限公司 | Chip mounting mechanism and chip mounting method |
-
2020
- 2020-11-23 CN CN202022738440.0U patent/CN213401141U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114375153A (en) * | 2021-12-30 | 2022-04-19 | 北京无线电计量测试研究所 | Chip mounting suction nozzle for crystal oscillator and chip mounting equipment |
| CN117042437A (en) * | 2023-08-29 | 2023-11-10 | 翼龙半导体设备(无锡)有限公司 | Chip mounting mechanism and chip mounting method |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN213401141U (en) | Suction nozzle of chip mounter | |
| EP1424032A4 (en) | Vacuum cleaner and device having ion generator | |
| CN107481964B (en) | Silicon wafer batch sucking device | |
| CN211378674U (en) | Suction nozzle structure and paster equipment | |
| CN209110930U (en) | A kind of curved surface cover-plate glass adsorption jig | |
| CN213485529U (en) | Suction nozzle of chip mounter | |
| CN108857981B (en) | Product positioning device and positioning method | |
| CN209753439U (en) | Rotary vacuum sucking and breaking mechanism | |
| CN219173625U (en) | Suction nozzle, suction assembly and suction device | |
| CN210157326U (en) | Sound cavity structure and sound equipment | |
| CN112385918A (en) | Sound amplifying device for mask | |
| CN215191376U (en) | Steel pipe positioning mechanism and scavenger cutting and sucking mirror | |
| KR100329707B1 (en) | Mike assembly for antigas mask | |
| CN219098283U (en) | Suction nozzle structure and mounting equipment | |
| CN217610811U (en) | Casing of dust collector and dust collector | |
| CN217011349U (en) | Shell assembly and electronic equipment | |
| CN219514214U (en) | TWS earphone | |
| CN220648617U (en) | Air purifier for notebook computer | |
| CN219383981U (en) | Adsorption tool | |
| CN216638118U (en) | Suction nozzle, material suction device and die bonder | |
| CN209755258U (en) | Improve sucking disc assembly of structure | |
| CN217603027U (en) | Housing structure and vacuum generator assembly | |
| CN216686491U (en) | Sucking disc assembly body | |
| CN216725512U (en) | Self-sealing assembly, self-sealing structure and ventilation treatment equipment | |
| CN217405811U (en) | Connector and electronic device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20210608 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |