CN213397609U

CN213397609U - A dynamics detection device for IC-substrate

Info

Publication number: CN213397609U
Application number: CN202022670220.9U
Authority: CN
Inventors: 付满仓; 沈乐
Original assignee: Suzhou Xinlisheng Electronics Co ltd
Current assignee: Suzhou Xinlisheng Electronics Co ltd
Priority date: 2020-11-18
Filing date: 2020-11-18
Publication date: 2021-06-08
Anticipated expiration: 2030-11-18

Abstract

The utility model relates to the technical field of IC substrates, and discloses a force detection device for an IC substrate, which comprises a detection table and a press head arranged on the detection table, wherein a movable plate is arranged on the table surface of the detection table, two support blocks are arranged on two sides of the top end of the movable plate, a first slider is arranged at the bottom end of one support block, and the first slider is arranged in a first chute arranged on the top end of the movable plate along the length direction of the movable plate; through be provided with two supporting shoes on examining test table movable plate, utilize the extrusion of moving down to placing the IC substrate on the supporting shoe according to the briquetting, can realize the detection achievement to IC board compressive strength degree to one of them supporting shoe is through the gliding first spout of seting up of first slider installation on the movable plate, like this can be according to the time dimension size of IC substrate, utilize the slip of first slider in first spout, carry out nimble regulation to the distance between two supporting shoes, it is more convenient to use.

Description

A dynamics detection device for IC-substrate

Technical Field

The utility model relates to a IC base plate technical field specifically is a dynamics detection device for IC base plate.

Background

An IC substrate is a microelectronic device or component. The transistor, diode, resistance, capacitance and inductance elements and wiring required in a circuit are interconnected together by adopting a certain process, manufactured on a small or a plurality of small semiconductor wafers or medium substrates, and then packaged in a tube shell to form a micro structure with the required circuit function; all the elements of which are structurally integrated, have advanced the electronic elements toward miniaturisation, low power consumption and high reliability, and in the production of IC substrates, in order to reach the production quality standards, it is necessary to design a device for detecting the strength of the IC substrates.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a dynamics detection device for IC-substrate to solve the problem that proposes among the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme:

the utility model provides a dynamics detection device for IC substrate, including examining test table, the setting is examining the press head on test table, be provided with the movable plate on examining test table's the mesa, the both sides on movable plate top are provided with two supporting shoes, the bottom of one of them supporting shoe is provided with first slider, first slider setting is extended in the first spout that its length direction was seted up on the movable plate top, another movable plate is fixed to be set up on the movable plate, the press head is connected on examining the hydraulic stem of test table top pneumatic cylinder output, be provided with pressure sensor on the press head, pressure sensor on the press head and the display screen signal connection of embedding on examining test table.

As a further aspect of the present invention: a threaded rod penetrates through a threaded hole in one fixedly arranged supporting block, and a rotating cap is sleeved at one end of the threaded rod penetrating through the other supporting block.

As a further aspect of the present invention: the bottom end of the moving plate is provided with a second sliding block, and the second sliding block is arranged in a second sliding groove formed in the detection table in a sliding mode.

As a further aspect of the present invention: the top end of one movable supporting block is provided with a pressing plate which is an L-shaped plate.

As a further aspect of the present invention: the inner wall of the top end of the abutting plate is provided with a groove, and a pressing strip is arranged in the groove.

As a further aspect of the present invention: the compressing strip is an L-shaped plate, and the corners of the compressing strip are hinged with the groove walls of the groove through hinges.

Compared with the prior art, the beneficial effects of the utility model are that: through be provided with two supporting shoes on examining test table movable plate, utilize the extrusion of moving down to placing the IC substrate on the supporting shoe according to the briquetting, can realize the detection achievement to IC board compressive strength degree to one of them supporting shoe is through the gliding first spout of seting up of first slider installation on the movable plate, like this can be according to the time dimension size of IC substrate, utilize the slip of first slider in first spout, carry out nimble regulation to the distance between two supporting shoes, it is more convenient to use.

Drawings

Fig. 1 is a schematic structural view of the present invention;

fig. 2 is a structural sectional view of the fastening plate of the present invention.

In the figure: 1. a detection table; 2. a pressing head; 3. a hydraulic cylinder; 4. a support block; 5. a propping plate; 6. a threaded rod; 7. turning the cap; 8. a first slider; 9. a first chute; 10. moving the plate; 11. a second slider; 12. a second chute; 13. a groove; 14. compressing the strips; 15. a display screen.

Detailed Description

Please refer to fig. 1-2, in an embodiment of the present invention, a dynamics detection apparatus for IC substrate, including detecting platform 1, the pressing head 2 arranged on detecting platform 1 is provided, the table top of detecting platform 1 is provided with a movable plate 10, both sides of the top of movable plate 10 are provided with two supporting blocks 4, wherein the bottom of one supporting block 4 is provided with a first slider 8, the first slider 8 is arranged in a first chute 9 formed on the top of the movable plate 10 along the length direction thereof, another movable plate 10 is fixedly arranged on the movable plate 10, the pressing head 2 is connected on the hydraulic rod of the output end of the hydraulic cylinder 3 fixedly arranged on the top of detecting platform 1, the pressing head 2 is provided with a pressure sensor, the pressure sensor on the pressing head 2 is in signal connection with the display screen 15 embedded on detecting platform 1.

As shown in fig. 1, a threaded rod 6 is rotatably inserted into a threaded hole of one of the fixedly arranged support blocks 4, and a rotating cap 7 is fixedly sleeved on one end of the threaded rod 6 which penetrates through the other support block 4.

By adopting the scheme, when the rotating cap 7 is utilized to drive the threaded rod 6 to rotate in the threaded hole on the supporting block 4, the rotating cap 7 can push one of the supporting blocks 4 to move, so that the adjustment of the distance between the two supporting blocks 4 is realized.

As shown in fig. 1, a second slide block 11 is fixedly disposed at a bottom end of the moving plate 10, and the second slide block 11 is slidably disposed in a second slide groove 12 formed in the inspection table 1.

Through adopting above-mentioned scheme, utilize the slip of second slider 11 in second spout 12, can go on to the IC base plate on the supporting shoe 4, and then realize the extrusion work to different positions on the IC base plate, it is higher to detect persuasive dynamics.

As shown in fig. 1, a pressing plate 5 is disposed at the top end of one movable supporting block 4, and the pressing plate 5 is an "L" shaped plate.

As shown in fig. 2, a groove 13 is formed on the inner wall of the top end of the abutting plate 5, and a pressing strip 14 is arranged in the groove 13.

By adopting the above scheme, when the IC substrate is inserted into the abutting plate 5 on the supporting block 4, the pressing strip 14 is utilized to extrude the IC substrate, and the IC substrate to be detected can be fixed on the supporting block 4.

As shown in fig. 2, the pressing strip 14 is an "L" shaped plate, and corners of the pressing strip 14 are hinged to the groove walls of the groove 13 through hinges.

Through adopting above-mentioned scheme, the IC base plate is pushing tightly 14 rotations through the extrusion to compressing tightly 14 one side in the in-process that inserts and support tight board 5, and then drives compressing tightly 14 opposite side extrusion and support tightly to the IC base plate, realizes the fixed work to the IC base plate

The utility model discloses a theory of operation is: firstly, an IC substrate to be detected is placed on two supporting blocks 4, one side of the IC substrate is abutted against the side surface of one supporting block 4, the other side of the IC substrate is inserted into an abutting plate 5 at the top end of the other supporting block 4, then a threaded rod 6 is rotated in a threaded hole by utilizing a rotating cap 7, a first sliding block 8 at the bottom end of the supporting block 4 is pushed by the rotating cap 7 to slide in a first sliding groove 9, when one movable supporting block 4 moves, one end of the IC substrate gradually moves towards the inner side of the abutting plate 5, when the IC substrate moves in the abutting plate 5, a pressing strip 14 is pushed to rotate in a groove 13 by extruding one side of the pressing strip 14, the other side of the pressing strip 14 is further driven to be abutted against the IC substrate, then, under the action of a hydraulic cylinder 3, a pressing head 2 at the bottom end of a hydraulic rod is driven to move downwards to press the IC substrate, the pressure sensed by a pressure sensor on the pressing head 2 is displayed on a, the pressure resistance detection device is used for detecting the pressure resistance of the IC substrate.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation. The use of the phrase "comprising one of the elements does not exclude the presence of other like elements in the process, method, article, or apparatus that comprises the element.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. A force detection device for IC substrate comprises a detection table (1), a pressing head (2) arranged on the detection table (1), it is characterized in that a moving plate (10) is arranged on the table surface of the detection table (1), two supporting blocks (4) are arranged on two sides of the top end of the moving plate (10), the bottom end of one of the supporting blocks (4) is provided with a first sliding block (8), the first sliding block (8) is arranged in a first sliding groove (9) which is formed in the top end of the moving plate (10) along the length direction of the moving plate, the other moving plate (10) is fixedly arranged on the moving plate (10), the pressing head (2) is connected with a hydraulic rod at the output end of a hydraulic cylinder (3) at the top end of the detection table (1), the pressing head (2) is provided with a pressure sensor, and the pressure sensor on the pressing head (2) is in signal connection with a display screen (15) embedded in the detection table (1).

2. A force detection device for IC substrates according to claim 1, wherein a threaded rod (6) passes through a threaded hole on one of the fixedly arranged support blocks (4), and a rotating cap (7) is sleeved on one end of the threaded rod (6) passing through the other support block (4).

3. A force detection device for IC substrates according to claim 1, wherein the bottom end of the moving plate (10) is provided with a second slide block (11), and the second slide block (11) is slidably arranged in a second slide groove (12) formed on the detection table (1).

4. A force detection device for IC substrates according to claim 1, wherein a top end of the movable supporting block (4) is provided with a pressing plate (5), and the pressing plate (5) is an L-shaped plate.

5. A force detection device for IC substrates according to claim 4, wherein the inner wall of the top end of the abutting plate (5) is provided with a groove (13), and the groove (13) is provided with a pressing strip (14).

6. A force detection device for IC substrates according to claim 5, wherein the compression strip (14) is an L-shaped plate, and corners of the compression strip (14) are hinged with the groove walls of the groove (13) through hinges.