CN213388952U - Electroplating device with circuit board weathers function - Google Patents
Electroplating device with circuit board weathers function Download PDFInfo
- Publication number
- CN213388952U CN213388952U CN202022266778.0U CN202022266778U CN213388952U CN 213388952 U CN213388952 U CN 213388952U CN 202022266778 U CN202022266778 U CN 202022266778U CN 213388952 U CN213388952 U CN 213388952U
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- Prior art keywords
- circuit board
- blowpipe
- blowing pipe
- electroplating
- air
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- 238000009713 electroplating Methods 0.000 title claims abstract description 39
- 238000007664 blowing Methods 0.000 claims abstract description 35
- 238000001035 drying Methods 0.000 claims abstract description 8
- 238000005485 electric heating Methods 0.000 claims description 7
- 238000000861 blow drying Methods 0.000 claims 1
- 238000010079 rubber tapping Methods 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 11
- 238000000034 method Methods 0.000 abstract description 3
- 239000007788 liquid Substances 0.000 description 6
- 238000007747 plating Methods 0.000 description 5
- 210000003437 trachea Anatomy 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 230000008021 deposition Effects 0.000 description 1
- 238000007602 hot air drying Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
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- Electroplating Methods And Accessories (AREA)
Abstract
The utility model relates to a printed circuit board production facility field provides an electroplate device with circuit board weathers function. Including electroplating box, electroplating box's top is equipped with the hanger rail, it has the pulley to roll in the hanger rail, the pulley rotates to be connected in the support, the support upper end is equipped with telescopic cylinder, telescopic cylinder is connected with the bracing piece, the bottom centre gripping of bracing piece has the circuit board, electroplating box's top is equipped with lower floor's blowing pipe and upper blowing pipe, lower floor's blowing pipe and upper blowing pipe all encircle in the circuit board, lower floor's blowing pipe and upper blowing pipe all are equipped with the multiunit air cock, the one end of lower floor's blowing pipe is connected with the air-blower, the outlet duct of air-blower still shunting in the electric heat box, the gas outlet of electric heat. The utility model discloses a circuit board accomplishes after electroplating just can accomplish drying of circuit board mentioning the in-process, need not wash, has simplified circuit board production processes, has improved circuit board production efficiency, has practiced thrift circuit board manufacturing cost.
Description
Technical Field
The utility model relates to a printed circuit board production facility field, in particular to electroplate device with circuit board weathers function.
Background
In order to realize the conduction between the layers of the multilayer printed circuit board, the prior art generally adopts a chemical copper deposition method. The existing chemical copper deposition production process mainly adopts a vertical electroplating line to electroplate the circuit board. However, in the traditional electroplating production process of the vertical electroplating line, after the circuit board is lifted from the electroplating pool after electroplating is finished, the circuit board needs to be cleaned and dried after cleaning. The existing production process generally uses special circuit board drying equipment to dry the circuit board, and the drying equipment for the circuit board generally uses cold air to dry the circuit board, so the drying effect is not ideal.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing an electroplate device with circuit board weathers function, mainly used solves the circuit board and washs the problem that the back blows dry needs special equipment, solves cold wind simultaneously and weathers the unsatisfactory problem of circuit board effect.
The above technical problem of the present invention can be solved by the following technical solutions: the electroplating device comprises an electroplating box, wherein a pair of hanging rails are arranged above the electroplating box, pulleys roll in the hanging rails, the two pulleys are rotationally connected to a support, the pulleys are connected with a motor for driving, the motor is fixed on the support, a plurality of groups of telescopic cylinders are arranged at the upper end of the support, the bottoms of the telescopic cylinders are connected with telescopic rods, a support rod is connected after the bottoms of the telescopic rods penetrate through the support, the bottoms of the support rods are connected with an electroplating clamp through connecting rods, the electroplating clamp clamps a circuit board, a lower layer blowing pipe is arranged above the electroplating box, an upper layer blowing pipe is arranged above the lower layer blowing pipe, the lower layer blowing pipe and the upper layer blowing pipe are all encircled around the circuit board, the support rod and the circuit board can penetrate through the middles of the lower layer blowing pipe and the upper layer blowing pipe, and the lower layer blowing pipe and the upper layer blowing pipe are both provided with a plurality of, the air cock opening all moves towards the circuit board, the one end of lower floor's blowing pipe is connected with the air-blower, the air-blower is equipped with the outlet duct, lower floor's blowing pipe connect in the outlet duct, the air-blower the outlet duct still shunting is connected with the electric heat box, the gas outlet of electric heat box connect in the one end of upper blowing pipe, the other end of upper blowing pipe is connected with the trachea, just the trachea stretches into wear out again behind the electroplating box inside electroplating box.
Preferably, the openings of the air nozzles are inclined downwards to face the circuit board.
The utility model has the advantages that: the circuit board can be dried in the lifting process after the circuit board is electroplated, and the circuit board does not need to be cleaned, so that the production process of the circuit board is simplified, the production efficiency of the circuit board is improved, and the manufacturing cost of the circuit board is saved.
Drawings
Fig. 1 is a schematic structural view of the present invention;
fig. 2 is a front view of the present invention;
fig. 3 is a top view of the present invention;
fig. 4 is a left side view of the present invention;
the notation in the figure is:
1. the device comprises an electroplating box, 2. a hanging rail, 3. a bracket, 4. a pulley, 5. a motor, 6. a telescopic cylinder, 7. a telescopic rod, 8. a support rod, 9. a lower layer blowing pipe, 10. an upper layer blowing pipe, 11. an air nozzle, 12. a connecting rod, 13. an electroplating clamp, 14. a circuit board, 15. an air pipe, 16. a blower, 1601. an air outlet pipe and 17. an electric heating box.
Detailed Description
The technical solution of the present invention is further specifically described below by way of examples and with reference to the accompanying drawings.
Example (b): the electroplating device with the circuit board drying function of the embodiment, as shown in fig. 1-4, comprises an electroplating box 1, a pair of hanger rails 2 are arranged above the electroplating box 1, pulleys 4 roll in the hanger rails 2, two pulleys 4 are rotatably connected to a support 3, the pulleys 4 are both connected with a motor 5 for driving, the motor 5 is fixed on the support 3, a plurality of groups of telescopic cylinders 6 are arranged at the upper end of the support 3, telescopic rods 7 are connected to the bottoms of the telescopic cylinders 6, a support rod 8 is connected to the bottom of each telescopic rod 7 after passing through the support 3, an electroplating clamp 13 is connected to the bottom of each support rod 8 through a connecting rod 12, the circuit board 14 is clamped by the electroplating clamp 13, a lower layer blowpipe 9 is arranged above the electroplating box 1, an upper layer blowpipe 10 is arranged above the lower layer blowpipe 9, the lower layer blowpipe 9 and the upper layer blowpipe 10 are both looped around the circuit board 14, and both the support rod 8 and the circuit board 14, lower floor's blowing pipe 9 and upper blowing pipe 10 all are equipped with multiunit air cock 11, air cock 11 opening all is towards circuit board 14, the one end of lower floor's blowing pipe 9 is connected with air-blower 16, air-blower 16 is equipped with outlet duct 1601, lower floor's blowing pipe 9 is connected in outlet duct 1601, air-blower 16's outlet duct 1601 still shunting is connected with electric heat box 17, the one end in upper blowing pipe 10 is connected in the gas outlet of electric heat box 17, the other end of upper blowing pipe 10 is connected with trachea 15, and trachea 15 stretches into and wears out electroplating box 1 again after 1 is inside.
Wherein, the openings of the air nozzles 11 are all inclined downwards towards the circuit board 14.
In this embodiment, two blowpipes, a lower blowpipe 9 and an upper blowpipe 10, are provided, and the air source is obtained from the same blower 16, but in order to improve the drying efficiency, the air that enters the upper blowpipe 10 is heated by an electric heating box 17 and then enters the upper blowpipe 10. In practical application, the number of layers of the blowpipe can be increased as appropriate according to the size of the plating line and the size of the circuit board 14. Meanwhile, the upper layer blowpipe 10 is also connected with a gas pipe 15, and the connected gas pipe 15 is skillfully extended into the bottom of the electroplating line. Thus, the plating liquid in the plating tank 1 can be heated by the residual temperature of the upper blowing pipe 10, and the plating efficiency of the circuit board 14 can be improved.
In specific use, after the circuit board 14 is electroplated or cleaned, the telescopic cylinder 6, the blower 16 and the electric heating box 17 are started. The telescopic cylinder 6 lifts up the telescopic rod 7, thereby lifting up the wiring board 14 from the plating liquid or the cleaning liquid. The air blower 16 pressurizes the air and then feeds the air into the lower layer blowpipe 9 and the upper layer blowpipe 10, and the air entering the upper layer blowpipe 10 is heated by the electric heating box 17 and then enters the upper layer blowpipe 10. When the circuit board 14 is lifted up, the air passes through the lower layer blowing pipe 9, the air nozzle 11 arranged on the lower layer blowing pipe 9 sprays pressurized air to the circuit board 14, and the opening of the air nozzle 11 inclines downwards towards the circuit board 14, so that the liquid attached to the circuit board 14 can be blown downwards by the air sprayed from the air nozzle 11. And the circuit board 14 enters the blowing area of the upper blowing pipe 10 after being dried by the wind power of the lower blowing pipe 9. And the gas in the upper layer blowpipe 10 is heated by the electric heating box 17, and meanwhile, the circuit board 14 is primarily dried by the lower layer circuit board 14, and the attached liquid is basically dried by the drying. The hot air drying of the upper layer blowpipe 10 does not cause the attached gathered liquid to generate local high temperature to burn the circuit board 14. After the circuit board 14 passes through the upper layer blowpipe 10, the motor 5 is started to drive the pulley 4 to rotate, so that the bracket 3 is moved, and the circuit board 14 is conveyed out of the electroplating box 1.
The present embodiment is only an exemplary embodiment of the present invention, and for those skilled in the art, based on the application method and principle disclosed in the present invention, various modifications or variations can be easily made, and not only limited to the structure described in the above embodiments of the present invention, therefore, the manner described in the foregoing is only a preferred embodiment, but not limiting, and all equivalent changes and modifications made according to the present invention are within the scope of the present invention.
Claims (2)
1. An electroplating device with a circuit board blow-drying function comprises an electroplating box (1) and is characterized in that a pair of hanger rails (2) are arranged above the electroplating box (1), pulleys (4) roll in the hanger rails (2), the two pulleys (4) are rotatably connected to a support (3), the pulleys (4) are connected with a motor (5) to drive, the motor (5) is fixed on the support (3), a plurality of groups of telescopic cylinders (6) are arranged at the upper end of the support (3), the bottom of each telescopic cylinder (6) is connected with a telescopic rod (7), the bottom of each telescopic rod (7) penetrates through the support (3) and then is connected with a support rod (8), the bottom of each support rod (8) is connected with an electroplating clamp (13) through a connecting rod (12), the electroplating clamp (13) clamps a circuit board (14), and a lower layer blowing pipe (9) is arranged above the electroplating box (1), the upper layer blowpipe (10) is arranged above the lower layer blowpipe (9), the lower layer blowpipe (9) and the upper layer blowpipe (10) are all surrounded on the circuit board (14), the support rod (8) and the circuit board (14) can all pass through the middle of the lower layer blowpipe (9) and the upper layer blowpipe (10), the lower layer blowpipe (9) and the upper layer blowpipe (10) are both provided with a plurality of groups of air nozzles (11), the openings of the air nozzles (11) are all towards the circuit board (14), one end of the lower layer blowpipe (9) is connected with an air blower (16), the air blower (16) is provided with an air outlet pipe (1601), the lower layer blowpipe (9) is connected with the air outlet pipe (1601), the air outlet pipe (1601) of the air blower (16) is also connected with an electric heating box (17) in a tapping manner, the air outlet of the electric heating box (17) is connected with one end of the upper layer blowpipe (10, the other end of the upper layer blowpipe (10) is connected with an air pipe (15), and the air pipe (15) stretches into the electroplating box (1) and then penetrates out of the electroplating box (1).
2. The electroplating device with the circuit board drying function according to claim 1, wherein the openings of the air nozzles (11) are all inclined downwards towards the circuit board (14).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022266778.0U CN213388952U (en) | 2020-10-13 | 2020-10-13 | Electroplating device with circuit board weathers function |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022266778.0U CN213388952U (en) | 2020-10-13 | 2020-10-13 | Electroplating device with circuit board weathers function |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213388952U true CN213388952U (en) | 2021-06-08 |
Family
ID=76186620
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022266778.0U Active CN213388952U (en) | 2020-10-13 | 2020-10-13 | Electroplating device with circuit board weathers function |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213388952U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113481556A (en) * | 2021-07-30 | 2021-10-08 | 杨桂昌 | Local electroplating process |
-
2020
- 2020-10-13 CN CN202022266778.0U patent/CN213388952U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113481556A (en) * | 2021-07-30 | 2021-10-08 | 杨桂昌 | Local electroplating process |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: An electroplating device with circuit board drying function Effective date of registration: 20231130 Granted publication date: 20210608 Pledgee: Agricultural Bank of China Limited Xinfeng County Branch Pledgor: Jiangxi Chengrui Technology Co.,Ltd. Registration number: Y2023980068615 |