CN213382740U - Special injection mold for semiconductor assembly - Google Patents

Abstract

The utility model relates to an injection mold field especially relates to a special injection mold of semiconductor subassembly, and it includes movable mould subassembly, cover half subassembly and ejection mechanism: the fixed die assembly comprises a fixed die mounting plate, a fixed die plate, a positioning ring and a pouring runner; the fixed template is fixed at the bottom of the fixed template mounting plate; a fixed die core is embedded at the bottom of the fixed die plate; the movable mould component comprises a movable mould plate and a movable mould mounting plate; a movable mould core is embedded at the bottom of the movable mould plate; the movable mold core and the fixed mold core can be matched with each other to form a mold cavity; the movable template is fixed on the movable mould mounting plate in a translation way through the ejection mechanism; the positioning ring is arranged at the top of the fixed die mounting plate; the pouring runner sequentially penetrates through the fixed die mounting plate, the fixed die plate and the fixed die core through the positioning rings and is communicated with the cavity; a miniature static mixer is arranged in the pouring runner. The utility model discloses improve the homogeneity of plastic melt in the pouring runner, reduced the quality problems that the line appears fusing because of the product that the plastic melt distributes the inequality and causes to a certain extent.

Description

Special injection mold for semiconductor assembly

Technical Field

The utility model relates to an injection mold field especially relates to a special injection mold of semiconductor component.

Background

The injection mold is a tool for producing plastic products and is widely applied to the processing industry of the plastic products. The injection mold is generally adapted to thermal molding of thermoplastic plastics, and utilizes the principle of thermal melting of thermoplastic plastics to inject molten plastics (plastic melt) into a cavity of the injection mold through an injection molding machine in a closed state. After cooling and forming, the injection mold is set to be in a mold opening state, and then the semiconductor assembly plastic product can be taken out.

The production of semiconductor components (plastic products) by using a conventional injection mold often causes the quality problem of fused grains of the semiconductor component plastic products due to the uneven distribution of plastic melt in a pouring runner.

SUMMERY OF THE UTILITY MODEL

The semiconductor component plastic part product produced by adopting the traditional injection mold often has the quality problems of fusion lines and the like caused by the uneven distribution of plastic melt in a pouring runner. To this problem, the utility model provides a technical scheme does:

the utility model provides a special injection mold of semiconductor subassembly, including movable mould subassembly, cover half subassembly and ejection mechanism: the fixed die assembly comprises a fixed die mounting plate, a fixed die plate, a positioning ring and a pouring runner; the fixed template is fixed at the bottom of the fixed template mounting plate; a fixed die core is embedded at the bottom of the fixed die plate; the movable die assembly comprises a movable die plate and a movable die mounting plate; a movable mold core is embedded at the bottom of the movable mold plate; the movable mold core and the fixed mold core can be matched with each other to form a cavity for molding a semiconductor component in a mold closing state; the movable template is fixed on the movable mold mounting plate in a vertically translational manner through the ejection mechanism; the positioning ring is arranged at the top of the fixed die mounting plate; the pouring runner sequentially penetrates through the fixed die mounting plate and the fixed die plate from the positioning ring to the lower part, penetrates through the fixed die core from the top to the lower part and is communicated with the cavity; and a miniature static mixer is arranged in the pouring runner.

Further, a static mixer mounting groove is formed in the fixed die mounting plate; the static mixer mounting groove is communicated with the pouring runner; the micro static mixer is detachably mounted in the static mixer mounting groove.

Furthermore, the number of the cavities is multiple; each cavity can produce a semiconductor component at a time; the pouring runner comprises a main runner and a plurality of branch runners; the main runner and all the branch runners are vertically arranged; the main runner is communicated with the bottom of the positioning ring, the top of the branch runners is communicated with the bottom of the main runner, and the branch runners are annularly and symmetrically distributed around the central axis of the main runner; the branch flow passages are communicated with the cavity in a one-to-one correspondence mode, and the cavity is located right below the branch flow passages.

Further, the main flow channel comprises a cylindrical flow channel cavity; the cylindrical runner cavity and the positioning ring are coaxially arranged; the main runner is communicated with the branch runners through the cylindrical runner cavities respectively; a flow equalizing plate is arranged in the cylindrical flow passage cavity; a plurality of groups of flow guide holes are formed in the flow equalizing plate; the diversion holes are communicated with the branch flow passages in a one-to-one correspondence manner.

Furthermore, each group of the through holes is formed by a plurality of through holes which are uniformly distributed in the diversion holes; in each group of the flow guide holes, all the through holes are symmetrical about the central axis of the branch flow channel.

Further, the fixed die plate is detachably connected with the bottom of the fixed die plate mounting plate through bolts.

The utility model has the advantages of or beneficial effect:

the utility model provides a special injection mold of semiconductor module, through set up miniature static mixer in the pouring runner, utilize the high-efficient high-quality ground of miniature static mixer in the pouring runner to mix on the one hand, the homogeneity between the different regions in the pouring runner of plastics fuse-element has been improved greatly, thereby the quality problems of fusing the line appear in the semiconductor module that has reduced to a certain extent because of the uneven semiconductor module that causes of plastics fuse-element distribution, be favorable to reducing the defective percentage that the product was moulded to the semiconductor module, promote the quality that the product was moulded to the semiconductor module. On the other hand, when miniature static mixer improves the homogeneity of plastic melt in different regions, miniature static mixer can also play the effect of "driving" the bubble, helps taking out the bubble in the corner region of pouring runner, and the bubble of taking away can be through exhaust duct discharge pouring runner to prevent that the bubble from flowing into the die cavity, to the adverse effect of semiconductor component plastic part product quality.

Drawings

The invention and its features, aspects and advantages will become more apparent from a reading of the following detailed description of non-limiting embodiments with reference to the attached drawings. Like reference symbols in the various drawings indicate like elements. The drawings are not intended to be drawn to scale, emphasis instead being placed upon illustrating the principles of the invention.

Fig. 1 is a schematic view of a partial cross-sectional structure of an injection mold dedicated for a semiconductor module according to an embodiment 1 of the present invention;

fig. 2 is a schematic top view of a flow equalizing plate according to embodiment 1 of the present invention.

Detailed Description

It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict. It is noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of example embodiments according to the present application.

It will be understood that the terms "comprises" and/or "comprising," when used in this specification, specify the presence of stated features, steps, operations, devices, components, and/or combinations thereof.

As the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. appear, their indicated orientation or positional relationship is based on that shown in the drawings, merely for convenience in describing the invention and simplifying the description, and does not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the invention.

The appearances of the terms first, second, and third, if any, are used for descriptive purposes only and are not intended to be limiting or imply relative importance.

Unless expressly stated or limited otherwise, the terms "mounted," "connected," and "connected" are intended to be inclusive and mean, for example, that they may be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

The technical solutions in the embodiments of the present invention are described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, but not all embodiments. Thus, the following detailed description of the embodiments of the present invention, presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative efforts belong to the protection scope of the present invention.

Example 1

Embodiment 1 provides a special injection mold 01 for a semiconductor component, as shown in fig. 1, comprising a movable mold component 1, a fixed mold component 2 and an ejection mechanism 3: the fixed die assembly 2 comprises a fixed die mounting plate 20, a fixed die plate 21, a positioning ring 22 and a pouring runner 23; the fixed die plate 21 is fixed at the bottom of the fixed die plate mounting plate 20; a fixed die core 24 is embedded at the bottom of the fixed die plate 21; the movable mould component 1 comprises a movable mould plate 10 and a movable mould mounting plate 11; a movable mould core 12 is embedded at the bottom of the movable mould plate 10; the movable mould core 12 and the fixed mould core 24 can be mutually matched to form a cavity 4 for molding the semiconductor component in a mould closing state; the movable mould plate 10 is fixed on the movable mould mounting plate 11 in a vertically translational manner through the ejection mechanism 3; the positioning ring 22 is arranged at the top of the fixed die mounting plate 20; the pouring runner 23 sequentially penetrates through the fixed die mounting plate 20 and the fixed die plate 21 from the positioning ring 22 to the lower part, penetrates through the fixed die core 24 from the top to the lower part and is communicated with the die cavity 4; a miniature static mixer 5 is arranged in the pouring runner 23. The micro static mixer 5 is a high-efficiency mixing element without moving parts, and the working principle of the micro static mixer is that the flow state of fluid (plastic melt) in a pipe is changed by using a mixing unit body fixed in the pipe so as to achieve the purposes of good dispersion and full mixing of the fluid (plastic melt) in different areas. Compared with the traditional mixer with a stirring device, the micro static mixer 5 has the unique advantages of small volume, easy installation, high mixing efficiency, small bubble occurrence rate, low cost, convenience for continuous production and the like.

The injection mold 01 for a semiconductor device provided in embodiment 1, by disposing the micro static mixer 5 in the pouring runner 23, on one hand, the high-efficiency and high-quality mixing of the micro static mixer 5 in the pouring runner 23 is utilized, and the uniformity of the plastic melt among different areas in the pouring runner 23 is greatly improved, thereby reducing the quality problem of fused grains of a semiconductor device plastic product caused by uneven distribution of the plastic melt to a certain extent, being beneficial to reducing the defective rate of the semiconductor device plastic product, and improving the quality of the semiconductor device plastic product. On the other hand, when the micro static mixer 5 improves the uniformity of the plastic melt in different areas, the micro static mixer 5 can also play a role in driving bubbles, so that the bubbles in the corner areas of the pouring runner 23 can be taken out, and the taken bubbles can be discharged out of the pouring runner 23 through the exhaust groove, so that the bubbles are prevented from flowing into the cavity 4, and the adverse effect on the product quality of the semiconductor component 001 plastic part is avoided.

In order to facilitate the maintenance of the micro static mixer, further, as shown in fig. 1, a static mixer installation groove is provided on the fixed die installation plate 20; the static mixer installation groove 25 is communicated with the pouring runner 23; the micro static mixer 5 is detachably mounted in the static mixer mounting groove 25. Through setting up static mixer mounting groove 25, miniature static mixer 5 can be installed and dismantle conveniently, has made things convenient for miniature static mixer 5's maintenance and maintenance, is favorable to improving semiconductor component special injection mold 01's overall reliability and stability of performance.

In order to improve the production efficiency of the semiconductor assembly produced by the special injection mold for the semiconductor assembly, further, as shown in fig. 1, a plurality of cavities 4 are provided; each cavity 4 can produce one semiconductor component 001 at a time; the pouring runner 23 comprises a main runner 230 and a plurality of branch runners 231; the main flow passage 230 and all the branch flow passages 231 are vertically arranged; the main flow channel 230 is communicated with the bottom of the positioning ring 22, the top of the branch flow channel 231 is communicated with the bottom of the main flow channel 230, and the branch flow channels 231 are annularly and symmetrically distributed about the central axis of the main flow channel 230; the branch flow channels 231 are communicated with the cavities 4 in a one-to-one correspondence manner, and the cavities 4 are located right below the branch flow channels 231. The injection mold 01 for semiconductor device according to the preferred embodiment integrates a plurality of cavities 4 into one mold, and designs the casting runner 23 having a plurality of branch runners 231, and one branch runner 231 corresponds to one cavity 4, so that the purpose of synchronously producing a plurality of semiconductor devices 001 (molded products) can be achieved. Compare with the injection mold of traditional single type chamber 4, promoted production efficiency greatly.

The sprue 230 and all the branch runners 231 are vertically arranged, so that the length of the pouring runner 23 is saved, and the injection molding quality is improved. The plastic melt can stably flow towards each cavity 4 under the double pushing of the dead weight and the injection pressure of the plastic melt in the pouring runner 23.

The preferred embodiment is designed as follows: the branch channels 231 are annularly and symmetrically distributed about the central axis of the main channel 230; the branch runners 231 are correspondingly communicated with the cavities 4 one by one, and the cavities 4 are positioned right below the branch runners 231, so that the flow resistance of each cavity 4 is completely consistent with that of the main runner 230; the lengths of the branch runners 23 corresponding to the cavities 4 are also equal, so that the time for the plastic melt to reach the cavities 4 and the injection molding progress can be kept in good consistency, and the high consistency of the quality of the semiconductor assemblies 001 (plastic products) produced by different cavities 4 can be ensured.

Further, as shown in fig. 1, the primary flow passage 230 includes a cylindrical flow passage chamber 2300; the cylindrical runner cavity 2300 is coaxially arranged with the positioning ring 22; the main runner 230 is respectively communicated with the branch runners 231 through the cylindrical runner cavity 2300; a flow equalizing plate 6 is arranged in the cylindrical flow passage cavity 2300; the flow equalizing plate 6 is provided with a plurality of groups of flow guide holes 60; the diversion holes 60 are communicated with the branch flow passages 231 in a one-to-one correspondence manner. On one hand, the flow equalizing plate 6 is arranged in the cylindrical runner cavity 2300, which is beneficial to the opportunity equality of the plastic melt in different branch runners 231; on the other hand, the flow equalizing plate 6 is provided with a plurality of sets of flow guiding holes 60, which is beneficial to improving the uniformity of the flow state of the plastic melt in different areas of the inlet cross section of the branch flow channel 231.

Specifically, as shown in fig. 2, each group of flow guide holes 60 is composed of a plurality of through holes 600 uniformly distributed; in each set of the flow guide holes 60, all the through holes 600 are symmetrical about the central axis of the branch flow channel 231.

In order to facilitate the later maintenance of the injection mold dedicated to the semiconductor module, further, as shown in fig. 1, the fixed die plate 21 is detachably connected to the bottom of the fixed die plate mounting plate 20 by bolts 7. Can install and dismantle fixed die plate 21 and fixed die plate mounting panel 20 fast through bolt 7, it is convenient to have brought for the later maintenance of special injection mold 01 of semiconductor component.

For example, when the notch of the static mixer installation groove 25 is located at the bottom of the stationary mold mounting plate 20, the quick and easy attachment and detachment of the stationary mold plate 21 to the stationary mold mounting plate 20 can be achieved by the bolts 7 to facilitate the later maintenance of the static mixer installation groove 25.

For another example, the cylindrical runner cavity 2300 includes a cylindrical recess formed in the top of the stationary platen 21. The cylinder runner cavity 2300 is formed by sealing a cylindrical groove with the lower plate surface of the fixed die mounting plate 20. The fixed die plate 21 and the fixed die plate mounting plate 20 can be quickly, simply and conveniently disassembled and assembled through the bolts 7, so that the later maintenance of the flow equalizing plate 6 in the cylindrical runner cavity 2300 and the washing and maintenance of the pouring runner 23 are facilitated.

The above only is the preferred embodiment of the present invention, not limiting the scope of the present invention, all the equivalent structural changes made by the contents of the specification and the drawings, or the direct or indirect application in other related technical fields, are included in the same way in the protection scope of the present invention.

Claims (6)

1. The utility model provides a special injection mold of semiconductor subassembly which characterized in that, includes movable mould subassembly, cover half subassembly and ejection mechanism:

the fixed die assembly comprises a fixed die mounting plate, a fixed die plate, a positioning ring and a pouring runner; the fixed template is fixed at the bottom of the fixed template mounting plate; a fixed die core is embedded at the bottom of the fixed die plate; the movable die assembly comprises a movable die plate and a movable die mounting plate; a movable mold core is embedded at the bottom of the movable mold plate; the movable mold core and the fixed mold core can be matched with each other to form a cavity for molding a semiconductor component in a mold closing state; the movable template is fixed on the movable mold mounting plate in a vertically translational manner through the ejection mechanism;

the positioning ring is arranged at the top of the fixed die mounting plate; the pouring runner sequentially penetrates through the fixed die mounting plate and the fixed die plate from the positioning ring to the lower part, penetrates through the fixed die core from the top to the lower part and is communicated with the cavity; and a miniature static mixer is arranged in the pouring runner.

2. The injection mold for semiconductor modules according to claim 1, wherein a static mixer mounting groove is provided on the fixed mold mounting plate; the static mixer mounting groove is communicated with the pouring runner; the micro static mixer is detachably mounted in the static mixer mounting groove.

3. The injection mold special for the semiconductor component according to claim 1 or 2, wherein the number of the cavities is several; each cavity can produce a semiconductor component at a time;

the pouring runner comprises a main runner and a plurality of branch runners; the main runner and all the branch runners are vertically arranged; the main runner is communicated with the bottom of the positioning ring, the top of the branch runners is communicated with the bottom of the main runner, and the branch runners are annularly and symmetrically distributed around the central axis of the main runner; the branch flow passages are communicated with the cavity in a one-to-one correspondence mode, and the cavity is located right below the branch flow passages.

4. The injection mold for semiconductor modules according to claim 3, wherein the main runner comprises a cylindrical runner cavity; the cylindrical runner cavity and the positioning ring are coaxially arranged; the main runner is communicated with the branch runners through the cylindrical runner cavities respectively; a flow equalizing plate is arranged in the cylindrical flow passage cavity; a plurality of groups of flow guide holes are formed in the flow equalizing plate; the diversion holes are communicated with the branch flow passages in a one-to-one correspondence manner.

5. The injection mold special for semiconductor components as claimed in claim 3, wherein each set of the flow guiding holes is composed of a plurality of through holes distributed uniformly; in each group of the flow guide holes, all the through holes are symmetrical about the central axis of the branch flow channel.

6. The injection mold for semiconductor modules according to claim 1 or 2, wherein the fixed mold plate is detachably attached to the bottom of the fixed mold plate mounting plate by bolts.

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